TW202310434A - Distance sensor packaging structure - Google Patents

Distance sensor packaging structure Download PDF

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TW202310434A
TW202310434A TW110135647A TW110135647A TW202310434A TW 202310434 A TW202310434 A TW 202310434A TW 110135647 A TW110135647 A TW 110135647A TW 110135647 A TW110135647 A TW 110135647A TW 202310434 A TW202310434 A TW 202310434A
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light
hole
distance sensor
chip
lens module
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TW110135647A
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TWI782715B (en
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溫錦賢
何俊杰
廖本瑜
黃建中
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大陸商弘凱光電(江蘇)有限公司
弘凱光電股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06Systems determining position data of a target
    • G01S17/08Systems determining position data of a target for measuring distance only
    • G01S17/10Systems determining position data of a target for measuring distance only using transmission of interrupted, pulse-modulated waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481Constructional features, e.g. arrangements of optical elements
    • G01S7/4811Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481Constructional features, e.g. arrangements of optical elements
    • G01S7/4811Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813Housing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • H01L31/02325Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02253Out-coupling of light using lenses

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Optics & Photonics (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Geophysics And Detection Of Objects (AREA)

Abstract

The invention is suitable for the technical field of distance sensors, and provides a distance sensor packaging structure, which comprises a substrate, a chip assembly, a light-transmitting assembly and a shell covering the substrate, wherein the chip assembly comprises a light-emitting chip and a sensing chip which are arranged on the substrate at intervals, the light-transmitting assembly comprises a light-transmitting piece and a lens module which are arranged at an interval, the light-transmitting piece and the light-emitting chip are correspondingly arranged so as to make light emitted by the light-emitting chip pass through the light-transmitting piece, the lens module is arranged corresponding to a receiving end photosensitive area so as to make the light emitted by the light-emitting chip be reflected by a detected object and the reflected light pass through the receiving end photosensitive area of the sensing chip and be converged to the receiving end photosensitive area of the sensing chip, and the lens module is molded on the substrate and covers the receiving end photosensitive area of the sensing chip. According to the distance sensor packaging structure provided by the invention, the distance sensor packaging process is simplified, the production efficiency, the assembly precision and the waterproof performance are improved, and the manufacturing cost and the product reject ratio of the distance sensor are further reduced.

Description

距離感測器封裝結構Distance sensor package structure

本發明屬於距離感測器的技術領域,尤其涉及一種距離感測器封裝結構。The invention belongs to the technical field of distance sensors, in particular to a package structure of distance sensors.

距離感測器是一種借助光束在發射面和接收面之間的往返飛行時間來測量物體距離的測距裝置,廣泛應用於手機攝像頭自動對焦、無人機駕駛、3D(three dimensions)建模等領域。未來將會在3D人臉識別、人臉支付等安全領域的應用越來越成熟。距離感測器一般包括基板、安裝於基板上的晶片組件、安裝於晶片組件上方的透光組件和殼體。其中,透光組件包括透鏡、濾光片等多個部件,一般通過膠接方式與殼體固定連接。其中,透鏡裝配必須精準,導致距離感測器的整個封裝製程複雜,製造成本高。同時,又由於距離感測器中各透光件分別通過膠接方式與殼體連接,使得其防水性能差,只能在室內使用。The distance sensor is a distance measuring device that measures the distance of an object by means of the round-trip flight time of the light beam between the transmitting surface and the receiving surface. It is widely used in mobile phone camera autofocus, drone driving, 3D (three dimensions) modeling and other fields . In the future, the application in security fields such as 3D face recognition and face payment will become more and more mature. A distance sensor generally includes a substrate, a chip component mounted on the substrate, a light-transmitting component mounted above the chip component, and a housing. Wherein, the light-transmitting component includes a plurality of components such as a lens and a filter, and is generally fixedly connected to the casing by glue bonding. Among them, the assembly of the lens must be precise, which leads to the complexity of the entire packaging process of the distance sensor and the high manufacturing cost. At the same time, since the light-transmitting parts in the distance sensor are respectively connected to the casing by glue bonding, the waterproof performance thereof is poor, and it can only be used indoors.

本發明的目的在於提供一種距離感測器封裝結構,旨在解決習知技術中距離感測器的整個封裝製程複雜,製造成本高,且不防水的技術問題。The object of the present invention is to provide a distance sensor packaging structure, aiming to solve the technical problems of the prior art that the entire packaging process of the distance sensor is complicated, the manufacturing cost is high, and it is not waterproof.

本發明是這樣實現的,一種距離感測器封裝結構,包括基板、晶片組件、透光組件和安裝於所述基板上的殼體;所述晶片組件包括間隔排布於所述基板上的發光晶片和感測晶片;所述透光組件包括間隔設置的透光件和透鏡模組;所述透光件與所述發光晶片對應設置,以供所述發光晶片發出的光穿過,所述透鏡模組與所述感測晶片的接收端感光區對應設置,以供所述發光晶片發出的光經檢測物體反射後的光線穿過並彙聚至所述感測晶片的接收端感光區;所述透鏡模組模壓成型於所述基板上且覆蓋所述感測晶片的接收端感光區。The present invention is achieved in this way, a distance sensor packaging structure, including a substrate, a chip assembly, a light-transmitting assembly, and a housing mounted on the substrate; chip and sensing chip; the light-transmitting assembly includes a light-transmitting member and a lens module arranged at intervals; the light-transmitting member is arranged correspondingly to the light-emitting chip for the light emitted by the light-emitting chip to pass through, the The lens module is set corresponding to the photosensitive area of the receiving end of the sensing chip, so that the light emitted by the light-emitting chip is reflected by the detection object to pass through and converge to the photosensitive area of the receiving end of the sensing chip; The lens module is molded on the substrate and covers the photosensitive area of the receiving end of the sensing chip.

在其中一個實施例中,所述透鏡模組包括聚光部和環繞所述聚光部設置的支撐部,所述支撐部與所述聚光部為相同材料且一體成型的固接; 所述距離感測器封裝結構還包括安裝於所述透鏡模組上的濾光組件,所述濾光組件可拆卸地連接於所述支撐部。 In one of the embodiments, the lens module includes a light concentrating part and a support part arranged around the light concentrating part, and the support part and the light concentrating part are made of the same material and integrally fixed; The package structure of the distance sensor further includes a filter assembly installed on the lens module, and the filter assembly is detachably connected to the supporting part.

在其中一個實施例中,所述濾光組件包括具有貫穿孔的支架以及嵌裝於所述貫穿孔內的濾光片,所述濾光片位於所述聚光部的正上方,所述支架形成有第一插接部,所述支撐部形成有第二插接部,所述濾光組件通過所述第一插接部和所述第二插接部與所述透鏡模組插接配合。In one of the embodiments, the filter assembly includes a bracket with a through hole and a filter embedded in the through hole, the filter is located directly above the light collecting part, and the bracket A first plug-in part is formed, and a second plug-in part is formed on the support part, and the filter assembly is plug-fitted with the lens module through the first plug-in part and the second plug-in part .

在其中一個實施例中,所述貫穿孔包括相互連通的第一孔體和第二孔體, 其中,所述第二孔體位於所述第一孔體的下方,且所述第二孔體的孔徑小於所述第一孔體的孔徑,所述濾光片嵌裝於所述第一孔體內; 或者,所述第二孔體位於所述第一孔體的下方,所述第二孔體的孔徑大於所述第一孔體的孔徑,所述濾光片嵌裝於所述第二孔體內; 或者,所述第二孔體位於所述第一孔體的中部,且所述第二孔體的孔徑大於所述第一孔體的孔徑,所述濾光片嵌裝於所述第二孔體內。 In one of the embodiments, the through hole includes a first hole body and a second hole body connected to each other, Wherein, the second hole is located below the first hole, and the aperture of the second hole is smaller than the aperture of the first hole, and the filter is embedded in the first hole in vivo; Alternatively, the second hole is located below the first hole, the aperture of the second hole is larger than the aperture of the first hole, and the filter is embedded in the second hole ; Alternatively, the second hole is located in the middle of the first hole, and the aperture of the second hole is larger than the aperture of the first hole, and the filter is embedded in the second hole in vivo.

在其中一個實施例中,所述支架為塑膠架,所述濾光片注塑成型於所述貫穿孔內,所述濾光片的尺寸適配所述聚光部的尺寸。In one embodiment, the bracket is a plastic frame, the filter is injection-molded in the through hole, and the size of the filter is adapted to the size of the light-collecting portion.

在其中一個實施例中,所述支撐部包括多個間隔設置的第一凸起部,多個所述第一凸起部圍繞所述聚光部設置,多個所述第一凸起部的上表面齊平且高於所述聚光部的頂面,所述第一凸起部的上表面接合所述濾光組件的支架。In one of the embodiments, the support part includes a plurality of first protrusions arranged at intervals, and the plurality of first protrusions are arranged around the light collecting part, and the plurality of first protrusions are The upper surface is flush with and higher than the top surface of the light collecting part, and the upper surface of the first protrusion engages the bracket of the filter assembly.

在其中一個實施例中,所述支撐部的外沿(外緣)形成有多個第二凸起部,多個所述第二凸起部的上表面齊平且高於所述第一凸起部的上表面,多個所述第二凸起部圍成用於嵌裝所述濾光組件的安裝腔,所述第一凸起部位於所述安裝腔內。In one of the embodiments, the outer edge (outer edge) of the support part is formed with a plurality of second protrusions, and the upper surfaces of the plurality of second protrusions are flush with and higher than the first protrusions. On the upper surface of the raised portion, a plurality of the second raised portions enclose an installation cavity for inserting the filter assembly, and the first raised portion is located in the installed cavity.

在其中一個實施例中,所述支撐部包括封閉結構,所述封閉結構圍繞所述聚光部,所述第一插接部為凸出於所述支架的下表面的凸起結構,所述第二插接部為凹槽且位於所述封閉結構與多個所述第一凸起部之間。In one of the embodiments, the support part includes a closed structure, the closed structure surrounds the light-collecting part, the first insertion part is a protruding structure protruding from the lower surface of the bracket, and the The second insertion part is a groove and is located between the closing structure and the plurality of first protrusions.

在其中一個實施例中,所述第一插接部為凸出於所述支架的下表面的凸起結構,所述第二插接部為凹槽且位於多個所述第一凸起部與所述聚光部之間。In one of the embodiments, the first insertion part is a protruding structure protruding from the lower surface of the bracket, and the second insertion part is a groove and is located on a plurality of the first protrusions. and the concentrator.

在其中一個實施例中,所述殼體模壓成型於所述基板上且包覆所述支架、所述透光件和所述透鏡模組,所述殼體的底部與所述基板密封連接。In one embodiment, the casing is molded on the substrate and covers the bracket, the light-transmitting member and the lens module, and the bottom of the casing is sealed and connected to the substrate.

本發明相對於習知技術的技術效果是:本發明實施例提供的距離感測器封裝結構,將透鏡模組的安裝方式,由膠接於殼體上改為了模壓成型於基板上,從而有效減少了部分或全部透光組件的滴膠(點膠)固定裝配工序,使得距離感測器封裝結構的製程變的簡單、易操作,提高了生產效率及透光組件的裝配精度,進而降低了距離感測器的製造成本和產品不良率。又由於透鏡模組模壓成型,可與基板緊密接觸或連接,從而將相應晶片包覆其中,進而大大提高了相應部件及距離感測器整體的防水性能,使得距離感測器即可在室內使用又可在戶外使用,有效提高了產品效益。The technical effect of the present invention relative to the prior art is: the distance sensor packaging structure provided by the embodiment of the present invention changes the installation method of the lens module from glued on the housing to molded on the substrate, thereby effectively Reduce the glue dropping (dispensing) fixed assembly process of part or all of the light-transmitting components, making the process of the distance sensor packaging structure simple and easy to operate, improving production efficiency and assembly accuracy of the light-transmitting components, thereby reducing the The manufacturing cost and product defect rate of the distance sensor. And because the lens module is molded, it can be in close contact with or connected to the substrate, thereby covering the corresponding chip, which greatly improves the waterproof performance of the corresponding components and the distance sensor as a whole, so that the distance sensor can be used indoors It can also be used outdoors, which effectively improves product benefits.

下面詳細描述本發明的實施例,所述實施例的示例在附圖中示出,其中自始至終相同或類似的標號表示相同或類似的元件或具有相同或類似功能的元件。下面通過參考附圖描述的實施例是示例性的,旨在用於解釋本發明,而不能理解為對本發明的限制。Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

在本發明的描述中,需要理解的是,術語“長度”、“寬度”、“上”、“下”、“前”、“後”、“左”、“右”、“垂直”、“水平”、“頂”、“底”“內”、“外”等指示的方位或位置關係為基於附圖所示的方位或位置關係,僅是為了便於描述本發明和簡化描述,而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作,因此不能理解為對本發明的限制。In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", " The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating Or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the invention.

此外,術語“第一”、“第二”僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”的特徵可以明示或者隱含地包括一個或者更多個該特徵。在本發明的描述中,“多個”的含義是兩個或兩個以上,除非另有明確具體的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

在本發明中,除非另有明確的規定和限定,術語“安裝”、“相連”、“連接”、“固定”等術語應做廣義理解,例如,可以是固定連接,也可以是可拆卸連接,或成一體;可以是機械連接,也可以是電連接;可以是直接相連,也可以通過中間媒介間接相連,可以是兩個元件內部的連通或兩個元件的相互作用關係。對於本領域的具有通常知識者而言,可以根據具體情況理解上述術語在本發明中的具體含義。In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those with ordinary knowledge in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

為了使本發明的目的、技術方案及優點更加清楚明白,以下結合附圖及實施例,對本發明進行進一步詳細說明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.

本發明實施例提供了一種距離感測器封裝結構。為便於理解圖1、圖3、圖8及圖11給出了四種較佳的實施例以說明本發明提供的距離感測器封裝結構。距離感測器封裝結構包括基板100、晶片組件200、透光組件300和安裝於基板100上的殼體400,晶片組件200包括間隔排布於基板100上的發光晶片210和感測晶片220。具體的,發光晶片210和感測晶片220一般沿基板100的長度方向間隔排布於基板100上。發光晶片210一般為鐳射晶片。感測晶片220具有靠近發光晶片210的發射端感光區和遠離發光晶片210的接收端感光區。An embodiment of the present invention provides a package structure of a distance sensor. To facilitate understanding, FIG. 1 , FIG. 3 , FIG. 8 and FIG. 11 give four preferred embodiments to illustrate the package structure of the distance sensor provided by the present invention. The package structure of the distance sensor includes a substrate 100 , a chip assembly 200 , a transparent assembly 300 and a housing 400 mounted on the substrate 100 . The chip assembly 200 includes light emitting chips 210 and sensing chips 220 arranged on the substrate 100 at intervals. Specifically, the light emitting chip 210 and the sensing chip 220 are generally arranged on the substrate 100 at intervals along the length direction of the substrate 100 . The light emitting chip 210 is generally a laser chip. The sensing chip 220 has a light-sensing area of the emitting end close to the light-emitting chip 210 and a light-sensing area of the receiving end far away from the light-emitting chip 210 .

透光組件300包括間隔設置的透光件310和透鏡模組321。透光件310與發光晶片210對應設置,以供發光晶片210發出的光穿過。透鏡模組321與感測晶片220的接收端感光區對應設置,以供發光晶片210發出的光經檢測物體反射後的光線穿過並彙聚至感測晶片220的接收端感光區。The light-transmitting assembly 300 includes a light-transmitting member 310 and a lens module 321 arranged at intervals. The light-transmitting member 310 is disposed corresponding to the light-emitting chip 210 for the light emitted by the light-emitting chip 210 to pass through. The lens module 321 is arranged corresponding to the photosensitive area of the receiving end of the sensing chip 220 , so that the light emitted by the light emitting chip 210 and reflected by the detected object passes through and converges to the photosensitive area of the receiving end of the sensing chip 220 .

透鏡模組321模壓成型於基板100上且覆蓋感測晶片220的接收端感光區,以增強感測晶片220的接收端感光區的防水性能。在一些實施例中,透鏡模組321模壓成型於基板100上時,可與基板100熔接或膠接於一體,從而將感測晶片220的接收端感光區密封包覆其中。The lens module 321 is molded on the substrate 100 and covers the receiving end photosensitive area of the sensing chip 220 to enhance the waterproof performance of the receiving end photosensitive area of the sensing chip 220 . In some embodiments, when the lens module 321 is molded on the substrate 100 , it can be welded or glued together with the substrate 100 , so as to seal and cover the photosensitive region of the receiving end of the sensing chip 220 .

本發明實施例提供的距離感測器封裝結構,將透鏡模組321的安裝方式,由傳統膠接於殼體400上改為了模壓成型於基板100上,從而有效減少了部分或全部透光組件300的滴膠(點膠)固定裝配工序,使得距離感測器封裝結構的製程變的簡單、易操作,提高了生產效率及透光組件300的裝配精度,進而降低了距離感測器封裝結構的製造成本和產品不良率。又由於透鏡模組321模壓成型,可與基板100緊密接觸或連接,從而將相應晶片包覆其中,進而大大提高了相應部件及距離感測器整體的防水性能,使得距離感測器即可在室內使用又可在戶外使用,有效提高了產品效益。如圖1至圖15所示,在一個具體的實施例中,透鏡模組321包括聚光部3211和環繞於聚光部3211設置的支撐部。支撐部與聚光部3211為相同材料且一體成型的固接。距離感測器封裝結構還包括安裝於透鏡模組321上的濾光組件322,濾光組件322可拆卸地連接於支撐部。具體的,濾光組件322可以搭放在支撐部上,也可通過膠接、插接、卡接、套接等方式中的一種或多種方式可拆卸地連接於支撐部上,如圖1所示,濾光組件322放置到支撐部上後,通過密封膠330與透鏡模組321密封連接。In the distance sensor packaging structure provided by the embodiment of the present invention, the installation method of the lens module 321 is changed from the traditional adhesive bonding on the housing 400 to molding on the substrate 100, thereby effectively reducing part or all of the light-transmitting components. 300’s glue-dropping (dispensing) fixed assembly process makes the process of the distance sensor packaging structure simple and easy to operate, improves production efficiency and assembly accuracy of the light-transmitting component 300, and reduces the distance sensor packaging structure. Manufacturing costs and product defect rates. And because the lens module 321 is molded, it can be closely contacted or connected with the substrate 100, thereby covering the corresponding chip therein, thereby greatly improving the waterproof performance of the corresponding components and the distance sensor as a whole, so that the distance sensor can be placed on the Indoor use can also be used outdoors, which effectively improves product efficiency. As shown in FIG. 1 to FIG. 15 , in a specific embodiment, the lens module 321 includes a light concentrating portion 3211 and a support portion disposed around the light concentrating portion 3211 . The supporting part and the light concentrating part 3211 are made of the same material and integrally formed and fixed. The package structure of the distance sensor further includes a filter assembly 322 installed on the lens module 321 , and the filter assembly 322 is detachably connected to the supporting part. Specifically, the filter assembly 322 can be placed on the support part, or can be detachably connected to the support part by one or more ways of gluing, plugging, clamping, socketing, etc., as shown in Figure 1 As shown, after the filter assembly 322 is placed on the supporting part, it is sealed and connected with the lens module 321 through the sealant 330 .

本實施例提供了一種新的透鏡模組結構,同時改變了濾光組件322的安裝方式。採用本實施例提供的距離感測器封裝結構,組裝距離感測器時,可先將透鏡模組321和濾光組件322組合成一個組合件,再將該組合件安裝於殼體400上,並將殼體400罩設於基板100上,進一步簡化了距離感測器的生產工序,提高了組裝效率,降低了製造成本,便於推廣。This embodiment provides a new lens module structure, while changing the installation method of the filter assembly 322 . Using the distance sensor packaging structure provided in this embodiment, when assembling the distance sensor, the lens module 321 and the filter assembly 322 can be combined into an assembly, and then the assembly is installed on the housing 400, And the housing 400 is covered on the substrate 100, which further simplifies the production process of the distance sensor, improves the assembly efficiency, reduces the manufacturing cost, and is convenient for popularization.

目前市場上現有的距離感測器,一般採用一個濾光片作為濾光組件322,採用這一結構接收端的濾光片面積比所需的有效接收面積大很多,除了經檢測物體反射回來的光線外還有其他的雜光投射進來,對產品的精確度造成影響。為改善這一現象,如圖3、圖6、圖10、圖11及圖14所示,在一個具體的實施例中,濾光組件322包括具有貫穿孔3224的支架3222以及嵌裝於貫穿孔3224內的濾光片3223。其中,濾光片3223位於聚光部3211的正上方。濾光組件322採用本實施例提供的結構可有效減少距離感測器接收端的濾光片3223的面積,進而降低檢測物體反射回來的光以外的其他雜光進入接收端的概率,以提高距離感測器的測量精確度。At present, the existing distance sensors on the market generally use a filter as the filter component 322. The area of the filter at the receiving end of this structure is much larger than the required effective receiving area, except for the light reflected from the detected object. In addition, there are other stray lights projected in, which will affect the accuracy of the product. In order to improve this phenomenon, as shown in Figure 3, Figure 6, Figure 10, Figure 11 and Figure 14, in a specific embodiment, the filter assembly 322 includes a bracket 3222 with a through hole 3224 and a Filter 3223 within 3224. Wherein, the filter 3223 is located directly above the light collecting part 3211 . The filter assembly 322 adopts the structure provided by this embodiment, which can effectively reduce the area of the filter 3223 at the receiving end of the distance sensor, thereby reducing the probability of stray light entering the receiving end other than the light reflected by the detected object, so as to improve the distance sensing. The measurement accuracy of the device.

如圖4至圖6、圖12至圖14所示,支架3222形成有第一插接部3221,支撐部形成有第二插接部3213,濾光組件322通過第一插接部3221和第二插接部3213與透鏡模組321插接配合。As shown in Figures 4 to 6 and Figures 12 to 14, the bracket 3222 is formed with a first insertion portion 3221, the support portion is formed with a second insertion portion 3213, and the filter assembly 322 passes through the first insertion portion 3221 and the second insertion portion 3213. The two socket parts 3213 are socketed and matched with the lens module 321 .

具體的,第一插接部3221可以為沿支架3222的長度方向、寬度方向或者厚度方向而向外延伸的凸起部,還可為沿上述任一或多個方向向內凹陷的凹陷部。第二插接部3213則可為與第一插接部3221插接配合的相應結構,如當第一插接部3221為沿長度方向或寬度方向而向外延伸的凸起部時,第二插接部3213則為開設於支撐部的相應方位上的開口朝上的凹槽或盲孔,以供凸起部插入;當第一插接部3221為沿厚度方向而向下延伸的凸起部時,第二插接部3213則為開設於支撐部頂部的開口朝上的凹槽或盲孔,以供凸起部插入;當第一插接部3221為沿長度方向或寬度方向而向內凹陷的凹陷時,第二插接部3213則為形成於支撐部的相應側壁上的凸起結構。具體實現方式眾多,這裡不再一一列舉。濾光組件322和透鏡模組321借助第一插接部3221和第二插接部3213插接配合,操作簡便,且連接後兩者關係不易發生變動,確保了兩者連接後相對位置的穩定性,保證了距離感測器的使用性能的穩定性。Specifically, the first inserting portion 3221 may be a protrusion extending outward along the length direction, width direction or thickness direction of the bracket 3222 , or a depression portion recessing inward along any one or more of the above directions. The second socket part 3213 can be a corresponding structure that is plugged and fitted with the first socket part 3221. For example, when the first socket part 3221 is a protrusion extending outward along the length direction or the width direction, the second socket part The insertion part 3213 is a groove or a blind hole with an upward opening opened on the corresponding orientation of the support part, for the protrusion to be inserted into; when the first insertion part 3221 is a protrusion extending downward along the thickness direction When part, the second plug-in part 3213 is a groove or a blind hole opened on the top of the support part with the opening facing upwards, for the protrusion to be inserted into; When the inner recess is recessed, the second inserting portion 3213 is a protruding structure formed on a corresponding side wall of the supporting portion. There are many specific implementation methods, which will not be listed one by one here. The filter assembly 322 and the lens module 321 are mated by means of the first socket part 3221 and the second socket part 3213, which is easy to operate, and the relationship between the two is not easy to change after connection, ensuring the stability of the relative position of the two after connection The stability ensures the stability of the performance of the distance sensor.

為確保距離感測器封裝結構的穩定性,上述第一插接部3221可一體成型於濾光組件322上,第二插接部3213可一體成型於透鏡模組321上。In order to ensure the stability of the package structure of the distance sensor, the above-mentioned first insertion portion 3221 can be integrally formed on the filter assembly 322 , and the second insertion portion 3213 can be integrally formed on the lens module 321 .

為確保濾光片3223與支架3222連接關係的穩定性,請參照圖16至圖18,在一個具體的實施例中,貫穿孔3224包括相互連通的第一孔體和第二孔體。上述第一孔體和第二孔體主要有三種連接關係: 第一種,如圖16所示,第二孔體位於第一孔體的下方,且第二孔體的孔徑小於第一孔體的孔徑,濾光片3223嵌裝於第一孔體內; 第二種,如圖17所示,第二孔體位於第一孔體的下方,第二孔體的孔徑大於第一孔體的孔徑,濾光片3223嵌裝於第二孔體內; 第三種,如圖18所示,第二孔體位於第一孔體的中部,且第二孔體的孔徑大於第一孔體的孔徑,濾光片3223嵌裝於第二孔體內。 In order to ensure the stability of the connection relationship between the filter 3223 and the bracket 3222, please refer to FIG. 16 to FIG. 18. In a specific embodiment, the through hole 3224 includes a first hole body and a second hole body connected to each other. There are mainly three connection relationships between the above-mentioned first hole body and the second hole body: The first type, as shown in Figure 16, the second hole is located below the first hole, and the aperture of the second hole is smaller than the aperture of the first hole, and the filter 3223 is embedded in the first hole; The second type, as shown in Figure 17, the second hole is located below the first hole, the aperture of the second hole is larger than the aperture of the first hole, and the filter 3223 is embedded in the second hole; The third type, as shown in FIG. 18 , is that the second hole is located in the middle of the first hole, and the diameter of the second hole is larger than that of the first hole, and the filter 3223 is embedded in the second hole.

如此,第一孔體和第二孔體無論採用上述哪種連接關係,均可保證貫穿孔3224內具有至少一個平行於濾光片3223的板面的連接面,相較濾光片3223的側壁與貫穿孔3224的孔壁連接,兩者的接觸面積大大增加,進而保證了兩者連接關係的穩定性。In this way, no matter which connection relationship the first hole body and the second hole body adopt, it can ensure that there is at least one connection surface parallel to the plate surface of the optical filter 3223 in the through hole 3224. Compared with the side wall of the optical filter 3223 Connecting with the hole wall of the through hole 3224, the contact area between the two is greatly increased, thereby ensuring the stability of the connection relationship between the two.

為進一步提高濾光片3223與支架3222連接關係的穩定性,同時進一步減少距離感測器封裝結構的生產工序,在一個可選的實施例中,支架3222為塑膠架,濾光片3223注塑成型於貫穿孔3224內。濾光片3223的尺寸適配聚光部3211的尺寸。其中,支架3222由塑膠製成,製造成本低廉,且加工方便。濾光片3223注塑成型於貫穿孔3224,加工方式簡單,且防水效果好。將濾光片3223作為塑膠支架的鑲件進行注塑成型,採用這種製造製程能在最大限度減小濾光片3223面積的情況下又能密封防水。In order to further improve the stability of the connection relationship between the optical filter 3223 and the bracket 3222, and further reduce the production process of the distance sensor packaging structure, in an optional embodiment, the bracket 3222 is a plastic frame, and the optical filter 3223 is injection molded in the through hole 3224. The size of the filter 3223 is adapted to the size of the light collecting part 3211 . Wherein, the bracket 3222 is made of plastic, and the manufacturing cost is low and the processing is convenient. The optical filter 3223 is injection molded in the through hole 3224, the processing method is simple, and the waterproof effect is good. The optical filter 3223 is injection-molded as an insert of the plastic bracket, and this manufacturing process can minimize the area of the optical filter 3223 while being sealed and waterproof.

上述支撐部可以採用一體成型結構,也可採用分體結構。現舉例說明,如圖15所示,在一個可選的實施例中,支撐部包括多個間隔設置的第一凸起部3214。多個第一凸起部3214圍繞聚光部3211設置,多個第一凸起部3214的上表面齊平且高於聚光部3211的頂面,第一凸起部3214的上表面接合濾光組件322的支架3222。支撐部採用這一結構,可減少所需材料數量,降低成本。The above-mentioned supporting part may adopt an integrally formed structure, or may adopt a split structure. For example, as shown in FIG. 15 , in an optional embodiment, the support portion includes a plurality of first protrusions 3214 arranged at intervals. A plurality of first raised portions 3214 are disposed around the light concentrating portion 3211, the upper surfaces of the plurality of first raised portions 3214 are flush and higher than the top surface of the light collecting portion 3211, and the upper surfaces of the first raised portions 3214 are joined to the filter. Bracket 3222 for light assembly 322 . By adopting this structure for the support part, the amount of required material can be reduced and the cost can be reduced.

如圖2、圖7及圖9所示,在一個可選的實施例中,支撐部包括封閉結構3212。該封閉結構3212圍繞聚光部3211,第一插接部3221為凸出於支架3222的下表面的凸起結構,第二插接部3213為凹槽且位於封閉結構3212與多個第一凸起部3214之間。具體的,上述封閉結構3212可以為凸出於聚光部3211的頂面的環形結構,也可以為凸出於聚光部3211的頂面的其他形狀的封閉結構3212,具體根據濾光組件322的形狀進行設定,這裡不做唯一限定。凸起結構可為凸出於支架3222的下表面的凸塊、環形結構、矩形結構等,第二插接部3213則為與第一插接部3221相適配的相應結構。第一插接部3221和第二插接部3213採用本實施例提供的結構,拆裝方便。支撐部採用上述封閉結構3212,加工方式簡單,且結構穩定。As shown in FIG. 2 , FIG. 7 and FIG. 9 , in an optional embodiment, the support part includes a closed structure 3212 . The closed structure 3212 surrounds the light concentrating part 3211, the first inserting part 3221 is a protruding structure protruding from the lower surface of the bracket 3222, the second inserting part 3213 is a groove and is located between the closing structure 3212 and the plurality of first protrusions. Between the starting parts 3214. Specifically, the above-mentioned closed structure 3212 may be a ring-shaped structure protruding from the top surface of the light concentrating part 3211, or a closed structure 3212 of other shapes protruding from the top surface of the light concentrating part 3211. The shape is set, and there is no unique limitation here. The protruding structure can be a protrusion protruding from the lower surface of the bracket 3222 , a ring structure, a rectangular structure, etc., and the second insertion part 3213 is a corresponding structure that matches the first insertion part 3221 . The first plug-in part 3221 and the second plug-in part 3213 adopt the structure provided by this embodiment, and are easy to assemble and disassemble. The support part adopts the above-mentioned closed structure 3212, the processing method is simple, and the structure is stable.

如圖7及圖9所示,在另一個可選的實施例中,支撐部既包括封閉結構3212,也包括第一凸起部3214,以實現濾光組件322的穩定支撐。As shown in FIG. 7 and FIG. 9 , in another optional embodiment, the supporting part includes both the closing structure 3212 and the first protruding part 3214 to achieve stable support of the filter assembly 322 .

如圖2、圖7、圖9及圖15所示,支撐部的外沿(外緣)形成有多個第二凸起部3215,多個第二凸起部3215的上表面齊平且高於第一凸起部3214的上表面,多個第二凸起部3215圍成用於嵌裝濾光組件322的安裝腔,進而使得濾光組件322安裝於透鏡模組321上時可嵌裝於安裝腔內,以避免濾光組件322安裝後與透鏡模組321發生相對移動。其中,第一凸起部3214位於上述安裝腔內。具體的,第二凸起部3215與支撐部一體成形地連接,也可為分開設置,具體可根據使用需要設定,這裡不做唯一限定。當第二凸起部3215與支撐部的第一凸起部3214連接時,由於第一凸起部3214低於第二凸起部3215,兩者連接可形成臺階結構,該臺階結構圍成的凹槽可為第二插接部3213,也可單獨設置第二插接部3213。As shown in Figure 2, Figure 7, Figure 9 and Figure 15, the outer edge (outer edge) of the support part is formed with a plurality of second protrusions 3215, and the upper surfaces of the plurality of second protrusions 3215 are flush and high. On the upper surface of the first protruding portion 3214, a plurality of second protruding portions 3215 encircle an installation cavity for inserting the filter assembly 322, so that the filter assembly 322 can be embedded when installed on the lens module 321 In the installation cavity, the filter assembly 322 and the lens module 321 are prevented from moving relative to each other after installation. Wherein, the first protruding portion 3214 is located in the above-mentioned installation cavity. Specifically, the second protruding part 3215 is integrally connected with the supporting part, or can be separately provided, which can be specifically set according to the needs of use, and there is no unique limitation here. When the second raised portion 3215 is connected to the first raised portion 3214 of the support portion, since the first raised portion 3214 is lower than the second raised portion 3215, the connection of the two can form a stepped structure, and the stepped structure surrounds The groove can be the second insertion part 3213, or the second insertion part 3213 can be provided separately.

更為具體的,第二凸起部3215的結構、支撐部的結構,以及第二凸起部3215與支撐部的連接方式有多種形式。如圖2所示,多個第二凸起部3215和支撐部的多個第一凸起部3214均構成封閉式結構且形狀與濾光組件322相適配,且支撐部的第一凸起部3214位於第二凸起部3215的內側且與第二凸起部3215連接形成臺階結構,濾光組件322嵌裝於第二凸起部3215所圍空腔內,並被支撐部的第一凸起部3214支撐。如圖7及圖9所示,多個第二凸起部3215為多個間隔設置且一體成型於透鏡模組321的主體上的凸塊,支撐部既包括封閉結構3212,又包括多個第一凸起部3214,封閉結構3212位於多個第一凸起部3214圍成的空腔內,多個第二凸起部3215圍成具有一個缺口的安裝腔,以供濾光組件322的一端伸入。如圖15所示,多個第二凸起部3215為多個間隔設置且一體成型於透鏡模組321主體上的凸塊,支撐部僅包括多個第一凸起部3214,且多個第一凸起部3214的數量大於多個第二凸起部3215的數量,第二凸起部3215圍成具有一個缺口的安裝腔,以供濾光組件322的一端伸入。當然,在其他實施例中,第二凸起部3215的結構、支撐部的結構,以及第二凸起部3215與支撐部的連接方式還可以採用其他形狀。More specifically, the structure of the second protruding part 3215, the structure of the supporting part, and the connection between the second protruding part 3215 and the supporting part can be in various forms. As shown in Figure 2, the plurality of second protrusions 3215 and the plurality of first protrusions 3214 of the support part form a closed structure and are shaped to match the filter assembly 322, and the first protrusions of the support part The part 3214 is located inside the second protruding part 3215 and is connected with the second protruding part 3215 to form a stepped structure. The filter assembly 322 is embedded in the cavity surrounded by the second protruding part 3215 and is supported by the first part of the supporting part. The raised portion 3214 supports. As shown in FIG. 7 and FIG. 9, the plurality of second protrusions 3215 are a plurality of protrusions arranged at intervals and integrally formed on the main body of the lens module 321. A protruding part 3214, the sealing structure 3212 is located in the cavity surrounded by a plurality of first protruding parts 3214, and a plurality of second protruding parts 3215 surround a mounting cavity with a gap for one end of the filter assembly 322 into. As shown in FIG. 15 , the plurality of second protrusions 3215 are a plurality of protrusions arranged at intervals and integrally formed on the main body of the lens module 321, the support portion only includes a plurality of first protrusions 3214, and the plurality of second protrusions The number of one protrusion 3214 is greater than the number of second protrusions 3215 , and the second protrusion 3215 encloses an installation cavity with a gap for one end of the filter assembly 322 to protrude into. Of course, in other embodiments, the structure of the second protruding portion 3215, the structure of the supporting portion, and the connection manner between the second protruding portion 3215 and the supporting portion may also adopt other shapes.

在一個具體的實施例中,第一插接部3221為凸出於支架3222的下表面的凸起結構,第二插接部3213為凹槽且位於多個第一凸起部3214與聚光部3211之間。具體的,凸起結構可為凸出於支架3222的下表面的凸塊、環形結構、矩形結構等,第二插接部3213則為與第一插接部3221相適配的相應結構。第一插接部3221和第二插接部3213採用本實施例提供的結構,拆裝方便。In a specific embodiment, the first insertion part 3221 is a protruding structure protruding from the lower surface of the bracket 3222, the second insertion part 3213 is a groove and is located between the first protrusions 3214 and the light-concentrating Between Section 3211. Specifically, the protruding structure can be a protrusion protruding from the lower surface of the bracket 3222 , a ring structure, a rectangular structure, etc., and the second insertion part 3213 is a corresponding structure that matches the first insertion part 3221 . The first plug-in part 3221 and the second plug-in part 3213 adopt the structure provided by this embodiment, and are easy to assemble and disassemble.

普通的距離感測器中的殼體400,其一般通過膠接方式連接於基板100上,防水效果差。為改善這一現象,在一個可選的實施例中,殼體400模壓成型於基板100上且包覆支架3222、透光件310和透鏡模組321,同時殼體400的底部與基板100密封連接。如此,殼體400成型後不僅可以與基板100緊密連接,還可對透鏡模組321和支架3222之間的縫隙進行填補,以進一步提高距離感測器的防水性能。The casing 400 of a common distance sensor is generally connected to the substrate 100 by glue, and the waterproof effect is poor. In order to improve this phenomenon, in an optional embodiment, the housing 400 is molded on the substrate 100 and covers the support 3222 , the light-transmitting member 310 and the lens module 321 , while the bottom of the housing 400 is sealed with the substrate 100 connect. In this way, the housing 400 can not only be tightly connected with the substrate 100 after molding, but also fill the gap between the lens module 321 and the bracket 3222 to further improve the waterproof performance of the distance sensor.

經測試,距離感測器封裝結構若採用透光件310、透鏡模組321和殼體400分別模壓成型製程,其防水等級可達IP66。之所以會產生如此優越的防水效果,是因為該距離感測器封裝結構形成了兩重防水結構。第一重防水結構為:透光組件300模壓成型,將晶片組件200等電子元件包裹於其中,鑄成第一道防水結構;第二重防水結構為:殼體400模壓成型,包覆支架3222、透光件310和透鏡模組321,鑄成第二道防水結構。兩重防水結構相互配合,保證了產品的品質。After testing, if the packaging structure of the distance sensor adopts the molding process of the light-transmitting member 310 , the lens module 321 and the casing 400 respectively, its waterproof level can reach IP66. The reason why such a superior waterproof effect is produced is that the packaging structure of the distance sensor forms a double waterproof structure. The first waterproof structure is: the light-transmitting component 300 is molded, and the chip component 200 and other electronic components are wrapped in it to form the first waterproof structure; the second waterproof structure is: the housing 400 is molded and covered with the bracket 3222 , the light-transmitting member 310 and the lens module 321 are cast into a second waterproof structure. The two waterproof structures cooperate with each other to ensure the quality of the product.

以上所述僅為本發明的較佳實施例而已,僅具體描述了本發明的技術原理,這些描述只是為了解釋本發明的原理,不能以任何方式解釋為對本發明保護範圍的限制。基於此處解釋,凡在本發明的精神和原則之內所作的任何修改、等同替換和改進,及本領域的具有通常知識者不需要付出具進步性的改變即可聯想到本發明的其他具體實施方式,均應包含在本發明的保護範圍之內。The above descriptions are only preferred embodiments of the present invention, and only specifically describe the technical principle of the present invention. These descriptions are only for explaining the principle of the present invention, and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention, and those with ordinary knowledge in the art can think of other specific embodiments of the present invention without making progressive changes. Embodiments should all be included within the protection scope of the present invention.

100:基板 200:晶片組件 210:發光晶片 220:感測晶片 300:透光組件 310:透光件 321:透鏡模組 3211:聚光部 3212:封閉結構 3213:第二插接部 3214:第一凸起部 3215:第二凸起部 322:濾光組件 3221:第一插接部 3222:支架 3223:濾光片 3224:貫穿孔 330:密封膠 400:殼體 100: Substrate 200: chip assembly 210: Light emitting chip 220: sensing chip 300: Light-transmitting components 310: Light-transmitting parts 321: Lens module 3211: Concentrating Department 3212: closed structure 3213: The second socket 3214: the first raised part 3215: second raised part 322: Filter component 3221: The first socket 3222: Bracket 3223: filter 3224: through hole 330: sealant 400: Shell

為了更清楚地說明本發明實施例的技術方案,下面將對本發明實施例或習知技術描述中所需要使用的附圖作簡單地介紹,顯而易見地,下面所描述的附圖僅僅是本發明的一些實施例,對於本領域中具有通常知識者來講,在不付出進步性的改變的前提下,還可以根據這些附圖獲得其他的附圖。 圖1是本發明一實施例提供的距離感測器封裝結構的爆炸結構示意圖; 圖2是圖1中透鏡模組的結構示意圖; 圖3是本發明另一實施例提供的距離感測器封裝結構的爆炸結構示意圖; 圖4是圖3所示距離感測器封裝結構的剖面結構示意圖; 圖5是圖4中透光組件的安裝結構示意圖; 圖6是圖4中透鏡模組和濾光組件的連接結構示意圖; 圖7是圖3中透鏡模組的結構示意圖; 圖8是本發明另一實施例提供的距離感測器封裝結構的爆炸結構示意圖; 圖9是圖8中透鏡模組的結構示意圖; 圖10是圖8中濾光組件的結構示意圖; 圖11是本發明另一實施例提供的距離感測器封裝結構的爆炸結構示意圖; 圖12是圖11所示距離感測器封裝結構的剖面結構示意圖; 圖13是圖12中透光組件的安裝結構示意圖; 圖14是圖11中透鏡模組和濾光組件的連接結構示意圖; 圖15是圖11中透鏡模組的結構示意圖; 圖16是本發明一實施例所採用的濾光組件的剖面結構示意圖; 圖17是本發明另一實施例所採用的濾光組件的剖面結構示意圖;以及 圖18是本發明另一實施例所採用的濾光組件的剖面結構示意圖。 In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the embodiments of the present invention or in the description of conventional technologies. Obviously, the accompanying drawings described below are only illustrations of the present invention. For some embodiments, for those skilled in the art, other drawings can also be obtained based on these drawings without progressive changes. Fig. 1 is a schematic diagram of an exploded structure of a distance sensor packaging structure provided by an embodiment of the present invention; Fig. 2 is a schematic structural view of the lens module in Fig. 1; Fig. 3 is a schematic diagram of an exploded structure of a distance sensor package structure provided by another embodiment of the present invention; Fig. 4 is a schematic cross-sectional structure diagram of the distance sensor package structure shown in Fig. 3; Fig. 5 is a schematic diagram of the installation structure of the light-transmitting component in Fig. 4; Fig. 6 is a schematic diagram of the connection structure of the lens module and the filter assembly in Fig. 4; Fig. 7 is a schematic structural view of the lens module in Fig. 3; Fig. 8 is a schematic exploded structure diagram of a distance sensor package structure provided by another embodiment of the present invention; Fig. 9 is a schematic structural view of the lens module in Fig. 8; Fig. 10 is a schematic structural view of the filter assembly in Fig. 8; Fig. 11 is a schematic diagram of an exploded structure of a distance sensor package structure provided by another embodiment of the present invention; Fig. 12 is a schematic cross-sectional structure diagram of the distance sensor package structure shown in Fig. 11; Fig. 13 is a schematic diagram of the installation structure of the light-transmitting component in Fig. 12; Fig. 14 is a schematic diagram of the connection structure of the lens module and the filter assembly in Fig. 11; Fig. 15 is a schematic structural view of the lens module in Fig. 11; Fig. 16 is a schematic cross-sectional structure diagram of an optical filter assembly used in an embodiment of the present invention; Fig. 17 is a schematic cross-sectional structure diagram of an optical filter assembly used in another embodiment of the present invention; and FIG. 18 is a schematic cross-sectional view of a filter assembly used in another embodiment of the present invention.

100:基板 100: Substrate

200:晶片組件 200: chip assembly

210:發光晶片 210: Light emitting chip

220:感測晶片 220: sensing chip

300:透光組件 300: Light-transmitting components

310:透光件 310: Light-transmitting parts

321:透鏡模組 321: Lens module

322:濾光組件 322: Filter component

330:密封膠 330: sealant

400:殼體 400: shell

Claims (10)

一種距離感測器封裝結構,包括一基板、一晶片組件、一透光組件和安裝於該基板上的一殼體;該晶片組件包括間隔排布於該基板上的一發光晶片和一感測晶片;該透光組件包括間隔設置的一透光件和一透鏡模組,該透光件與該發光晶片對應設置,以供該發光晶片發出的光穿過,該透鏡模組與該感測晶片的一接收端感光區對應設置,以供該發光晶片發出的光經一檢測物體反射後的光線穿過並彙聚至該感測晶片的該接收端感光區,其中,該透鏡模組模壓成型於該基板上且覆蓋該感測晶片的該接收端感光區。A distance sensor package structure, comprising a substrate, a chip component, a light-transmitting component and a housing installed on the substrate; the chip component includes a light-emitting chip and a sensing chip arranged at intervals on the substrate Chip; the light-transmitting assembly includes a light-transmitting member and a lens module arranged at intervals, the light-transmitting member is arranged correspondingly to the light-emitting chip for the light emitted by the light-emitting chip to pass through, the lens module and the sensing A receiving end photosensitive area of the chip is correspondingly arranged so that the light emitted by the light emitting chip is reflected by a detection object to pass through and converge to the receiving end photosensitive area of the sensing chip, wherein the lens module is molded On the substrate and covering the photosensitive region of the receiving end of the sensing chip. 如請求項1所述的距離感測器封裝結構,其中,該透鏡模組包括一聚光部和環繞該聚光部設置的一支撐部,該支撐部與該聚光部為相同材料且一體成型的固接;該距離感測器封裝結構還包括安裝於該透鏡模組上的一濾光組件,該濾光組件可拆卸地連接於該支撐部。The package structure of the distance sensor according to claim 1, wherein the lens module includes a light concentrating part and a support part arranged around the light concentrating part, the support part and the light concentrating part are made of the same material and integrated Formed and fixed; the distance sensor packaging structure also includes a filter assembly installed on the lens module, and the filter assembly is detachably connected to the supporting part. 如請求項2所述的距離感測器封裝結構,其中,該濾光組件包括具有一貫穿孔的一支架以及嵌裝於該貫穿孔內的一濾光片,該濾光片位於該聚光部的正上方,該支架形成有一第一插接部,該支撐部形成有一第二插接部,該濾光組件通過該第一插接部和該第二插接部與該透鏡模組插接配合。The package structure of the distance sensor according to claim 2, wherein the filter assembly includes a bracket with a through hole and a filter embedded in the through hole, and the filter is located in the light collecting part directly above, the bracket forms a first insertion part, the support part forms a second insertion part, and the filter assembly is inserted into the lens module through the first insertion part and the second insertion part Cooperate. 如請求項3所述的距離感測器封裝結構,其中,該貫穿孔包括相互連通的一第一孔體和一第二孔體,該第二孔體位於該第一孔體的下方,且該第二孔體的孔徑小於該第一孔體的孔徑,該濾光片嵌裝於該第一孔體內;或者,該第二孔體位於該第一孔體的下方,該第二孔體的孔徑大於該第一孔體的孔徑,該濾光片嵌裝於該第二孔體內;或者,該第二孔體位於該第一孔體的中部,且該第二孔體的孔徑大於該第一孔體的孔徑,該濾光片嵌裝於該第二孔體內。The distance sensor packaging structure according to claim 3, wherein the through hole includes a first hole and a second hole connected to each other, the second hole is located below the first hole, and The aperture of the second hole is smaller than the aperture of the first hole, and the filter is embedded in the first hole; or, the second hole is located below the first hole, and the second hole The aperture is larger than the aperture of the first aperture, and the filter is embedded in the second aperture; or, the second aperture is located in the middle of the first aperture, and the aperture of the second aperture is larger than the The aperture of the first hole body, the filter is embedded in the second hole body. 如請求項3所述的距離感測器封裝結構,其中,該支架為塑膠架,該濾光片注塑成型於該貫穿孔內,該濾光片的尺寸適配該聚光部的尺寸。The package structure of the distance sensor according to claim 3, wherein the bracket is a plastic frame, the filter is injection-molded in the through hole, and the size of the filter is adapted to the size of the light-collecting portion. 如請求項3所述的距離感測器封裝結構,其中,該支撐部包括多個間隔設置的第一凸起部,多個該第一凸起部圍繞該聚光部設置,多個該第一凸起部的一上表面齊平且高於該聚光部的頂面,該第一凸起部的該上表面接合該濾光組件的該支架。The distance sensor packaging structure according to claim 3, wherein the supporting part includes a plurality of first protrusions arranged at intervals, the plurality of first protrusions are arranged around the light-concentrating part, and the plurality of first protrusions An upper surface of a raised portion is flush with and higher than the top surface of the light collecting portion, and the upper surface of the first raised portion engages with the bracket of the filter assembly. 如請求項6所述的距離感測器封裝結構,其中,該支撐部的外沿形成有多個第二凸起部,多個該第二凸起部的一上表面齊平且高於該第一凸起部的該上表面,多個該第二凸起部圍成用於嵌裝該濾光組件的一安裝腔,該第一凸起部位於該安裝腔內。The package structure of the distance sensor according to claim 6, wherein a plurality of second protrusions are formed on the outer edge of the support part, and an upper surface of the plurality of second protrusions is flush with and higher than the The upper surface of the first protruding part and the plurality of second protruding parts enclose an installation cavity for embedding the filter assembly, and the first protruding part is located in the installation cavity. 如請求項6所述的距離感測器封裝結構,其中,該支撐部包括一封閉結構,該封閉結構圍繞該聚光部,該第一插接部為凸出於該支架的下表面的一凸起結構,該第二插接部為一凹槽且位於該封閉結構與多個該第一凸起部之間。The package structure of the distance sensor according to claim 6, wherein the support part includes a closed structure, the closed structure surrounds the light-collecting part, and the first plug-in part is a protruding part protruding from the lower surface of the bracket. The protruding structure, the second insertion part is a groove and is located between the closing structure and the plurality of first protruding parts. 如請求項6所述的距離感測器封裝結構,其中,該第一插接部為凸出於該支架的下表面的一凸起結構,該第二插接部為一凹槽且位於多個該第一凸起部與該聚光部之間。The package structure of the distance sensor according to claim 6, wherein the first insertion part is a protruding structure protruding from the lower surface of the bracket, the second insertion part is a groove and is located at multiple between the first protruding portion and the light-concentrating portion. 如請求項3至9中任一項所述的距離感測器封裝結構,其中,該殼體模壓成型於該基板上且包覆該支架、該透光件和該透鏡模組,該殼體的底部與該基板密封連接。The distance sensor packaging structure according to any one of claims 3 to 9, wherein the casing is molded on the substrate and covers the bracket, the light-transmitting member and the lens module, and the casing The bottom is hermetically connected to the substrate.
TW110135647A 2021-08-17 2021-09-24 Distance sensor package structure TWI782715B (en)

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Publication number Priority date Publication date Assignee Title
JP2000322989A (en) * 1999-05-14 2000-11-24 Omron Corp Photoelectric sensor and its manufacture
US20170135617A1 (en) * 2014-07-14 2017-05-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules operable to distinguish between signals indicative of reflections from an object of interest and signals indicative of a spurious reflection
US10115757B2 (en) * 2014-08-22 2018-10-30 SK Hynix Inc. Image sensor and electronic device having the same
EP3417486A4 (en) * 2016-02-19 2019-06-12 Heptagon Micro Optics Pte. Ltd. Optoelectronic module having dual encapsulation with opening for receiving an optical assembly
CN108269796B (en) * 2016-12-30 2020-09-01 菱生精密工业股份有限公司 Packaging structure and packaging method of remote sensor
CN113540062A (en) * 2016-12-30 2021-10-22 菱生精密工业股份有限公司 Packaging structure and packaging method of remote sensor
EP3620813A1 (en) * 2018-09-04 2020-03-11 ams AG Optical sensor arrangement, device and method of manufacturing an optical sensor arrangement
WO2020239538A1 (en) * 2019-05-29 2020-12-03 Ams International Ag Reducing optical cross-talk in optical sensor modules
TWM608988U (en) * 2020-10-29 2021-03-11 艾笛森光電股份有限公司 Proximity sensing device
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