CN106129051A - Optical sensor and method for manufacturing optical device - Google Patents
Optical sensor and method for manufacturing optical device Download PDFInfo
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- CN106129051A CN106129051A CN201610296730.XA CN201610296730A CN106129051A CN 106129051 A CN106129051 A CN 106129051A CN 201610296730 A CN201610296730 A CN 201610296730A CN 106129051 A CN106129051 A CN 106129051A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
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Abstract
The invention provides an optical sensing device, which comprises a circuit board, an invisible light receiving module, a visible light sensor, a light emitting element, a light transmitting colloid and a light-tight colloid, wherein the invisible light receiving module, the visible light sensor, the light emitting element, the light transmitting colloid and the light-tight colloid are arranged on the circuit board. The light-transmitting colloid covers the light-emitting element and the visible light sensor, and the light-tight colloid covers the invisible light receiving module. The light-tight colloid and the light-transmitting colloid are mutually contacted or separated. The present invention further provides a method for manufacturing an optical device, which can at least manufacture the optical sensor. Thereby, the assembly or manufacturing steps of the optical sensing device can be simplified.
Description
Technical field
The present invention, about a kind of optical induction device and the manufacture method of Optical devices, has especially in regard to one
Printing opacity colloid and the optical induction device of light tight colloid and the system of a kind of Optical devices simplifying processor
Make method.
Background technology
Electronic product (such as TV) is often provided with various optical sensor, so that this electronic product can lead to
Cross optical pickocff to sense change or the light of reception specific wavelength, the then electronics of external environment light source
Product performs a specific function (such as changing screen intensity or switching channels etc.) in response to ground.
Owing to different optical pickocffs is independent element, need to singly these optical pickocffs be pacified
Being loaded in electronic product, this measure is the most convenient, easily increases the set-up time.It addition, the manufacture of optical pickocff
Process also has at inconvenience, such as, need multiple tracks cutting step, adds the manufacturing time of optical pickocff；Its
He also has similar problem by Optical devices.
In view of this, how to improve at least one disadvantages mentioned above, be for this industry problem to be solved.
Summary of the invention
One purpose of the present invention is to propose the manufacture method of a kind of optical induction device and Optical devices, and it is extremely
Assembling or the manufacturing step of Optical devices (optical induction device) can be simplified less.
For reaching above-mentioned purpose, optical induction device proposed by the invention, including a circuit board, one can not
See Optical Receivers, a visible light sensor, a light-emitting component, a printing opacity colloid and a light tight colloid.
Black light receiver module is arranged on circuit board, and in order to receive a black light, and it is invisible to be converted to one
Optical signal exports.Visible light sensor is arranged on circuit board, in order to receive a visible ray, and changes according to this
It is a visible light signal output.Light-emitting component is arranged on circuit board, in order to according to black light signal or can
See optical signal luminescence display.Printing opacity colloid is arranged on circuit board, passes in order to covering luminous element and visible ray
Sensor.Light tight colloid is arranged on circuit board, in order to cover black light receiver module, and stop visible
Light penetrates, and allows black light penetrate.Wherein, light tight colloid is to contact with each other with printing opacity colloid or separate.
In one embodiment of this invention, it is seen that optical sensor and light-emitting component are can be by brightness feedback or compensation
Control.
In one embodiment of this invention, light tight colloid is at least about a part for the side of printing opacity colloid.
In one embodiment of this invention, light tight colloid has a lens section, and lens section is in invisible
On Optical Receivers.
In one embodiment of this invention, printing opacity colloid has one first transmittance section and one second printing opacity of separation
Portion, and the first transmittance section and the second transmittance section be to be covered each by light-emitting component and visible light sensor.
In one embodiment of this invention, light tight colloid has more a light shielding part, and light shielding part is arranged at first
Between transmittance section and the second transmittance section.
In one embodiment of this invention, printing opacity colloid further includes one the 3rd transmittance section, and the 3rd transmittance section covers
Black light receiver module, and light tight colloid covers the 3rd transmittance section.
In one embodiment of this invention, printing opacity colloid is a polygon cylinder, a cylinder or a cylindroid
Body.
In one embodiment of this invention, black light receiver module includes a light receiving element and an optical telecommunications
Number treatment element.
In one embodiment of this invention, light-emitting component includes a light-emitting diode chip for backlight unit or a light emitting diode
Encapsulating structure.
In one embodiment of this invention, printing opacity colloid has an extension, and the side of extension is with light tight
The side of colloid substantially copline.
In one embodiment of this invention, optical induction device further includes a metal shell, and metal shell covers
At least one of light tight colloid.
In one embodiment of this invention, circuit board further includes multiple pin, and multiple pins are electrically connected with this not
Visible ray receiver module, light-emitting component and visible light sensor, and multiple pin extend to light tight colloid and
/ or printing opacity colloid outside.
For reaching above-mentioned purpose, the manufacture method of Optical devices proposed by the invention, comprise the following steps.
First, it is provided that a circuit board, circuit board has multiple electronic component setting area.Then, one group of electronics is set
Element is in each electronic component setting area, and each of which group electronic component includes one first electronic component and one
Two electronic components.Then, carry out a molding for the first time, to form one or many group transparent encapsulant structure, and cover
Covering this little first electronic components, wherein transparent encapsulant structure has a junction, and connecting portion is in every two electronics
Between element setting area.Then, a second time molding is carried out, to form the one or many light tight encapsulating structure of group,
And covering this little second electronic components, the most light tight encapsulating structure more covers this little connecting portions.Then, cut
Cut circuit board, transparent encapsulant structure and light tight encapsulating structure, to separate this little electronic component setting areas, and
Form multiple electronic component structure.Wherein, electronic component structure includes the first electronic component, the second electronics unit
Light tight colloid organized by part, one or many group printing opacity colloid and one or more, and printing opacity colloid and light tight colloid are respectively
Covering the first electronic component and the second electronic component, printing opacity colloid has an extension, the side of extension with
The side of light tight colloid substantially copline.
For reaching above-mentioned purpose, optical induction device proposed by the invention, including a circuit board, one can not
See Optical Receivers, a visible light sensor, a light-emitting component, a printing opacity colloid, one first coating layer,
One second coating layer and a shielding construction.Black light receiver module is arranged on circuit board, in order to receive
One black light, and be converted to a black light signal output.Visible light sensor is arranged on circuit board,
In order to receive a visible ray, and be converted to a visible light signal output according to this.Light-emitting component is arranged at circuit board
On, in order to according to black light signal or visible light signal luminescence display.Printing opacity colloid is arranged on circuit board,
In order to cover black light receiver module, light-emitting component and visible light sensor.First coating layer is arranged at
On black light receiver module, and it is positioned at printing opacity colloid, in order to stop visible ray, allows black light pass through.
Second coating layer is located on visible light sensor, and is positioned at printing opacity colloid, in order to stop black light, allows
Visible ray passes through.Shielding construction is arranged at around black light receiver module, and is positioned at printing opacity colloid, uses
To isolate the electromagnetic wave from external environment, it is to avoid black light receiver module is interfered.
In one embodiment of this invention, when carrying out second time molding, at least cincture of light tight encapsulating structure
A part for the side of transparent encapsulant structure.
In one embodiment of this invention, this group electronic component further includes one the 3rd electronic component, wherein,
When carrying out molding for the first time, transparent encapsulant structure more covers multiple 3rd electronic component.
In one embodiment of this invention, when carrying out molding for the first time, transparent encapsulant structure has one first
Light-transmissive encapsulant and one second light-transmissive encapsulant, and first and second light-transmissive encapsulant cover respectively first and
3rd electronic component.
In one embodiment of this invention, the first electronic component is a light-emitting component, and the 3rd electronic component is one
Visible light sensor, and the second electronic component is a black light receiver module.
In one embodiment of this invention, when carrying out second time molding, light tight encapsulating structure is more formed at
Between first and second light-transmissive encapsulant.
In one embodiment of this invention, when carrying out molding for the first time to form transparent encapsulant structure, printing opacity
Encapsulating structure has one the 3rd light-transmissive encapsulant, and the 3rd light-transmissive encapsulant covers this second electronic component, and
When carrying out second time molding to form light tight encapsulating structure, light tight encapsulating structure more covers the 3rd printing opacity envelope
Dress portion.
In one embodiment of this invention, the manufacture method of Optical devices further includes offer one metal shell, with
Cover at least one of light tight colloid.
For reaching above-mentioned purpose, optical induction device proposed by the invention, including a circuit board, one can not
See Optical Receivers, a light-emitting component and a light tight colloid.Black light receiver module is arranged at circuit board
On, in order to receive a black light, and be converted to a black light signal output.Light-emitting component is arranged at electricity
On the plate of road, in order to according to black light signal luminescence display.Light tight colloid is arranged on circuit board, in order to
Cover black light receiver module, and stop that visible ray penetrates, and allow black light penetrate.Wherein, impermeable
Light colloid has a groove, in order to accommodate light-emitting component.
Whereby, the optical induction device of the present invention and the manufacture method of Optical devices provide at following useful
Effect:
1, different electronic components (such as visible light sensor and black light receiver module) is disposed on
Same packaging body, therefore can one step i.e. install to an electronic product；
2, different electronic components is covered by different colloids respectively, and such as light-emitting component or visible ray pass
Sensor is covered by same or independently printing opacity colloid, and invisible light receiving element is by a light tight colloid
Cover, at least one electronic component can be avoided to be disturbed by the light of unexpected wavelength；
3, in the manufacture process of Optical devices (optical induction device), one cutting step can only be needed,
Optical devices are obtained faster or is more easy to produce.
Accompanying drawing explanation
For the above-mentioned purpose of the present invention, feature and advantage can be become apparent, below in conjunction with accompanying drawing to this
Bright detailed description of the invention elaborates, wherein:
Fig. 1 is the axonometric chart of the optical induction device according to the first embodiment of the present invention.
Fig. 2 is the profile of the optical induction device according to the first embodiment of the present invention.
Fig. 3 A and Fig. 3 B is axonometric chart and the section of the optical induction device according to the second embodiment of the present invention
Figure.
Fig. 4 A and Fig. 4 B is axonometric chart and the section of the optical induction device according to the third embodiment of the present invention
Figure.
Fig. 5 and Fig. 6 is axonometric chart and the profile of the optical induction device according to the fourth embodiment of the present invention.
Fig. 7 is the flow chart of steps of the manufacture method of the Optical devices according to the fifth embodiment of the present invention.
Fig. 8 is the die bond schematic diagram of the manufacture method according to the fifth embodiment of the present invention.
Fig. 9 is the bonding wire schematic diagram of the manufacture method according to the fifth embodiment of the present invention.
Figure 10 is the first time shaping schematic view of the manufacture method according to the fifth embodiment of the present invention.
Figure 11 is the second time shaping schematic view of the manufacture method according to the fifth embodiment of the present invention.
Figure 12 is the cutting schematic diagram of the manufacture method according to the fifth embodiment of the present invention.
Figure 13 is that the first time molding of the manufacture method of the Optical devices according to the sixth embodiment of the present invention is shown
It is intended to.
Figure 14 is that the second time molding of the manufacture method of the Optical devices according to the sixth embodiment of the present invention is shown
It is intended to.
Figure 15 is the cutting schematic diagram of the manufacture method of the Optical devices according to the sixth embodiment of the present invention.
Figure 16 is that the first time molding of the manufacture method of the Optical devices according to the seventh embodiment of the present invention is shown
It is intended to.
Figure 17 is that the second time molding of the manufacture method of the Optical devices according to the seventh embodiment of the present invention is shown
It is intended to.
Figure 18 is the cutting schematic diagram of the manufacture method of the Optical devices according to the seventh embodiment of the present invention.
In figure, element numbers is described as follows:
S101～S111 step
1,2,3,4 optical induction device
The manufacture method of 4a, 5a, 6a Optical devices
11,21,21 ' circuit board
111,211 upper surface
113,213 circuit pattern
115 pins
12 light-emitting components
13 black light receiver modules
131 light receiving elements
132 Photoelectric Signal Processing elements
14 visible light sensors
15,15a, 15b, 15c, 23 ', 33 ', 43 ' printing opacity colloid
151 sides
152,232 ' extension
153 first transmittance sections
154 second transmittance sections
155 the 3rd transmittance sections
16,16a, 16b, the light tight colloid in 16c, 24 ', 34 ', 44 '
161 lens sections
162,241 light shielding part
17,17a metal shell
20,30,40 electronic component structure
212 electronic component setting areas
22 often organize electronic component
22a the first electronic component
22b the second electronic component
22c the 3rd electronic component
23,33,43 transparent encapsulant structure
23a, 43a first light-transmissive encapsulant
23b, 43b second light-transmissive encapsulant
23c the 3rd light-transmissive encapsulant
232 connecting portions
24,34,44 light tight encapsulating structure
Detailed description of the invention
Referring to shown in Fig. 1 and Fig. 2, it is the optical induction device according to the first embodiment of the present invention
Axonometric chart and profile.
In first embodiment, optical induction device 1 can include circuit board 11, light-emitting component 12,
One black light receiver module 13, visible light sensor 14, printing opacity colloid 15 and a light tight colloid
16.The technology contents of each element will sequentially be described as follows.
Circuit board 11 can have a upper surface 111 and and be arranged at the circuit pattern 113 of upper surface 111, and
Light-emitting component 12 may be placed on the upper surface 111 of circuit board 11, and electrically connects with circuit pattern 113
Connect.It is macroscopic coloured that light-emitting component 12 can launch visible ray, such as white light, HONGGUANG or gold-tinted etc.
Light, and this light-emitting component 12 can be one or more light-emitting diode chip for backlight unit, and built by light-emitting component 12
Crystal structure electrode layer design, is arranged at the die bonds such as singles sideline, doubles line or flip and bonding wire mode
On upper surface 111.
Light-emitting component 12 is the most selectively one or more package structure for LED (not shown).
Specifically, package structure for LED comprises a light-emitting diode chip for backlight unit and an encapsulating structure.Luminous two
Pole pipe encapsulating structure, before being arranged at upper surface 111, can first be tested, to guarantee that this light emitting diode is tied
Structure is the specification meeting user needs.Additionally, package structure for LED can further include phosphor powder.
It addition, light-emitting component 12 can be laser chip or laser package structure, laser package structure includes laser
Chip.
Black light receiver module 13 may be placed on the upper surface 111 of circuit board 11, and black light connects
Receive module 13 and can receive a black light, and export a black light signal according to this.This black light is
Refer to that naked eyes are difficult to the light of the specific wavelength observed, such as: infrared ray, far infrared, ultraviolet etc..
It is preferred that black light receiver module 13 can comprise at a light receiving element 131 and a photosignal
Reason element 132, light receiving element 131 couples with Photoelectric Signal Processing element 132.Light receiving element 131
In order to receive black light, Photoelectric Signal Processing element 132 can be a chip with signal processing function.
After light receiving element 131 receives black light, and output one invisible light receiving signal according to this.Photoelectricity
Signal Processing Element 132 comes from, in order to receive, the invisible light receiving signal that light receiving element 131 is exported,
And according to this black light signal is converted into black light signal and output.Black light receiver module 13 is also
Can comprise that light receiving element 131 and Photoelectric Signal Processing element 132 phase are integrated into single element is (not shown
Go out), the most single element has light receiving element 131 and the function of Photoelectric Signal Processing element 132 simultaneously.
Wherein, said elements can be ASIC (Application-specific integrated circuit,
ASIC), field programmable gate array (Field Programmable Gate Array, FPGA) or
CPLD (Complex Programmable Logic Device, CPLD).
Visible light sensor 14 may be placed on the upper surface 111 of circuit board 11 equally, in order to receive one
Visible ray, it is seen that light refers to the light of the specific wavelength that naked eyes easily observe.When visible light sensor 14 connects
After receiving this visible ray, this visible ray can be converted to a visible light signal output.Wherein, it is seen that light senses
Device can be ambient light sensor.
In detail, specific wavelength is sensed when black light receiver module 13 and/or visible light sensor 14
Light, and when being converted to black light signal and/or visible light signal output, light-emitting component 12 can be according to not
Visible light signal and/or visible light signal luminescence display.It is preferred that visible light sensor 14 and light-emitting component
12 can be controlled with compensating by brightness feedback, that is, light-emitting component 12 can be examined according to visible light sensor 14
The ambient light intensity measured or the luminosity of light-emitting component 12, show different brightness in order to be adjusted
Light.
For example, brightness feedback is carried out when visible light sensor 14 according to the luminosity of light-emitting component 12
With when compensating the application controlled, light-emitting component 12 may be disposed near visible light sensor 14 or sensing range
In.In detail, when light-emitting component 12 has the problem of brightness decay because of service life or temperature factor,
Visible light sensor 14 can sense the brightness decay of light-emitting component 12 and carry out brightness feedback control；Then,
Light-emitting component 12, in the way of compensating control, is given more electric energy in good time and is had predetermined luminance to send
Light.
When the application that optical induction device 1 is as backlight module, brightness feedback and the mode compensating control
Being then when environment light source is brighter, the light that light-emitting component 12 sends is the highest；When environment light source is dark,
The light that light-emitting component 12 sends is the most relatively low.Wherein, optical induction device 1 further includes a driving control electricity
Road, in order to receive the visible light signal of visible light sensor 12, and judges whether needs the most further
Luminance compensation mechanism is carried out for light-emitting component 12.
Printing opacity colloid 15 can covering luminous element 12 and visible light sensor 14." cover " and printing opacity glue can be referred to
Body 15 fits tightly light-emitting component 12 and visible light sensor 14 or hides light-emitting component 12 and visible
Optical sensor 14 (that is, printing opacity colloid 15 does not contacts with light-emitting component 12 and visible light sensor 14,
But still it is surrounded on light-emitting component 12 and the surrounding of visible light sensor 14 and top).
Printing opacity colloid 15 at least can allow visible ray to pass through, and black light also can be allowed to pass through, and printing opacity glue
The material that manufactures of body 15 can be the material that epoxy resin, acryl, PPA, silica gel etc. have this light transmission features.
Printing opacity colloid 15 can be a polygon cylinder, a cylinder or an Elliptic Cylinder (not shown), and this
The printing opacity colloid 16 of embodiment is as a example by the polygon cylinder as rectangle of the cross section.
Light tight colloid 16 can cover (i.e. fit tightly or hide) black light receiver module 13.Impermeable
Light colloid 16 at least can stop that visible ray penetrates, and allow black light receiver module 13 can sense can not
See that light passes, and the manufacture material of light tight colloid 16 can be epoxy resin, acryl, PPA, silica gel adds
Upper light tight dyestuff, such as carbon black (Carbon Black) or inserts (filler), such as titanium dioxide (TiO2)
Etc. the material with this light tight characteristic.In other words, light tight colloid 16 can have the merit filtering visible ray
Can, black light receiver module 13 can be increased and receive the accuracy of black light.
Light tight colloid 16 selectively has a lens section 161, and lens section 161 can be a convex lens, and
And it is positioned at the top of black light receiver module 13.Therefore, when black light enters lens section 161,
Black light receiver module 13 can be collected to so that black light receiver module 13 is more easy to by lens section 161
In sensing black light.
Printing opacity colloid 15 can contact with each other or separate with light tight colloid 16.When contacting with each other, printing opacity glue
Both body 15 and light tight colloid 16 at least one side is to contact；And when being separated from each other, printing opacity glue
The side that body 15 and light tight colloid 16 do not contact.It is preferred that printing opacity colloid 15 and impermeable optical cement
Body 16 is the person of contacting with each other, and light tight colloid 16 can be at least about the side 151 of printing opacity colloid 15
A part.More preferably, light tight colloid 16 around this printing opacity colloid 15 side 151 whole (as figure
1 those shown), only allow the upper surface of printing opacity colloid 15 expose；So, it is seen that light is only capable of from printing opacity colloid
The upper surface of 15 passes through, and cannot pass through from the side of printing opacity colloid 15 (because can be by light tight colloid 16
Stop).
If it addition, taking the manufacture method of the Optical devices in aftermentioned embodiment to manufacture the light of the present embodiment
When learning induction installation 1, this printing opacity colloid 15 can have an extension 152 (as shown in Figure 1), and extends
The side in portion 152 and the side substantially copline of light tight colloid 16.As for extension 152 side of being formed
Formula is by detailed description in successive process.
Another explanation, circuit board 11 selectively includes multiple pin 115, and these a little pins 115 are arranged at
On upper surface 111, and it is electrically connected at black light receiver module 13, light-emitting component 12 and visible ray biography
Sensor 14.These a little pins 115 extend to outside light tight colloid 16 and/or printing opacity colloid 15, with not by not
Printing opacity colloid 16 and/or printing opacity colloid 15 cover.So, other electronic installations or electronic component can pass through this
A little pins 115 electrically connect with black light receiver module 13, light-emitting component 12 and visible light sensor 14
Connecing, black light receiver module 13 and visible light sensor 14 can be exported not by these a little pins 115
Visible light signal and visible light signal, light-emitting component 12 can be received by these a little pins 115 outside coming from
The control signal on boundary.
Referring to shown in Fig. 3 A and Fig. 3 B, it is the optical induction device according to the second embodiment of the present invention
Axonometric chart and profile.In the second embodiment, optical induction device 2 and the optics sense of first embodiment
Answering device 1 similar, therefore both technology contents can be cross-referenced.
Except for the difference that, it is one first saturating that the printing opacity colloid 15a that optical induction device 2 is comprised can have separation
Light portion 153 and one second transmittance section 154, and the first transmittance section 153 and the second transmittance section 154 be to cover respectively
Lid light-emitting component 12 and visible light sensor 14；And light tight colloid 16a has more a light shielding part 162, hide
Light portion 162 is arranged between the first transmittance section 153 and the second transmittance section 154.Wherein, light tight colloid 16a
It is around the first transmittance section 153 and the second transmittance section 154.
Light shielding part 162 is in order to stop the light that light-emitting component 12 is launched so that light cannot be passed by visible ray
Sensor 14 senses.So, it is seen that optical sensor 14 can sense the light in external environment exactly, no
The light launched by light-emitting component 12 disturbs.
Referring to Fig. 4 A and Fig. 4 B, it is the optical induction device 3 according to the third embodiment of the present invention
Axonometric chart and profile.The optical induction device 3 of the present embodiment is with the optical induction device 2 of embodiment two not
Being with part, printing opacity colloid 15b can further include one the 3rd printing opacity compared with the printing opacity colloid 15b of the second embodiment
Portion 155, and the 3rd transmittance section 155 is to cover black light receiver module 13, and light tight colloid 16b is again
Cover the 3rd transmittance section 155.So, light tight colloid 16b is not directly to cover black light to receive mould
Block 13, can avoid light tight colloid 16b directly to cover black light receiver module 13 and cause black light
What receiver module 13 damaged may disappearance.
Referring to shown in Fig. 5 and Fig. 6, it is the optical induction device 4 according to the fourth embodiment of the present invention
Axonometric chart and profile.
In the 4th embodiment, optical induction device 4 is similar to the optical induction device 1 of first embodiment,
Therefore both technology contents can be cross-referenced.Except for the difference that, the printing opacity glue included by optical induction device 4
Body 15c relatively first embodiment printing opacity colloid 15 further includes one the 3rd transmittance section 155, and the 3rd transmittance section 155
Can cover this black light receiver module 13 in advance, light tight colloid 16c covers the 3rd transmittance section 155 again.
So, light tight colloid 16c is not directly to cover black light receiver module 13, can avoid impermeable optical cement
The possibility that body 16c directly covers black light receiver module 13 and causes black light receiver module 13 to damage
Disappearance.
It is preferred that the optical induction device 1 referring to this enforcement of Fig. 1 also can comprise a shielding construction, such as
Being a metal shell 17, metal shell 17 covers at least one of light tight colloid 16 (in the present embodiment
In, metal shell 17 covers three sides and the upper surface of light tight colloid 16).Metal shell 17 can
Stop and enter in printing opacity colloid 16 from the black light of light tight colloid 16 side, also can isolate from
The electromagnetic wave etc. of external environment, it is to avoid black light receiver module 13 is interfered.Preferably implement at another
In example, optionally, refer to the metal shell 17a included by Fig. 4 A optical induction device 3 can cover
One side of light tight colloid 16b and upper surface.In another preferred embodiment, optionally, outside metal
In shell may be disposed at light tight colloid or in printing opacity colloid (not shown).In another preferred embodiment, choosing
Selecting property ground, the lower surface of metal shell can be with the earth lead copline of circuit board bottom surface, and the one side of shell can be with
The earth lead copline of circuit board side so that optical induction device is applied at forward luminous (top view)
Or during lateral direction light emission (side view), metal shell can ground connection, and reach the effect of electromagnetic shielding.
In a preferred embodiment, metal shell can replace with conductive rubber or metallic film, equally reaches electricity
The function of magnetic shield.
Being more than the explanation of the optical induction device of various embodiments of the present invention, these a little optical induction devices at least may be used
Following beneficial effect is provided:
1, visible light sensor, black light receiver module and light-emitting component are disposed on same circuit board,
Therefore can only be mounted in other electronic products by one step；
2, light-emitting component or visible light sensor can be covered by printing opacity colloid, and invisible light receiving element can
Covered by light tight colloid, both can be avoided to be disturbed by the light of unexpected wavelength；
3, optical induction device can have " brightness feedback " and the function of " luminance compensation ".
4, light tight colloid can be set to a part for the side at least about printing opacity colloid, makes visible ray quilt
Light tight colloid stops, and cannot enter printing opacity colloid from the side of light tight colloid.
5, light tight colloid can have light shielding part, is arranged between the first transmittance section and the second transmittance section, with
Make to be positioned at the light-emitting component of two transmittance sections and visible light sensor does not interferes with each other.
Then explanation is according to the manufacture method of the Optical devices of various embodiments of the present invention.
Referring to shown in Fig. 7, it is the manufacture method of the Optical devices according to the fifth embodiment of the present invention
Flow chart of steps.In the present embodiment, manufacture method 4a of Optical devices is suggested, and it at least can manufacture
Going out the optical induction device 1～4 in above-described embodiment, therefore the technology contents of optical induction device 1～4 can
As Optical devices manufacture method 4a realize reference frame.In other words, the manufacture method of Optical devices
What the following technology contents of 4a can act also as optical induction device 1～4 realizes reference frame.
Being not limited to optical induction device 1～4, manufacture method 4a of Optical devices also can produce other bags
Include printing opacity colloid and the Optical devices of light tight colloid.Each step of manufacture method 4a of Optical devices will sequentially
It is described as follows, but when each step performs, does not limit the order only according to explanation.
Specifically, manufacture method 4a of Optical devices can begin at step S101.Please refer to Fig. 8,
In step S101, a circuit board 21 will be provided, and circuit board 21 can be a plastic substrate, a pottery
Any plates being formed with circuit pattern (not shown) such as substrate, a flexible base plate or a glass substrate
Shape structure.Circuit board 21 has multiple electronic component setting area 212 of upper surface 211 that is arranged at (with two
As a example by formula), these a little electronic component setting areas 212 can be configured to transverse direction and longitudinal direction continuous arrangement, also can be in
The most horizontal, longitudinal or staggered mode continuity moment formation arrangement.
Then, in step S103, one group of electronic component 22 will be set in each electronic component setting area
In 212, and each group of electronic component 22 at least includes one first electronic component 22a, one second electronic component
22b and one the 3rd electronic component 22c.As a example by the 5th embodiment, the first electricity of each group of electronic component 22
Sub-element 22a can be that a light-emitting component (tie by such as visible light emitting diode chip or LED package
Structure), the second electronic component 22b can be a black light receiver module (such as comprise a light receiving element and
One Photoelectric Signal Processing element), the 3rd electronic component 22c can be a visible light sensor (such as ambient light
Sensor).
Each electronic component 22a～22c and circuit board 21 can be adopted and reach electric connection in various manners, such as, beat
The junctures such as line, flip, eutectic joint, gold goal or projection joint, elargol or tin cream.
Please refer to shown in Fig. 9, as a example by routing connects, each group of electronic component 22 is comprised first
Electronic component 22a, the second electronic component 22b and the 3rd electronic component 22c will be by bonding wire and circuit boards 21
On circuit pattern (not shown) electrical connection, make each electronics unit in electronic component setting area 212
Part 22a～22c can electrically conduct each other.
Refer to shown in Figure 10, then in step S105, a molding for the first time will be carried out, to form one
Transparent encapsulant structure 23.Specifically, circuit board 21 and each group of electronic component 22 can be placed on a mould
In tool (not shown), then the raw material (not shown) of transparent encapsulant structure 23 can be moulded in mould
Type, to form a transparent encapsulant structure 23 at upper surface 211.After transparent encapsulant structure 23 is formed, at least
The first electronic component 22a among each electronic component setting area 212 can be covered, and still alternatively cover
Cover second and third electronic component 22b and 22c；In other words, whole electronic component 22a～22c can quilt
Transparent encapsulant structure 23 covers.
According to electronic component 22a～22c covered, transparent encapsulant structure 23 may be defined to have one first
Light-transmissive encapsulant 23a, one second light-transmissive encapsulant 23b and one the 3rd light-transmissive encapsulant 23c, and the first printing opacity
Encapsulation part 23a covers the first electronic component 22a, the second light-transmissive encapsulant 23b covers the 3rd electronic component 22c,
3rd light-transmissive encapsulant 23c covers the second electronic component 22b.
It addition, the first light-transmissive encapsulant 23a and the second light-transmissive encapsulant 23b can contact and be formed in one,
3rd light-transmissive encapsulant 23c is then to divide with the first light-transmissive encapsulant 23a and the second light-transmissive encapsulant 23b phase
From.The end face of the first light-transmissive encapsulant 23a and the second light-transmissive encapsulant 23b can also be above the 3rd transparent encapsulant
The end face of portion 23c；But, three for contour be also feasible.
After transparent encapsulant structure 23 is formed, transparent encapsulant structure 23 also can have a junction 232, even
Meeting portion 232 between every two electronic component setting areas 212, it is for being filled in glue in the mould of pressing mold
Material in passage flow duct.
Refer to shown in Figure 11, then in step S107, a second time molding will be carried out, to form one
Light tight encapsulating structure 24.Similar step S105, circuit board 21 and each group of electronic component 22 can be put
It is placed in another mould (not shown), the raw material (not shown) of the most light tight encapsulating structure 24
Can be by plastotype in this mould, to form a light tight encapsulating structure 24 at upper surface 211.Light tight encapsulation knot
After structure 24 is formed, it will cover these a little second electronic component 22b and this little connecting portions 232；It addition, not
Transparent encapsulant structure 24 also can cover the 3rd light-transmissive encapsulant 23c of transparent encapsulant structure 23.Wherein, no
Transparent encapsulant structure 24 further includes a lens section 161.
It is preferred that light tight encapsulating structure 24 is at least about a part for the side of transparent encapsulant structure 23,
More preferably, completely about the first light-transmissive encapsulant 23a and second light-transmissive encapsulant of transparent encapsulant structure 23
The side of 23b.Additionally, light tight encapsulating structure 24 can be with the first transparent encapsulant of transparent encapsulant structure 23
Portion 23a and the second light-transmissive encapsulant 23b are the highest.
Refer to shown in Figure 12, then in step S109, clipper circuit plate 21, transparent encapsulant structure
23 and light tight encapsulating structure 24, to separate this few electronic component setting areas 212, then formed multiple solely
Vertical electronic component structure 20.
Electronic component structure 20 can optical induction device 4 in corresponding above-described embodiment, including circuit board 21 ',
First electronic component 22a, the second electronic component 22b, the 3rd electronic component 22c, a printing opacity colloid (are i.e. cut
Transparent encapsulant structure after cutting) 23 ' and a light tight colloid (i.e. light tight encapsulating structure after cutting) 24 '.
Additionally, printing opacity colloid 23 ' has an extension 232 ', extension 232 ' is to be cut by connecting portion 232
Formed after cutting, therefore the side of extension 232 ' and the side substantially copline of light tight colloid 24 '.
Then in step S111, it is provided that metal shell 17 (see Fig. 5) or a metal coating,
To cover at least one of light tight colloid 24 ' of each electronic component structure 20, protection the second electricity
Sub-element 22b is from external electromagnetic ripple or noise jamming.
It is more than the explanation of the manufacture method of the Optical devices according to the fifth embodiment of the present invention, then will say
The manufacture method of the Optical devices of the 6th and the 7th embodiment of the bright present invention.
Refer to shown in Figure 13 to Figure 15, manufacture method 5a of the Optical devices of the sixth embodiment of the present invention
Similar to manufacture method 4a of the 5th embodiment Optical devices (therefore both technology contents should mutually reference),
All can include included by step S101～S111 (as shown in Figure 7), only manufacture method 5a of Optical devices
Step S105～S109 different, specific description is as follows.
As shown in figure 13, in step S105, carrying out molding for the first time, to form a transparent encapsulant knot
During structure 33, transparent encapsulant structure 33 covers the first electronics unit in each electronic component setting area 212
Part 22a and the 3rd electronic component 22c, but do not have covering the second electronic component 22b.In other words, transparent encapsulant
Structure 33 does not have the 3rd light-transmissive encapsulant 23c as shown in Figure 10, to save material.Now, impermeable
Light encapsulating structure 33 also has connecting portion 232 between every two electronic component setting areas 212.
As shown in figure 14, in step S107, a second time molding will be carried out, to form a light tight envelope
Assembling structure 34.Owing to, in abovementioned steps S105, transparent encapsulant structure 33 only covers this first electronic component
22a and the 3rd electronic component 22c, therefore after light tight encapsulating structure 34 is formed, light tight encapsulation knot
Structure 34 will directly cover the second electronic component 22b.Wherein, to further include one saturating for light tight encapsulating structure 34
Mirror portion 161.
As shown in figure 15, in step S109, by clipper circuit plate 21, transparent encapsulant structure 33 and not
Transparent encapsulant structure 34, to separate this few electronic component setting areas 212, then forms multiple independent electricity
Sub-component structure 30.Electronic component structure 30 can optical induction device 1 in corresponding above-described embodiment, bag
Include circuit board 21 ', the first electronic component 22a, the second electronic component 22b, the 3rd electronic component 22c, one
Printing opacity colloid (i.e. cutting after transparent encapsulant structure) 33 ' and a light tight colloid (i.e. impermeable after cutting
Light encapsulating structure) 34 '.Additionally, printing opacity colloid 33 ' has an extension 232 ', extension 232 '
It is to be formed afterwards by connecting portion 232 is cut, therefore the side of extension 232 ' and light tight colloid 34 '
Side substantially copline.
Then by the manufacture method of the Optical devices of the explanation seventh embodiment of the present invention.
Refer to shown in Figure 16 to Figure 18, manufacture method 6a of the Optical devices of the seventh embodiment of the present invention
Similar to manufacture method 4a of Optical devices and 5a (therefore the technology contents of three should mutually reference), all
Step S105 included by manufacture method 6a of step S101～S111, only Optical devices～S109 can be included
Different, specific description is as follows.
As shown in figure 16, in step S105, carrying out molding for the first time, to form one first printing opacity envelope
During dress portion 43, transparent encapsulant structure 43 can have one first light-transmissive encapsulant 43a separated and do not contact
And one second light-transmissive encapsulant 43b, and this first light-transmissive encapsulant 43a and the second light-transmissive encapsulant 43b divide
Do not cover the first electronic component 22a and the 3rd electronic component 22c.
As shown in figure 17, in step S107, carrying out a second time molding, to form a light tight envelope
During assembling structure 44, due between the first light-transmissive encapsulant 43a and the second light-transmissive encapsulant 43b for separation not
Contacting, light tight encapsulating structure 44 is more formed at the first light-transmissive encapsulant 43a and the second light-transmissive encapsulant
Between 43b, to form a light shielding part 241.Wherein, light tight encapsulating structure 44 further includes a lens section 161.
As shown in figure 18, in step S109, by clipper circuit plate 21, transparent encapsulant structure 43 and not
Transparent encapsulant structure 44, to separate this little electronic component setting areas 212, then forms multiple independent electronics
Component structure 40.Electronic component structure 40 can optical induction device 2 in corresponding above-described embodiment, including
Circuit board 21 ', the first electronic component 22a, the second electronic component 22b, the 3rd electronic component 22c, one saturating
Light colloid (i.e. cutting after transparent encapsulant structure) 43 ' and a light tight colloid (i.e. light tight after cutting
Encapsulating structure) 44 '.Additionally, printing opacity colloid 43 ' has an extension 232 ', extension 232 ' is
Formed after being cut by connecting portion 232, therefore the side of extension 232 ' and the side of light tight colloid 44 '
Face substantially copline.
In the manufacture method according to the Optical devices of other embodiments (not shown), each group of electronics unit
Part may not include the 3rd electronic component, therefore transparent encapsulant structure will only cover the first electronic component.Additionally, it is each
In the manufacture method of the Optical devices of embodiment (not shown), applicable cases or the environment of visual finished product and
Omit the step that metal shell is provided.It addition, also a metal shell can be formed before the second forming step
To protect the second electronic component.Then, the light tight encapsulating structure of the second forming step can cover outside metal
Shell.
It is more than the explanation of the manufacture method of the Optical devices of various embodiments of the present invention, below it at least can provide
Beneficial effect: first time molding and second time molding step terminate after, can the most once cut step
Suddenly, in the most whole manufacture method, can only need one cutting step.So, can significantly reduce finished product and process institute
The time needed, and the depth of cut of cutting is not required to control especially (as long as i.e. can cut off circuit board, transparent encapsulant knot
Structure and light tight encapsulating structure).
In one embodiment, in the top of above-mentioned light-emitting component 12, printing opacity colloid further includes a lens section,
It can be convex lens.In another embodiment, in the top of above-mentioned visible light sensor 14, printing opacity colloid
Further include a lens section, can be convex lens.
In one embodiment, above-mentioned black light receiver module 13 can be smeared a coating layer, in order to stop
Visible ray, allows black light pass through.In another embodiment, above-mentioned visible light sensor 14 can be smeared
One coating layer, in order to stop black light, allows visible ray pass through.Wherein, it is seen that light wave a length of 380～820
Nanometer (nm), remaining wave band is black light wavelength.
Although the present invention discloses as above with preferred embodiment, so it is not limited to the present invention, Ren Heben
Skilled person, without departing from the spirit and scope of the present invention, when making a little amendment and perfect,
Therefore protection scope of the present invention is when with being as the criterion that claims are defined.
Claims (21)
1. an optical induction device, including:
One circuit board；
One black light receiver module, is arranged on this circuit board, in order to receive a black light, and changes
It is a black light signal output；
One visible light sensor, is arranged on this circuit board, in order to receive a visible ray, and is converted to according to this
One visible light signal output；
One light-emitting component, is arranged on this circuit board, in order to luminescence display；
One printing opacity colloid, is arranged on this circuit board, in order to cover this light-emitting component and this visible light sensor；
And
One light tight colloid, is arranged on this circuit board, in order to cover this black light receiver module, and hinders
Keeping off this visible ray to penetrate, and allow this black light penetrate, wherein this light tight colloid is and this printing opacity gel phase
Contact or separation mutually.
2. optical induction device as claimed in claim 1, it is characterised in that this visible light sensor and should
Light-emitting component is can be controlled by brightness feedback or compensation.
3. optical induction device as claimed in claim 1, it is characterised in that this light tight colloid at least encloses
A part around the side of this printing opacity colloid.
4. optical induction device as claimed in claim 1, it is characterised in that this light tight colloid has
Lens section, this lens section is on this black light receiver module.
5. optical induction device as claimed in claim 1, it is characterised in that this printing opacity colloid has separation
One first transmittance section and one second transmittance section, and this first transmittance section and this second transmittance section be to be covered each by
This light-emitting component and this visible light sensor.
6. optical induction device as claimed in claim 5, it is characterised in that this light tight colloid has more
One light shielding part, this light shielding part is arranged between this first transmittance section and this second transmittance section.
7. optical induction device as claimed in claim 1, it is characterised in that this printing opacity colloid further includes
3rd transmittance section, the 3rd transmittance section covers this black light receiver module, and this light tight colloid covers and is somebody's turn to do
3rd transmittance section.
8. optical induction device as claimed in claim 1, it is characterised in that this printing opacity colloid is polygon
Shape cylinder, a cylinder or an Elliptic Cylinder.
9. optical induction device as claimed in claim 1, it is characterised in that this black light receiver module
Including a light receiving element and a Photoelectric Signal Processing element.
10. optical induction device as claimed in claim 1, it is characterised in that this light-emitting component includes
Luminous diode chip or a package structure for LED.
11. optical induction devices as claimed in claim 1, it is characterised in that this printing opacity colloid has and prolongs
The side substantially copline of extending portion, the side of this extension and this light tight colloid.
12. optical induction devices as claimed in claim 1, it is characterised in that this optical induction device more wraps
Including a metal shell, this metal shell covers this light tight colloid at least one of.
13. optical induction devices as claimed in claim 1, it is characterised in that this circuit board further includes multiple
Pin, the plurality of pin is electrically connected with this black light receiver module, this light-emitting component and this visible ray sensing
Device, and the plurality of pin extends to outside this light tight colloid and/or this printing opacity colloid.
The manufacture method of 14. 1 kinds of Optical devices, including:
Thering is provided a circuit board, this circuit board has multiple electronic component setting area；
Arranging one group of electronic component in each electronic component setting area, wherein this group electronic component includes one first
Electronic component and one second electronic component；
Carry out a molding for the first time, to form a transparent encapsulant structure, and cover the plurality of first electronic component,
Wherein this transparent encapsulant structure has a junction, and this connecting portion is between every two electronic component setting areas；
Carry out a second time molding, to form a light tight encapsulating structure, and cover the plurality of second electronics unit
Part, wherein this light tight encapsulating structure more covers the plurality of connecting portion；And
Cut this circuit board, this transparent encapsulant structure and this light tight encapsulating structure, to separate the plurality of electronics
Element setting area, and form multiple electronic component structure, wherein, this electronic component structure includes this first electricity
Sub-element, this second electronic component, a printing opacity colloid and a light tight colloid, this printing opacity colloid and this is impermeable
Light colloid is covered each by this first electronic component and this second electronic component, and this printing opacity colloid has an extension,
The side of this extension and the side substantially copline of this light tight colloid, this extension is by this connecting portion
Formed after cut.
The manufacture method of 15. Optical devices as claimed in claim 14, it is characterised in that carry out this
During post forming, this light tight encapsulating structure is at least around a part for the side of this transparent encapsulant structure.
The manufacture method of 16. Optical devices as claimed in claim 14, it is characterised in that this group electronics unit
Part further includes one the 3rd electronic component, and wherein, when carrying out this first time molding, this transparent encapsulant structure is more
Cover the plurality of 3rd electronic component.
The manufacture method of 17. Optical devices as claimed in claim 16, it is characterised in that carry out this
During one-shot forming, this transparent encapsulant structure has one first light-transmissive encapsulant and one second light-transmissive encapsulant, and
This first and second light-transmissive encapsulant cover respectively this first and the 3rd electronic component.
The manufacture method of 18. Optical devices as claimed in claim 17, it is characterised in that this first electronics
Element is a light-emitting component, and the 3rd electronic component is a visible light sensor, and this second electronic component is
One black light receiver module.
The manufacture method of 19. Optical devices as claimed in claim 17, it is characterised in that carry out this
During post forming, this light tight encapsulating structure is more formed between this first and second light-transmissive encapsulant.
The manufacture method of 20. Optical devices as claimed in claim 17, it is characterised in that carry out this
When one-shot forming is to form this transparent encapsulant structure, this transparent encapsulant structure has one the 3rd light-transmissive encapsulant,
3rd light-transmissive encapsulant covers this second electronic component, and impermeable to form this carrying out this second time molding
During light encapsulating structure, this light tight encapsulating structure more covers the 3rd light-transmissive encapsulant.
The manufacture method of 21. Optical devices as claimed in claim 14, it is characterised in that these Optical devices
Manufacture method further include: provide a metal shell, to cover this light tight colloid at least one of.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104114620 | 2015-05-07 | ||
| TW104114620A TWI578491B (en) | 2015-05-07 | 2015-05-07 | Optical sensing device and manufacturing method for optical device |
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| Publication Number | Publication Date |
|---|---|
| CN106129051A true CN106129051A (en) | 2016-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610296730.XA Pending CN106129051A (en) | 2015-05-07 | 2016-05-06 | Optical sensor and method for manufacturing optical device |
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| CN (1) | CN106129051A (en) |
| TW (1) | TWI578491B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108240866A (en) * | 2016-12-27 | 2018-07-03 | 光宝电子(广州)有限公司 | Optical-electric module, motion sensing apparatus and its driving method |
| WO2018192555A1 (en) * | 2017-04-20 | 2018-10-25 | 亿光电子工业股份有限公司 | Sensing module and manufacturing method therefor |
| CN111463293A (en) * | 2019-01-17 | 2020-07-28 | 光宝光电(常州)有限公司 | Support structure, optical sensor structure and method for manufacturing optical sensor structure |
| CN111769107A (en) * | 2019-04-01 | 2020-10-13 | 菱生精密工业股份有限公司 | Light sensing module packaging structure |
| CN112310126A (en) * | 2020-10-30 | 2021-02-02 | 维沃移动通信有限公司 | Optical distance sensing module, processing method thereof and electronic equipment |
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| CN110235254B (en) * | 2017-04-20 | 2023-07-11 | 亿光电子工业股份有限公司 | Sensing module and manufacturing method thereof |
| CN111463293A (en) * | 2019-01-17 | 2020-07-28 | 光宝光电(常州)有限公司 | Support structure, optical sensor structure and method for manufacturing optical sensor structure |
| CN111769107A (en) * | 2019-04-01 | 2020-10-13 | 菱生精密工业股份有限公司 | Light sensing module packaging structure |
| CN112310126A (en) * | 2020-10-30 | 2021-02-02 | 维沃移动通信有限公司 | Optical distance sensing module, processing method thereof and electronic equipment |
| CN112310126B (en) * | 2020-10-30 | 2023-10-27 | 维沃移动通信有限公司 | Optical distance sensing module, processing method thereof and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI578491B (en) | 2017-04-11 |
| TW201640644A (en) | 2016-11-16 |
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