CN202758888U - Sensor sealing module - Google Patents
Sensor sealing module Download PDFInfo
- Publication number
- CN202758888U CN202758888U CN201220418850XU CN201220418850U CN202758888U CN 202758888 U CN202758888 U CN 202758888U CN 201220418850X U CN201220418850X U CN 201220418850XU CN 201220418850 U CN201220418850 U CN 201220418850U CN 202758888 U CN202758888 U CN 202758888U
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- CN
- China
- Prior art keywords
- sensor
- transparent adhesive
- chip
- package module
- tellite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Abstract
The invention relates to a sensor sealing module, which is characterized some of various transparent sealing colloids formed by transfer molding cover a plurality of sensor chips and light-emitting components to form a lens form, and a shading sealing colloid formed by transfer molding fills the surrounding of the transparent sealing colloid and its gap in one time. Thereby, a plurality of photoelectric elements and control elements are easily integrated by the sensor sealing module, and the sensor sealing module has good transmissivity, polyfunctionality and high reliability.
Description
Technical field
The utility model relates to a kind of sensor package module, particularly a kind of sensor package module of integrating a plurality of photoelectric subassemblys.
Background technology
Along with the day by day lifting of IC product consumption, promoted the flourish of Electronic Packaging industry.And in the evolution of electronic manufacturing technology development, stress under the requirement of " light, thin, short, little, high function " at present electronic product, also so that the IC chip encapsulation technology constantly weed out the old and bring forth the new, to meet the needs of electronic product.
All electronic products are all take " electricity " as the energy, however the transmission of electric power must can reach through the connection side of circuit, so the IC encapsulation can reach this function; After connection, the signal between each electronic building brick transmits nature and can be carried via these circuits.Another function of Electronic Packaging then is the heat conduction function by encapsulating material, electronics is transmitted the heat that produces remove between circuit, damages because of overheated to avoid the IC chip.At last, the IC encapsulation removes and provides enough mechanical strengths to frangible chip, and suitable protection, the possibility of also having avoided meticulous integrated circuit to be polluted.
IC encapsulation is according to using material can be divided into two kinds in pottery (ceramic) and plastics (plastic), and present commercial the application, then take Plastic Package as main.Routing engages as example in the Plastic Package, and its step is sequentially garden sheet cutting (die saw), glutinous brilliant (die mount/die bond), bonding wire (wire bond), sealing (mold), shears/be shaped (trim/form), lettering (mark), electroplates (plating) and check (inspection) etc.
And the demand of various electronic products has all configured all kinds of sensing apparatus now, as: contact panel, gravity accelerator, electronic compass, gyroscope, low coverage transducer and environment light source etc.; The product manufacturing technology is the encapsulation technology of knowing at present, take optical sensor (Light Sensor) as example, as shown in Figure 1, optical sensor 9 has a lead frame, configure a light-emitting diode chip for backlight unit 91 and an induction chip 92 thereon, and coat one first transparent resin 911 at light-emitting diode chip for backlight unit 91; Coat one second transparent resin 921 at induction chip 92 in addition; Then, outer package one black glue 93 around the first transparent resin 911 and the second transparent resin 921, and the relative position at luminous diode chip 91 and induction chip 92 is reserved one first aperture 931 and the second aperture 932, the light that allows light-emitting diode chip for backlight unit 91 send penetrates via the first aperture 931, also allows simultaneously light enter induction chip 92 via the second aperture 932.
Yet, this kind method for packing is complied with some glue modes more and is repeatedly formed transparent resin and black glue, usually causes the conjugation between adhesive body and the substrate not good, and may cause printing opacity unstable, make the running that optical sensor can't be correct, electronic product is had a greatly reduced quality in reliability.
The utility model content
The purpose of this utility model is to provide a kind of sensor package module, to solve the problem of being mentioned in the known technology.
For achieving the above object, the sensor package module that the utility model provides comprises:
One tellite, it has a first surface and a second surface;
One sensor chip and a luminescence component are disposed on this first surface of this tellite;
Plural number pin pad is disposed on this second surface of this tellite;
The transparent adhesive body of plural number once forms according to the transfer formation mode, cover individually this sensor chip and this luminescence component, and those transparent adhesive bodies has a space each other; And
One shading adhesive body once forms according to the transfer formation mode, is covered on this first surface of this tellite, and fills up around those transparent adhesive bodies and this space.
Described sensor package module wherein, comprises one or more control chip.
Described sensor package module, wherein, the material of those transparent adhesive bodies is epoxy resin.
Described sensor package module, wherein, the material of those transparent adhesive bodies is silica gel.
Described sensor package module, wherein, this sensor chip is a light receiving chip.
Described sensor package module, wherein, this luminescence component is light-emitting diode.
Described sensor package module wherein, is covered in this transparent adhesive body of this sensor chip, and its surface presents a concavity.
Described sensor package module wherein, is covered in this transparent adhesive body of this luminescence component, and its surface presents a convex.
The sensor package module that the utility model proposes has preferably light transmittance, make transducer when running can be correct induction, and make it on the product that uses, relatively have more multifunctionality and reliability preferably.
Description of drawings
Fig. 1 is the schematic diagram of the optical sensor of known technology;
Fig. 2 A to Fig. 2 D is the cutaway view of encapsulation process of the sensor assembly of an embodiment of the present utility model;
Fig. 3 is the flow chart of sensor module package method of the present utility model.
Primary clustering symbol description in the accompanying drawing:
10 tellites; 101 upper surfaces; 103 lower surfaces; 12 pin pads; 20 sensor chips; 22 luminescence components; 30 metal wires; 40 transparent adhesive bodies; 401 spaces; 50 shading adhesive bodies; 70 control chips; 9 optical sensors; 91 light-emitting diode chip for backlight unit; 911 first transparent resins; 92 induction chips; 921 second transparent resins; 93 black glue; 931 first apertures; 932 second apertures; 301,302,303,304 steps.
Embodiment
The sensor package module that the utility model provides, the conjugation between its transparent and shading adhesive body and substrate is better, makes transducer have preferably light transmittance, and transducer can be operated normally.
The sensor package module that the utility model provides, has a tellite, and at first surface at least one sensor chip of configuration and at least one luminescence component and the control chip of tellite, a plurality of pin pads are disposed on the second surface of tellite.A plurality of transparent adhesive bodies are to form according to the transfer formation mode in addition, cover individually sensor chip and luminescence component, and transparent adhesive body have a space each other; And a shading adhesive body, be once to form according to the transfer formation mode, be covered on the first surface of tellite, and fill up around the transparent adhesive body and the space between the transparent adhesive body.
Sensor package module of the present utility model and method for packing thereof, a kind of technology of integrating encapsulation particularly, make encapsulating products have higher reliability and light transmittance, wherein the sensor chip that includes of transducer and luminescence component glutinous put and engages and lead-in wire is to utilize prior art to reach, therefore in following explanation, and imperfect description.In addition, the accompanying drawing in following interior literary composition, not according to the actual complete drafting of relative dimensions, its effect is only being expressed the schematic diagram relevant with the utility model feature.
See also Fig. 2 A to Fig. 2 E, be the cutaway view of the encapsulation process of the sensor package module of an embodiment of the present utility model.Please consult first Fig. 2 A, at first, provide first a tellite (PCB; Printed Circuit Board) 10, have a upper surface 101 and lower surface 103; Tellite 10 is according to circuit design, and the electric wiring of connecting circuit part is depicted as wiring pattern, and then in modes such as the machining of designing institute appointment, surface treatments, makes electric conductor reappear the circuit board that consists of at insulator; Tellite 10 its material cores are substrate material, and substrate material is comprised of resin, reinforcing material and metal forming three, and modal substrate is copper clad laminate, and the utility model is not limited the material of tellite 10.In addition, the lower surface 103 a plurality of pin pads of configuration (PAD) 12 at tellite 10 are used for and the electronic product welding, and this is basic I C processing procedure, is not illustrated at this.
Then, see also Fig. 2 B, on the upper surface 101 of tellite 10, have a plurality of chip carrier (not shown)s, can be configured (the present embodiment is to illustrate with two) according to different design and quantity; Put elargol predetermined the sticking together of chip carrier, and configure respectively one or more sensor chip 20 and one or more luminescence components 22 thereon, that is be chip join (Die bonding); Then again with the contact (not shown) on sensor chip 20 and the luminescence component 22, with metal wire 30 for example: gold thread is soldered on the tellite 10, that is is wire-bonded (Wire bonding).Luminescence component 22 for example is led light source, and sensor chip 20 is to receive extraneous next light, that is the light receiving chip.On the other hand, at the upper surface 101 of tellite 10, can configure on demand a control chip 70, for example be a microprocessor (CPU).In other words, the sensor assembly that the utility model proposes is highly susceptible to integrating other photoelectric subassemblys, has technologic convenience; And the utility model is not limited allocation position and the quantity of control chip 70.
Follow again, see also Fig. 2 C, around the sensor chip 20 of being furnished with metal wire 30 and luminescence component 22, cover respectively a mantle (not shown), and in mantle, form a plurality of transparent adhesive bodies 40 to shift (Transfer Molding) mode of shaping, cover respectively on sensor chip 20 and the luminescence component 22; Transparent adhesive body 40 is in order to protect luminescence component 22 and sensor chip 20, and its material is epoxy resin or silica gel; In addition, have a space 401 between the transparent adhesive body 40 of sensor chip 20 and luminescence component 22, rear extended meeting is illustrated this.It should be noted that because transparent adhesive body 40 is to form according to shifting forming mode, thereby its dimensional accuracy can precisely control, and save unnecessary waste of material.In addition, at the transparent adhesive body 40 that is covered on the sensor chip 20, its surface is a concavity, is easy to be concentrated on sensor chip 20; And being covered in transparent adhesive body 40 on the luminescence component 22, its surface is a convex, is easy to the light source of luminescence component 22 is scattered out.
Follow again, see also Fig. 2 D, on covering, around the sensor chip 20 of transparent adhesive body 40 and the luminescence component 22 and in the space 401, utilize to be same as the transfer forming mode that transparent adhesive body 40 is injected in the front, generally speaking disposable formation one shading adhesive body 50 is the shading adhesive body of black; Will illustrate at this, its shading adhesive body 50 is mainly the interference of avoiding sensor chip 20 and luminescence component 22 to be subject to extraneous light for having the character of resistance light; Filling up in addition shading adhesive body 50 in space 401, also is to avoid interfering with each other between sensor chip 20 and the luminescence component 22, and its space 401 width most preferred embodiments of the utility model are 0.2mm, but the utility model is not limited this width.It should be noted that because shading adhesive body 50 is to form according to shifting forming mode, thereby its dimensional accuracy can precisely control, and save unnecessary waste of material.
See also Fig. 3, be the flow chart of the method for packing of sensor assembly of the present utility model.Shown in Fig. 2 A to 2E, the method step of sensor module package is as follows:
Via above-mentioned steps, make the packaging of the fiber grating sensors module can maintain better thickness, and induction chip 20 and luminescence component 22 in running with having better light transmittance, and make it on the product that uses, relatively have more multifunctionality and reliability preferably.
In addition, because above-mentioned a plurality of transparent adhesive body 40 and the formation of shading adhesive body 50, all can once form according to shifting forming mode, thereby when the quantity of sensor chip 20 and luminescence component 22 when being a plurality of, also mode is once finished the shaping of the transparent adhesive body 40 of a plurality of sensor chips 20 and a plurality of luminescence component 22 according to this, and in the shaping of once finishing thereafter shading adhesive body 50, tool not only can once be integrated a plurality of photoelectric subassemblys of encapsulation on technique, and simultaneously because yield can unanimously and be easily controlled in the implementation that is shaped, and then promote the reliability of sensor package module.
Although the utility model discloses as above with aforesaid preferred embodiment; so it is not to limit the utility model; those skilled in the art are not within breaking away from spirit and scope of the present utility model; when can doing a little change and retouching, therefore the protection range of the present utility model content that should be defined with the claim scope of application is as the criterion.
Claims (8)
1. a sensor package module is characterized in that, comprises:
One tellite, it has a first surface and a second surface;
One sensor chip and a luminescence component are disposed on this first surface of this tellite;
Plural number pin pad is disposed on this second surface of this tellite;
The transparent adhesive body of plural number for once forming, cover individually this sensor chip and this luminescence component, and those transparent adhesive bodies has a space each other; And
One shading adhesive body for once forming, is covered on this first surface of this tellite, and fills up around those transparent adhesive bodies and this space.
2. sensor package module according to claim 1 wherein, comprises one or more control chip.
3. sensor package module according to claim 1, wherein, those transparent adhesive bodies are epoxy resin.
4. sensor package module according to claim 1, wherein, those transparent adhesive bodies are silica gel.
5. sensor package module according to claim 1, wherein, this sensor chip is a light receiving chip.
6. sensor package module according to claim 1, wherein, this luminescence component is light-emitting diode.
7. sensor package module according to claim 1 wherein, is covered in this transparent adhesive body of this sensor chip, and its surface presents a concavity.
8. sensor package module according to claim 1 wherein, is covered in this transparent adhesive body of this luminescence component, and its surface presents a convex.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220418850XU CN202758888U (en) | 2012-08-22 | 2012-08-22 | Sensor sealing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220418850XU CN202758888U (en) | 2012-08-22 | 2012-08-22 | Sensor sealing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202758888U true CN202758888U (en) | 2013-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220418850XU Expired - Fee Related CN202758888U (en) | 2012-08-22 | 2012-08-22 | Sensor sealing module |
Country Status (1)
| Country | Link |
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| CN (1) | CN202758888U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129051A (en) * | 2015-05-07 | 2016-11-16 | 亿光电子工业股份有限公司 | Optical sensor and method for manufacturing optical device |
| CN106298761A (en) * | 2016-09-24 | 2017-01-04 | 苏州捷研芯纳米科技有限公司 | Photosensor package part, semi-finished product and batch method for packing |
| CN107980175A (en) * | 2015-06-09 | 2018-05-01 | 弗劳恩霍夫应用研究促进协会 | For detecting the component of electromagnetic radiation |
| CN108240866A (en) * | 2016-12-27 | 2018-07-03 | 光宝电子(广州)有限公司 | Optical-electric module, motion sensing apparatus and its driving method |
| CN108388868A (en) * | 2018-02-27 | 2018-08-10 | 北京思比科微电子技术股份有限公司 | A kind of device of short distance sense object image |
| CN109119347A (en) * | 2018-09-03 | 2019-01-01 | 惠州泓亚智慧科技有限公司 | A kind of packaging method of the biological characteristic optical sensor of wearable device |
| CN113948628A (en) * | 2020-07-15 | 2022-01-18 | 歆炽电气技术股份有限公司 | Chip transfer system and chip transfer method |
-
2012
- 2012-08-22 CN CN201220418850XU patent/CN202758888U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129051A (en) * | 2015-05-07 | 2016-11-16 | 亿光电子工业股份有限公司 | Optical sensor and method for manufacturing optical device |
| CN107980175A (en) * | 2015-06-09 | 2018-05-01 | 弗劳恩霍夫应用研究促进协会 | For detecting the component of electromagnetic radiation |
| CN106298761A (en) * | 2016-09-24 | 2017-01-04 | 苏州捷研芯纳米科技有限公司 | Photosensor package part, semi-finished product and batch method for packing |
| CN108240866A (en) * | 2016-12-27 | 2018-07-03 | 光宝电子(广州)有限公司 | Optical-electric module, motion sensing apparatus and its driving method |
| CN108240866B (en) * | 2016-12-27 | 2020-06-09 | 光宝电子(广州)有限公司 | Photoelectric module, motion sensing device and driving method thereof |
| CN108388868A (en) * | 2018-02-27 | 2018-08-10 | 北京思比科微电子技术股份有限公司 | A kind of device of short distance sense object image |
| CN109119347A (en) * | 2018-09-03 | 2019-01-01 | 惠州泓亚智慧科技有限公司 | A kind of packaging method of the biological characteristic optical sensor of wearable device |
| CN109119347B (en) * | 2018-09-03 | 2021-08-10 | 深圳市泓亚智慧电子有限公司 | Packaging method of biological characteristic optical sensor of wearable device |
| CN113948628A (en) * | 2020-07-15 | 2022-01-18 | 歆炽电气技术股份有限公司 | Chip transfer system and chip transfer method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130227 Termination date: 20150822 |
|
| EXPY | Termination of patent right or utility model |