CN111769107A

CN111769107A - Light sensing module packaging structure

Info

Publication number: CN111769107A
Application number: CN201910256286.2A
Authority: CN
Inventors: 陈威任; 杜明德
Original assignee: Lingsen Precision Industries Ltd
Current assignee: Lingsen Precision Industries Ltd
Priority date: 2019-04-01
Filing date: 2019-04-01
Publication date: 2020-10-13

Abstract

A light sensing module packaging structure comprises a substrate, a light emitting element, a light sensing chip, a first light blocking layer and a second light blocking layer. The light-emitting element and the light-sensing wafer are arranged on the substrate and are covered by a packaging colloid, the first light-blocking layer is arranged between the light-emitting element and the light-sensing wafer so as to prevent light rays generated by the light-emitting element from being transmitted to the light-sensing wafer in a scattering or diffraction mode, the second light-blocking layer is arranged on the upper surface of the packaging colloid in a printing mode and shields one part of the light-sensing wafer, and the light rays generated by the light-emitting element are transmitted to the light-sensing wafer through the part which is not shielded by the second light-blocking layer after being reflected by an object. Therefore, the light sensing module packaging structure can realize the thinning effect and improve the sensing sensitivity.

Description

Light sensing module packaging structure

Technical Field

The present invention relates to a package structure of a light sensing module, and more particularly, to a package structure of a light sensing module capable of realizing a thin type effect.

Background

Referring to fig. 1, fig. 1 is a cross-sectional view of a conventional optical sensor module package structure 10, in which two molding compounds 11 are used to respectively encapsulate a light emitting device 12 and an optical sensor chip 13, and then an upper cover 14 is disposed on the light emitting device 12 and the optical sensor chip 13, and a partition 15 is formed therebetween, so that light generated by the light emitting device 12 is not transmitted to the optical sensor chip 13 by scattering or diffraction through the partition 15. However, in such a conventional structure, the upper cover 14 having the partition 15 makes it difficult to effectively reduce the volume of the entire package structure 10.

Referring to fig. 2, fig. 2 is a cross-sectional view of another conventional optical sensor module package structure 20, which mainly utilizes a molding process to encapsulate two molding compounds 21 respectively on a light emitting device 22 and an optical sensor chip 23, and then utilizes the molding process to form a shielding layer 24 around the two molding compounds 21 for providing a light-blocking effect, thereby completing the package. However, in such a conventional structure, the stress applied during the secondary molding process is likely to affect the performance of the photo sensor chip 23 and cause the stability of the photo sensor chip 23 to be degraded, and the volume of the whole package structure 20 cannot be effectively reduced.

As can be seen from the above, the two conventional structures cannot meet the current requirement for thinning the product.

Disclosure of Invention

The present invention is directed to a light sensing module package structure, which can achieve a thin type effect and improve sensing sensitivity.

In order to achieve the above objective, the package structure of the photo sensing module of the present invention includes a substrate, a light emitting device, a photo sensing unit, a layer of encapsulant, a first light blocking layer, and a second light blocking layer. The light-emitting element and the light sensing chip are arranged on the upper surface of the substrate together; the packaging colloid is arranged on the upper surface of the substrate and coats the light-emitting element and the light sensing wafer so as to provide a protection effect; the first light-blocking layer is arranged between the light-emitting element and the light-sensing wafer and is used for blocking the light-emitting element and the light-sensing wafer so that light rays emitted by the light-emitting element are not transmitted to the light-sensing wafer in a scattering or diffraction mode; the second light-blocking layer is arranged on the upper surface of the packaging colloid and is positioned above the light-sensing wafer, and shields a part of the light-sensing wafer, so that light rays emitted by the light-emitting element are transmitted to the light-sensing wafer through the part of the packaging colloid which is not shielded by the second light-blocking layer after being reflected by an object, and the sensing sensitivity is improved.

Through the design, the light sensing module packaging structure of the invention can omit the light blocking element such as an upper cover or a shielding layer used in the prior art by utilizing the matching of the first light blocking layer and the second light blocking layer, thereby realizing the thinning effect.

Preferably, the encapsulant has a trench between the light emitting device and the photo sensing chip, so that the encapsulant is divided into a first portion for covering the light emitting device and a second portion for covering the photo sensing chip by the trench, wherein an opaque strip (material is not limited to plastic or metal) can be directly inserted into the trench as the first light blocking layer, or an opaque encapsulant is disposed in the trench by molding process as the first light blocking layer, and a layer of black glue is disposed on the upper surface of the second portion of the encapsulant by printing as the second light blocking layer.

The detailed structure, features, assembly or use of the package structure for the photo sensing module provided by the present invention will be described in the following detailed description of the embodiments. It should be understood, however, by one skilled in the art that the detailed description and the specific examples while indicating the specific embodiment of the invention are intended for purposes of illustration only and are not intended to limit the scope of the invention as defined by the appended claims.

Drawings

Fig. 1 is a schematic cross-sectional view of a conventional optical sensing module package structure;

FIG. 2 is a cross-sectional view of another conventional package structure for a light sensing module;

FIG. 3 is a schematic cross-sectional view of a package structure of a light sensing module according to the present invention;

FIG. 4 is a schematic top view of a light sensing module package structure according to the present invention;

fig. 5 is a manufacturing flow chart of the light sensing module package structure of the present invention.

[ description of reference ]

"Prior Art"

10 optical sensing module packaging structure 11 packaging colloid

12 light emitting device 13 photosensing chip

14 upper cover 15 clapboard

20 optical sensing module packaging structure 21 packaging colloid

22 light-emitting element 23 photosensing chip

24 masking layer

"the invention"

30 light sensing module packaging structure 31 substrate

32 light emitting device 33 photosensing chip

34 encapsulant 35 trench

36 first part 37 second part

38 first light-blocking layer 39 second light-blocking layer

S1-S5

Detailed Description

Applicants first describe herein, throughout the specification and claims that follow, the description and claims, directional terms, and phrases, refer to those directions and directions in the drawings. Next, in the embodiments and the drawings to be described below, the same reference numerals are used for the same or similar elements or structural features thereof, and the sizes and the proportions of the respective elements in the drawings are not drawn according to actual forms in order to show and explain the structural features of the present invention.

Referring to fig. 3 and 4, the package structure 30 of the photo sensing module of the present invention includes a substrate 31, a light emitting device 32, a photo sensing chip 33, an encapsulant 34, a first light blocking layer 38, and a second light blocking layer 39.

The substrate 31 may be a printed circuit board, a BT substrate, an FR-4 epoxy fiberglass substrate, or a direct copper clad substrate, which is not limited herein.

As shown in step S1 of fig. 5, the light emitting element 32 (here, a light emitting diode) is disposed on the upper surface of the substrate 31 and electrically connected to the substrate 31 by Wire bonding.

As shown in step S1 of fig. 5, the photo sensor chip 33 is disposed on the upper surface of the substrate 31 and electrically connected to the substrate 31 by wire bonding.

The encapsulant 34 is made of a transparent material, such as a colorless and transparent epoxy resin. As shown in steps S2-S3 of fig. 5, the molding compound 34 is disposed on the upper surface of the substrate 31 by a molding process and a trench 35 is formed between the light emitting device 32 and the photo sensor chip 33 by a cutting process, such that the molding compound 34 is divided into a first portion 36 covering the light emitting device 32 and a second portion 37 covering the photo sensor chip 33 by the trench 35.

As shown in step S4 of fig. 5, the first light-blocking layer 38 is disposed in the groove 35 and flush with the upper surface of the encapsulant 34 to block the light-emitting device 32 and the photo sensor chip 33, so that the light emitted from the light-emitting device 32 is not transmitted to the photo sensor chip 33 in a scattering or diffraction manner. It should be noted that the first light-blocking layer 38 can be a strip made of plastic, metal or other opaque material and then directly plugged into the groove 35, or alternatively, the first light-blocking layer 38 can be made of opaque epoxy and then disposed into the groove 35 by a molding process.

The second light-blocking layer 39 is black glue. As shown in step S5 of fig. 5, the second light-blocking layer 39 is printed on the upper surface of the second portion 37 of the encapsulant 34 by a printing glue roller, screen printing or steel plate printing, and shields a part of the photo-sensing chip 33, and is adjacent to the first light-blocking layer 38, so that the light emitted by the light-emitting element 32 is reflected by the object and then transmitted to the photo-sensing chip 33 through the second portion 37 of the encapsulant 34 where the light is not shielded by the second light-blocking layer 39, thereby improving the sensing sensitivity of the photo-sensing chip 33.

As can be seen from the above, the light sensing module package structure 30 of the present invention utilizes the first and second

light blocking layers

38 and 39 to omit the light blocking elements such as the top cover 14 or the shielding layer 24 used in the prior art, thereby achieving the effect of thinning the product.

Claims

1. A light sensing module package structure includes:

a substrate;

a light emitting element arranged on the upper surface of the substrate and electrically connected with the base;

the optical sensing chip is arranged on the upper surface of the substrate and is electrically connected with the substrate;

the packaging colloid is arranged on the upper surface of the substrate and covers the light-emitting element and the light sensing chip;

a first light-blocking layer arranged between the light-emitting element and the light-sensing wafer; and

and the second light-blocking layer is arranged on the upper surface of the packaging colloid, is positioned above the light sensing element and shields one part of the light sensing wafer.

2. The optical sensing module package according to claim 1, wherein the encapsulant has a trench between the light emitting device and the optical sensing die, such that the encapsulant is divided by the trench into a first portion encapsulating the light emitting device and a second portion encapsulating the optical sensing die; the first light-blocking layer is arranged in the groove; the second light-blocking layer is arranged on the upper surface of the second part.

3. The light sensing module package structure of claim 1 or 2, wherein the first and second light blocking layers are adjacent to each other.

4. The light sensing module package structure of claim 1 or 2, wherein an upper surface of the first light blocking layer is flush with an upper surface of the molding compound.

5. The light sensing module package structure of claim 1, wherein the second light blocking layer is black glue.