TWI777587B - Packaging structure of distance sensor and packaging method thereof - Google Patents

Abstract

The present invention relates to the technical field of distance sensor packaging, and provides a packaging structure of a distance sensor and a packaging method thereof. The package structure of the distance sensor includes a substrate, a light-emitting chip, a sensing chip, an insulating support and a light-blocking glue wall element. The light-blocking glue wall element includes at least one of a surrounding glue wall and a partition glue wall. The surrounding glue wall surrounds the side surface of the substrate and the side surface of the insulating support, and the separating glue wall is connected to the sensing chip, located between the photosensitive area of the receiving end and the photosensitive area of the transmitting end, and connected to the insulating support. The present invention provides a packaging structure of a distance sensor and a packaging method thereof, which adopts a light-blocking glue wall element to prevent light leakage, and solves the technical problem of low detection accuracy of the conventional distance sensor, thereby improving the distance sensor. detection accuracy.

Description

Packaging structure of distance sensor and packaging method thereof

The present invention relates to the technical field of sensor packaging, and in particular, to a packaging structure of a distance sensor and a packaging method thereof.

A proximity sensor is a sensor that detects the proximity or distance of an object in a non-contact manner. Since it can be detected in a non-contact manner, the detection object will not be worn and damaged, so the distance sensor is widely used in various industries. For example, automatic teller machines use proximity sensors to detect whether a cashier is approaching, production lines use proximity sensors to count products, and so on.

According to the working principle of distance sensors, distance sensors can be divided into inductive, capacitive, Hall, photoelectric and pyroelectric types. Among them, due to the advantages of convenient design, high sensitivity and strong anti-interference, photoelectric distance sensors are widely used in products such as smart phones, smart homes, smart cars and wearable devices.

According to the related art learned by the inventor, please refer to FIG. 1 to FIG. 3 , the package structure of the distance sensor includes a substrate 11 , a light-emitting chip 12 , a sensing chip 13 and an insulating support 14 . The light-emitting chip 12 and the sensing chip 13 are disposed on the substrate 11 separately from each other. The insulating support 14 is connected to the substrate 11 and covers the light-emitting chip 12 and the sensing chip 13. The insulating support 14 and the substrate 11 form a relatively airtight shell. .

However, the distance sensor made by the related art has technical problems of light leakage and low detection accuracy.

The purpose of the present invention is to provide a packaging structure of a distance sensor and a packaging method thereof, aiming at solving the technical problem of low detection accuracy of the conventional distance sensor.

In order to achieve the above object, the technical solution adopted by the present invention is to provide a package structure of a distance sensor, including a substrate, a light-emitting chip, a sensing chip, an insulating support and a light-blocking glue wall element. The light-emitting wafer and the sensing wafer are mounted on the first surface of the substrate at intervals. The sensing wafer includes a receiving end photosensitive area and a transmitting end photosensitive area. The insulating support is mounted on the first surface of the substrate to cover the light-emitting chip and the sensing chip. The insulating support has a first light hole and a second light hole, the position of the first light hole corresponds to the position of the photosensitive area of the receiving end, and the position of the second light hole corresponds to the position of the light-emitting chip Corresponding. The light-blocking glue wall element includes at least one of a surrounding glue wall and a separation glue wall, the surrounding glue wall surrounds the side surface of the substrate and the side surface of the insulating support, and the separation glue wall is connected to the The sensing wafer is located between the receiving end photosensitive area and the transmitting end photosensitive area, and is connected with the insulating support.

In one of the embodiments, the insulating support has partition walls. The partition wall joins the partition glue wall to divide the inner chamber of the insulating support into a first chamber and a second chamber, and the light-emitting chip and the light-emitting area of the emission end are located in the first chamber In the chamber, the receiving end photosensitive region is located in the second chamber.

In one of the embodiments, the insulating support has a glue replenishing groove. The opening of the glue filling groove is set on the top surface of the insulating support, the height of the glue filling groove is less than the distance from the sensing chip to the top surface of the insulating support, and the glue filling groove connects the insulation The inner chamber of the support is divided into a first chamber and a second chamber, the light-emitting wafer and the photosensitive area of the transmitting end are located in the first chamber, and the photosensitive area of the receiving end is located in the second chamber In the above, the top of the separating glue wall extends into the glue replenishing groove.

In one embodiment, the package structure of the distance sensor further includes a lens and a first filter. The first light hole is a stepped hole, and the stepped hole is divided into a large diameter section and a small diameter section in turn from top to bottom, the lens is installed in the small diameter section, and the first filter is installed in the small diameter section. Describe the large diameter section.

In one of the embodiments, the lens is a glass lens.

In one of the embodiments, the package structure of the distance sensor further includes a lens. The lens faces the first light hole, and the lens and the insulating bracket are integrally injection-molded.

The present invention also provides a packaging method for a distance sensor, comprising the following steps: providing a substrate, and installing the light-emitting chip and the sensing chip on the first surface of the substrate at intervals; An insulating support for light holes; the insulating support is installed on the first surface of the substrate, and the insulating support covers the light-emitting chip and the sensing chip, and the position of the first light hole is the same as that of the first light hole. The position of the receiving end photosensitive area of the sensing chip corresponds to the position of the light-emitting chip, and the position of the second light hole corresponds to the position of the light-emitting chip; surrounding glue wall.

In one embodiment, the forming of the surrounding glue wall surrounding the side surface of the base plate and the side surface of the insulating support through a molding process includes the following steps: forming a plurality of the base plates on which the insulating support is installed arranging, and there are gaps between adjacent substrates; molding a plurality of the substrates after the arrangement, injecting light-blocking glue into the gaps; and cutting along the gaps to form a Glue the walls around the sides and the sides of the insulating brackets.

In one of the embodiments, the providing the substrate and mounting the light-emitting wafer and the sensing wafer on the first surface of the substrate at intervals includes the following steps: placing a plurality of the substrates on the first surface of the substrate. A whole board is arranged at intervals; a plurality of the first whole boards are arranged on the first jig board; and one of the light-emitting chips and one of the sensing chips are attached on each of the substrates.

In one of the embodiments, the providing the insulating support with the first light hole and the second light hole includes the following steps: The second whole board including a plurality of the insulating brackets is injection-molded, wherein the arrangement order of the plurality of the insulating brackets on the second whole board is the same as the order of the plurality of the substrates on the first whole board. The sorting order is the same.

In one embodiment, the step of installing the insulating support on the first surface of the substrate and covering the light-emitting chip and the sensing chip with the insulating support includes the following steps: Each of the second whole boards is attached to a plurality of the first whole boards on the first jig board in a one-to-one correspondence; the second jig board is covered on the first jig board, Wherein, a plurality of the first whole board and a plurality of the second whole board are located between the first jig board and the second jig board; bake the first jig board and the second jig board; A combined body formed by the second jig plate; and cutting along the interval between the adjacent substrates to form a package structure of a single distance sensor.

The encapsulation structure of the distance sensor and the encapsulation method thereof provided by the present invention have the beneficial effects of: adopting the surrounding glue wall to surround the side surface of the substrate and the side surface of the insulating bracket, even if the insulating bracket and the substrate are connected with offset, or even appear The gap and the surrounding glue wall can prevent light leakage, protect the sensing chip from interference from external light, or use a separation glue wall to prevent light leakage and prevent the light emitted by the light-emitting chip from directly reaching the receiving end photosensitive area without the second light hole. That is, at least one of the surrounding glue wall and the separation glue wall can block irrelevant light from interfering with the sensing chip, which solves the technical problem of low detection accuracy of the conventional distance sensor, thereby improving the detection of the distance sensor. Accuracy.

1: Detect objects

11: Substrate

12: Luminous chip

13: Sensing chip

14: Insulation bracket

15: Lens

100: Substrate

101: First Surface

200: Luminous Chip

300: Sensing chip

310: Receiver photosensitive area

320: Transmitting end photosensitive area

400: Insulation bracket

410: The first light hole

411: Large diameter section

412: Trail Section

420: second aperture

430: glue tank

440: Partition Wall

500: Surrounding glue wall

600: Separation glue wall

710: Lens

720: First filter

730: Second filter

801: The first positioning hole

810: The first whole board

820: Second whole board

830: The first jig board

831: The first positioning column

832: Second positioning column

840: Second jig board

841: Second positioning hole

850: Dispensing head

In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for the present invention. In some embodiments, for those skilled in the art, other drawings can also be obtained according to these drawings without making progressive changes.

1 is an exploded view of a distance sensor in the related art; FIG. 2 is a cross-sectional view of the distance sensor in the related art; FIG. 3 is a manufacturing flow chart of a packaging method of the distance sensor in the related art; FIG. 4 is an exploded view of the package structure of the distance sensor in the embodiment of the present invention; FIG. 5 is a schematic diagram of the distance sensor in FIG. 4 ; Fig. 7 is an exploded view of the packaging structure of the distance sensor in the embodiment of the present invention; Fig. 8 is a cross-sectional view of the packaging structure of the distance sensor in Fig. 7; 9( a ) to ( h ) are manufacturing flowcharts of a packaging method of a distance sensor in an embodiment of the present invention; FIG. 10 is an exploded view of a packaging structure of a distance sensor in an embodiment of the present invention; and FIG. 11(a)-(h) are the manufacturing flowcharts of the packaging method of the distance sensor in the embodiment of the present invention.

The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", " The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating Or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the present invention, unless otherwise expressly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of the two elements or the interaction relationship between the two elements. Those with ordinary knowledge in the technical field can understand the specific meanings of the above terms in the present invention according to specific situations.

Referring to FIG. 1 and FIG. 2 , in the related art distance sensor, the light-emitting chip 12 and the sensing chip 13 are mounted on the substrate 11 separately from each other. The insulating support 14 is mounted on the substrate 11 and covers the light-emitting wafer 12 and the sensing wafer 13 . The installation and alignment requirements of the insulating bracket 14 and the substrate 11 are very high, otherwise a gap as shown in FIG. 2 may easily appear between the two, resulting in a decrease in the airtightness of the distance sensor. External light can enter the distance sensor through the gap, and there is light leakage, which affects the detection of the distance sensor, which is one reason for the low detection accuracy.

Another reason for the low detection accuracy of the distance sensor is that the light-emitting chip and the photosensitive area of the receiving end are not isolated, and there is light leakage. The light emitted by the light-emitting chip is not reflected by the detection object but directly reaches the interior of the distance sensor. The photosensitive area of the receiving end of the sensing chip is used, resulting in low detection accuracy.

Referring to FIG. 3 , the related art packaging method of the distance sensor is to install the lens 15 on one side of the insulating support 14 , and then install the filter on the other side of the insulating support 14 after the insulating support 14 is turned 180 degrees. Then, the insulating support 14 is integrally mounted on the substrate 11 on which the light-emitting chip 12 and the sensing chip 13 have been mounted, which causes the problems of complicated manufacturing process and easy falling off of the lens 15 .

Example 1

Referring to FIG. 4 , a package structure of a distance sensor includes a substrate 100 , a light-emitting chip 200 , a sensing chip 300 , an insulating support 400 and a light-blocking glue wall element. The light emitting chip 200 and the sensing chip 300 are mounted on the first surface 101 of the substrate 100 at intervals, and the insulating support 400 is mounted on the first surface 101 of the substrate 100 to cover the light emitting chip 200 and the sensing chip 300 . The insulating support 400 has a first light hole 410 and a second light hole 420 . The position of the first light hole 410 corresponds to the position of the photosensitive area 310 of the receiving end of the sensing chip 300 , and the position of the second light hole 420 is the same as that of the light emitting chip 200 . corresponding position.

Please refer to FIG. 5 , the sensing chip 300 is used for sensing the light source emitted by the light-emitting chip 200 . The insulating support 400 has two mutually independent chambers, the light-emitting chip 200 and the photosensitive region 320 at the transmitting end are located in one of the chambers, the chamber is communicated with the second light hole 420, and the photosensitive region 310 at the receiving end is located in the other chamber. The other chamber communicates with the first light hole 410 . A part of the light emitted by the light-emitting chip 200 reaches the photosensitive area 320 at the transmitting end, and the other part passes through the second light hole 420, the detection object 1, and the first light hole 410 in sequence and then reaches the light receiving end 310 at the receiving end. The time difference between the light-receiving area 320 receiving the light can measure the distance of the detection object 1 .

In one embodiment, please refer to FIG. 4 , the light-blocking glue wall element includes a surrounding glue wall 500 , and the surrounding glue wall 500 surrounds the side surface of the substrate 100 and the side surface of the insulating support 400 . In this way, even if there is an offset or even a gap between the insulating support 400 and the substrate 100 during connection, the surrounding glue wall 500 can protect the sensing chip 300 from external light interference, thereby improving the detection accuracy of the distance sensor.

In another embodiment, please refer to FIG. 4 , the light-blocking glue wall element includes a separation glue wall 600 . The separation glue wall 600 is connected to the sensing chip 300 and is located between the receiving end photosensitive region 310 and the transmitting end photosensitive region 320 , And it is connected with the insulating support 400 . In this way, the separation glue wall 600 isolates the light-emitting chip 200 from the light-emitting area 310 of the receiving end in the interior of the distance sensor, so as to prevent light leakage and avoid light leakage. The light emitted by the optical wafer 200 directly reaches and interferes with the receiving end photosensitive region 310, thereby improving the detection accuracy of the distance sensor.

In yet another embodiment, the light-blocking glue wall element includes both the surrounding glue wall 500 and the separation glue wall 600 .

To sum up, the light-blocking glue wall element only needs to include any one of the surrounding glue wall 500 and the partition glue wall 600 , or both the surrounding glue wall 500 and the separation glue wall 600 , which can prevent light leakage and improve the distance sensor’s performance. Detection accuracy.

In addition, the surrounding glue wall 500 can also protect the light-emitting chip 200 and the sensing chip 300 inside the insulating support 400 from being corroded by water vapor in the external environment, which reduces the requirement on the alignment accuracy between the insulating support 400 and the substrate 100, thereby reducing the The manufacturing difficulty and cost are reduced, and the airtight performance of the distance sensor is guaranteed.

Preferably, the substrate 100 includes but is not limited to one of a printed circuit board, a bismaleimide triazine substrate, a glass fiber substrate or a direct copper clad substrate.

Preferably, the light-emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The light-emitting chip 200 may be, for example, a laser chip.

Preferably, the sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process. The sensing chip 300 may be, for example, an IC chip (Integrated Circuit Chip).

Preferably, the insulating support 400 can be mounted on the first surface 101 of the base plate 100 by bonding, snap-fit connection, or using a connector (eg, a bolt or a screw).

Wherein, the insulating support 400 may be formed first and then fixed to the substrate 100 . For example, the insulating support 400 can be, for example, a plastic support. At this time, the separation glue wall 600 also plays a buffer role, which can prevent the sensing chip 300 from being crushed when the insulating support 400 is mounted on the substrate 100 .

Preferably, the material of the light-blocking glue wall element includes, but is not limited to, opaque epoxy resin, acrylic resin, or polychlorinated ester. For example, the surrounding glue wall 500 is a black glue wall, and the partition glue wall 600 is a black glue wall.

In some embodiments, please refer to FIG. 6( b ) and FIG. 6( d ), the insulating support 400 has a partition wall 440 . The partition wall 440 is joined to the partition wall 600 to separate the inner chamber of the insulating support 400 into a first chamber and a second chamber. The light-emitting chip 200 and the photosensitive area 320 at the transmitting end are located in the first chamber, and the photosensitive area at the receiving end is located in the first chamber. 310 is located in the second chamber. The partition wall 440 and the partition wall 600 together form a light-blocking wall that isolates the first chamber and the second chamber to prevent light leakage between the first chamber and the second chamber, and the partition wall 600 also functions Due to the buffering effect, when the insulating support 400 is installed on the substrate 100 , the partition wall 440 can be prevented from being crushed to the sensing chip 300 .

Referring to FIG. 10 , in some embodiments, the insulating support 400 has a glue replenishing groove 430 . The upper opening of the glue filling groove 430 is set on the top surface of the insulating support 400 , the lower opening of the glue filling groove 430 is set on the bottom surface of the glue filling groove 430 , and the height of the glue filling groove 430 is smaller than the top surface of the sensing chip 300 to the insulating support 400 . The distance is so as to avoid that when the insulating support 400 is installed on the substrate 100 , the glue filling groove 430 is crushed to damage the sensing chip 300 . The glue filling groove 430 divides the inner chamber of the insulating support 400 into a first chamber and a second chamber, the light-emitting chip 200 and the photosensitive area 320 at the transmitting end are located in the first chamber, and the photosensitive area 310 at the receiving end is located in the second chamber , the separation glue wall 600 extends into the glue filling groove 430 to fill the gap between the glue filling groove 430 and the sensing chip 300 to prevent light leakage from the gap, so that the light of the first chamber and the second chamber do not interfere with each other, and the distance The sensor is more accurate.

In some embodiments, please refer to FIG. 4 , FIG. 7 and FIG. 10 , the package structure of the distance sensor further includes a lens 710 . The lens 710 is installed in the first light hole 410 . The lens 710 can gather and project the incident light to the photosensitive area 310 of the receiving end of the sensing chip 300 , so as to improve the sensing capability of the sensing chip 300 . The package structure of the distance sensor further includes a first filter 720 . The first filter 720 is installed in the first aperture 410 . The first filter 720 is used to filter stray light.

Since the lens 710 is small in size and the edge thickness is only 0.1 mm, if a positioning hole for installing the lens 710 needs to be opened on the insulating bracket 400 , it is very difficult to manufacture and the product defect rate is high. In addition, the lens 710 is fixed on the positioning hole with glue, and the glue is easily liquefied or even loses its viscosity when passing through a high temperature SMT (Surface Mounted Technology) furnace, causing the lens 710 to fall.

In order to solve the above problem, in an embodiment, please refer to FIG. 7 and FIG. 8 , the first optical hole 410 is a stepped hole. The stepped hole is sequentially divided into a large diameter section 411 and a small diameter section 412 from top to bottom. The lens 710 is installed in the small diameter section 412 , and the first filter 720 is installed in the large diameter section 411 . In this way, the lens 710 and the first optical filter 720 are sequentially installed into the stepped holes in the same direction from top to bottom, without turning the insulating bracket 400 180 degrees, thereby simplifying the manufacturing process, reducing the manufacturing difficulty and saving the manufacturing cost. Moreover, the lens 710 is placed in the stepped hole, and will not be debonded and dropped even in a high temperature environment or during transportation and vibration.

Specifically, please refer to FIG. 8 , a support arm for placing the lens 710 extends from the bottom hole wall of the stepped hole, and the support arm does not completely close the stepped hole and does not affect the light reaching the photosensitive area 310 at the receiving end. The middle hole wall of the stepped hole forms a shoulder for placing the first filter 720 .

Preferably, please refer to FIG. 7 and FIG. 8 , the lens 710 is a glass lens, and the glass lens 710 can avoid the phenomenon of aging and yellowing, and avoid affecting the light transmittance, thereby ensuring long-term stability of the performance of the distance sensor.

In another embodiment, please refer to FIG. 9( a ), the lens 710 and the insulating bracket 400 are integrally injection-molded, and there is no need to set a special mounting structure on the insulating bracket 400 for mounting the lens 710 , and there is no need to use glue to attach the lens 710 Adhering to the insulating support 400 simplifies the manufacturing process, reduces the investment in automation equipment, improves the production efficiency, and reduces the manufacturing cost.

In some embodiments, please refer to FIG. 4 , FIG. 7 and FIG. 10 , the package structure of the distance sensor further includes a second filter 730 mounted on the second light hole 420 .

Embodiment 2

The present invention provides a packaging method for a distance sensor, comprising the following steps:

In step S100 , please refer to FIG. 6( a ), a substrate 100 is provided, and the light-emitting chip 200 and the sensing chip 300 are mounted on the first surface 101 of the substrate 100 at intervals. Preferably, the light-emitting chip 200 is electrically connected to the substrate 100 through a wire bonding process. The sensing chip 300 is electrically connected to the substrate 100 through a wire bonding process. In particular, the sensing chip 300 is electrically connected to the substrate 100 through gold wires.

Step S200 , please refer to FIG. 6( b ) and FIG. 6( c ), provide an insulating bracket 400 with a first light hole 410 and a second light hole 420 , and install the lens 710 and the first filter 720 on the first light hole 410 and the second light hole 420 respectively. The bottom end and the top end of the light hole 410 , the second filter 730 is installed on the top end of the second light hole 420 .

Step S300, please refer to FIG. 6(d) and FIG. 6(e), install the insulating support 400 on the first surface 101 of the substrate 100, and make the insulating support 400 cover the light-emitting chip 200 and the sensing chip 300, and the first light The positions of the holes 410 correspond to the positions of the photosensitive regions 310 at the receiving end of the sensing wafer 300 , and the positions of the second light holes 420 correspond to the positions of the light-emitting chips 200 .

In step S400 , please refer to FIG. 6( g ) and FIG. 6( h ), forming a surrounding glue wall 500 surrounding the side surface of the substrate 100 and the side surface of the insulating support 400 through a molding process. In this way, the surrounding glue wall 500 is wrapped around the side surface of the substrate 100 and the side surface of the insulating support 400 , and the thickness can be made only in the micrometer level, which occupies a small space and is beneficial to the miniaturization of the distance sensor.

In the packaging method of the distance sensor provided by the present invention, even if there is an offset or even a gap between the insulating support 400 and the substrate 100, the surrounding glue wall 500 is wrapped on the outside of the substrate 100 and the insulating support 400 through the molding process to prevent Light leakage can improve the detection accuracy of the distance sensor.

In addition, the surrounding glue wall 500 can also protect the light-emitting chip 200 and the sensing chip 300 inside the insulating support 400 from being corroded by water vapor in the external environment, which reduces the alignment accuracy between the insulating support 400 and the substrate 100 and reduces the manufacturing process. difficulty and cost.

The sequence of steps S100 and S200 is adjustable, that is, the packaging method may first perform step S100 and then step S200, and also perform step S200 first and then step S100.

Specifically, step S100 includes:

In step S110 , referring to FIG. 9( b ), a plurality of substrates 100 are arranged at intervals on the first entire board 810 .

In step S120 , please refer to FIG. 9( c ) and FIG. 9( d ), arranging a plurality of first whole boards 810 on the first jig board 830 . Wherein, each first entire board 810 has a plurality of substrates 100 on it.

In step S130 , please refer to FIG. 9( e ), an automated device may be used to attach a light-emitting chip 200 and a sensing chip 300 on each substrate 100 .

In this way, a plurality of first whole boards 810 are placed on one first jig board 830, and the light emitting chip 200 and the sensing chip 300 are mounted on the substrate 100 in batches, which can improve work efficiency and reduce manufacturing cost.

Specifically, step S200 includes: referring to FIG. 9( a ), injection molding a second entire board 820 including a plurality of insulating brackets 400 . Wherein, the arrangement order of the plurality of insulating supports 400 on the second whole board 820 is the same as the arrangement order of the plurality of substrates 100 on the first whole board 810 .

It should be noted that, for the convenience of viewing, the arrangement density of the insulating supports 400 in FIG. 9( a ) is relatively loose. In actual production, the arrangement of the insulating supports 400 on the second whole board 820 in FIG. 9( a ) is the same as that shown in FIG. 9 . (b) The arrangement of the substrates 100 on the first entire board 810 is the same.

In this way, the above-mentioned packaging method utilizes the injection molding process, and can mass-produce a plurality of insulating brackets 400 , which greatly improves the work efficiency and reduces the manufacturing cost.

Further, in FIG. 9( a ), each insulating support 400 is also integrally formed with a lens 710 .

Specifically, step S300 includes:

In step S310 , referring to FIG. 9( f ), the plurality of second whole boards 820 are attached to the plurality of first whole boards 810 on the first jig board 830 in a one-to-one correspondence. That is, a second whole board 820 is attached to a first whole board 810 . Since the arrangement order of the plurality of insulating brackets 400 on the second entire board 820 is the same as the arrangement order of the plurality of substrates 100 on the first entire board 810 , the insulating brackets 400 and the substrates 100 are in a one-to-one correspondence.

Step S320, please refer to FIG. 9(g), cover the second jig board 840 on the first jig board 830, wherein the plurality of first whole boards 810 and the plurality of second whole boards 820 are located on the first jig between the plate 830 and the second jig plate 840 .

In step S330 , please refer to FIG. 9( h ), bake the combined body formed by the first jig plate 830 and the second jig plate 840 .

Step S340 , cutting along the interval between adjacent substrates 100 to form a package structure of a single distance sensor (as shown in FIG. 6( f )).

In this way, the above-mentioned packaging method can produce a single package in batches. In each package, the light-emitting chip 200 and the sensing chip 300 are mounted on the substrate 100 at intervals, and the insulating support 400 is fixed to the substrate 100 and covers the light-emitting chip 200 and the substrate 100 . The sensing chip 300 greatly improves the work efficiency and reduces the manufacturing cost.

Preferably, before step S310 , the method further includes: coating the edge of the first surface 101 of the substrate 100 with glue, so that in the subsequent baking process, the insulating support 400 is fixed on the substrate 100 by the glue.

Preferably, please refer to FIGS. 9( a ) to 9 ( c ), the first jig plate 830 has a first positioning column 831 , and both the first whole plate 810 and the second whole plate 820 have the first positioning column 831 . The first positioning holes 801 are matched so that when the first jig plate 830, the first whole plate 810 and the second whole plate 820 are combined, the first positioning posts 831 of the first jig plate 830 pass through the first jig plate 830. The first positioning hole 801 of the whole board 810 and the first positioning hole 801 of the second whole board 820 . In this way, the first whole board 810 and the second whole board 820 can be conveniently positioned and stacked on the first jig board 830 , which greatly improves the installation accuracy and reduces the defect rate.

Preferably, please refer to FIG. 9( g ), the first fixture plate 830 further has a second positioning post 832 , and the second fixture plate 840 has a second positioning hole 841 matched with the second positioning post 832 .

In some embodiments, step S400 includes:

In step S410 , please refer to FIG. 6( f ), arranging a plurality of substrates 100 adhered to the insulating support 400 with a gap between adjacent substrates 100 .

In step S420, referring to FIG. 6(g), the plurality of substrates 100 after being arranged are molded, and light-blocking glue is injected into the gaps.

In step S430 , please refer to FIG. 6( h ), cutting along the gap to form a surrounding glue wall 500 surrounding the side surface of the substrate 100 and the side surface of the insulating support 400 . At this time, after cutting, a thin surrounding glue wall 500 is formed around the substrate 100 and the insulating support 400 .

In this way, in the above packaging method, the packaging structure of a single distance sensor is obtained by cutting. In each package, even if there is a gap between the substrate 100 and the insulating support 400 , the surrounding glue wall 500 can seal the gap. At the same time, the multiple substrates 100 are directly molded to realize batch manufacturing, which greatly reduces the production cost and improves the production efficiency.

Embodiment 3

Referring to FIG. 10 , the third embodiment provides a packaging structure for a distance sensor. Specifically, the insulating support 400 has a glue filling groove 430 , and the glue filling groove 430 divides the internal chamber of the insulating support 400 into a first chamber and a In the second chamber, the separation glue wall 600 extends into the glue filling groove 430 , the separation glue wall 600 fills the gap between the glue filling groove 430 and the sensing chip 300 to prevent light leakage from the gap, and the separation glue wall 600 makes the first chamber and the The light of the second chamber does not interfere with each other, and the distance sensor has higher recognition accuracy.

Specifically, the top of the separation glue wall 600 is flush with the top of the insulating support 400 , and the height of the glue replenishing groove 430 is smaller than the distance from the sensing chip 300 to the top surface of the insulating support 400 , so as to prevent the insulating support 400 from being installed on the substrate 100 . The glue tank 430 crushes the sensing chip 300 .

Embodiment 3 also provides a packaging method for a distance sensor, including:

Step 1, referring to FIG. 11( a ), a substrate 100 is provided, and the light-emitting chip 200 and the sensing chip 300 are mounted on the substrate 100 at intervals.

Step 2, please refer to FIG. 11( b ), providing an insulating support 400 having a first light hole 410 , a second light hole 420 and a glue filling groove 430 .

Step 3, please refer to FIG. 11( c ), FIG. 11( d ) and FIG. 11( e ), install the lens 710 on the bottom of the first light hole 410 , install the first filter 720 and the second filter 730 They are respectively installed above the first light hole 410 and the second light hole 420 .

Step 4, please refer to FIG. 11( f ), install the insulating support 400 on the substrate 100 .

Step 5, please refer to FIG. 11( g ), use the glue dispensing head 850 to inject light-blocking glue into the glue replenishing groove 430 to form the separation glue wall 600 .

In this way, please refer to FIG. 11( h ), the above-mentioned packaging method completes the fabrication of the distance sensor.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

100: Substrate

101: First Surface

200: Luminous Chip

300: Sensing chip

310: Receiver photosensitive area

320: Transmitting end photosensitive area

400: Insulation bracket

410: The first light hole

420: second aperture

500: Surrounding glue wall

600: Separation glue wall

710: Lens

720: First filter

730: Second filter

Claims (10)

A package structure of a distance sensor, which includes a substrate, a light-emitting chip, a sensing chip, an insulating support and a light-blocking glue wall element, the light-emitting chip and the sensing chip are installed on the first side of the substrate at intervals. A surface, the sensing chip includes a receiving end photosensitive area and a transmitting end photosensitive area, the insulating support is mounted on the first surface of the substrate to cover the light-emitting chip and the sensing chip, the insulating support has a first surface A light hole and a second light hole, the position of the first light hole corresponds to the position of the photosensitive area of the receiving end, the position of the second light hole corresponds to the position of the light-emitting chip, the light-blocking glue wall element Including a surrounding glue wall which is not transparent, the surrounding glue wall surrounds the side surface of the substrate and the side surface of the insulating support. The package structure of the distance sensor according to claim 1, wherein the light-blocking glue wall element further comprises a separation glue wall, which is connected to the sensing chip and is located in the receiving end photosensitive area and the transmitting end photosensitive area between and connected with the insulating support; the insulating support has a partition wall, and the partition wall joins the partition wall to separate the inner chamber of the insulating support into a first chamber and a second chamber, The light-emitting chip and the light-sensing region at the transmitting end are located in the first chamber, and the light-sensing region at the receiving end is located in the second chamber. The package structure of the distance sensor according to claim 1, wherein the light-blocking glue wall element further comprises a separation glue wall, which is connected to the sensing chip and is located in the receiving end photosensitive area and the transmitting end photosensitive area between and connected with the insulating support; the insulating support has a glue filling groove, the opening of the glue filling groove is arranged on the top surface of the insulating support, and the height of the glue filling groove is smaller than the height of the sensing chip to the insulating support The distance from the top surface, the glue groove divides the inner chamber of the insulating support into a first chamber and a second chamber, the light-emitting chip and the photosensitive area of the transmitting end are located in the first chamber, and the receiving end is located in the first chamber. The photosensitive area is located in the second chamber, and the top of the separating glue wall extends into the glue replenishing groove. According to the package structure of the distance sensor according to any one of claims 1 to 3, Wherein, the package structure of the distance sensor further includes a lens, the lens is facing the first light hole, and the lens and the insulating bracket are integrally injection-molded. A package structure of a distance sensor, which includes a substrate, a light-emitting chip, a sensing chip, an insulating support and a light-blocking glue wall element, the light-emitting chip and the sensing chip are installed on the first side of the substrate at intervals. A surface, the sensing chip includes a receiving end photosensitive area and a transmitting end photosensitive area, the insulating support is mounted on the first surface of the substrate to cover the light-emitting chip and the sensing chip, the insulating support has a first surface A light hole and a second light hole, the position of the first light hole corresponds to the position of the photosensitive area of the receiving end, the position of the second light hole corresponds to the position of the light-emitting chip, the light-blocking glue wall element Including at least one of a surrounding glue wall and a separating glue wall, the surrounding glue wall surrounds the side surface of the substrate and the side surface of the insulating support, the separation glue wall is connected to the sensing chip, and is located at the receiving end to receive light. between the light-emitting area and the light-sensing area of the emitting end and connected with the insulating support; wherein, the package structure of the distance sensor further includes a lens and a first filter, the first light hole is a stepped hole, and the step The hole is sequentially divided into a large diameter section and a small diameter section from top to bottom, the lens is installed in the small diameter section, and the first optical filter is installed in the large diameter section. The package structure of the distance sensor according to claim 5, wherein the lens is a glass lens. A packaging method for a distance sensor, comprising the following steps: providing a substrate and installing a light-emitting chip and a sensing chip on a first surface of the substrate at intervals; providing a first light hole and a second light An insulating support for the hole; the insulating support is mounted on the first surface of the substrate and the insulating support covers the light-emitting chip and the sensing chip, and the position of the first light hole corresponds to a receiving part of the sensing chip The positions of the end photosensitive regions correspond to the positions of the second light holes, and the positions of the second light holes correspond to the positions of the light-emitting chips; and A surrounding glue wall surrounding the side surface of the substrate and the side surface of the insulating support and not transparent is formed by a molding process. The packaging method of a distance sensor according to claim 7, wherein the step of forming the surrounding glue wall surrounding the side surface of the substrate and the side surface of the insulating support by a molding process comprises the following steps: installing a plurality of The substrates with the insulating support are arranged, and there is a gap between the adjacent substrates; a plurality of the arranged substrates are molded, and a light-blocking glue is injected into the gap; and cutting along the gap is formed to form The surrounding glue wall surrounding the side of the substrate and the side of the insulating support. The packaging method of a distance sensor according to claim 7, wherein the step of providing the substrate and mounting the light-emitting chip and the sensing chip on the first surface of the substrate at intervals includes the following steps: The substrates are arranged at intervals on a first whole board; a plurality of the first whole boards are arranged on a first fixture board; and a light-emitting chip and a sensor are attached on each of the substrates Test wafers. The packaging method of the distance sensor according to claim 9, wherein the step of providing the insulating support with the first light hole and the second light hole includes the following steps: injection molding the insulating support including a plurality of a second whole board, wherein the arrangement order of a plurality of the insulating brackets on the second whole board is the same as the arrangement order of a plurality of the substrates on the first whole board; and the insulating brackets are installed on the The step of covering the first surface of the substrate with the insulating support covering the light-emitting chip and the sensing chip includes the following steps: A plurality of the second whole boards are attached to the plurality of first whole boards on the first jig board in a one-to-one correspondence; a second jig board is covered on the first jig board, wherein , a plurality of the first whole board and a plurality of the second whole board are located between the first jig board and the second jig board; bake the first jig board and the second jig board to form a combined body; and cutting along the interval between the adjacent substrates to form a single package structure of the distance sensor.

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