CN108269796B - Packaging structure and packaging method of remote sensor - Google Patents
Packaging structure and packaging method of remote sensor Download PDFInfo
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- CN108269796B CN108269796B CN201611256204.7A CN201611256204A CN108269796B CN 108269796 B CN108269796 B CN 108269796B CN 201611256204 A CN201611256204 A CN 201611256204A CN 108269796 B CN108269796 B CN 108269796B
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- 238000004806 packaging method and process Methods 0.000 title claims description 31
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000000084 colloidal system Substances 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 230000000903 blocking effect Effects 0.000 claims abstract description 7
- 239000008393 encapsulating agent Substances 0.000 claims description 20
- 238000000465 moulding Methods 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims 2
- 238000004382 potting Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- MPDDTAJMJCESGV-CTUHWIOQSA-M (3r,5r)-7-[2-(4-fluorophenyl)-5-[methyl-[(1r)-1-phenylethyl]carbamoyl]-4-propan-2-ylpyrazol-3-yl]-3,5-dihydroxyheptanoate Chemical compound C1([C@@H](C)N(C)C(=O)C2=NN(C(CC[C@@H](O)C[C@@H](O)CC([O-])=O)=C2C(C)C)C=2C=CC(F)=CC=2)=CC=CC=C1 MPDDTAJMJCESGV-CTUHWIOQSA-M 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
A package structure of a remote sensor comprises a substrate, a light emitting chip, a sensing chip, two package colloids, a sealing cover and two shielding means, wherein the substrate is provided with a bearing surface, the light emitting chip is arranged on the bearing surface, the sensing chip is arranged on the bearing surface and is separated from the light emitting chip, the two package colloids respectively coat the light emitting chip and the sensing chip, the top surface of each package colloid forms a lens part and a shoulder part, the sealing cover is formed on the bearing surface and each package colloid, the sealing cover is provided with a light emitting hole and a light receiving hole which are respectively used for accommodating the lens part and the shoulder part on the top surface of each package colloid, and the two shielding means are respectively arranged on each shoulder part and are used for blocking light rays from passing through each shoulder part.
Description
Technical Field
The present invention relates to a package structure, and more particularly, to a package structure of a remote sensor and a method for packaging the same.
Background
In a conventional remote sensor package structure, a light emitting chip and a sensing chip are disposed on a substrate, two Molding compounds are used to respectively cover the light emitting chip and the sensing chip, a hemispherical lens is formed on a top surface of each Molding compound to correspond to the light emitting chip and the sensing chip, and a cap is disposed above the substrate and each Molding compound to complete the entire package process.
However, in the method of forming the cap by using the molding process, since the molding die cannot approach each lens portion, the inner wall surfaces of the light emitting hole and the light receiving hole are usually spaced from each lens portion by a distance, so that the sensing distance of the remote sensor is short, and the sensing accuracy of the chip is reduced due to the external light noise.
Disclosure of Invention
In view of the above, the present invention provides a package structure of a remote sensor, which has the advantages of a longer sensing distance and a higher sensing accuracy.
The packaging structure of the remote sensor comprises a substrate, a light emitting chip, a sensing chip, two packaging colloid, a sealing cover and two shielding means, wherein the substrate is provided with a bearing surface, the light emitting chip is arranged on the bearing surface, the sensing chip is arranged on the bearing surface and is separated from the light emitting chip, the two packaging colloid respectively coat the light emitting chip and the sensing chip, the top surface of each packaging colloid forms a lens part and a shoulder part, the sealing cover is formed on the bearing surface and each packaging colloid, the sealing cover is provided with a light emitting hole and a light receiving hole respectively for accommodating the lens part and the shoulder part on the top surface of each packaging colloid, and the two shielding means are respectively arranged on each shoulder part and are used for blocking light rays from passing through each shoulder part.
Another object of the present invention is to provide a method for packaging a remote sensor, comprising the following steps:
(a) providing a substrate, and arranging a light-emitting chip and a sensing chip on the bearing surface of the substrate in a mutually separated manner;
(b) the two packaging colloid are separated from each other and respectively coat the light-emitting chip and the sensing chip, and a lens part and a shoulder part are formed on the top surface of each packaging colloid;
(c) forming a sealing cover with a light emitting hole and a light receiving hole on the packaging colloid and the bearing surface of the substrate, so that the light emitting hole and the light receiving hole respectively accommodate the lens part and the shoulder part on the top surface of the packaging colloid; and
(d) two shielding means are formed on each shoulder respectively for blocking light passing through each shoulder.
Therefore, each shielding means can prevent light from passing through the shoulder part of the top surface of each packaging colloid, and external light noise interference is reduced, so that the sensing distance and the sensing accuracy of the remote sensor are improved.
The detailed structure and features of the present invention will be described in the following detailed description of the embodiments. However, it should be understood by those skilled in the art that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Drawings
FIG. 1 is a top view of a first preferred embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1, illustrating the positional relationship of the components within the package structure;
FIG. 3 is a cross-sectional view of a second preferred embodiment of the present invention;
FIGS. 4A-4E are packaging flow diagrams of the first preferred embodiment of the present invention;
FIGS. 5A-5F are packaging flow charts of a second preferred embodiment of the present invention.
[ Main element ]
10. 10' a package structure of a remote sensor;
20 a substrate;
30 light emitting chips;
40 a sensing chip;
50. 50' encapsulating the colloid;
60, sealing the cover;
70. 70' shielding means;
22 a bearing surface;
a 52 lens part;
54 shoulder portion;
62 light emitting holes;
64 light receiving apertures;
72 a viscous gel;
622. 642 inner wall surface;
74 a lens ring;
522 side surface.
Detailed Description
Referring to fig. 1-2, a package structure 10 of a remote sensor according to a first preferred embodiment of the present invention includes a substrate 20, a light emitting chip 30, a sensing chip 40, two molding compounds 50, a cap 60, and two shielding means 70.
The substrate 20 has a carrying surface 22, and the substrate 20 can be a Printed Circuit Board (PCB), a bismaleimide triazine substrate (BT), a glass fiber substrate (FR 4), or a direct copper clad substrate (DBC), but not limited thereto, so that the production cost of the substrate 20 is low.
The light emitting chip 30 is disposed on the supporting surface 22 and electrically connected to the substrate 20 by a Wire Bonding process (Wire Bonding), in the preferred embodiment, the light emitting chip 30 is an LED chip and can be used to emit light.
The sensing chip 40 is disposed on the supporting surface 22 and separated from the light emitting chip 30, wherein the sensing chip 40 is electrically connected to the substrate 20 by a wire bonding process, and the sensing chip 40 is used for sensing a light source emitted by the light emitting chip 30.
The two molding compounds 50 respectively cover the light emitting chip 30 and the sensing chip 40, a lens portion 52 and a shoulder portion 54 are formed on the top surface of each molding compound 50, in the preferred embodiment, the shoulder portion 54 on the top surface of each molding compound 50 surrounds the lens portion 52, and each lens portion 52 is hemispherical.
The cover 60 is formed on the carrying surface 22 and each encapsulant 50, the cover 60 has a light emitting hole 62 and a light receiving hole 64, the light emitting hole 62 and the light receiving hole 64 are respectively used for accommodating the lens portion 52 and the shoulder portion 54 of the top surface of each encapsulant 50, in the preferred embodiment, the lens portion 52 of the top surface of each encapsulant 50 protrudes out of the light emitting hole 62 and the light receiving hole 64.
The two shielding means 70 are respectively disposed on the shoulder 54 of the top surface of each encapsulant 50 for blocking light from passing through each shoulder 54, and the height of each shielding means 70 is lower than the height of each lens portion 52. in the preferred embodiment, each shielding means 70 is formed by coating an opaque adhesive 72, such as an opaque Epoxy Resin (Epoxy Resin), on the shoulder 54 of the top surface of each encapsulant 50 by a Dispensing process (Dispensing), so that the opaque adhesive 72 can adhere to the shoulder 54, the inner wall surfaces (622, 642) of the light emitting holes 62 (light receiving holes 64) and the side surface 522 of the lens portion 52, in practice, the opaque adhesive 72 can cover any opaque material, and in the preferred embodiment, the top surface of each shielding means 70 (opaque adhesive 72) is flush with the top surface of the encapsulant 60.
Referring to fig. 3, in the second preferred embodiment, each shielding means 70' is formed by fixing a lens ring 74 to the shoulder 54 of the top surface of each molding compound 50 through an opaque adhesive 72. The lens ring 74 may be made of a transparent or opaque material, such as, but not limited to, a transparent Epoxy (Epoxy Resin) or an opaque Epoxy (Epoxy Resin), wherein the top surface of each shielding means 70' (lens ring 74) is flush with the top surface of the cover 60.
Referring to fig. 4A to 4E, a method for packaging a package structure 10 of a remote sensor according to a first preferred embodiment of the present invention includes the following steps:
step (a): a substrate 20 is provided, and a light emitting chip 30 and a sensing chip 40 are separately disposed on the carrying surface 22 of the substrate 20.
Step (b): it should be noted that in the preferred embodiment, a single encapsulant 50 'is used to encapsulate the light emitting chip 30 and the sensing chip 40 by Molding (Molding), and the single encapsulant 50' is cut into two encapsulant 50 separated from each other by cutting (cutting), and the two encapsulant 50 respectively encapsulate the light emitting chip 30 and the sensing chip 40.
Step (c): a cap 60 having a light emitting hole 62 and a light receiving hole 64 is formed on each encapsulant 50 and the carrying surface 22 of the substrate 20, so that the light emitting hole 62 and the light receiving hole 64 respectively receive the lens portion 52 and the shoulder portion 54 of the top surface of each encapsulant 50, and it should be noted that in the preferred embodiment, the cap 60 is formed by Molding (Molding).
Step (d): two shielding means 70 are formed on each shoulder 54 respectively for blocking light from passing through each shoulder 54, and further, in the preferred embodiment, each shielding means 70 is formed by coating an opaque adhesive 72 on each shoulder 54 through a Dispensing process (Dispensing) so that the opaque adhesive 72 can adhere to the shoulders 54, the inner wall surfaces (622, 642) of the light emitting holes 62 (light receiving holes 64) and the side surfaces 522 of the lens portions 52, and in the preferred embodiment, the top surface of each shielding means 70 (opaque adhesive 72) is flush with the top surface of the cover 60.
Referring to fig. 5A to 5F, a method for packaging a remote sensor package structure 10 ' according to a second preferred embodiment of the present invention is shown, wherein steps (a) to (c) of the present preferred embodiment are the same as those of the first preferred embodiment, and are not repeated herein, but the difference is two shielding means 70 ' described in step (d) of the second preferred embodiment, and further, in step (d) of the packaging method according to the second preferred embodiment, each shielding means 70 ' coats the opaque adhesive 72 on the shoulder 54 on the top surface of each encapsulant 50 by a Dispensing process (Dispensing), and then a lens ring 74 is disposed on the shoulder 54 on the top surface of each encapsulant 50, and after the Baking process (Baking), each lens ring 74 is fixed to the shoulder 54 on the top surface of each encapsulant 50 by the opaque adhesive 72.
Therefore, each shielding means (70, 70') can block light from passing through the shoulder 54 on the top surface of each encapsulant 50, and simultaneously reduce the external light noise interference, thereby improving the sensing distance and sensing accuracy of the remote sensor.
Finally, it should be noted that the components disclosed in the foregoing embodiments are merely exemplary and are not intended to limit the scope of the invention, and other equivalent components may be substituted or modified within the scope of the claims.
Claims (9)
1. A remote sensor package comprising:
a substrate having a carrying surface;
a light emitting chip arranged on the bearing surface;
the sensing chip is arranged on the bearing surface and is separated from the light-emitting chip;
two encapsulation colloid, wrap the chip of the light-emitting and should detect the chip separately, every top surface of encapsulation colloid forms a lens portion and a shoulder;
a sealing cover formed on the bearing surface and each of the encapsulant, the sealing cover having a light emitting hole and a light receiving hole for accommodating the lens part and the shoulder part of the top surface of each of the encapsulant; and
two shielding means respectively arranged on the shoulders for blocking light from passing through the shoulders, and the shielding means are respectively attached to the lens part of the packaging colloid without gaps, and the top edge of each lens part protrudes out of the shielding means.
2. The remote sensor package of claim 1, wherein a shoulder on a top surface of each encapsulant surrounds said lens portion.
3. The remote sensor package according to claim 2, wherein each of said shielding means is an opaque adhesive.
4. The remote sensor package structure as claimed in claim 2, wherein each of said shielding means is formed by fixing a lens ring to a shoulder portion of a top surface of each of said molding compounds via a light-tight adhesive.
5. The remote sensor package as set forth in claim 1 wherein each of said lens portions is hemispherical.
6. A method for packaging a remote sensor, comprising the steps of:
(a) providing a substrate, and arranging a light-emitting chip and a sensing chip on the bearing surface of the substrate in a mutually separated manner;
(b) the two packaging colloid are separated from each other and respectively coat the light-emitting chip and the sensing chip, and a lens part and a shoulder part are formed on the top surface of each packaging colloid;
(c) forming a sealing cover with a light emitting hole and a light receiving hole on the packaging colloid and the bearing surface of the substrate, so that the light emitting hole and the light receiving hole respectively accommodate the lens part and the shoulder part on the top surface of the packaging colloid; and
(d) two shielding means are respectively formed on each shoulder part and used for blocking light rays from passing through each shoulder part, each shielding means is respectively attached to the lens part of each packaging colloid without gaps, and the top edge of each lens part protrudes out of each shielding means.
7. The method for packaging a remote sensor as claimed in claim 6, wherein in the step (b), the respective molding compounds are separated from each other by cutting.
8. A method of packaging remote sensors as claimed in claim 6, wherein in step (b), a shoulder on the top surface of each of the potting compounds surrounds the lens portion.
9. The method of claim 8, wherein in step (d), each of said shielding means fixedly attaches a lens ring to a shoulder on the top surface of each of said encapsulants via a light-impermeable adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201611256204.7A CN108269796B (en) | 2016-12-30 | 2016-12-30 | Packaging structure and packaging method of remote sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611256204.7A CN108269796B (en) | 2016-12-30 | 2016-12-30 | Packaging structure and packaging method of remote sensor |
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| CN108269796A CN108269796A (en) | 2018-07-10 |
| CN108269796B true CN108269796B (en) | 2020-09-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111613677A (en) * | 2020-04-22 | 2020-09-01 | 福建天电光电有限公司 | Photoelectric switch packaging structure and packaging method |
| CN112014831B (en) * | 2020-09-25 | 2024-04-26 | 闪耀现实(无锡)科技有限公司 | Sensing device, intelligent glasses and lens for sensing device |
| CN113809060B (en) * | 2021-08-17 | 2023-10-03 | 弘凯光电(江苏)有限公司 | Distance sensor packaging structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104122990A (en) * | 2013-04-29 | 2014-10-29 | 敦南科技股份有限公司 | Motion sensor and packaging method thereof |
| TW201505133A (en) * | 2013-07-25 | 2015-02-01 | Lingsen Precision Ind Ltd | Packaging structure of optical module |
| CN105206627A (en) * | 2014-06-13 | 2015-12-30 | 亿光电子工业股份有限公司 | Optical sensor and manufacturing method thereof |
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|---|---|---|---|---|
| US8957380B2 (en) * | 2009-06-30 | 2015-02-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104122990A (en) * | 2013-04-29 | 2014-10-29 | 敦南科技股份有限公司 | Motion sensor and packaging method thereof |
| TW201505133A (en) * | 2013-07-25 | 2015-02-01 | Lingsen Precision Ind Ltd | Packaging structure of optical module |
| CN105206627A (en) * | 2014-06-13 | 2015-12-30 | 亿光电子工业股份有限公司 | Optical sensor and manufacturing method thereof |
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