KR101600267B1 - Proximity sensor package and method of manufacturing thereof - Google Patents

Abstract

A proximity sensor package and a method of manufacturing the same are disclosed. A proximity sensor package according to an embodiment of the present invention includes a base substrate, a light emitting unit mounted on the upper surface of the base substrate, a light receiving unit mounted on the upper surface of the base substrate to receive light emitted from the light emitting unit, And a shielding wall that shields the first opening, the second opening, and the second opening, wherein the light-emitting portion is received, the second opening is received in the light-receiving portion, and the shielding wall shields the first opening and the second opening, A first molding part coupled to the base substrate or the cover part in the vicinity of the light emitting part, and a second molding part coupled to the base substrate or the cover part in the vicinity of the light receiving part inside the second opening part, .

Description

[0001] PROXIMITY SENSOR PACKAGE AND METHOD OF MANUFACTURING THEREOF [0002]

The present invention relates to a proximity sensor package and a method of manufacturing the proximity sensor package, and more particularly, to a proximity sensor package having improved light transmittance of a molding portion and a sensing accuracy, and a method of manufacturing the same.

BACKGROUND ART [0002] In recent years, various electronic devices and mechanical devices have been increasingly equipped with proximity sensors for sensing the proximity of an object. For example, Korean Patent Laid-Open Publication No. 10-2010-0069531 (published on June 24, 2010) discloses a portable terminal including a proximity sensor. When the proximity sensor senses the proximity of the object, the user can start the conversation without the user's operation. If the proximity sensor moves away from the face, the conversation can be terminated.

The conventional proximity sensor includes a light emitting portion and a light receiving portion for sensing that light emitted from the light emitting portion is reflected by an object, and a molding portion molded by resin is formed in each of the light emitting portion and the light receiving portion.

Normally, the proximity sensor should not only maintain reliability in high temperature and high humidity conditions, but also maintain its characteristics at a high temperature in a soldering process to be mounted on a device.

However, the conventional proximity sensor is in a high temperature and high humidity condition. However, as shown in FIG. 1, during the soldering process, the light transmittance of the molding part to a specific wavelength band may be low. The decrease in light transmittance of the molding part causes a problem of lowering the sensing accuracy.

It is an object of the present invention to provide a proximity sensor package having a molding part that does not decrease in light transmittance even after a high temperature and high humidity and a soldering process, and a method of manufacturing the proximity sensor package .

Another object of the present invention is to provide a proximity sensor package having a molding part that can be tightly adhered to a substrate or a cover part, and a method of manufacturing the proximity sensor package.

It is still another object of the present invention to provide a method of manufacturing a proximity sensor in which the manufacturing process is simplified while tightly adhering closely to the substrate or the cover.

According to another aspect of the present invention, there is provided a proximity sensor package including a base substrate, a light emitting portion mounted on a top surface of the base substrate, a light emitting portion mounted on an upper surface of the base substrate, And a shielding wall for shielding between the first opening and the second opening, wherein the shielding wall comprises a light receiving portion for receiving the emitted light, a first opening for receiving the light emitting portion, a second opening for receiving the light receiving portion, A first molding part coupled to the base substrate or the cover part around the light emitting part from the inside of the first opening part, and a second molding part coupled with the base substrate or the cover part around the light receiving part inside the second opening part, And a second molding part formed of a material.

According to one aspect of the present invention, the second molding part may be formed by curing the liquid silicone filled in the inner space surrounded by the upper surface of the base substrate and the inner surface of the second opening.

According to another aspect of the present invention, there is provided a proximity sensor package including: a base substrate; a light emitting unit mounted on the base substrate; a light emitting unit mounted on the base substrate to reflect light emitted from the light emitting unit, A cover portion which has a light receiving portion for receiving light, a first opening for receiving the light emitting portion, a second opening for receiving the light receiving portion, and a shielding wall for shielding between the first opening and the second opening, A first molding part coupled to the base substrate or the cover part in the vicinity of the light emitting part at the inside of the first opening part and a second molding part coupled to the upper surface of the base substrate around the light receiving part, 2 lower molding part and a second molding part coupled to the upper part of the second lower molding part and including a second upper molding part formed of silicon.

According to one aspect of the present invention, the second lower molding part may be formed so as not to cover the upper surface of the light receiving part.

According to one aspect of the present invention, the second lower molding part is formed on an upper surface of the base substrate, and the second upper molding part is formed in an inner space surrounded by an upper surface of the second lower molding part and an inner surface of the second opening part After liquid silicone is filled, it can be cured and formed.

According to another aspect of the present invention, there is provided a proximity sensor package including: a light emitting unit mounted on an upper surface of a base substrate; a light emitting unit mounted on an upper surface of the base substrate to receive light emitted from the light emitting unit, A cover portion which has a light receiving portion, a first opening for receiving the light emitting portion, a second opening for receiving the light receiving portion, and a shielding wall for shielding the first opening and the second opening, A first molding part coupled to the base substrate or the cover part in the vicinity of the light emitting part and formed of a silicon material, and a second molding part coupled to the base substrate or the cover part around the light receiving part, And a molding part.

According to another aspect of the present invention, there is provided a proximity sensor package including: a base substrate; a light emitting portion mounted on the upper surface of the base substrate; a light emitting portion mounted on an upper surface of the base substrate, And a shielding wall which shields the first opening and the second opening from each other, and a cover member which is engaged with the base substrate, And a first upper molding part coupled to an upper surface of the base substrate around the light emitting part and coupled to an upper part of the first lower molding part and formed of an EMC material, 1 molding part and a second molding part coupled with the base substrate or the cover part around the light receiving part inside the second opening part.

In one embodiment, the first lower molding part may be formed so as not to cover the upper surface of the light emitting part.

According to another aspect of the present invention, there is provided a method of manufacturing a proximity sensor package, including the steps of: providing a base substrate; mounting a light emitting portion and a light receiving portion on an upper surface of the base substrate; And a cover portion having a first opening portion in which the light emitting portion is received and a second opening portion in which the light receiving portion is received, the first molding portion being coupled with the base substrate so that the first molding portion is located inside the first opening portion, Filling an inner space formed by the upper surface of the base substrate and the inner surface of the second opening with a liquid resin, and curing the liquid resin.

According to another aspect of the present invention, there is provided a method of manufacturing a proximity sensor package, including the steps of: providing a base substrate; mounting a light emitting portion and a light receiving portion on an upper surface of the base substrate; Forming a first lower molding part on the upper surface of the base substrate, the second lower molding part abutting the upper surface of the base substrate around the light receiving part, the first opening part accommodating the light emitting part, Wherein the first molding part is located inside the first opening and the second lower molding part is located inside the second opening, the step of joining the cover part with the base substrate, Filling an inner space formed by the upper surface of the molding part and the inner surface of the second opening with a liquid resin; and And curing the liquid resin.

In one side, the step of forming the second lower molding part may be formed so as not to cover the upper surface of the light receiving part.

According to another aspect of the present invention, there is provided a method of manufacturing a proximity sensor package, including the steps of: providing a base substrate; mounting a light emitting unit and a light receiving unit on an upper surface of the base substrate; And a cover portion having a first opening portion in which the light emitting portion is received and a second opening portion in which the light receiving portion is received, the second molding portion being located inside the second opening, Filling the inner space formed by the upper surface of the base substrate and the inner surface of the first opening with liquid resin, and curing the liquid resin.

According to another aspect of the present invention, there is provided a method of manufacturing a proximity sensor package, including the steps of: providing a base substrate; mounting a light emitting portion and a light receiving portion on an upper surface of the base substrate; A step of forming a second molding part covering the light receiving part on the upper surface of the base substrate, a step of forming a first opening part in which the light emitting part is housed and a second opening part in which the light emitting part is housed, Coupling a cover portion having a second opening portion in which the light receiving portion is received to the base substrate such that the first lower molding portion is located inside the first opening portion and the second molding portion is located inside the second opening portion; 1 filling the liquid space with an inner space formed by the upper surface of the lower molding part and the inner surface of the first opening part, And curing the liquid resin.

In one aspect, the step of forming the first lower molding part may be formed so as not to cover the upper surface of the light emitting part.

According to another aspect of the present invention, there is provided a method of manufacturing a proximity sensor package, including the steps of: providing a base substrate; mounting a light emitting portion and a light receiving portion on an upper surface of the base substrate; Filling the liquid space with an inner space surrounded by an upper surface of the base substrate and an inner surface of the first opening, filling a liquid containing the liquid resin into the inner space surrounded by the upper surface of the base substrate and the inner surface of the first opening, Filling the liquid space with an inner space surrounded by the upper surface of the first opening and the inner surface of the second opening, and curing the liquid resin.

According to another aspect of the present invention, there is provided a method of manufacturing a proximity sensor package, including the steps of: providing a base substrate; mounting a light emitting portion and a light receiving portion on an upper surface of the base substrate; Forming a second lower molding part in contact with the upper surface of the base substrate around the light receiving part by injecting a first lower molding part abutting the upper surface of the base substrate around the light receiving part, And a second opening portion in which the light receiving portion is received, wherein the first lower molding portion is located inside the first opening portion, and the second lower molding portion is located inside the second opening portion, A step of joining the first lower molding part to the substrate, forming an upper surface of the first lower molding part and an inner side surface of the first opening part And a step, and curing the liquid resin to be filled with the liquid resin in the unit the method comprising filling a liquid resin in a space, the inner space formed is surrounded by the inner surface of the second upper surface of the lower mold portion and the second opening.

In one aspect, the step of forming the first lower molding part may be formed so as not to cover the upper surface of the light emitting part.

In one side, the step of forming the second lower molding part may be formed so as not to cover the upper surface of the light receiving part.

On one side, the liquid resin may be liquid silicone.

The proximity sensor package and the method of manufacturing the same according to an embodiment of the present invention can improve the accuracy of sensing the proximity of an object by not decreasing the light transmittance even though the molding part undergoes high temperature and high humidity and soldering process.

Further, the proximity sensor package and the method of manufacturing the same according to an embodiment of the present invention can improve the reliability of the proximity sensor package by tightly bonding the molding part to the substrate or the cover part.

In addition, the manufacturing method of the proximity sensor package according to an embodiment of the present invention can secure economical efficiency of the proximity sensor package by providing a simple manufacturing process while tightly bonding the molding part to the substrate or the cover part.

FIG. 1 is a graph showing light transmittance characteristics of a conventional proximity sensor package.
2 is a perspective view of a proximity sensor package according to an embodiment of the present invention.
3 is an exploded perspective view of a proximity sensor package according to an embodiment of the present invention.
4 is a cross-sectional view of a proximity sensor package according to an embodiment of the present invention.
FIG. 5 is a graph illustrating light transmission characteristics of a silicon molding part of a proximity sensor package according to an embodiment of the present invention.
6 to 10 are sectional views of a proximity sensor package according to an embodiment of the present invention.
11 is a flowchart illustrating a method of manufacturing a proximity sensor package according to an embodiment of the present invention.
Figs. 12 to 17 are process sectional views for explaining each step of the method of manufacturing the proximity sensor package of Fig.
18 is a flowchart illustrating a method of manufacturing a proximity sensor package according to an embodiment of the present invention.
Figs. 19 to 25 are process sectional views for explaining each step of the method of manufacturing the proximity sensor package of Fig. 18;

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that it is possible to make the gist of the present invention obscure by adding a detailed description of a technique or configuration already known in the field, it is omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express embodiments of the present invention, which may vary depending on the person or custom in the field. Therefore, the definitions of these terms should be based on the contents throughout this specification. Like reference numerals in the drawings denote like elements.

One aspect of the invention relates to a proximity sensor package.

Hereinafter, a proximity sensor package according to an embodiment of the present invention will be described with reference to FIGS. 2 to 5 attached hereto.

2 is a perspective view of a proximity sensor package according to an embodiment of the present invention. 3 is an exploded perspective view of a proximity sensor package according to an embodiment of the present invention. 4 is a cross-sectional view of a proximity sensor package according to an embodiment of the present invention.

2 to 4, the proximity sensor package includes a base substrate 100, a light emitting portion 110, a light receiving portion 130, a cover portion 200, a first molding portion 310, and a second molding portion 330 ).

Referring to FIG. 2, the cover unit 200 is coupled to the upper surface of the base substrate 100. The cover part 200 includes a first opening part 210 and a second opening part 230. The first molding part 310 and the second molding part 330 are formed in the inner space formed by the first and second openings 230 and the upper surface of the base substrate 100, respectively. The first molding part 310 and the second molding part 330 are exposed to the outside through the upper surfaces of the first and second openings 230.

Referring to FIG. 3, the light emitting unit 110 and the light receiving unit 130 are mounted on the upper surface of the base substrate 100. The light emitting unit 110 and the light receiving unit 130 are mounted on the upper surface of the base substrate 100 at positions shifted to one side opposite to each other. The light emitting unit 110 and the light receiving unit 130 may be mounted with a predetermined spacing therebetween.

The light emitting portion 110 and the light receiving portion 130 are mounted on a contact pad formed on the upper surface of the base substrate 100. The contact pads formed on the upper surface of the base substrate 100 may be electrically connected to the input / output pads formed on the lower surface of the base substrate 100.

The light emitting portion 110 emits light in a predetermined wavelength range. The light emitted from the light emitting unit 110 emitted by the light emitting unit 110 may be reflected by the proximity sensor near the upper surface of the proximity sensor package and irradiated to the light receiving unit 130. The light receiving unit 130 can receive the light of the light emitting unit 110 reflected by the touch surface sensing object. It is possible to determine whether or not the subject is in proximity to the light receiving unit 130 depending on the presence or the intensity of the light received by the light receiving unit 130. [

The light emitting unit 110 may emit light in various wavelength bands. For example, a UV (Ultra Violet) band of 200 to 400 nm, a visible light band of 450 to 650 nm, and an infrared band of 850 nm and 950 nm may be used. The wavelength of the light emitted from the light emitting unit 110 may be selectively used depending on the application and characteristics, and is not limited to the above-described examples.

Referring to FIG. 4, the cover portion 200 has a first opening 210, a second opening 230, and a shielding wall. The first opening 210 receives the light emitting portion 110 and the second opening 230 receives the light receiving portion 130. The shielding wall shields between the first opening 210 and the second opening 230, do. More specifically, the shielding wall may have a light shielding property such that light of the light emitting portion 110 can not pass through.

The cover unit 200 is coupled with the base substrate 100 to form an inner space surrounded by the inner surface of the base substrate 100 and the first and second openings 210 and 230. The light emitting portion 110 and the light receiving portion 130 are accommodated in the inner space, respectively.

The first molding part 310 is formed in the inner space surrounded by the inner surface of the base substrate 100 and the first opening 210. The first molding part 310 is coupled to the base substrate 100 or the cover part 200 around the light emitting part 110. The first molding part 310 may seal the light emitting part 110. The upper surface 315 of the first molding part 310 may have a concave or convex shape. Thus, the upper surface 315 of the first molding part 310 can refract light like a lens. The first molding part 310 shields the light emitting part 110 from the outside to protect the light emitting part 110 from an external impact or the like. Further, the light from the light emitting portion 110 can be refracted to condense or disperse the light.

In addition, the first molding part 310 may be formed to have a constant space between the first molding part 310 and the light emitting part 110. When the first molding part 310 is in direct contact with the light emitting part 110, delamination or cracking may occur between the first molding part 310 and the light emitting part 110 . Therefore, when the first molding part 310 is formed to be spaced apart from the surface of the light emitting part 110, the surface peeling or cracking can be prevented.

The second molding part 330 is formed in an inner space surrounded by the inner surface of the base substrate 100 and the second opening part 230. The second molding part 330 is coupled to the base substrate 100 or the cover part 200 around the light receiving part 130. The second molding part 330 can seal the light receiving part 130. The upper surface 335 of the second molding part 330 may have a concave or convex shape. Thus, the upper surface 335 of the second molding part 330 can refract light like a lens. The second molding part 330 may shield the light receiving part 130 from the outside to protect the light emitting part 110 from an external impact or the like. In addition, the light from the light emitting portion 110 can be refracted and the light from the light emitting portion 110 reflected by the touching object can be condensed or dispersed.

In addition, the second molding part 330 may be formed to have a constant spacing between the second molding part 330 and the light receiving part 130. When the second molding part 330 is in direct contact with the light receiving part 130, surface delamination or cracking may occur between the second molding part 330 and the light receiving part 130 . Therefore, when the second molding part 330 is formed apart from the surface of the light receiving part 130, the surface peeling or cracking can be prevented.

The first molding part 310 and the second molding part 330 may be formed of a material having high light transmittance with respect to the light of the light emitting part 110. For example, when the light emitting unit 110 emits light having a wavelength band corresponding to 200 nm to 400 nm, the first molding unit 310 and the second molding unit 330 may have high light transmittance with respect to the wavelength band It is preferable that it is formed of a material.

The first molding part 310 and the second molding part 330 may be formed of a material firmly coupled to the upper surface of the base substrate 100 or the cover part 200.

The first molding part 310 and the second molding part 330 may be exposed to a high temperature of about 200 ° C or higher in a reflow process performed while the proximity sensor package is mounted. In addition, depending on the use environment of the proximity sensor, it can be exposed to high temperature and high humidity for a long time. Accordingly, the first molding part 310 and the second molding part 330 are formed of a material that can maintain high light transmittance with respect to the light of the light emitting part 110 even if the first molding part 310 and the second molding part 330 are exposed to high temperature several times or exposed to high temperature and high humidity for a long time. .

As shown in FIG. 1, the molding part formed of the EMC material is characterized in that the light transmittance of a specific wavelength band (which differs depending on products of EMC, but is usually in a wavelength band of 200 nm to 700 nm) is degraded after several reflow processes .

On the other hand, as shown in FIG. 5, the molding portion formed of a silicon material maintains high light transmittance in most wavelength bands even after several reflow processes. However, since the molding part formed of a silicone material has a weak strength to be tightly coupled with the base substrate 100 or the cover part 200, the molding part can be easily separated by external impact or environmental influences.

Accordingly, one selected from the first molding part 310 or the second molding part 330 may be formed of a silicon material and the other may be made of another material such as an EMC material. Referring to FIG. 4, the first molding part 310 may be formed of an EMC material, and the second molding part 330 may be formed of a silicon material. Generally, since the surface area of the light receiving portion 130 is wider than the light emitting portion 110, it is more preferable to form the second molding portion 330 of silicone material to maintain the adhesive force of the second molding portion 330. In another possible embodiment, the first molding part 310 may be formed of a silicone material, and the second molding part 330 may be formed of an EMC material. When one molding part is made of a silicone material and the other molding part is made of another resin material such as EMC material, the light transmittance of the molding part can be improved to some extent, and the adhesiveness of the molding part can be kept constant have.

The molding part of the EMC material can be injection molded on the base substrate 100. More specifically, the molding part of the EMC material is formed by insert injection directly onto the base substrate 100 in a form covering the light emitting part 110 or the light receiving part 130.

The molding part of the silicon material may be formed by filling the inner space formed by the upper surface of the base substrate 100 and the inner surface of the second opening part 230 with liquid silicone and curing. More specifically, when the cover portion 200 is coupled to the base substrate 100 to form an internal space, a liquid silicone is filled into the internal space using a liquid resin dispenser. The liquid silicone is then cured. The shape of the upper surface of the molding part can be formed in a lens shape or the like during the curing process.

4, the first molding part 310 is first formed on the base substrate 100, and after the cover is coupled with the base substrate 100, the second molding part 330, .

Referring to FIG. 6, the first molding part 310 may be formed of a silicone material, and the second molding part 330 may be formed of an EMC material. In this case, the first molding part 310 may be formed by curing the liquid silicone, and the second molding part 330 may be formed by insert injection molding.

Referring to FIG. 7, both the first molding part 310 and the second molding part 330 may be formed of a silicon material. At this time, both the first molding part 310 and the second molding part 330 may be formed by curing the liquid silicon.

In this case, the light transmittance of the molding part can be improved. However, the adhesion of the molding part can be weakened. Various structures may be added to solve the problem of weakening the adhesion of the molding part. For example, it is possible to strengthen the adhesive strength between the cover and the base substrate 100, or to apply a separate adhesive for bonding the molding part. One of the other possible structures will be described in another embodiment below.

Hereinafter, a proximity sensor package according to another embodiment of the present invention will be described with reference to FIG. For convenience of description, the proximity sensor package according to another embodiment of the present invention will be described focusing on differences from the above-described embodiment with reference to FIGS. 2 to 5.

8 is a cross-sectional view of a proximity sensor package according to an embodiment of the present invention.

Referring to FIG. 8, the second molding part 330 is formed in the inner space surrounded by the inner surface of the base substrate 100 and the second opening part 230, as described above. The second molding part 330 includes a second lower molding part 331 and a second upper molding part 333.

The second lower molding part 331 abuts and engages with the upper surface of the base substrate 100 around the light receiving part 130. More specifically, the second lower molding part 331 is formed to abut the upper surface of the base substrate 100 forming the inner space formed by the cover part 200 coupled with the base substrate 100.

The second lower molding part 331 may be formed so as not to cover the upper surface of the light receiving part 130. More specifically, the height of the second lower molding part 331 may be lower than the height of the light receiving part 130. The light of the light emitting part 110 irradiated to the light receiving part 130 does not pass through the second lower molding part 331 and the light loss according to the low light transmittance of the second lower molding part 331 can be avoided .

As described above, since the second lower molding part 331 can be formed so as not to allow the light received by the light receiving part 130 to pass through, the second lower molding part 331 can be formed of an EMC material that is relatively less light- have. As described above, since the EMC material has a higher adhesion than a material such as silicon, the EMC material is firmly adhered to the inner surface of the base substrate 100 or the second opening 230 while forming the lower part of the second molding part 330 Can be combined.

The second upper molding part 333 is joined to the upper part of the second lower molding part 331. More specifically, the second upper molding part 333 is formed in the inner space formed by the upper surface of the second lower molding part 331 and the inside of the second opening part 230.

The second upper molding part 333 is formed of a silicon material. As described above, the silicon material maintains high light transmittance even after a high temperature reflow process. The second upper molding portion 333 passes light of the light emitting portion 110 through which the light receiving portion 130 receives light. The second upper molding part 333 formed of silicon can minimize the loss of light.

The second molding part 330 formed of a different material can ensure adhesion by the second lower molding part 331 and can ensure light transmittance by the second upper molding part 333.

As described above, the molding part of the EMC material can be formed by injection-molding on the base substrate 100, and the molding part of the silicon material can be formed by filling the inner space with the liquid silicone state and curing. Therefore, in the case of this embodiment, the second molding part 330 is formed by first injecting the second lower molding part 331, and the cover part 200 is coupled to the base substrate 100, and the upper part of the lower molding part The inner space surrounded by the inner surface of the second opening 230 may be filled with liquid silicon and then cured to form the second upper molding part 333.

9, the first molding part 310 may include a first lower molding part 311 and a first upper molding part 313, as in the second molding part 330 of the above-described embodiment, As shown in FIG.

Like the second lower molding part 331, the first lower molding part 311 is also made of EMC material. The first lower molding part 311 may be formed so as not to cover the upper surface of the light emitting part 110. Accordingly, light from the light emitting portion 110 does not pass through the first lower molding portion 311, thereby avoiding light loss.

Like the second upper molding part 333, the first upper molding part 313 is also made of a silicon material. The first upper molding part 313 is formed of a silicon material so that the loss of light of the light emitting part 110 can be reduced by the light of the light emitting part 110 passing through the first upper molding part 313 and radiated to the outside of the proximity sensor. Can be minimized.

Referring to FIG. 10, as another possible embodiment, in the first molding part 310 and the second molding part 330, both molding parts may be formed to include a lower molding part and an upper molding part.

Another aspect of the invention relates to a method of manufacturing a proximity sensor package.

In describing the method of manufacturing the proximity sensor package of the present invention, the order of the steps of the method of manufacturing the proximity sensor package corresponds to a preferred embodiment that can be performed to manufacture the proximity sensor package, And may be performed in the case of some of the steps.

In describing the method of manufacturing the proximity sensor package for convenience of explanation, some of the same contents as those of the proximity sensor package described above are omitted.

Hereinafter, a method of manufacturing a proximity sensor package according to an embodiment of the present invention will be described with reference to FIGS.

11 is a flowchart illustrating a method of manufacturing a proximity sensor package according to an embodiment of the present invention. Figs. 12 to 17 are process sectional views for explaining each step of the method of manufacturing the proximity sensor package of Fig.

11, a method of manufacturing a proximity sensor package includes a base substrate preparing step S110, a light emitting part and a light receiving part mounting step S120, a first molding part forming step S130, a cover part bonding step S140, A resin filling step (S150) and a curing step (S160).

Referring to FIG. 12, a base substrate preparing step S110 is a step of providing a base substrate 100 on which the light emitting unit 110 and the light receiving unit 130 can be mounted.

The base substrate 100 may be provided as an array base substrate 100 having a plurality of base substrates 100 connected to each other. In this case, the manufacture of a plurality of proximity sensor packages can be performed in a single process.

13, the mounting step S120 of mounting the light emitting unit 110 and the light receiving unit 130 on the upper surface of the base substrate 100 is a step of mounting the light emitting unit and the light receiving unit. The light emitting portion 110 and the light receiving portion 130 may be electrically connected to a contact pad formed on the upper surface of the base substrate 100. The light emitting unit 110 and the light receiving unit 130 may be coupled by a ball grid array (BGA), a wire bonding, or a flip-chip bonding method.

In addition, when the base substrate 100 is provided in the above-described array form, the light emitting unit 110 and the light receiving unit 130 may be mounted on the plurality of base substrates 100, respectively.

Referring to FIG. 14, the first molding part forming step S130 is a step of forming a first molding part 310, which covers the light emitting part 110, on the upper surface of the base substrate 100 by injection. More specifically, the first molding part 310 may be formed by insert molding in a state where the light emitting part 110 is inserted on the base substrate 100. Alternatively, the first molding part 310 having a predetermined shape may be separately injection molded and joined on the upper surface of the base substrate 100 so as to cover the light emitting part 110.

The first molding part 310 may be formed of an EMC material. The EMC material can be tightly adhered to the base substrate 100 and the like. The first molding part 310 may be firmly adhered to the surface of the base substrate 100 or the light emitting part 110. In this case,

In addition, when the base substrate 100 is provided in the above-described array form, the first molding part 310 may be formed on each of the plurality of base substrates 100.

Referring to FIG. 15, the step of engaging the cover part S140 includes a cover part 200 having a first opening part 210 receiving the light emitting part 110 and a second opening part 230 receiving the light receiving part 130, Is coupled with the base substrate (100) so that the first molding part (310) is located inside the first opening (210). The cover 200 may be coupled to the base substrate 100 so that the inner surface of the first opening 210 may be closely contacted with the first molding part 310. In addition, an inner space surrounded by the inner surface of the second opening 230 and the base substrate 100 can be formed. The cover portion 200 and the base substrate 100 may be coupled to each other through an adhesive or the like.

In addition, when the base substrate 100 is provided in the above-described array form, the cover portion 200 can be coupled to the plurality of base substrates 100, respectively.

Referring to FIG. 16, the liquid resin filling step S150 is a step of filling the inner space surrounded by the upper surface of the base substrate 100 and the inner surface of the second opening 230 with the liquid resin. It is preferable that the liquid resin is a resin capable of maintaining a high light transmittance to a specific wavelength band (for example, a wavelength band of 200 nm to 400 nm) even though it is subjected to a high-temperature reflow process such as a silicone resin. The liquid resin may flow into the inner space through the second opening part 230 of the cover part 200 through the dispenser 400. The liquid resin is cured in a subsequent step to form a second molding part 330.

Further, in the liquid resin filling step, the upper surface may be formed into a specific shape by using a separate mold or the like. For example, the upper surface of the second molding part 330 may be formed in a convex lens shape to condense the light received by the light receiving part 130.

In addition, when the base substrate 100 is provided in the above-described array form, the inner space of the plurality of base substrates 100 can be filled with liquid resin.

Referring to Fig. 17, the curing step S160 is a step of curing the filled liquid resin. The liquid resin is cured to form the second molding part 330.

11 to 17, the first molding part 310 is molded and injected before the cover part 200 is coupled. After the second molding part 330 is joined to the cover part 200, The first molding part 310 may be molded and injected before the cover part 200 is joined and the second molding part 330 may be molded after the cover part 200 is joined, Or may be formed from a resin. Also, as another possible embodiment, both the first molding part 310 and the second molding part 330 may be formed from the liquid resin after the cover part 200 is joined.

Hereinafter, a method of manufacturing the proximity sensor package according to another embodiment of the present invention will be described with reference to FIGS. 18 to 25 attached hereto. 18 is a flowchart illustrating a method of manufacturing a proximity sensor package according to an embodiment of the present invention. Figs. 19 to 25 are process sectional views for explaining each step of the method of manufacturing the proximity sensor package of Fig. 18;

For convenience of explanation, the method of manufacturing the proximity sensor package according to the present embodiment will be described with focus on differences from the method of manufacturing the proximity sensor package described with reference to FIGS. 11 to 17. FIG.

18, a method of manufacturing a proximity sensor package according to the present embodiment includes a base substrate preparing step S210, a light emitting part and a light receiving part mounting step S220, a first molding part forming step S230, (230), a cover part bonding step (S250), a liquid resin filling step (S260), and a curing step (S270).

Referring to FIG. 19, a base substrate preparing step S210 is a step of providing a base substrate 100 on which the light emitting unit 110 and the light receiving unit 130 can be mounted.

Referring to FIG. 20, the light emitting unit and the light receiving unit mounting step S220 is a step of mounting the light emitting unit 110 and the light receiving unit 130 on the upper surface of the base substrate 100. FIG.

Referring to FIG. 21, the first molding part forming step S230 is a step of forming a first molding part 310 covering the light emitting part 110 on the upper surface of the base substrate 100 by injection molding.

22, the second lower molding part forming step S240 includes a second lower molding part 331 which abuts the upper surface of the base substrate 100 around the light receiving part 130 on the upper surface of the base substrate 100 And is formed by injection molding. More specifically, the second lower molding part 331 may be formed by insert molding in a state where the light receiving part 130 is inserted on the base substrate 100. Alternatively, the first molding part 310 having a predetermined shape may be separately injection molded and joined on the upper surface of the base substrate 100 so as to cover the light emitting part 110.

The second lower molding part 331 may be formed so as not to cover the upper surface of the light receiving part 130. That is, since the height of the second lower molding part 331 is lower than the height of the light receiving part 130, the second lower molding part 331 is formed so as to be in contact with the side surface of the light receiving part 130, .

The second lower molding part 331 may be formed of an EMC material. The second lower molding part 331 can improve the poor adhesion of the second upper molding part 333 made of a material such as silicon. When the second lower molding part 331 is insert-injected with the EMC material, the second lower molding part 331 can firmly contact with the upper surface of the base substrate 100 or the side surface of the light receiving part 130.

23, the step of joining the cover part S250 includes a cover part 200 having a first opening part 210 receiving the light emitting part 110 and a second opening part 230 receiving the light receiving part 130, Is coupled with the base substrate 100 such that the first molding part 310 is positioned inside the first opening 210 and the second lower molding part 331 is positioned inside the second opening part 230. [ The cover portion 200 may be combined with the base substrate 100 to form an inner space surrounded by the upper surface of the second lower molding portion 331 and the inner surface of the second opening portion 230. [

Referring to FIG. 24, the liquid resin filling step (S260) is a step of filling the inner space surrounded by the upper surface of the second lower molding part 331 and the inner surface of the second opening part 230 with the liquid resin. It is preferable that the liquid resin is a resin capable of maintaining a high light transmittance to a specific wavelength band (for example, a wavelength band of 200 nm to 400 nm) even though it is subjected to a high-temperature reflow process such as a silicone resin. The liquid resin may flow into the inner space through the second opening part 230 of the cover part 200 through the dispenser 400. The liquid resin is cured in a subsequent step to form a second upper molding part 333.

In addition, the upper surface may be formed into a specific shape by using a separate mold or the like in the liquid resin filling step (S260). For example, the upper surface 335 of the second upper molding part 333 may be formed in a convex lens shape so that light received by the light receiving part 130 can be condensed.

Referring to Fig. 25, the curing step S270 is a step of curing the filled liquid resin. The liquid resin is cured to form the second upper molding portion 333.

18 to 25, the second molding part 330 is described as being formed to include the second lower molding part 331 and the second upper molding part 333, As an embodiment, the first molding part 310 may be formed to include the first lower molding part 311 and the first upper molding part 313. In another possible embodiment, both the first molding part 310 and the second molding part 330 include the first and second lower molding parts 331 and the first and second upper molding parts 333 But it is also possible to include it.

100: Base substrate
110: light emitting portion 130:
200: cover part 210: first opening
230: second opening
310: first molding part 311: first lower molding part
313: first upper molding part
330: second molding part 331: second lower molding part
333: second upper molding part

Claims (19)

A base substrate;
A light emitting unit mounted on an upper surface of the base substrate;
A light receiving unit mounted on an upper surface of the base substrate to receive light emitted from the light emitting unit reflected by the touch surface sensing body;
A cover portion having a first opening in which the light emitting portion is received, a second opening in which the light receiving portion is received, and a shielding wall that shields the first opening and the second opening from each other;
A first molding part coupled to the base substrate or the cover part around the light emitting part from the inside of the first opening part; And
A second upper molding part coupled to an upper surface of the base substrate around the light receiving part and formed of an EMC (Epoxy Molding Compound) material, and a second upper molding part coupled to an upper part of the second lower molding part, And a second molding part,
And the second lower molding portion is formed so as not to cover the upper surface of the light receiving portion.
The method according to claim 1,
Wherein the second lower molding part is formed on an upper surface of the base substrate,
Wherein the second upper molding portion is formed by curing the liquid silicone filled in the inner space surrounded by the upper surface of the second lower molding portion and the inner surface of the second opening portion.
A base substrate;
A light emitting unit mounted on an upper surface of the base substrate;
A light receiving unit mounted on an upper surface of the base substrate to receive light emitted from the light emitting unit reflected by the touch surface sensing body;
A cover portion having a first opening in which the light emitting portion is received, a second opening in which the light receiving portion is received, and a shielding wall that shields the first opening and the second opening from each other;
And a first upper molding part coupled to an upper part of the first lower molding part and made of silicon, the first upper molding part being formed of an EMC material, the first upper molding part being in contact with the upper surface of the base substrate around the light emitting part, A molding part; And
And a second molding part coupled to the base substrate or the cover part around the light receiving part inside the second opening part,
Wherein the first lower molding portion is formed so as not to cover the upper surface of the light emitting portion.
Providing a base substrate;
Mounting a light emitting portion and a light receiving portion on an upper surface of the base substrate;
Forming a first molding part on the upper surface of the base substrate to cover the light emitting part;
Forming a second lower molding part on an upper surface of the base substrate, the second lower molding part abutting the upper surface of the base substrate around the light receiving part;
A cover portion having a first opening for receiving the light emitting portion and a second opening for receiving the light receiving portion, the first molding portion being located inside the first opening, and the second lower molding portion being located inside the second opening, Engaging a base substrate;
Filling a liquid resin into an inner space surrounded by an upper surface of the second lower molding part and an inner surface of the second opening part; And
And curing the liquid resin,
The step of forming the second lower mold-
And the upper surface of the light receiving portion is not covered.
A method of manufacturing a proximity sensor package.
Providing a base substrate;
Mounting a light emitting portion and a light receiving portion on an upper surface of the base substrate;
Forming a first lower molding part on an upper surface of the base substrate, the first lower molding part abutting the upper surface of the base substrate around the light emitting part;
Forming a second molding part on the upper surface of the base substrate to cover the light receiving part;
A cover portion including a first opening portion in which the light emitting portion is received and a second opening portion in which the light receiving portion is received, the first lower molding portion being located inside the first opening portion, and the second molding portion being located inside the second opening portion, Engaging a base substrate;
Filling a liquid resin into an inner space surrounded by an upper surface of the first lower molding part and an inner surface of the first opening part; And
And curing the liquid resin,
The step of forming the first lower mold-
And the upper surface of the light emitting portion is not covered.
Providing a base substrate;
Mounting a light emitting portion and a light receiving portion on an upper surface of the base substrate;
Forming a first lower molding part on an upper surface of the base substrate, the first lower molding part abutting the upper surface of the base substrate around the light emitting part;
Forming a second lower molding part on an upper surface of the base substrate, the second lower molding part abutting the upper surface of the base substrate around the light receiving part;
A cover portion having a first opening portion in which the light emitting portion is received and a second opening portion in which the light receiving portion is received is positioned such that the first lower molding portion is located inside the first opening portion and the second lower molding portion is located inside the second opening portion Coupling to the base substrate;
Filling a liquid resin into an inner space surrounded by an upper surface of the first lower molding part and an inner surface of the first opening part;
Filling a liquid resin into an inner space surrounded by an upper surface of the second lower molding part and an inner surface of the second opening part; And
And curing the liquid resin,
At least one of the step of forming the first lower molding part and the step of forming the second lower molding part,
Wherein at least one of the first lower molding portion and the second lower molding portion is formed so as not to cover the upper surface of at least one of the light emitting portion and the light receiving portion.
7. The method according to any one of claims 4 to 6,
Wherein the liquid resin is liquid silicon.



delete delete delete delete delete delete delete delete delete delete delete delete

Images