CN108183987A - Electronic device - Google Patents

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Publication number
CN108183987A
CN108183987A CN201711433365.3A CN201711433365A CN108183987A CN 108183987 A CN108183987 A CN 108183987A CN 201711433365 A CN201711433365 A CN 201711433365A CN 108183987 A CN108183987 A CN 108183987A
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CN
China
Prior art keywords
infrared
light
lamp
head
close
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711433365.3A
Other languages
Chinese (zh)
Other versions
CN108183987B (en
Inventor
吴安平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN202010823872.3A priority Critical patent/CN111953824B/en
Priority to CN201711433365.3A priority patent/CN108183987B/en
Publication of CN108183987A publication Critical patent/CN108183987A/en
Priority to PCT/CN2018/118716 priority patent/WO2019128628A1/en
Application granted granted Critical
Publication of CN108183987B publication Critical patent/CN108183987B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/70—Circuitry for compensating brightness variation in the scene
    • H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means

Abstract

Electronic device disclosed by the invention includes casing, output module, vibration module, piezoelectric element, imaging modules and receiving module.It exports module and includes encapsulating housing, infrared light compensating lamp and close to infrared lamp.Encapsulating housing includes package substrate, and infrared light compensating lamp close to infrared lamp with being encapsulated in encapsulating housing and being carried on package substrate.Piezoelectric element is combined with vibration module and with exporting module interval.Piezoelectric element vibrates for being deformed upon when being applied in electric signal so as to vibrate module.Imaging modules include camera case and camera lens module.Camera lens module is housed in camera case and corresponding with the light extraction through-hole of the top surface of camera case.Receiving module is arranged at the first sub- top surface and including proximity sensor and/or optical flame detector.The integrated level height and receiving module for exporting module set compacter with imaging modules, have saved the installation space of electronic device；Electronic device realizes that osteoacusis is transaudient using piezoelectric element and vibration module, and the privacy of dialog context has been effectively ensured.

Description

Electronic device
Technical field
The present invention relates to consumer electronics technical fields, more specifically, are related to a kind of electronic device.
Background technology
As the function that mobile phone is supported is more and more rich and varied, mobile phone needs the type and quantity of function element set It is more and more, in order to realize the functions such as the facial 3D feature recognitions of distance detection, environment light detection and user, need to set in electronics The function elements such as standby middle configuration proximity sensor, ambient light sensor, infrared pick-up head, structured light projector, and for cloth Numerous function elements is put, the excessive space of mobile phone can be occupied.
Invention content
Embodiment of the present invention provides a kind of electronic device.
The electronic device of embodiment of the present invention includes：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, infrared benefit Light lamp and close to infrared lamp, the encapsulating housing includes package substrate, and the infrared light compensating lamp is encapsulated with described close to infrared lamp In the encapsulating housing and carry on the package substrate, the infrared light compensating lamp with it is described can be with not close to infrared lamp Same power emits infrared light outside the encapsulating housing；
Module is vibrated, the vibration module installation is on the housing；
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectricity with described Element is used to deform upon when being applied in electric signal so that the vibration module vibration；
The imaging modules of installation on the housing, the imaging modules include camera case and camera lens module, the phase Cascaded surface is in the top surface of casing body and the first sub- top surface and the second sub- top surface including being connected, the second sub- top surface are relatively described First sub- top surface inclination simultaneously forms notch with the described first sub- top surface, and the top surface offers light extraction through-hole, the camera lens module It is housed in the camera case and corresponding with the light extraction through-hole；With
The receiving module being arranged at the described first sub- top surface, the receiving module include proximity sensor and/or light sensation Device.
In some embodiments, the vibration module includes display screen and the cover board of light transmission, the display screen are arranged on Host cavity is collectively formed on the casing and with the casing, the cover board setting is on the housing and positioned at the display screen The side far from the host cavity, the display screen combined with the cover board, and the casing offers spaced casing Through-hole, described corresponding close to through-hole with the casing close to infrared lamp, institute are vibrated close to through-hole, casing light filling through-hole and casing It is corresponding with the casing light filling through-hole to state infrared light compensating lamp, the piezoelectric element be housed in casing vibration through-hole and with institute State cover board combination.
In some embodiments, the piezoelectric element and the display screen are attached to by fastener on the cover board.
In some embodiments, the output module further includes chip, and the infrared light compensating lamp is with described close to infrared Lamp is formed on a piece of chip.
In some embodiments, the encapsulating housing further includes package wall and encapsulation top, and the package wall is certainly The package substrate extends and is connected at the top of the encapsulation between the package substrate, and light filling is formed at the top of the encapsulation Window and close to window, the light filling window is corresponding with the infrared light compensating lamp, it is described close to window with it is described close to infrared lamp It is corresponding.
In some embodiments, the output module further includes light-supplementing lamp lens, and the light-supplementing lamp lens are arranged on institute It states in encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The output module is further included close to lamp lens, it is described be arranged in the encapsulating housing close to lamp lens and with institute It states and is corresponded to close to infrared lamp.
In some embodiments, the output module further include the light-supplementing lamp lens that are arranged in the encapsulating housing and Close to lamp lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp lens and described close to infrared lamp Corresponding, the light-supplementing lamp lens are located at close to lamp lens on same transparent base with described.
In some embodiments, the output module further includes metal shutter, and the metal shutter is located at described In encapsulating housing and positioned at the infrared light compensating lamp and described close between infrared lamp.
In some embodiments, the output module further includes the optics sealing cover made of translucent material, the optics Sealing cover is formed on the package substrate and in the encapsulating housing, and the optics sealing cover wraps the infrared light compensating lamp It is and described close to infrared lamp.
In some embodiments, the output module further includes out light clapboard, it is described go out light clapboard be formed in the light It learns in sealing cover and positioned at the infrared light compensating lamp and described close between infrared lamp.
In some embodiments, grounding pin, light compensating lamp pin are formed with and close to lamp pin on the output module, When the grounding pin and the light compensating lamp pin are enabled, the infrared light compensating lamp emits infrared light；The grounding pin With it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light.
In some embodiments, the cover board is formed with the surface that the casing is combined and only transmits the infrared of infrared light Through ink, the infrared ink that penetrates blocks the casing close to the vibration of through-hole, the casing light filling through-hole and the casing At least one of through-hole.
In some embodiments, the imaging modules include at least one in visible image capturing head and infrared pick-up head Kind.
In some embodiments, the imaging modules include infrared pick-up head and visible image capturing head, the electronics Device further includes structured light projector, the output module, the infrared pick-up head, the visible image capturing head, the pressure The center of electric device and the structured light projector is located on same line segment, is followed successively by from one end of the line segment to the other end：
It is the output module, the structured light projector, the piezoelectric element, the infrared pick-up head, described visible Light video camera head；Or
The output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, the structure Light projector；Or
The infrared pick-up head, the output module, the piezoelectric element, the visible image capturing head, the structure Light projector；Or
The infrared pick-up head, the visible image capturing head, the piezoelectric element, the output module, the structure Light projector.
In some embodiments, the imaging modules include infrared pick-up head and visible image capturing head, the electronics Device further includes structured light projector, the output module, the infrared pick-up head, the visible image capturing head and the knot The center of structure light projector is located on same line segment, and the piezoelectric element is between the line segment and the top of the casing.
In some embodiments, the imaging modules include infrared pick-up head and visible image capturing head, the electronics Device further includes structured light projector, the quantity of the piezoelectric element be it is multiple, the quantity of the casing vibration through-hole be it is multiple, Multiple piezoelectric elements are corresponding with multiple casing vibration through-holes, and each piezoelectric element is housed in the corresponding machine In shell vibration through-hole, the output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectric elements It is located on same line segment with the center of the structured light projector, the output is provided between the two neighboring piezoelectric element At least one of module, the infrared pick-up head, the visible image capturing head and described structured light projector.
In some embodiments, the imaging modules further include infrared pick-up head and visible image capturing head, the electricity Sub-device further includes structured light projector, and the piezoelectricity that the piezoelectric element includes piezoelectric body and stretched out from the piezoelectric body is convex Block, the quantity of the casing vibration through-hole is multiple, and multiple piezoelectricity convex blocks are corresponding with multiple casing vibration through-holes, often A piezoelectricity convex portion is housed in the corresponding casing vibration through-hole and is combined with the cover board, the output mould Group, the infrared pick-up head, the visible image capturing head and the structured light projector are located at the cover board and the piezoelectricity Between ontology, the output module, the infrared pick-up head, the visible image capturing head, multiple piezoelectricity convex blocks and institute The center for stating structured light projector is located on same line segment, and the output mould is provided between the two neighboring piezoelectricity convex block At least one of group, the infrared pick-up head, the visible image capturing head and described structured light projector.
In the electronic device of embodiment of the present invention, output module is by infrared light compensating lamp with being integrated into one close to infrared lamp Single package body structure has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, therefore, has exported the integrated level of module Higher, small volume, output module has saved the space of the function of the infrared light filling of realization and infrared distance measurement.In addition, due to infrared Light compensating lamp and be carried on same package substrate close to infrared lamp, compared to traditional handicraft infrared light compensating lamp with close to infrared Lamp, which needs to be respectively adopted in different wafer manufacture recombinants to PCB substrate, to be encapsulated, and improves packaging efficiency.Further more, electronic device Realize that osteoacusis is transaudient using piezoelectric element and vibration module, instead of traditional telephone receiver structure by air transmitted sound, one The privacy of dialog context is effectively ensured in aspect, on the other hand, due to eliminating the receiver of script, avoids and opens on the cover board It is simpler in technique if through-hole corresponding with receiver, it is also more aesthetically pleasing in appearance.Finally, imaging modules offer notch, and And receiving module is arranged at the first sub- top surface, receiving module is made to set compacter with imaging modules, the two occupies jointly Horizontal space it is smaller, saved the installation space in electronic device.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partly will be from following Description in become apparent or recognized by the practice of embodiments of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change It obtains significantly and is readily appreciated that, wherein：
Fig. 1 is the structure diagram of the electronic device of embodiment of the present invention；
Fig. 2 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 3 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Fig. 4 is the stereoscopic schematic diagram of the output module of the electronic device of embodiment of the present invention；
Fig. 5 is schematic cross-section of the electronic device along V-V lines in Fig. 1；
Fig. 6 is partial sectional schematic view of the electronic device in Fig. 1 along line VI -- VI；
Fig. 7 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Fig. 8 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Fig. 9 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 10 to Figure 11 is the arrangement schematic diagram of the electronic component of the electronic device of embodiment of the present invention；
Figure 12 is the structure diagram of the electronic device of embodiment of the present invention；
Figure 13 is partial sectional schematic view of the electronic device along XIII-XIII lines in Figure 12；
Figure 14 is the schematic cross-section of the output module of the electronic device of embodiment of the present invention；
Figure 15 is the receiving module of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules；
Figure 16 to Figure 17 is that the electronic device edge of embodiment of the present invention is intercepted with XVI-XVI lines corresponding position in Fig. 1 Partial sectional schematic view；
Figure 18 to Figure 26 is the receiving module of the electronic device of embodiment of the present invention and the stereoscopic schematic diagram of imaging modules.
Specific embodiment
Embodiments of the present invention are described further below in conjunction with attached drawing.Same or similar label is from beginning in attached drawing To the whole element for representing same or similar element or there is same or like function.
In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, it is only used for explaining the present invention's Embodiment, and be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature can be with "above" or "below" second feature It is that the first and second features are in direct contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists Second feature " on ", " top " and " above " but fisrt feature right over second feature or oblique upper or be merely representative of Fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be One feature is immediately below second feature or obliquely downward or is merely representative of fisrt feature level height less than second feature.
Referring to Fig. 1, the electronic device 100 of embodiment of the present invention includes casing 20, cover board 30 and electronic component.Electricity Sub- component includes output module 10, vibration module 30a (such as Fig. 5), piezoelectric element 70, receiving module 50 (such as Fig. 7), imaging mould 60 (such as Fig. 7) of group and structured light projector 80.Electronic device 100 can be mobile phone, tablet computer, laptop, intelligent hand Table, Intelligent bracelet, automatic teller machine etc., the embodiment of the present invention are illustrated so that electronic device 100 is mobile phone as an example, it will be understood that electricity The concrete form of sub-device 100 can be other, and this is not restricted.
Fig. 2 and Fig. 3 are please referred to, output module 10 is single package body structure, including encapsulating housing 11,12 and of infrared light compensating lamp Close to infrared lamp 13.
Encapsulating housing 11 for encapsulating infrared light compensating lamp 12 and close to infrared lamp 13, in other words, infrared light compensating lamp 12 simultaneously It is encapsulated in encapsulating housing 11 simultaneously with close to infrared lamp 13.Encapsulating housing 11 includes package substrate 111,112 and of package wall Encapsulation top 113.Encapsulating housing 11 can be shielded by electromagnetic interference (Electromagnetic Interference, EMI) Material is made, and output module 10 is had an impact to avoid extraneous electromagnetic interference.
Package substrate 111 is for carrying infrared light compensating lamp 12 and close to infrared lamp 13.It is infrared when manufacture exports module 10 Light compensating lamp 12 and can be formed on a piece of chip 14 close to infrared lamp 13, then by infrared light compensating lamp 12, close to 13 and of infrared lamp Chip 14 is set along on package substrate 111, and specifically, chip 14 can be bonded on package substrate 111.Meanwhile it seals Dress substrate 111 can be used for other parts (such as the casing 20 of electronic device 100, mainboard etc.) with electronic device 100 Connection, will export module 10 and be fixed in electronic device 100.
Package wall 112 can surround infrared light compensating lamp 12 and be set close to infrared lamp 13, and package wall 112 encapsulates base certainly Plate 111 extends, and package wall 112 can be combined with package substrate 111, preferably, package wall 112 is can with package substrate 111 It releasably connects, in order to remove to infrared light compensating lamp 12 after package wall 112 and overhauled close to infrared lamp 13.Package-side The making material of wall 112 can be the material of impermeable infrared light, be sent out to avoid infrared light compensating lamp 12 or close to infrared lamp 13 Infrared light passes through package wall 112.
Encapsulation top 113 is opposite with package substrate 111, and encapsulation top 113 is connect with package wall 112.Encapsulation top 113 It is formed with light filling window 1131 and close to window 1132, light filling window 1131 is corresponding with infrared light compensating lamp 12, infrared light compensating lamp 12 The infrared light of transmitting is pierced by from light filling window 1131；It is corresponding with close to infrared lamp 13 close to window 1132, it is sent out close to infrared lamp 13 The infrared light penetrated is pierced by from close to window 1132.Encapsulation top 113 integrally formed can be obtained with package wall 112, can also Split shapes to obtain.In one example, light filling window 1131 and close to window 1132 be through-hole, encapsulation top 113 making Material is the material of impermeable infrared light.In another example, 113 material by impermeable infrared light of encapsulation top and saturating infrared light Material co-manufactured forms, and specifically, light filling window 1131 and is made close to window 1132 of the material of saturating infrared light, remaining part Position is made of the material of impermeable infrared light, further, light filling window 1131 and could be formed with lens knot close to window 1132 Structure, to improve the infrared light emission angle from light filling window 1131 and close to the injection of window 1132, such as 1131 shape of light filling window Into there is concavees lens structure, so that the divergence of beam across light filling window 1131 projects outward；Convex lens is formed with close to window 1132 Mirror structure, so as to gather outside injection across the light close to window 1132.
Infrared light compensating lamp 12 further reduces infrared light compensating lamp with that can be formed on a piece of chip 14 close to infrared lamp 13 12 with the volume close to infrared lamp 13 after integrated, and preparation process is simpler.Infrared light compensating lamp 12 can emit infrared light, infrared light Across light filling window 1131 to project body surface, the infrared pick-up head 62 of electronic device 100 is (as shown in Figure 1) to receive quilt The infrared light of object reflection is to obtain the image information of object (at this point, infrared light compensating lamp 12 be used for infrared light filling).Close to infrared Lamp 13 can emit infrared light, and infrared light passes through close to window 1132 and reaches body surface, the proximity sensor of electronic device 100 The infrared light that 51 receptions (as shown in Figure 7) are reflected by the object is with the distance of detection object to electronic device 100 (at this point, close to red Outer lamp 13 is used for infrared distance measurement).
Infrared light compensating lamp 12 can emit infrared light with different power from close to infrared lamp 13 outside encapsulating housing 11, Specifically, infrared light compensating lamp 12 with that can emit infrared light simultaneously close to infrared lamp 13, and output module 10 is simultaneously for infrared Light filling and infrared distance measurement；Can also infrared light compensating lamp 12 emit light and do not emit light close to infrared lamp 13, export module 10 It is only used for infrared light filling；Can also infrared light compensating lamp 12 do not emit light and close to infrared lamp 13 emit light, export module 10 It is only used for infrared distance measurement.
Incorporated by reference to Fig. 4, in embodiments of the present invention, export and be formed with grounding pin 15, light compensating lamp pin 16 on module 10 With close to lamp pin 17.It grounding pin 15, light compensating lamp pin 16 and can be formed on package substrate 111 close to lamp pin 17, When grounding pin 15 and light compensating lamp pin 16 are enabled (that is, grounding pin 15 and light compensating lamp pin 16 access circuit turn-on When), infrared light compensating lamp 12 emits infrared light；When grounding pin 15 and when being enabled close to lamp pin 17 (that is, grounding pin 15 During with close to the access circuit turn-on of lamp pin 17), emit infrared light close to infrared lamp 13.
It please refers to Fig.1 and Fig. 5, casing 20 can be as the installation carrier of output module 10, in other words, output module 10 can To be arranged in casing 20.Casing 20 can be the shell of electronic device 100.
Also referring to Fig. 1, Fig. 5 and Fig. 6, casing 20 includes top 21 and bottom 22, corresponding with electronic component Position, casing 20 offer spaced casing close to through-hole 23, casing light filling through-hole 24 and casing vibration through-hole 2a.It is defeated When going out module 10 and being arranged in casing 20, infrared light compensating lamp 12 and casing corresponding close to through-hole 23 with casing close to infrared lamp 13 Light filling through-hole 24 corresponds to.Wherein close to infrared lamp 13 and casing close to through-hole 23 it is corresponding refer to the light sent out close to infrared lamp 13 can It is passed through from casing close to through-hole 23, can close to 23 face of through-hole or be connect with casing close to infrared lamp 13 specifically The light that near-infrared lamp 13 emits passes through casing close to through-hole 23 after light-guide device acts on.Infrared light compensating lamp 12 and casing light filling Through-hole 24 corresponds to similarly, and therefore not to repeat here.In the embodiment illustrated in fig. 6, casing leads to close to through-hole 23 and casing light filling Hole 24 can be apart from one another by certainly, in other embodiments, casing can also close to through-hole 23 and casing light filling through-hole 24 It interconnects.
Module 30a is vibrated to be mounted on casing 20.Vibration module 30a may include display screen 90 and cover board 30, show in other words Display screen 90 is combined formation vibration module 30a with cover board 30, to promote the rigidity of vibration module 30a.Display screen 90 is arranged on casing Host cavity 91 is formed on 20 and with casing 20, cover board 30 is arranged on casing 20 and is located at the separate host cavity 91 of display screen 90 Side, to protect display screen 90.Since the output module 10 of embodiment of the present invention can occupy smaller volume, machine For setting the volume of display screen 90 that can correspond to increase in shell 20, to improve the screen accounting of electronic device 100.Specifically, Display screen 90, output module 10 and piezoelectric element 70 are arranged between top 21 and bottom 22, are filled in user's normal use electronics In the state of putting 100, top 21 is located at the top of bottom 22, as shown in Figure 1, output module 10 can be arranged on display screen 90 with Between top 21.In other embodiments, display screen 90 can open up jagged for screen comprehensively, and display screen 90 surrounds output Module 10, and export module 10 and expose from the notch of display screen 90.
Piezoelectric element 70 is made of ceramics or quartz crystal materials, and piezoelectric element 70 can be single-chip, twin crystal sheet or layer The piezoelectric element 70 of pressure.Piezoelectric element 70 is combined with vibration module 30a and is spaced with output module 10.Specifically, piezoelectric element 70 are housed in casing vibration through-hole 2a and are combined, and be spaced with casing 20, Ke Yishi with cover board 30：It receives 70 part of piezoelectric element Hold in casing vibration through-hole 2a or piezoelectric element 70 is housed in completely in the logical 2a holes of casing vibration.When the two of piezoelectric element 70 When end is applied with electric signal (voltage), due to inverse piezoelectric effect, mechanical deformation, such as expansion or shrinkage occur for piezoelectric element 70, The vibration module 30a combined with piezoelectric element 70 is driven to be vibrated according to the frequency of the electric signal as a result,.When the body of user is with shaking When dynamic model group 30a is contacted, the part that osteoacusis sound is contacted by the body of user with vibration module 30a is (for example, external ear is soft Bone, tooth) it is sent to the auditory nerve of user.In this way, user can realize voice by piezoelectric element 70 and vibration module 30a It the functions such as converses, listen to music.In embodiments of the present invention, the processor of electronic device 100 is used to obtain voice signal, and pressing The both ends of electric device 70 apply electric signal corresponding with the voice signal.
It is appreciated that traditional telephone receiver structure, using air transmitted sound, part acoustic pressure usually exists when receiver works 90dB~100dB or so, in ambient enviroment quieter (under the working environment as 50dB or so) even if sound is transmitted to week It encloses 1 meter of range and also still remains with 50dB~60dB or so, the chat script between caller is caused to be perceived by surrounding, secret is caused to be let out Dew.The electronic device 100 of embodiment of the present invention realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, call Sound be mainly perceived by the user by the osteoacusis vibrated, can effectively ensure that the privacy of dialog context.
Referring to Fig. 5 and Fig. 6, piezoelectric element 70 and display screen 90 are attached to by fastener 30b on cover board 30. Fastener 30b is with heat curable properties, the adhesive of UV-curing characteristics, double faced adhesive tape, viscose etc..For example, fastener 30b can To be Photoelasticity resin (the UV curable acrylic adhesive of colorless and transparent).Cover board 30 is combined with piezoelectric element 70 Region and cover board 30 combined with display screen 90 it is interregional every to prevent the display of display screen 90 by piezoelectric element 70 Interference.Certainly, cover board 30 can also be bonded to casing 20 by fastener 30b, be set up directly on casing 20 compared to cover board 30, The vibration of vibration module 30a can be prevented to be transmitted directly onto casing 20, to reduce user because of the Oscillation Amplitude of casing 20 Possibility that is excessive and falling electronic device 100.
Cover board 30 can be light transmission, and the material of cover board 30 can be glass, resin, plastics of light transmission etc..Cover board 30 is set It puts on casing 20, the inner surface 32 and the outer surface 31 opposite with inner surface 32 that cover board 30 includes with casing 20 is combined are defeated Go out after the light that module 10 is sent out sequentially passes through inner surface 32 and outer surface 31 and be pierced by cover board 30.In embodiment as shown in Figure 6 In, cover board 30 covers casing light filling through-hole 24 and casing close to through-hole 23, and infrared transmission is coated on the inner surface 32 of cover board 30 Ink 40, it is infrared to have higher transmitance to infrared light through ink 40, such as 85% or more is can reach, and have to visible ray Higher attenuation rate, such as can reach more than 70% so that user during normal use, is visually difficult to see that electronic device 100 On by the infrared region covered through ink 40.Specifically, it is infrared through ink 40 can cover on inner surface 32 not with display Shield 90 corresponding regions.
It is infrared to block casing close to through-hole 23, casing light filling through-hole 24 and casing vibration through-hole through ink 40 At least one of 2a, that is, infrared to cover casing simultaneously close to through-hole 23, casing light filling through-hole 24 and machine through ink 40 Shell vibration through-hole 2a (as shown in Figure 6), user are difficult to logical close to the vibration of through-hole 23, casing light filling through-hole 24 and casing by casing Hole 2a sees the internal structure of electronic device 100, and the shape of electronic device 100 is more beautiful；It is infrared to be hidden through ink 40 Lid casing does not cover casing light filling through-hole 24 and casing vibration through-hole 2a close to through-hole 23；Infrared transmission ink 40 can also Casing light filling through-hole 24 is covered, and does not cover casing close to through-hole 23 and casing vibration through-hole 2a；It is infrared also through ink 40 To cover casing vibration through-hole 2a, and casing is not covered close to through-hole 23 and casing light filling through-hole 24；It is infrared to penetrate ink 40 Casing can be covered close to through-hole 23 and casing light filling through-hole 24, and do not cover casing vibration through-hole 2a；It is infrared to penetrate ink 40 Casing light filling through-hole 24 and casing vibration through-hole 2a can also be covered, and does not cover casing close to through-hole 23；It is infrared to penetrate ink 40 can also cover casing close to through-hole 23 and casing vibration through-hole 2a, and do not cover casing light filling through-hole 24.
Referring to Fig. 7, receiving module 50 is integrated with proximity sensor 51 and optical flame detector 52, proximity sensor 51 and optical flame detector 52 are collectively formed single package body structure.The infrared light sent out close to infrared lamp 13 after being reflected by external object, is passed by close Sensor 51 receives, proximity sensor 51 according to the infrared light reflected received judge external object and electronic device 100 it Between distance.Optical flame detector 52 receives the visible ray in ambient light, and detects the intensity of visible ray, using as control display screen 90 The foundation of display brightness.Proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, when reduction the two is individually assembled Gap, save electronic device 100 in installation space.
It please refers to Fig.1 and Fig. 7, imaging modules 60 can be visible image capturing head 61 and one in infrared pick-up head 62 Or two.Imaging modules 60 include microscope base 63, lens barrel 64 and imaging sensor 65.Lens barrel 64 is mounted on microscope base 63, and image passes Sensor 65 is housed in microscope base 63.Microscope base 63 includes mounting surface 631, mounting surface 631 be located at lens barrel 64 and imaging sensor 65 it Between.In the embodiment as shown in figure 7, receiving module 50 is arranged on mounting surface 631, and specifically, receiving module 50 is being installed Plane orthographic projection where face 631 is at least partly dropped on mounting surface 631, in this way, receiving module 50 is set with imaging modules 60 Put compacter, the horizontal space that the two occupies jointly is smaller.
Referring to Fig. 1, structured light projector 80 is used for outside emitting structural light, on project structured light to testee after quilt Reflection, the structure light reflected can be received by infrared pick-up head 62, and the processor of electronic device 100 is further analyzed by infrared The structure light that light video camera head 62 receives, to obtain the depth information of testee.
In the embodiment shown in fig. 1, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, defeated The center for going out module 10, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70 and structured light projector 80 is located at together On one line segment.Specifically, output module 10, structured light projector 80, piezoelectric element are followed successively by from one end of line segment to the other end 70th, infrared pick-up head 62, visible image capturing head 61 (as shown in Figure 8)；Or it is followed successively by from one end of line segment to the other end defeated Go out module 10, infrared pick-up head 62, piezoelectric element 70, visible image capturing head 61, structured light projector 80 (as shown in Figure 1)； Or infrared pick-up head 62, output module 10, piezoelectric element 70, visible image capturing are followed successively by from one end of line segment to the other end First 61, structured light projector 80；Or infrared pick-up head 62, visible image capturing head are followed successively by from one end of line segment to the other end 61st, piezoelectric element 70, output module 10, structured light projector 80.Certainly, module 10, infrared pick-up head 62, piezoelectricity member are exported Part 70, visible image capturing head 61, structured light projector 80 arrangement mode be not limited to above-mentioned citing, can also have other, example The center of such as each electronic component arranges in the arc-shaped, center and arranges rectangular shape.
Referring to Fig. 9, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62.Export module 10, red The center of outer light video camera head 62, visible image capturing head 61 and structured light projector 80 is located on same line segment, piezoelectric element 70 Between line segment and the top 21 of casing 20.Specifically, output module 10, structure light are followed successively by from one end of line segment to the other end The projector 80, infrared pick-up head 62, visible image capturing head 61；Or output module is followed successively by from one end of line segment to the other end 10th, infrared pick-up head 62, visible image capturing head 61, structured light projector 80 (as shown in Figure 9)；Or from one end of line segment to The other end is followed successively by infrared pick-up head 62, output module 10, visible image capturing head 61, structured light projector 80；Or from line One end of section is followed successively by infrared pick-up head 62, visible image capturing head 61, output module 10, structured light projector to the other end 80.Certainly, it is unlimited that module 10, infrared pick-up head 62, visible image capturing head 61, the arrangement mode of structured light projector 80 are exported In above-mentioned citing.In embodiments of the present invention, the center of piezoelectric element 70 is not located on the line segment, has saved each on cover board 30 The horizontal stroke that electronic component (output module 10, infrared pick-up head 62, visible image capturing head 61, structured light projector 80 etc.) occupies To space.
Further, incorporated by reference to Fig. 7, receiving module 50 can be arranged on the mounting surface 631 of infrared pick-up head 62, It can be arranged on the mounting surface 631 of visible image capturing head 61, certainly, receiving module 50 can not also be arranged on mounting surface 631 On, receiving module 50 can be disposed adjacent with output module 10, and proximity sensor 51 is readily received by being sent out close to infrared lamp 13 It penetrates, and the infrared light being reflected back by external object；Receiving module 50 can also be disposed adjacent with piezoelectric element 70, not limited herein System.
To sum up, in the electronic device 100 of embodiment of the present invention, output module 10 by infrared light compensating lamp 12 with close to infrared Lamp 13 is integrated into a single package body structure, has gathered transmitting infrared light with the function of infrared distance measurement and infrared light filling, therefore, defeated The integrated level for going out module 10 is higher, small volume, and output module 10 has saved the function of the infrared light filling of realization and infrared distance measurement Space.In addition, since infrared light compensating lamp 12 close to infrared lamp 13 with being carried on same package substrate 111, compared to tradition The infrared light compensating lamp 12 of technique is sealed from needing to be respectively adopted in different wafer manufacture recombinants to PCB substrate close to infrared lamp 13 Dress, improves packaging efficiency.Further more, electronic device 100 realizes that osteoacusis is transaudient using piezoelectric element 70 and vibration module 30a, Instead of traditional telephone receiver structure by air transmitted sound, on the one hand, can effectively ensure that the privacy of dialog context；It is another Aspect due to eliminating the receiver of script, avoids and through-hole corresponding with receiver is opened up on cover board 30, simpler in technique It is single, it is also more aesthetically pleasing in appearance, and can prevent dust or moisture from entering in electronic device 100.
Fig. 6 and Figure 10 are please referred to, in some embodiments, imaging modules 60 include visible image capturing head 61 and infrared light Camera 62.Casing 20 offers spaced casing and vibrates through-hole close to through-hole 23, casing light filling through-hole 24 and casing 2a.Corresponding close to through-hole 23 with casing close to infrared lamp 13, infrared light compensating lamp 12 is corresponding with casing light filling through-hole 24.Piezoelectric element 70 quantity is multiple, and the quantity of casing vibration through-hole 2a is multiple, multiple piezoelectric elements 70 and multiple casings vibration through-hole 2a Corresponding, each piezoelectric element 70 is housed in corresponding casing vibration through-hole 2a.Export module 10, infrared pick-up head 62, can See that the center of light video camera head 61, multiple piezoelectric elements 70 and structured light projector 80 is located on same line segment, two neighboring piezoelectricity It is provided between element 70 in output module 10, infrared pick-up head 62, visible image capturing head 61 and structured light projector 80 It is at least one.For example, the quantity of piezoelectric element 70 is two, piezoelectric element 70, defeated is followed successively by from one end of line segment to the other end Go out module 10, structured light projector 80, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70 (as shown in Figure 10)； Or piezoelectric element 70, output module 10, infrared pick-up head 62, visible image capturing are followed successively by from one end of line segment to the other end First 61, piezoelectric element 70, structured light projector 80 etc..In another example the quantity of piezoelectric element 70 be three, from one end of line segment to The other end be followed successively by piezoelectric element 70, output module 10, structured light projector 80, piezoelectric element 70, infrared pick-up head 62, can See light video camera head 61, piezoelectric element 70 (as shown in figure 11)；Or be followed successively by from one end of line segment to the other end piezoelectric element 70, Export module 10, piezoelectric element 70, infrared pick-up head 62, visible image capturing head 61, piezoelectric element 70, structured light projector 80 Deng.Certainly, the quantity of piezoelectric element 70 and piezoelectric element 70, output module 10, infrared pick-up head 62, visible image capturing head 61st, the arrangement mode of structured light projector 80 is not limited to above-mentioned citing.In embodiments of the present invention, multiple piezoelectric elements 70 with Cover board 30 combines, and in particular multiple piezoelectric elements 70 are attached to by fastener 30b on cover board 30 respectively.Electronic device 100 Processor for obtaining voice signal, and apply electricity corresponding with the voice signal at the both ends of multiple piezoelectric elements 70 simultaneously Mechanical deformation occurs for signal, multiple piezoelectric elements 70, and multiple piezoelectric elements 70 are multiple and different from being combined with cover board 30 as a result, Position drives vibration module 30a to be vibrated according to the frequency of the electric signal.When the body of user is contacted with vibration module 30a, bone Conduction sound is sent to user's by the body of user with the vibration module 30a parts (for example, the cartilage of external ear, tooth) contacted Auditory nerve.
In embodiments of the present invention, multiple piezoelectric elements 70 drive simultaneously from the multiple and different positions combined with cover board 30 Vibrate module 30a vibration, the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts To the auditory nerve of user.
Fig. 6, Figure 12 and Figure 13 are please referred to, in some embodiments, imaging modules 60 include 61 He of visible image capturing head Infrared pick-up head 62.Casing 20 offers spaced casing and is vibrated close to through-hole 23, casing light filling through-hole 24 and casing Through-hole 2a.Corresponding close to through-hole 23 with casing close to infrared lamp 13, infrared light compensating lamp 12 is corresponding with casing light filling through-hole 24.Piezoelectricity Element 70 includes piezoelectric body 71 and the piezoelectricity convex block 72 stretched out from piezoelectric body 71, and the quantity of piezoelectricity convex block 72 is multiple, machine The quantity of shell vibration through-hole 2a is multiple, and multiple piezoelectricity convex blocks 72 are corresponding with multiple casings vibration through-hole 2a, each piezoelectricity convex block 72 partial receipts are combined in corresponding casing vibration through-hole 2a and with cover board 30.Export module 10, infrared pick-up head 62, can See light video camera head 61 and structured light projector 80 between cover board 30 and piezoelectric body 71.Export module 10, infrared pick-up First 62, the center of visible image capturing head 61, multiple piezoelectricity convex blocks 72 and structured light projector 80 is located on same line segment, and adjacent two Output module 10, infrared pick-up head 62, visible image capturing head 61 and structured light projector are provided between a piezoelectricity convex block 72 At least one of 80.For example, the quantity of piezoelectricity convex block 72 is two, piezoelectricity convex block is followed successively by from one end of line segment to the other end 72nd, module 10, structured light projector 80, infrared pick-up head 62, visible image capturing head 61, piezoelectricity convex block 72 are exported；Or from One end of line segment to the other end be followed successively by piezoelectricity convex block 72, output module 10, infrared pick-up head 62, visible image capturing head 61, Piezoelectricity convex block 72, structured light projector 80 etc..In another example the quantity of piezoelectricity convex block 72 is three, from one end of line segment to another End is followed successively by piezoelectricity convex block 72, output module 10, structured light projector 80, piezoelectricity convex block 72, infrared pick-up head 62, visible ray Camera 61, piezoelectricity convex block 72；Or piezoelectricity convex block 72, output module 10, piezoelectricity are followed successively by from one end of line segment to the other end Convex block 72, infrared pick-up head 62, visible image capturing head 61, piezoelectricity convex block 72, structured light projector 80 etc..For another example piezoelectricity The quantity of convex block 72 is five, and piezoelectricity convex block 72, output module 10, piezoelectricity convex block are followed successively by from one end of line segment to the other end 72nd, structured light projector 80, piezoelectricity convex block 72, infrared pick-up head 62, piezoelectricity convex block 72, visible image capturing head 61, piezoelectricity are convex Block 72 (as shown in figure 13).Certainly, the quantity of piezoelectricity convex block 72 and piezoelectricity convex block 72, output module 10, infrared pick-up head 62nd, visible image capturing head 61, structured light projector 80 arrangement mode be not limited to above-mentioned citing.In embodiments of the present invention, Multiple piezoelectricity convex blocks 72 are combined with cover board 30, and more specifically multiple piezoelectricity convex blocks 72 are attached to lid by fastener 30b respectively On plate 30.The processor of electronic device 100 applies piezoelectric element 70 corresponding with the voice signal for obtaining voice signal Electric signal, mechanical deformation occurs for piezoelectric element 70 including piezoelectric body 71 and piezoelectricity convex block 72, as a result, multiple piezoelectricity Convex block 72 drives vibration module 30a to be vibrated according to the frequency of the electric signal from the multiple and different positions combined with cover board 30.When with When the body at family is contacted with vibration module 30a, part (example that osteoacusis sound is contacted by the body of user with vibrating module 30a Such as, the cartilage of external ear, tooth) it is sent to the auditory nerve of user.
In as shown for example in fig.13, casing 20 offers spaced casing vibration through-hole 2a, output through-hole 25th, structure light through-hole 26, infrared light through-hole 27, visible ray through-hole 28.Casing vibration through-hole 2a is corresponding with piezoelectricity convex block 72, output Through-hole 25 is corresponding with output module 10, and structure light through-hole 26 is corresponding with structured light projector 80, infrared light through-hole 27 and infrared light Camera 62 corresponds to, it is seen that light through-hole 28 is corresponding with visible image capturing head 61.Wherein, output through-hole 25 is alternatively into above-mentioned mutual The casing at interval is close to through-hole 23 and casing light filling through-hole 24 or output through-hole 25 by said machine casing close to through-hole 23 and casing The connection of light filling through-hole 24 is formed.In addition, the structured light projector 80 that refers to corresponding with structured light projector 80 of structure light through-hole 26 is sent out Structure light can be passed through from structure light through-hole 26, infrared light through-hole 27 is corresponding with infrared pick-up head 62 to refer to infrared pick-up head 62 The infrared light that is reflected by the object can be received from infrared light through-hole 27, it is seen that light through-hole 28 is corresponding with visible image capturing head 61 refer to it is visible Light video camera head 61 can receive the visible ray being reflected by the object from visible ray through-hole 28.
In embodiments of the present invention, multiple piezoelectricity convex blocks 72 drive vibration from the multiple and different positions combined with cover board 30 Module 30a vibrates, and the vibration of vibration module 30a more uniformly and intensity bigger, is conducive to osteoacusis sound and steadily conducts to use The auditory nerve at family；In addition, multiple piezoelectricity convex blocks 72 are stretched out from same piezoelectric body 71, convenient for multiple piezoelectricity convex blocks 72 simultaneously Apply electric signal, to be vibrated from multiple and different position synchronous drives vibration module 30a；Further more, output module 10, infrared pick-up First 62, visible image capturing head 61 and structured light projector 80 are between cover board 30 and piezoelectric body 71, and intert and be provided with pressure Electric convex block 72,100 overall volume of electronic device is smaller, saves space.
Referring to Fig. 3, in some embodiments, output module 10 further includes light-supplementing lamp lens 18 and close to lamp lens 19.Light-supplementing lamp lens 18 are arranged in encapsulating housing 11 and corresponding with infrared light compensating lamp 12.Encapsulation is arranged on close to lamp lens 19 It is in housing 11 and corresponding with close to infrared lamp 13.The infrared light that infrared light compensating lamp 12 emits converges under the action of light-supplementing lamp lens 18 Gather and projected in light filling window 1131, reduce the light quantity in other regions for being emitted to package wall 112 and encapsulation top 113.Together Reason, the infrared light emitted close to infrared lamp 13 are projected being converged to close under the action of lamp lens 19 close in window 1132, are subtracted It is emitted to the light quantity in other regions at package wall 112 and encapsulation top 113 less.Specifically, light-supplementing lamp lens 18 with close to lamp Lens 19 can be located at same transparent base on, more specifically, light-supplementing lamp lens 18 with can be transparent with this close to lamp lens 19 Matrix, which is integrally formed, to be made.Certainly, output module 10 can also be provided only with light-supplementing lamp lens 18 and close in lamp lens 19 One, light-supplementing lamp lens 18 can not also be set and close to lamp lens 19.
Referring to Fig. 3, in some embodiments, output module 10 further includes metal shutter 1a, metal shutter 1a In encapsulating housing 11, and metal shutter 1a is located at infrared light compensating lamp 12 and close between infrared lamp 13.Metal shutter 1a is located at infrared light compensating lamp 12 and close between infrared lamp 13, metal shutter 1a on the one hand can shield infrared light compensating lamp 12 with The electromagnetic interference mutual close to infrared lamp 13, infrared light compensating lamp 12 will not with the luminous intensity and sequential close to infrared lamp 13 Interact, another aspect metal shutter 1a can be used for completely cutting off 12 place cavity of infrared light compensating lamp with close to 13 institute of infrared lamp Cavity, light will not enter another cavity from a cavity.
4 are please referred to Fig.1, in some embodiments, output module 10 further includes optics sealing cover 1b.Optics sealing cover 1b is by saturating Luminescent material is made, and optics sealing cover 1b is formed on package substrate 111 and in encapsulating housing 11.Optics sealing cover 1b wraps red Outer light compensating lamp 12 and close to infrared lamp 13.Specifically, optics sealing cover 1b can be formed by encapsulating injection molding and forming technology, optics envelope Cover 1b may be used transparent thermosetting epoxy resin and be made, and to be not easy to soften in use, optics sealing cover 1b can fix red Outer light compensating lamp 12 and close to the relative position between infrared lamp 13, and cause infrared light compensating lamp 12 with being encapsulated close to infrared lamp 13 It is not easy to shake in housing 11.
In addition, please referring to Fig.1 4, output module 10 further includes out light clapboard 1c, goes out light clapboard 1c and is formed in optics sealing cover 1b It is interior and positioned at infrared light compensating lamp 12 and close between infrared lamp 13.Go out light clapboard 1c to can be used for interval infrared light compensating lamp 12 and approach Infrared lamp 13, the light that infrared light compensating lamp 12 is sent out will not be pierced by from close to window 1132, the light sent out close to infrared lamp 13 Line will not be pierced by from light filling window 1131.
5 are please referred to Fig.1, in some embodiments, proximity sensor 51 can be not integrated in reception mould with optical flame detector 52 In group 50, in other words, proximity sensor 51 is separately set with optical flame detector 52.At this point, proximity sensor 51 can be arranged on microscope base On 63 mounting surface 631；Optical flame detector 52 can also be arranged on the mounting surface 631 of microscope base 63；Or proximity sensor 51 and light Sensor 52 is arranged on the mounting surface 631 of microscope base 63 simultaneously.Microscope base 63 can be the microscope base 63 of infrared pick-up head 62, can also It is the microscope base 63 of visible image capturing head 61.
6 are please referred to Fig.1, cover board light filling through-hole 34 can also be offered in some embodiments, on cover board 30, cover board is mended Light through-hole 34 is corresponding with casing light filling through-hole 24, and the infrared light that infrared light compensating lamp 12 emits can be with after passing through casing light filling through-hole 24 Electronic device 100 is pierced by from cover board light filling through-hole 34.It at this point, can be with close to 23 corresponding position of through-hole with casing on cover board 30 Set it is infrared penetrate ink 40, user be difficult to close to through-hole 23 see by casing the inside of electronic device 100 close to infrared Lamp 13, the shape of electronic device 100 are more beautiful.
7 are please referred to Fig.1, cover board can also be opened up in some embodiments, on cover board 30 close to through-hole 33, cover board approaches Through-hole 33 is corresponding close to through-hole 23 with casing, and the infrared light emitted close to infrared lamp 13 passes through casing can be from close to after through-hole 23 Cover board is pierced by electronic device 100 close in through-hole 33.At this point, it can be set with 24 corresponding position of casing light filling through-hole on cover board 30 Infrared transmission ink 40 is put, user is difficult to see by casing light filling through-hole 24 infrared light compensating lamp of the inside of electronic device 100 12, the shape of electronic device 100 is more beautiful.
8 are please referred to Fig.1, in some embodiments, imaging modules 60 further include substrate 66, and imaging sensor 65 is arranged on On substrate 66, receiving module 50 may be also secured on substrate 66.Specifically, it is provided with FPC on substrate 66, one of substrate 66 Divide and be located in microscope base 63, another part is stretched out out of microscope base 63, and one end of FPC is located in microscope base 63 and is used to carry image sensing Device 65, the other end can be connect with the mainboard of electronic device 100.When receiving module 50 is arranged on substrate 66, receiving module 50 It is arranged on outside microscope base 63, receiving module 50 can also be connect with FPC.
Further, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, close to sensing Single package body structure is collectively formed with optical flame detector 52 in device 51, reduces gap when the two is individually assembled, saves in electronic device 100 Installation space.In other embodiments, the receiving module 50 for being arranged on substrate 66 includes proximity sensor 51 or/and light sensation Device 52, proximity sensor 51 and optical flame detector 52 are respectively single package body structure.That is, the receiving module 50 for being arranged on substrate 66 is single The proximity sensor 51 of package body structure；Alternatively, the receiving module 50 for being arranged on substrate 66 is the optical flame detector of single package body structure 52；Alternatively, the receiving module 50 for being arranged on substrate 66 is the proximity sensor 51 of single package body structure and single package body structure Optical flame detector 52.
Imaging modules 60 can be visible image capturing head 61 and one or two in infrared pick-up head 62.Specifically, Receiving module 50 can be fixed on the substrate 66 of visible image capturing head 61；Receiving module 50 can be fixed on infrared pick-up head On 62 substrate 66.When proximity sensor 51 and optical flame detector 52 are encapsulated for split, proximity sensor 51 can be fixed on visible On the substrate 66 of light video camera head 61, optical flame detector 52 can be fixed on the substrate 66 of infrared pick-up head 62；Alternatively, optical flame detector 52 It can be fixed on the substrate 66 of visible image capturing head 61, proximity sensor 51 can be fixed on the substrate of infrared pick-up head 62 On 66；Alternatively, proximity sensor 51 is each attached to optical flame detector 52 on the substrate 66 of visible image capturing head 61；Alternatively, close to passing Sensor 51 is each attached to optical flame detector 52 on the substrate 66 of infrared pick-up head 62.
Further, substrate 66 further includes stiffening plate, and stiffening plate is arranged on the side opposite with receiving module 50, to increase The integral strength of substrate 66 so that FPC is not susceptible to around folding, while receiving module 50 (or proximity sensor 51 or optical flame detector 52) It is not susceptible to shake when being arranged on substrate 66.In one example, receiving module 50 (or proximity sensor 51 or optical flame detector 52) it may be also secured on the lateral wall of microscope base 63, such as be fixed on the lateral wall of microscope base 63 by cohesive mode.
9 are please referred to Fig.1, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 include imaging sensor 65, camera case 67 and camera lens module 68.The top of camera case 67 Face 670 is cascaded surface, and top surface 670 includes the first sub- top surface 671, the second sub- top surface 672 and the sub- top surface 673 of third, the second son top 672 and first sub- top surface 671 of face tilts connection and forms notch 675, the sub- top surface 673 and second of third with the first sub- top surface 671 Sub- top surface 672 tilts connection, and the second sub- top surface 672 is between the first sub- top surface 671 and the sub- top surface 673 of third to connect first Sub- top surface 671 and the sub- top surface 673 of third.Angle between second sub- 672 and first sub- top surface 671 of top surface can be obtuse angle or straight Angle, the angle between the second sub- top surface 672 and the sub- top surface 673 of third can be obtuse angle or right angle.Notch 675 is opened in camera shell On one end of body 67, that is to say, that notch 675 is located at the marginal position of top surface 670.The sub- top surface 673 of third offers out Light through-hole 674, camera lens module 68 are housed in camera case 67 and corresponding with light extraction through-hole 674.Imaging sensor 65 is housed in In camera case 67 and corresponding with camera lens module 68, the light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens mould Group 68 is simultaneously transmitted on imaging sensor 65, and imaging sensor 65 converts optical signals to electric signal.Receiving module 50 is arranged on At first sub- top surface 671, receiving module 50 includes proximity sensor 51 and optical flame detector 52.In present embodiment, imaging modules 60 Can be visible image capturing head 61, receiving module 50 is single packaging body knot that proximity sensor 51 is collectively formed with optical flame detector 52 Structure.Proximity sensor 51 can be consistent with the extending direction of notch 675 (such as Figure 19 institutes with the center line connecting direction of optical flame detector 52 Show)；Alternatively, proximity sensor 51 can be vertical with the extending direction of notch 675 with the center line connecting direction of optical flame detector 52 or be in The angle that the two is formed is acute angle or obtuse angle.In other embodiments, imaging modules 60 can be infrared pick-up head 62.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the first sub- top surface On 671, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, saves Installation space in electronic device 100；Meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in gap when the two is individually assembled.
Please continue to refer to Figure 19, in some embodiments, the receiving module 50 of the above embodiment is arranged on the first son On top surface 671 and positioned at the outside of camera case 67, specifically, entire receiving module 50 is along perpendicular to the first sub- top surface 671 Projection can be located in the first sub- top surface 671 (as shown in figure 19)；Alternatively, part receiving module 50 is pushed up along perpendicular to the first son The projection in face 671 is located in the first sub- top surface 671.That is, receiving module 50 is at least part of to be located at the first sub- top surface 671 surface, in this way, receiving module 50 sets compacter with imaging modules 60, the horizontal space that the two occupies jointly compared with It is small, further save the installation space in electronic device 100.In other embodiments, receiving module 50 is included close to biography Sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single package body structures, at this point, being respectively The proximity sensor 51 and optical flame detector 52 of single package body structure can also be all disposed on the first sub- top surface 671.
Figure 20 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes proximity sensor 51, not comprising optical flame detector 52, tied at this point, proximity sensor 51 (or receiving module 50) is respectively monomer encapsulation with optical flame detector 52 Structure, proximity sensor 51 are arranged on the first sub- top surface 671, and optical flame detector 52 is arranged on any other except the first sub- top surface 671 Position.
Please continue to refer to Figure 20, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, and not comprising proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively monomer envelope with proximity sensor 51 Assembling structure, optical flame detector 52 are arranged on the first sub- top surface 671, proximity sensor 51 be arranged on except the first sub- top surface 671 other Any position.
Figure 21 is please referred to, the first sub- top surface 671 of the above embodiment offers loophole 676, and receiving module 50 is located at It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without light sensation Device 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 The light in portion can pass through loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on In camera case 67, receiving module 50 and the structure of camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging mould Group 60 is installed on casing 20.
Please continue to refer to Figure 21, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without connecing Nearly sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electricity Light outside sub-device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment Be arranged in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with Imaging modules 60 are installed on casing 20.
Figure 22 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 be integrated with it is close When sensor 51 is with optical flame detector 52, loophole 676 can be one and proximity sensor 51 and the corresponding light transmission of optical flame detector 52 Hole or two it is spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that light can pass through loophole 676 and be transmitted in receiving module 50.In other realities It applies in mode, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two Individually list package body structure, at this point, being respectively the proximity sensor 51 of single package body structure and optical flame detector 52 can also all set It puts in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, is made Receiving module 50 and the structure of camera case 67 are more stablized and convenient for receiving module 50 and imaging modules 60 are installed to casing On 20.
Figure 22 is please referred to, in some embodiments, the first sub- top surface 671 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 is also encapsulated for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, optical flame detector 52 is only included in receiving module 50, proximity sensor 51, which is not integrated into, to be connect It receives in module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also sealed for monomer Assembling structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when one of substrate 66 Divide and be located in camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate On 66 and outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
Figure 23 is please referred to, in some embodiments, the electronic device 100 and imaging modules 60 of the above embodiment can replace It is changed to lower structure：Imaging modules 60 take the photograph module to be double, including two imaging sensors 65, camera case 67 and two camera lens moulds Group 68.The top surface 670 of camera case 67 is cascaded surface, and top surface 670 includes the first tread 677, second less than the first tread 677 678 and first joint face 679a of tread.First joint face 679a and the second tread 678 tilt connection and with 678 shape of the second tread Into notch 675, the first joint face 679a and the first tread 677, which tilt, to be connected, the first joint face 679a be located at the first tread 677 with With the first tread 677 of connection and the second tread 678 between second tread 678.Between first joint face 679a and the first tread 677 Angle can be obtuse angle or right angle, the angle between the first joint face 679a and the second tread 678 can be obtuse angle or right angle. Notch 675 is opened on an end of camera case 67, that is to say, that notch 675 is located at the marginal position of top surface 670.Two A light extraction through-hole 674 is opened on the first tread 677 and is respectively positioned on the same side of notch 675, in two light extraction through-holes 674 Heart line is vertical with the extending direction of notch 675.Two camera lens modules 68 be housed in camera case 67 and with two light extractions Through-hole 674 corresponds to respectively, and two imaging sensors 65 are housed in camera case 67 and corresponding respectively with two camera lens modules 68, Light outside electronic device 100 can pass through light extraction through-hole 674 and camera lens module 68 and be transmitted on imaging sensor 65.This reality It applies in mode, imaging modules 60 can be visible image capturing head 61, and two camera lens modules 68 are visible image capturing head 61 at this time Corresponding camera lens module.Receiving module 50 is arranged on the second tread 678 and outside camera case 67.Receiving module 50 is connects Single package body structure that nearly sensor 51 is collectively formed with optical flame detector 52.The line of centres side of proximity sensor 51 and optical flame detector 52 To can be consistent with the extending direction of notch 675；Alternatively, the center line connecting direction of proximity sensor 51 and optical flame detector 52 can be with The angle that the extending direction of notch 675 vertical (as shown in figure 23) or the two are formed is acute angle or obtuse angle.In other embodiment In, imaging modules 60 can be infrared pick-up head 62, and two camera lens modules 68 are that infrared pick-up head 62 is corresponding at this time Camera lens module.In yet another embodiment, imaging modules 60 include visible image capturing head 61 and infrared pick-up head 62, at this time its In camera lens module 68 be 62 corresponding camera lens module of infrared pick-up head, another camera lens module 68 is visible image capturing head 61 corresponding camera lens modules.
The imaging modules 60 of present embodiment offer notch 675, and receiving module 50 is arranged on the second tread 678 On, receiving module 50 is made to set compacter with imaging modules 60, the horizontal space that the two occupies jointly is smaller, has saved electronics Installation space in device 100；Both meanwhile proximity sensor 51 and optical flame detector 52 are packaged into receiving module 50 jointly, reduce The installation space in electronic device 100 is saved in individually gap during assembling.
Figure 24 is please referred to, in some embodiments, the notch 675 of the above embodiment is opened in the centre of top surface 670 On position, 677 incision 675 of the first tread is separated into the first sub- sub- tread 677b of tread 677a and second, the first sub- tread The sub- tread 677b of 677a and second are located at the opposite sides of notch 675 respectively, and two light extraction through-holes 674 are opened in the first son respectively On the sub- tread 677b of tread 677a and second, the camera lens module 68 in camera case 67 also is located at the opposite of notch 675 Both sides.At this point, notch 675 is surrounded by the second tread 678, the first joint face 679a and the second joint face 679b, the first joint face 679a tilts the first sub- top surface 677a of connection and the second tread 678 and between the first sub- top surface 677a and the second tread 678, Second joint face 679b tilts the second sub- top surface 677b of connection and the second tread 678 and positioned at the ladder of the second sub- top surface 677b and second Between face 678.In present embodiment, the first tread 677 is parallel with the second tread 678, the son ladders of the first joint face 679a and first The angle of face 677a is obtuse angle, and the angle of the sub- tread 677b of the second joint face 679b and second is obtuse angle.In other embodiment In, the angle of the sub- tread 677a of the first joint face 679a and first is right angle, the sub- tread 677b of the second joint face 679b and second Angle be right angle.Relative to the marginal position that notch 675 is opened in top surface 670, the notch 675 of present embodiment is opened in The centre position of top surface 670 can make the width of notch 675 wider, consequently facilitating receiving module 50 is arranged on the second tread On 678.
Figure 23 and Figure 24 is please referred to, in some embodiments, the receiving module 50 of the above embodiment is arranged on second On tread 678 and positioned at the outside of camera case 67.Specifically, it is whole when notch 675 is opened in the marginal position of top surface 670 A receiving module 50 can be located in the second tread 678 along perpendicular to the projection of the second tread 678；Alternatively, part receives mould Group 50 is located at along the projection perpendicular to the second tread 678 in the second tread 678 (as shown in figure 23).That is, receiving module The 50 at least part of surfaces for being located at the second tread 678.It is whole when notch 675 is opened on the centre position of top surface 670 A receiving module 50 can be located in the second tread 678 (as shown in figure 24) along perpendicular to the projection of the second tread 678.Such as This, receiving module 50 sets compacter with imaging modules 60, and the horizontal space that the two occupies jointly is smaller, further saves Installation space in electronic device 100.In other embodiments, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are two individual single package body structures, at this point, being respectively single package body structure Proximity sensor 51 and optical flame detector 52 can also be all disposed on the second tread 678.
Figure 24 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes close to sensing Device 51, receiving module 50 does not include optical flame detector 52, at this point, proximity sensor 51 (or receiving module 50) is respectively with optical flame detector 52 Cell packaging configuration, proximity sensor 51 are arranged on the second tread 678, and optical flame detector 52 is arranged on the casing outside imaging modules 60 On 20.
Figure 24 is please referred to, in some embodiments, the receiving module 50 of the above embodiment only includes optical flame detector 52, Receiving module 50 does not include proximity sensor 51, at this point, optical flame detector 52 (or receiving module 50) is respectively with proximity sensor 51 Cell packaging configuration, optical flame detector 52 are arranged on the second tread 678, and proximity sensor 51 is arranged on the casing outside imaging modules 60 On 20.
Figure 25 is please referred to, the second tread 678 of the above embodiment offers loophole 676, and receiving module 50 is located at phase It is in casing body 67 and corresponding with loophole 676.Specifically, when receiving module 50 only includes proximity sensor 51 without optical flame detector 52, and optical flame detector 52 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, outside electronic device 100 Light can pass through and loophole 676 and be transmitted on proximity sensor 51.The receiving module 50 of present embodiment is arranged on phase In casing body 67, the structure of receiving module 50 and camera case 67 is made more to stablize and be convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 25, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 It is in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 comprises only optical flame detector 52 without close Sensor 51, and proximity sensor 51 be arranged on camera case 67 it is outer when, the quantity of loophole 676 can be one, electronics Light outside device 100 can pass through loophole 676 and be transmitted on optical flame detector 52.The receiving module 50 of present embodiment is set Put in camera case 67, make the structure of receiving module 50 and camera case 67 more stablize and convenient for by receiving module 50 with into As module 60 is installed on casing 20.
Figure 26 is please referred to, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, Receiving module 50 is located in camera case 67 and corresponding with loophole 676.Specifically, when receiving module 50 is integrated with close to sensing When device 51 and optical flame detector 52, loophole 676 can be one with proximity sensor 51 and the corresponding loophole of optical flame detector 52 or Two spaced and respectively with 52 corresponding loophole of proximity sensor 51 and optical flame detector, the light outside electronic device 100 On the proximity sensor 51 and optical flame detector 52 that loophole 676 can be passed through and be transmitted in receiving module 50.In other embodiment party In formula, receiving module 50 includes proximity sensor 51 and optical flame detector 52, but proximity sensor 51 and optical flame detector 52 are independent for two Single package body structure, at this point, being respectively the proximity sensor 51 of single package body structure and optical flame detector 52 can also be all disposed within It is in camera case 67 and corresponding with loophole 676.The receiving module 50 of present embodiment is arranged in camera case 67, makes reception The structure of module 50 and camera case 67 is more stablized and convenient for receiving module 50 and imaging modules 60 are installed on casing 20.
Please continue to refer to Figure 26, in some embodiments, the second tread 678 of the above embodiment offers loophole 676, receiving module 50 is located in camera case 67 and corresponding with loophole 676.Imaging modules 60 further include substrate 66, and image passes Sensor 65 is arranged on substrate 66, and receiving module 50 may be also secured on substrate 66 and be housed in camera case 67.Specifically Ground is provided with FPC on substrate 66, and one end of FPC is located in camera case 67 and for carrying imaging sensor 65, and the other end can It is connect with the mainboard with electronic device 100.In other embodiments, receiving module 50 can also be connect with FPC.This embodiment party In formula, the receiving module 50 being arranged on substrate 66 includes proximity sensor 51 and optical flame detector 52, proximity sensor 51 and light sensation Single package body structure is collectively formed in device 52, reduces gap when the two is individually assembled, and the installation saved in electronic device 100 is empty Between.
In other embodiments, receiving module 50 only includes proximity sensor 51, and optical flame detector 52 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of proximity sensor 51, and optical flame detector 52 is also encapsulated for monomer Structure, optical flame detector 52 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 is located at In camera case 67, when another part is stretched out out of camera case 67, optical flame detector 52 can also be fixed on substrate 66 and be located at Outside camera case 67.
In yet another embodiment, receiving module 50 only includes optical flame detector 52, and proximity sensor 51 is not integrated into reception In module 50, that is to say, that receiving module 50 is the cell packaging configuration of optical flame detector 52, and proximity sensor 51 is also encapsulated for monomer Structure, proximity sensor 51 can be fixed on substrate 66 and be housed in camera case 67；Alternatively, when a part for substrate 66 In camera case 67, when another part is stretched out out of camera case 67, proximity sensor 51 can also be fixed on substrate 66 It goes up and is located at outside camera case 67.
The receiving module 50 of present embodiment is arranged in camera case 67, makes the knot of receiving module 50 and camera case 67 Structure is more stablized and convenient for receiving module 50 and imaging modules 60 is installed on casing 20；Meanwhile imaging modules 60 set base Receiving module 50 is simultaneously arranged on substrate 66 by plate 66, and receiving module 50 is enable to be firmly mounted in camera case 67.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " means with reference to the embodiment Or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the present invention. In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, description Particular features, structures, materials, or characteristics can be in any one or more embodiments or example with suitable side Formula combines.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one feature.In the description of the present invention, " multiple " are meant that at least two, such as two, Three, unless otherwise specifically defined.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art within the scope of the invention can be to above-mentioned Embodiment is changed, changes, replacing and modification, the scope of the present invention are limited by claim and its equivalent.

Claims (17)

1. a kind of electronic device, which is characterized in that including：
Casing；
Module is exported, the output module is arranged in the casing, and the output module includes encapsulating housing, infrared light filling Lamp and close to infrared lamp, the encapsulating housing includes package substrate, and the infrared light compensating lamp is encapsulated in described close to infrared lamp In the encapsulating housing and carry on the package substrate, the infrared light compensating lamp with it is described can be with difference close to infrared lamp Power emit infrared light outside the encapsulating housing；
Module is vibrated, the vibration module installation is on the housing；
Piezoelectric element, the piezoelectric element are combined with the vibration module and export module interval, the piezoelectric element with described For being deformed upon when being applied in electric signal so that the vibration module vibration；
The imaging modules of installation on the housing, the imaging modules include camera case and camera lens module, the camera shell The top surface of body is for cascaded surface and including connected the first sub- top surface and the second sub- top surface, the second sub- top surface relatively described first Sub- top surface inclination simultaneously forms notch with the described first sub- top surface, and the top surface offers light extraction through-hole, the camera lens module receiving It is in the camera case and corresponding with the light extraction through-hole；With
The receiving module being arranged at the described first sub- top surface, the receiving module include proximity sensor and/or optical flame detector.
2. electronic device according to claim 1, which is characterized in that the vibration module includes display screen and the lid of light transmission Host cavity is collectively formed on the housing and with the casing in plate, the display screen setting, and the cover board is arranged on the machine On shell and positioned at the side far from the host cavity of the display screen, the display screen is combined with the cover board, the casing Offer spaced casing close to through-hole, casing light filling through-hole and casing vibrate through-hole, it is described close to infrared lamp with it is described Casing is corresponded to close to through-hole, and the infrared light compensating lamp is corresponding with the casing light filling through-hole, and the piezoelectric element is housed in described It is combined in casing vibration through-hole and with the cover board.
3. electronic device according to claim 2, which is characterized in that the piezoelectric element and the display screen pass through engagement Part is attached on the cover board.
4. electronic device according to claim 1, which is characterized in that the output module further includes chip, described infrared Light compensating lamp is formed in close to infrared lamp on a piece of chip with described.
5. electronic device according to claim 1, which is characterized in that the encapsulating housing further includes package wall and encapsulation Top, the package wall extend from the package substrate and are connected at the top of the encapsulation between the package substrate, institute It states encapsulation top and is formed with light filling window and close to window, the light filling window is corresponding with the infrared light compensating lamp, described close Window with it is described corresponding close to infrared lamp.
6. electronic device according to claim 1, which is characterized in that the output module further includes light-supplementing lamp lens, institute Light-supplementing lamp lens are stated to be arranged in the encapsulating housing and corresponding with the infrared light compensating lamp；And/or
The output module is further included close to lamp lens, described to be arranged in the encapsulating housing close to lamp lens and connect with described Near-infrared lamp corresponds to.
7. electronic device according to claim 1, which is characterized in that the output module, which further includes, is arranged on the encapsulation Light-supplementing lamp lens in housing and close to lamp lens, the light-supplementing lamp lens are corresponding with the infrared light compensating lamp, described close to lamp With described corresponding close to infrared lamp, the light-supplementing lamp lens are located at close to lamp lens on same transparent base lens with described.
8. electronic device according to claim 1, which is characterized in that the output module further includes metal shutter, institute Metal shutter is stated to be located in the encapsulating housing and positioned at the infrared light compensating lamp and described close between infrared lamp.
9. electronic device according to claim 1, which is characterized in that the output module is further included to be made of translucent material Optics sealing cover, the optics sealing cover formed on the package substrate and in the encapsulating housing, the optics sealing cover Wrap the infrared light compensating lamp and described close to infrared lamp.
10. electronic device according to claim 9, which is characterized in that the output module further includes out light clapboard, described Go out light clapboard to be formed in the optics sealing cover and positioned at the infrared light compensating lamp and described close between infrared lamp.
11. electronic device according to claim 1, which is characterized in that be formed with grounding pin on the output module, mend Light lamp pin and close to lamp pin, the grounding pin and the light compensating lamp pin be enabled when, infrared light compensating lamp transmitting Infrared light；The grounding pin and it is described close to lamp pin be enabled when, it is described close to infrared lamp emit infrared light.
12. electronic device according to claim 2, which is characterized in that the surface shape that the cover board is combined with the casing The infrared through ink of infrared light is only transmitted into having, the infrared ink that penetrates blocks the casing close to through-hole, the casing At least one of light filling through-hole and casing vibration through-hole.
13. electronic device according to claim 1, which is characterized in that the imaging modules include visible image capturing head and At least one of infrared pick-up head.
14. electronic device according to claim 2, which is characterized in that the imaging modules include infrared pick-up head and Visible image capturing head, the electronic device further include structured light projector, the output module, the infrared pick-up head, institute The center for stating visible image capturing head, the piezoelectric element and the structured light projector is located on same line segment, from the line segment One end be followed successively by the other end：
The output module, the structured light projector, the piezoelectric element, the infrared pick-up head, the visible ray are taken the photograph As head；Or
The output module, the infrared pick-up head, the piezoelectric element, the visible image capturing head, the structure light are thrown Emitter；Or
The infrared pick-up head, the output module, the piezoelectric element, the visible image capturing head, the structure light are thrown Emitter；Or
The infrared pick-up head, the visible image capturing head, the piezoelectric element, the output module, the structure light are thrown Emitter.
15. electronic device according to claim 2, which is characterized in that the imaging modules include infrared pick-up head and Visible image capturing head, the electronic device further include structured light projector, the output module, the infrared pick-up head, institute The center for stating visible image capturing head and the structured light projector is located on same line segment, and the piezoelectric element is located at the line segment Between the top of the casing.
16. electronic device according to claim 2, which is characterized in that the imaging modules include infrared pick-up head and Visible image capturing head, the electronic device further include structured light projector, and the quantity of the piezoelectric element is multiple, the casing The quantity for vibrating through-hole is multiple, and multiple piezoelectric elements are corresponding with multiple casing vibration through-holes, each piezoelectricity Element is housed in the corresponding casing vibration through-hole, and the output module, the infrared pick-up head, the visible ray are taken the photograph As the center of head, multiple piezoelectric elements and the structured light projector is located on same line segment, the two neighboring piezoelectricity The output module, the infrared pick-up head, the visible image capturing head and the project structured light are provided between element At least one of device.
17. electronic device according to claim 2, which is characterized in that the imaging modules include infrared pick-up head and Visible image capturing head, the electronic device further include structured light projector, and the piezoelectric element includes piezoelectric body and described in The piezoelectricity convex block that piezoelectric body is stretched out, the quantity of the casing vibration through-hole is multiple, multiple piezoelectricity convex blocks and multiple institutes Casing vibration through-hole is stated to correspond to, each piezoelectricity convex portion be housed in the corresponding casing vibration through-hole and with it is described Cover board combines, the output module, the infrared pick-up head, the visible image capturing head and the structured light projector position Between the cover board and the piezoelectric body, it is described output module, the infrared pick-up head, the visible image capturing head, The center of multiple piezoelectricity convex blocks and the structured light projector is located on same line segment, the two neighboring piezoelectricity convex block it Between be provided in the output module, the infrared pick-up head, the visible image capturing head and the structured light projector It is at least one.
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Address before: 523860 No. 18, Wu Sha Beach Road, Changan Town, Dongguan, Guangdong

Applicant before: Guangdong OPPO Mobile Communications Co., Ltd.

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