KR20150130193A

KR20150130193A - Sensor package and manufacturing method thereof

Info

Publication number: KR20150130193A
Application number: KR1020140057457A
Authority: KR
Inventors: 김태원; 정영우; 김규섭
Original assignee: (주)파트론
Priority date: 2014-05-13
Filing date: 2014-05-13
Publication date: 2015-11-23

Abstract

Disclosed is a sensor package. The sensor package of the present invention comprises: a substrate; a light emitting unit and a light receiving unit which are mounted on the substrate; a sidewall member which comprises a first opening accommodating the light emitting unit, a second opening accommodating the light receiving unit, and a shielding wall shielding the gap between the first and second openings wherein a lower side of the sidewall member is coupled with the substrate; and a cover glass which is coupled with an upper side of the sidewall member to shield the first and second openings.

Description

[0001] SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF [0002]

The present invention relates to a sensor package and a manufacturing method thereof.

Recently, electronic devices such as smart phones and tablet computers have evolved into electronic devices capable of performing multiple functions such as camera function, location search function using GPS, and healthcare function in addition to simple call and text message sending and receiving functions. In order to realize such a complex function, demands for various sensors are increasing, and optical sensors are a representative example thereof.

The optical sensor includes a light amount sensor capable of measuring a light amount in a measurement wavelength band such as a visible light or an ultraviolet in the vicinity, and a gesture sensor receiving light reflected by the light emitted from the light emitting part and measuring movement or proximity of the object can do.

Korean Patent Publication No. 10-2010-0069531 (published on June 24, 2010) discloses a portable terminal including a proximity sensor.

The optical sensor is required to be mounted on the outside of the electronic device so that external light can enter or exit the device. Therefore, the optical sensor may be vulnerable to an external impact or the like. In addition, the optical sensor should be formed of a light-transmitting material with respect to a wavelength band of light to be used. For this reason, there has been a restriction in selecting a material having high durability and low cost.

In addition, as electronic devices on which optical sensors are mounted become smaller and thinner, optical sensors are also becoming smaller. However, as the optical sensor is miniaturized, a more precise assembly process is required and the assembly yield is lowered.

Accordingly, there is an increasing demand for a sensor package and a manufacturing method thereof that can secure a certain level of reliability and performance, and which has a simple assembling process and is related to an optical sensor.

A problem to be solved by the present invention is to provide a sensor package having sufficient durability against an external impact when an optical sensor is mounted on an electronic device and a method of manufacturing the sensor package.

Another problem to be solved by the present invention is to provide a sensor package capable of providing sufficient optical characteristics with respect to the wavelength of light emitted or received by the optical sensor and a method of manufacturing the same.

Another object to be solved by the present invention is to provide a method of manufacturing a sensor package capable of achieving a high yield even for a miniaturized optical sensor by simplifying the process.

According to an aspect of the present invention, there is provided a sensor package including a substrate, a light emitting portion and a light receiving portion mounted on the substrate, a first opening in which the light emitting portion is received, a second opening in which the light receiving portion is received, And a cover glass which includes a shielding wall for shielding between the openings, a side wall member whose lower side engages with the substrate, and a cover glass which engages with the upper side of the side wall member to seal the first and second openings.

In one embodiment of the present invention, the cover glass may have a light transmittance of 60% or more with respect to a wavelength band of light emitted by the light emitting unit and a wavelength band of light received by the light receiving unit.

According to an embodiment of the present invention, a groove may be formed on the side wall member, and the cover glass may be received in the groove.

In one embodiment of the present invention, a protruding wall protruding from a rim portion of the upper surface of the side wall member is formed, and the groove may be formed by the protruding wall.

According to an embodiment of the present invention, an adhesive may be further applied between the side wall member and the cover glass to bond the side wall member and the cover glass.

In one embodiment of the present invention, the adhesive may have a light transmittance of 60% or less with respect to a wavelength band of light emitted by the light emitting unit and a wavelength band of light received by the light receiving unit.

In one embodiment of the present invention, the light emitting device may further include a molding part surrounding the light emitting part within the first opening.

In an embodiment of the present invention, the sidewall member may be formed of a material impregnated with paper or glass fiber, such as a phenol resin, a polyester resin, a polyimide resin, or an epoxy resin.

In one embodiment of the present invention, the substrate and the sidewall member may be formed of the same material.

In one embodiment of the present invention, the sidewall member may have a thermal expansion coefficient of 0.8 to 1.2 times the thermal expansion coefficient of the substrate.

According to another aspect of the present invention, there is provided a method of manufacturing a sensor package, the method comprising the steps of: forming a bottom surface of a plurality of sensor packages and providing a substrate including a plurality of effective regions spaced apart from each other with an intermediate region therebetween; A plurality of sidewall members spaced apart from each other by an intermediate member and including a first opening for receiving the light emitting portion and a second opening for receiving the light receiving portion, Applying an adhesive to an area including an upper surface of the side wall member frame and an upper surface of the intermediate member around the side wall member, bonding the cover glass to the side wall member by the adhesive, Into one sensor package including an effective area and one sidewall member.

In an embodiment of the present invention, the upper surface of the sidewall member rim and the upper surface of the intermediate member around the sidewall member may be flush with each other.

In one embodiment of the present invention, the separating step may include separating the effective area and the intermediate area.

In one embodiment of the present invention, the separating step may include separating the sidewall member and the intermediate member.

A sensor package and a method of manufacturing the same according to an embodiment of the present invention can have sufficient durability against an external impact when the optical sensor is mounted on an electronic device.

In addition, the sensor package and the manufacturing method thereof according to the embodiment of the present invention can provide sufficient optical characteristics for the wavelength of the light emitted or received by the optical sensor.

In addition, the method of manufacturing a sensor package according to an embodiment of the present invention can achieve a high yield even for a miniaturized optical sensor by simplifying the process.

1 is a perspective view of a sensor package according to an embodiment of the present invention.
2 is a cross-sectional view of the sensor package shown in FIG. 1, taken along line AA '.
3 is an exploded cross-sectional view of the sensor package shown in Fig.
4 is a cross-sectional view of a sensor package according to another embodiment of the present invention.
5 is a flowchart illustrating a method of manufacturing a sensor package according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that it is possible to make the gist of the present invention obscure by adding a detailed description of a technique or configuration already known in the field, it is omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express embodiments of the present invention, which may vary depending on the person or custom in the field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

Hereinafter, a sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3 attached hereto.

1 is a perspective view of a sensor package according to an embodiment of the present invention. 2 is a cross-sectional view of the sensor package shown in FIG. 1, taken along line AA '. 3 is an exploded cross-sectional view of the sensor package shown in Fig.

1 to 3, the sensor package of the present invention includes a substrate 100, a light emitting portion 110, a light receiving portion 130, a side wall member 200, and a cover glass 300.

The substrate 100 is formed in the form of a circuit board 100 on which the light emitting unit 110 and the light receiving unit 130 are mounted. The substrate 100 may be in the form of a conventional printed circuit board (PCB). The substrate 100 may be formed of a material impregnated with a paper or glass fiber, such as a phenol resin, a polyester resin, a polyimide resin, or an epoxy resin. Such materials may generally be FR-2, FR-3, FR-4, FR-5, FR-6 CEM-1, CEM-3 or GI. However, the material of the substrate 100 is not limited to the above-described examples.

A conductive pad may be formed on the upper surface of the substrate 100 to be coupled to the light emitting portion 110 and the light receiving portion 130. In the substrate 100, the conductive pad coupled to the light emitting portion 110 and the conductive pad coupled to the light receiving portion 130 may be spaced apart from each other on the substrate 100. For example, the conductive pad coupled to the light emitting portion 110 is biased toward one side, and the conductive pad coupled to the light receiving portion 130 may be biased toward the other side.

In the lower surface of the substrate 100, an input / output pad may be formed to couple the sensor package to the electronic device to input / output an electrical signal. The conductive pad on the upper surface of the substrate 100 may be electrically connected to the input / output pad on the lower surface.

The light emitting unit 110 and the light receiving unit 130 are mounted on the upper surface of the substrate 100.

The light emitting portion 110 emits light in a predetermined wavelength range. The light emitting unit 110 may include a light emitting diode (LED). The light emitting unit 110 may include a plurality of light emitting diodes to emit light in a wide wavelength range or a plurality of wavelength ranges.

The light emitted from the light emitting unit 110 emitted by the light emitting unit 110 may be reflected by the surface of the object to be sensed proximate to the upper surface of the sensor package and irradiated to the light receiving unit 130.

The light receiving unit 130 receives light in a predetermined wavelength range. The light receiving unit 130 may be a photo diode or the like that can receive light and convert it into an electric signal. The light receiving unit 130 may include a plurality of photodiodes to receive light in a wide wavelength range or a plurality of wavelength ranges. More specifically, the light receiving unit 130 can receive light in a wavelength band of light emitted by the light emitting unit 110, and can receive light in other wavelength bands.

The light receiving unit 130 can receive the light of the light emitting unit 110 reflected by the touch surface sensing object. It is possible to detect the proximity of the touching object or the kind of the gesture according to the presence or the intensity of the light received by the light receiving unit 130. [

The wavelength of the light emitted by the light emitting unit 110 and the light receiving unit 130 is not limited to a specific wavelength band. The wavelength of the light can be variously changed by the designer of the sensor package and the like depending on the purpose and purpose of the sensor package. For example, when the sensor package is used for the proximity sensor, the wavelength of the light including the infrared band of 700 nm to 1100 nm may be used as the wavelength of the light of the light emitting unit 110 and the light receiving unit 130, The wavelength of the light including the visible light band of 350 to 750 nm may be used as the wavelength of the light of the light receiving unit 130 and the wavelength of the light including the ultraviolet band of 400 nm or less when the UV sensor is used as the wavelength of the light of the light receiving unit 130 A wavelength band can be used. In addition, two or more wavelength bands of the above-mentioned examples may be simultaneously used to perform a combination of two or more functions.

The side wall member 200 is coupled with the substrate 100 to shield the light emitting portion 110 and the light receiving portion 130 from each other. It is possible to prevent the light from the light emitting portion 110 from being directly irradiated to the light receiving portion 130 by the side wall member 200. [

The sidewall member 200 may be formed of a material having low light transmittance to the light of the light emitting unit 110 so as to shield the light of the light emitting unit 110.

In addition, the sidewall member 200 may be formed by connecting a plurality of sidewall members 200 in a mass production process, and may be formed separately through a sawing process. For this purpose, it is preferable that the side wall member 200 is formed of a material in which burrs are relatively less generated in the process of separating in the sawing process.

In addition, since the sidewall member 200 is coupled with the substrate 100, it is preferable that the sidewall member 200 is formed of a material having a thermal expansion coefficient similar to that of the substrate 100. Accordingly, even if the sensor package is used in a wide temperature range, the connection between the substrate 100 and the side wall member 200 can be firmly maintained, and the shape of the sensor package can be prevented from being deformed. Specifically, the material of the sidewall member 200 may be selected so that the sidewall member 200 has a thermal expansion coefficient of 0.8 to 1.2 times the thermal expansion coefficient of the substrate 100.

The sidewall member 200 may be formed of, for example, a material constituting a printed circuit board. Specifically, it may be formed of a material impregnated with paper or glass fiber, such as a phenol resin, a polyester resin, a polyimide resin, or an epoxy resin. Such materials may generally be FR-2, FR-3, FR-4, FR-5, FR-6 CEM-1, CEM-3 or GI. However, the material of the side wall member 200 is not limited to the above-described example. The side wall member 200 may be made of the same material as the substrate 100.

The sidewall member 200 includes a first opening 210, a second opening 230, and a shielding wall. The first and second openings 210 and 230 are formed through the upper surface and the lower surface of the side wall member 200. The first opening 210 receives the light emitting portion 110 mounted on the upper surface of the substrate 100 when the lower surface of the side wall member 200 is coupled to the substrate 100, Receiving unit 130 mounted on the upper surface of the photodiode 100. The shielding wall shields between the first and second openings 210, 230.

The cover glass 300 is coupled to the upper surface of the side wall member 200 to seal the first and second openings 210 and 230. Accordingly, not only the light emitting unit 110 and the light receiving unit 130 housed in the first and second openings 210 and 230 can be protected from external impacts, but also external foreign substances can be prevented from entering the first and second openings 210 and 230, 230). &Lt; / RTI >

The cover glass 300 preferably has light transmittance of 60% or more with respect to the wavelength band of light because the light emitted by the light emitting portion 110 and the light received by the light receiving portion 130 pass through. When the light transmittance of the cover glass 300 is lower than 60%, the loss of light is excessively large, resulting in a decrease in efficiency as well as a remarkable decrease in measurement accuracy.

The cover glass 300 is coupled to the upper surface of the side wall member 200. Specifically, when a groove as described above is formed on the upper surface of the side wall member 200, the cover glass 300 may be coupled to the groove.

The cover glass 300 may be joined to the side wall member 200 by an adhesive 250. In this case, the adhesive 250 may be selectively positioned only at a portion of the lower surface of the cover glass 300 which is engaged with the upper surface of the side wall member 200. That is, the adhesive agent 250 is not applied to the portions of the cover glass 300 that seal the upper surfaces of the first and second openings 210 and 230. Accordingly, the light emitted from the light emitting unit 110 and the light received by the light receiving unit 130 do not pass through the adhesive 250. Accordingly, the adhesive 250 may be made of a material having a low light transmittance. Through this, various kinds of adhesives 250 can be used, the bonding strength can be increased, and the unit cost of the sensor package can be reduced. Specifically, the adhesive 250 may be formed of a material having a light transmittance of 60% or less with respect to the wavelength band of the light emitted by the light emitting unit 110 and the wavelength band of the light received by the light receiving unit 130.

The adhesive 250 is first applied to a part of the upper surface of the sidewall member 200 during the manufacturing process and then the upper surface of the sidewall member 200 and the cover glass It is preferable that the lower surface of the base 300 is coupled.

The sensor package of the present invention may further include a molding part for sealing the light emitting part 110 or the light receiving part 130 within the first or second opening part 230. [ The molding part may be formed of a resin material having high light transmittance with respect to light emitted from the light emitting part 110 or light received by the light receiving part 130, such as epoxy series or silicone series.

The molding part may be formed to be in contact with the surface of the light emitting part 110 or the light receiving part 130 or slightly spaced from the surface of the light emitting part 110 or the light receiving part 130. It is possible to protect the light emitting unit 110 or the light receiving unit 130 from an external impact or the like and increase the coupling force between the light emitting unit 110 or the light receiving unit 130 and the substrate 100. [

Hereinafter, another embodiment of the sensor package of the present invention will be described with reference to FIG. Referring to FIG. 4, another embodiment of the sensor package will be described focusing on differences from the embodiment of the sensor package described with reference to FIGS. 1 to 3. FIG.

4 is a cross-sectional view of another embodiment of the sensor package of the present invention.

Referring to FIG. 4, a groove may be formed on the upper surface of the side wall member 200. The groove may be formed by a protruding wall protruding from a rim portion of the upper surface of the side wall member 200. A portion of the upper surface of the first and second openings 210 and 230 which is inside the rim portion formed with the protruding wall is formed so as to be lowered by the protruding wall so that a groove surrounded by the protruding wall is formed. The cover glass 300 to be described later may be coupled to the groove.

Another aspect of the invention relates to a method of manufacturing a sensor package.

In describing the method of manufacturing the sensor package of the present invention, the order of the steps of the method of manufacturing the sensor package corresponds to a preferred embodiment that can be performed for manufacturing the sensor package, It does not need to be performed, and some steps may be performed with the order reversed.

In describing the method of manufacturing the sensor package for convenience of description, some of the same contents as those of the above-described sensor package will be omitted.

Hereinafter, a method of manufacturing a sensor package according to an embodiment of the present invention will be described with reference to FIGS.

5 is a flowchart illustrating a method of manufacturing a sensor package according to an embodiment of the present invention. Figs. 6 to 10 are process sectional views for explaining each step of the method of manufacturing the sensor package of Fig. 5; 11 is an exploded cross-sectional view for explaining a method for manufacturing a sensor package. 12 is an exploded perspective view for explaining a method of manufacturing a sensor package. 13 is a sectional view for explaining the separation step of the method of manufacturing the sensor package.

A method of manufacturing a sensor package described below relates to a process for manufacturing a plurality of sensor packages arranged in one direction.

Referring to FIG. 6, a step S100 of providing a substrate is a step of providing a substrate 500 including a plurality of effective regions 501. One effective area 501 forms the bottom surface of one sensor package.

The plurality of valid areas 501 may be arranged in a certain form. For example, in a first direction and in a second direction different from the first direction. And may be perpendicular to the first direction and the second direction. Although the number of the idle regions 501 arranged in the first direction and the second direction is limited to two and three in all the accompanying drawings, the present invention is not limited thereto.

The plurality of effective regions 501 are spaced apart from each other with the intermediate region 503 therebetween. Scribing lanes may be formed between the effective area 501 and the intermediate area 503 so as to be separated from each other by a subsequent sawing process.

Referring to FIG. 7, step S200 of mounting the light emitting unit and the light receiving unit is a step of mounting the light emitting unit 610 and the light receiving unit 630 in the effective area 501 of the substrate 500. Specifically, one light emitting portion 610 and one light receiving portion 630 can be mounted on one effective region 501, respectively.

Referring to Fig. 8, step S300 of engaging sidewall members is a step of engaging sidewall member 700 on effective area 501. Fig.

The sidewall member 700 may be formed of the same material as the substrate 100. In addition, the sidewall member 700 may have a thermal expansion coefficient of 0.8 to 1.2 times the thermal expansion coefficient of the substrate 500. Specifically, the sidewall member 700 may be formed of a material impregnated with paper or glass fiber, such as a phenol resin, a polyester resin, a polyimide resin, or an epoxy resin. For example, FR-2, FR-3, FR-4, FR-5, FR-6 CEM-1, CEM-3 or GI.

One side wall member 700 includes a first opening for receiving the light emitting portion 610 and a second opening for receiving the light receiving portion 630.

A plurality of side wall members 700 may be arranged in a constant shape. The plurality of sidewall members 700 may be arranged to correspond to a plurality of effective regions 501 on the substrate 500. At this time, the plurality of side wall members 700 may be spaced apart with the intermediate member 710 therebetween. The individual sidewall member 700 corresponds to the individual effective area 501 and the intermediate member 710 corresponds to the middle area 503. [

When the plurality of sidewall members 700 are coupled with the substrate 500, the first opening receives the light emitting portion 610 and the second opening receives the light receiving portion 630.

Referring to FIG. 9, step S400 of applying an adhesive is a step of applying an adhesive 750 to a specific area of the side wall member 700 to join the side wall member 700 and the cover glass 800. FIG. Here, it is preferable that the adhesive agent 750 is not applied to the path portion through which the light passes, because a material that is non-transmissive to the light used by the sensor package can be used. Accordingly, it is preferable that the adhesive 750 is first applied to the upper surface of the side wall member 700, and then the cover glass 800 is coupled to the upper surface of the side wall member 700.

In order to apply the adhesive 750 to the upper surface of the sidewall member 700, it is ideal that the upper surface of the sidewall member 700 is coated on the upper surface of the rim abutting the lower surface of the cover glass 300. However, in the miniaturized sensor package, the upper surface portion of the rim of the sidewall member 700 is typically very narrow, with a width of less than 5 mm. Therefore, it is very difficult to selectively apply the adhesive 750 only to such portions. Particularly, when the adhesive agent 750 is in a gel form, if the adhesive agent 750 flows into the first or second opening to cover the light emitting portion 610 and the light receiving portion 630, the light can be shielded, .

In the present invention, the adhesive 750 is applied not only to the upper surface portion of the rim of the side wall member 700 but also to the upper surface of the intermediate member 710 in the vicinity thereof. The upper portion of the rim of the sidewall member 700 and the upper portion of the intermediate member 710 in its periphery are relatively large in area so that it is easy to apply the adhesive 750. For this purpose, it is preferable that the upper surface portion of the rim of the side wall member 700 and the upper surface of the intermediate member 710 around the sidewall member 700 are formed in the same plane to form a flat region.

Referring to FIG. 10, the step of joining the cover glass (S500) is a step of bonding the side wall member 700 and the cover glass 800 by placing the cover glass 800 on the portion where the adhesive 750 is applied.

11 and 12 are an exploded sectional view and an exploded perspective view of the sensor package thus far combined.

Referring to FIG. 13, the separating step (S600) is a step of separating the assembly of the plurality of sensor packages through a sawing process. The separation step S600 includes separating the effective region 501 and the intermediate region 503 in the substrate 500. [ In the separation step S600, the sidewall member 700 and the intermediate member 710 are separated from each other. Accordingly, one sensor package includes one effective area 501 and a sidewall member 700.

However, in some cases, one sensor package may include a portion of the effective region 501 and the intermediate region 503 around the same. The sensor package may also include a portion of the sidewall member 700 and the intermediate member 710 therearound.

The embodiments of the sensor package of the present invention and the manufacturing method thereof have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Therefore, the scope of the present invention should be determined by the equivalents of the claims and the claims.

100: substrate 101: effective area
103: Middle area 110: Light emitting part
130: light receiving section 200: side wall member
203: intermediate member 210: first opening
230: second opening part 250: adhesive
300: cover glass
S100: Step of preparing a substrate
S200: mounting the light emitting unit and the light receiving unit
S300: Step of joining the side wall members
S400: Step of applying adhesive
S500: Combining the cover glass
S600: Separation step

Claims

Board;
A light emitting unit and a light receiving unit mounted on the substrate;
A side wall member having a first opening for receiving the light emitting portion, a second opening for receiving the light receiving portion, and a shielding wall for shielding between the first and second openings, the lower side of which engages with the substrate; And
And a cover glass coupled with an upper side of the side wall member to seal the first and second openings.

The method according to claim 1,
Wherein the cover glass has a light transmittance of 60% or more with respect to a wavelength band of light emitted by the light emitting unit and a wavelength band of light received by the light receiving unit.

The method according to claim 1,
A groove is formed on the side wall member,
And the cover glass is received in the groove.

The method of claim 3,
A protruding wall protruding from a rim portion of an upper surface of the side wall member is formed,
Wherein the groove is formed by the protruding wall.

The method according to claim 1,
And an adhesive that is applied between the side wall member and the cover glass to bond the side wall member and the cover glass.

5. The method of claim 4,
Wherein the adhesive has a light transmittance of 60% or less with respect to a wavelength band of light emitted by the light emitting section and a wavelength band of light received by the light receiving section.

The method according to claim 1,
And a molding part surrounding the light emitting part inside the first opening.

The method according to claim 1,
Wherein the side wall member is formed of a material impregnated with paper or glass fiber, the phenolic resin, the polyester resin, the polyimide resin, or the epoxy resin.

The method according to claim 1,
Wherein the substrate and the side wall member are formed of the same material.

The method according to claim 1,
Wherein the sidewall member has a thermal expansion coefficient of 0.8 to 1.2 times the thermal expansion coefficient of the substrate.

Providing a substrate comprising a plurality of effective regions forming a bottom surface of a plurality of sensor packages and spaced apart from each other with an intermediate region therebetween;
Mounting a light emitting portion and a light receiving portion on the effective region;
Coupling a plurality of sidewall members spaced apart from each other with the intermediate member therebetween on the plurality of effective regions, the sidewall member including a first opening for receiving the light emitting portion and a second opening for receiving the light receiving portion;
Applying an adhesive to an area including an upper surface of the side wall member frame and an upper surface of the intermediate member around the side wall member;
Bonding the cover glass to the sidewall member by the adhesive; And
And separating the sensor package into one sensor package including one effective area and one sidewall member.

12. The method of claim 11,
Wherein the upper surface of the sidewall member frame and the upper surface of the intermediate member around the sidewall member are flush with each other.

12. The method of claim 11,
Wherein the separating comprises separating the effective region and the intermediate region.

12. The method of claim 11,
Wherein the separating step comprises separating the sidewall member and the intermediate member.

12. The method of claim 11,
Wherein the side wall member is made of a material impregnated with paper or glass fiber, the phenolic resin, the polyester resin, the polyimide resin, or the epoxy resin.

12. The method of claim 11,
Wherein the substrate and the side wall member are formed of the same material.

12. The method of claim 11,
Wherein the sidewall member has a thermal expansion coefficient of 0.8 to 1.2 times the thermal expansion coefficient of the substrate.