CN206340540U - The encapsulating structure of optical module - Google Patents
The encapsulating structure of optical module Download PDFInfo
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- CN206340540U CN206340540U CN201621478154.2U CN201621478154U CN206340540U CN 206340540 U CN206340540 U CN 206340540U CN 201621478154 U CN201621478154 U CN 201621478154U CN 206340540 U CN206340540 U CN 206340540U
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- chip
- encapsulating structure
- optical module
- shielding layer
- light
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Abstract
A kind of encapsulating structure of optical module, include a substrate, a luminescence chip, a sensor chip, two packing colloids and a shielding layer, substrate has a loading end, luminescence chip is arranged at loading end by chip adhering film, sensor chip is also arranged at loading end and spaced with luminescence chip by chip adhering film, two packing colloids are respectively coated by luminescence chip and sensor chip, shielding layer is arranged above loading end and two packing colloids, and shielding layer is provided with a light-emitting hole and a light admitting aperture and is located at respectively above luminescence chip and sensor chip.
Description
Technical field
The utility model is relevant with encapsulating structure, particularly relates to a kind of encapsulating structure of optical module.
Background technology
Widely, all automated machines and intelligent device all can be seen that its trace for the application of optical sensing module,
By taking intelligent mobile phone as an example, when intelligent mobile phone is close to user's cheek or when put pocket into, intelligent mobile phone is arranged at
On optical sensing module can closing hand phone screen immediately, with the effect for reaching power saving or avoiding user's false touch, its principle exists
In optical sensing module can launch light source, after light source reflects through external object, quilt using luminescence chip (such as LED chip)
The sensor chip of optical sensing module is received, and then is converted into electronic signal progress subsequent treatment.
And the manufacture of existing optical sensing module, for by upper blade technolgy set on a substrate a luminescence chip with
And a sensor chip, two packing colloids are then respectively coated by the luminescence chip and the sense via mould pressing process (Molding)
Chip is surveyed, finally a shielding layer is formed above the grade packing colloid also with mould pressing process and completes whole encapsulating structure.
Wherein, then when carrying out secondary mould pressing process, the stress on the luminescence chip and the sensor chip is produced, can
The product performance of chip can be influenceed, cause the reduction of chip stability or even cause disabler, therefore, existing optical sensing
Module still has its shortcoming, and has much room for improvement.
Utility model content
Summary illustrates that main purpose of the present utility model is to provide a kind of encapsulating structure of optical module, the light
The stress produced on chip can be reduced by learning the encapsulating structure of module, and then reduce the interference that stress is caused to chip, be lifted whole
The efficiency of individual product.
The encapsulating structure of the optical module includes a substrate, a luminescence chip, a sensor chip, two packing colloids and one
Shielding layer, the substrate has a loading end, and the luminescence chip is arranged at this by chip adhering film (Die Attach Film)
Loading end, the sensor chip by chip adhering film (Die Attach Film) be arranged at the loading end and with the luminous core
Piece is spaced, and two packing colloid is respectively coated by the luminescence chip and the sensor chip, and the shielding layer is arranged at the carrying
Above face and two packing colloid, the shielding layer is provided with a light-emitting hole and a light admitting aperture and respectively positioned at the luminous core
Above piece and the sensor chip.
Preferably, respectively the packing colloid and the shielding layer are formed using the mode of molding.
Thereby, when progress mould pressing process forms the respectively packing colloid and the shielding layer, chip adhering film (Die
Attach Film) mould pressing process can be reduced to the stress caused by the luminescence chip and the sensor chip, and then reduce stress
Interference to the luminescence chip and the sensor chip, therefore the utility model provides the encapsulating structure of optical module has structure
Firm and product efficiency preferably advantage.
Relevant detailed configuration provided by the utility model, feature, give in being described in detail in follow-up embodiment
Description.However, those skilled in the art should be able to understand, the grade is described in detail and implemented cited by the utility model
Specific embodiment, be merely to illustrate the utility model, and be not used to limit claims of the present utility model.
Brief description of the drawings
Fig. 1 is the top view of the preferred embodiment of the utility model one.
Fig. 2 is the sectional view of 2-2 hatching lines in Fig. 1, shows the position relationship of encapsulating structure intraware.
【Description of reference numerals】
The substrate of encapsulating structure 20 of 10 optical modules
The sensor chip of 30 luminescence chip 40
The shielding layer of 50 packing colloid 60
22 loading ends
70a chip adhering film 70b chip adhering films
The lens section of 52 first lens section 54 second
The light admitting aperture of 62 light-emitting hole 64
Embodiment
Fig. 1~2 are refer to, the encapsulating structure 10 that the preferred embodiment of the utility model one provides optical module includes a base
Plate 20, a luminescence chip 30, a sensor chip 40, two packing colloids 50 and a shielding layer 60.
Substrate 20 can be Bismaleimide Triazine (common name BT) substrate, glass fibre basal plate in this preferred embodiment
(common name FR4) or directly copper-clad base plate (common name DBC) but it is not limited thereto, thereby, the production cost of substrate 20 is relatively low, base
Plate 20 has a loading end 22.
Luminescence chip 30 is arranged at loading end 22 by chip adhering film 70a (Die Attach Film), in this preferably
Luminescence chip 30 is LED chip and can be used to launch light source in embodiment.
Sensor chip 40 is arranged at loading end 22 by chip adhering film 70b (Die Attach Film), and senses
Chip 40 and luminescence chip 30 are spaced, wherein, sensor chip 40 can be used to sense the light source that luminescence chip 30 is sent.
Two packing colloids 50 are made up in this preferred embodiment of light-transmitting materials, such as transparent epoxy resin (Epoxy
Resin), two packing colloids 50 are formed in the way of being molded (Molding) and are respectively coated by luminescence chip 30 and sensor chip 40,
It is noted that each packing colloid 50 forms one first lens section 52 respectively at luminescence chip 30 and the top of sensor chip 40
And one second lens section 54, the first lens section 52 and the second lens section 54 are in hemispherical, and first, second lens section
The visual demand of curvature of (52,54) is adjusted when manufacture.
Shielding layer 60 is formed in one in this preferred embodiment and is made up of light tight material, such as lighttight asphalt mixtures modified by epoxy resin
Fat (Epoxy Resin), shielding layer 60 is formed in the way of molding and is arranged at the top of 22 and two packing colloid of loading end 50,
Shielding layer 60 is provided with a light-emitting hole 62 and a light admitting aperture 64 and is located at respectively on luminescence chip 30 and sensor chip 40
Side, it is worth mentioning at this point that, the first lens section 52 and the second lens section 54 are respectively accommodated in light-emitting hole 62 and light admitting aperture
In 64.
Then the encapsulation flow that the utility model provides optical module is introduced, first step A is first offer substrate 20, and
Luminescence chip 30 and sensor chip 40 are arranged to the loading end 22 of substrate 20 by chip adhering film (70a, 70b) respectively,
Two packing colloids 50 are respectively coated by luminescence chip 30 and sensor chip 40 by second step B followed by the mode of molding, together
When each packing colloid 50 form the first lens section 52 and the second lens section in luminescence chip 30 and the top of sensor chip 40 respectively
Shielding layer 60 is arranged at the packaging plastic of loading end 22 and two by 54, third step C with being integrally formed also with the mode of molding
The top of body 50, and simultaneously the formation light-emitting hole 62 of shielding layer 60 and light admitting aperture 64 and be located at respectively luminescence chip 30 with
And the top of sensor chip 40, and can to accommodate the first lens section 52 and second respectively saturating for light-emitting hole 62 and light admitting aperture 64
Mirror portion 54.
Summary illustrates that luminescence chip 30 and sensor chip 40 are set by chip adhering film (70a, 70b) respectively
In loading end 22, in the secondary mould pressing technique of each packing colloid 50 and shielding layer 60 is carried out, chip adhering film (70a,
Can 70b) reduce the stress that mould pressing process is produced to luminescence chip 30 and sensor chip 40, reduction stress to luminescence chip 30 with
And the interference of sensor chip 40, and then lift the structural stability of product and excellent efficiency is provided.
It must finally illustrate that the utility model constituent components disclosed in previous embodiment are only for example again
It is bright, not for limiting scope of the present utility model, the replacement of other equivalent elements or change, it also should be power of the present utility model
The claimed scope of profit is covered.
Claims (7)
1. a kind of encapsulating structure of optical module, it is characterised in that include：
One substrate, with a loading end；
One luminescence chip, the loading end is arranged at by chip adhering film (Die Attach Film)；
One sensor chip, by chip adhering film (Die Attach Film) be arranged at the loading end and with the luminescence chip
It is spaced；
Two packing colloids, are respectively coated by the luminescence chip and the sensor chip；And
One shielding layer, is arranged above the loading end and two packing colloid, and the shielding layer is provided with a light-emitting hole and one
Light admitting aperture is simultaneously located above the luminescence chip and the sensor chip respectively.
2. the encapsulating structure of optical module as claimed in claim 1, it is characterised in that respectively the packing colloid and the shielding layer are sharp
Formed with the mode of molding.
3. the encapsulating structure of optical module as claimed in claim 1, it is characterised in that respectively the packing colloid is respectively at the luminous core
One first, second lens section is formed above piece and the sensor chip.
4. the encapsulating structure of optical module as claimed in claim 3, it is characterised in that first, second lens section is in hemispherical.
5. the encapsulating structure of optical module as claimed in claim 3, it is characterised in that first, second lens section is housed respectively
In the light-emitting hole and the light admitting aperture.
6. the encapsulating structure of optical module as claimed in claim 1, it is characterised in that respectively the packing colloid is light-transmitting materials system
Into the shielding layer is made up of light tight material.
7. the encapsulating structure of optical module as claimed in claim 1, it is characterised in that the shielding layer is formed in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621478154.2U CN206340540U (en) | 2016-12-30 | 2016-12-30 | The encapsulating structure of optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621478154.2U CN206340540U (en) | 2016-12-30 | 2016-12-30 | The encapsulating structure of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206340540U true CN206340540U (en) | 2017-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621478154.2U Active CN206340540U (en) | 2016-12-30 | 2016-12-30 | The encapsulating structure of optical module |
Country Status (1)
| Country | Link |
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| CN (1) | CN206340540U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108269793A (en) * | 2016-12-30 | 2018-07-10 | 菱生精密工业股份有限公司 | The encapsulating structure of optical module |
| CN111769107A (en) * | 2019-04-01 | 2020-10-13 | 菱生精密工业股份有限公司 | Light sensing module packaging structure |
-
2016
- 2016-12-30 CN CN201621478154.2U patent/CN206340540U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108269793A (en) * | 2016-12-30 | 2018-07-10 | 菱生精密工业股份有限公司 | The encapsulating structure of optical module |
| CN111769107A (en) * | 2019-04-01 | 2020-10-13 | 菱生精密工业股份有限公司 | Light sensing module packaging structure |
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