CN202977376U - Sensor packaging module - Google Patents
Sensor packaging module Download PDFInfo
- Publication number
- CN202977376U CN202977376U CN 201220638377 CN201220638377U CN202977376U CN 202977376 U CN202977376 U CN 202977376U CN 201220638377 CN201220638377 CN 201220638377 CN 201220638377 U CN201220638377 U CN 201220638377U CN 202977376 U CN202977376 U CN 202977376U
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- support plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Led Device Packages (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Abstract
The utility model provides a sensor packaging module. A light-emitting diode chip and a sensing chip are manufactured in a module way, a sensing module and a light-emitting module are formed, the modules are placed on carrying boards with corresponding grooves, and a sensor is formed through direct assembly. The sensor packaging module has the advantages that complicated technology is saved, mass manufacturing is facilitated, cost can then be reduced, and the time of technology is shortened.
Description
Technical field
The utility model relates to a kind of sensor package module, particularly a kind of light-emitting diode chip for backlight unit and induction chip made with modular manner, and the sensor package module of directly module being combined with support plate.
Background technology
Along with the lifting day by day of IC product consumption, promoted the flourish of Electronic Packaging industry.And in the evolution of electronic manufacturing technology development, stress under the requirement of " light, thin, short, little, high function " at present electronic product, also make the IC chip encapsulation technology constantly weed out the old and bring forth the new, to meet the needs of electronic product.
All electronic products are all take " electricity " as the energy, however the transmission of electric power must can reach through the connection side of circuit, so the IC encapsulation can reach this function; After connection, the signal between each electronic building brick transmits nature and can be carried via these circuits.Another function of Electronic Packaging is the heat conduction function by encapsulating material, electronics is transmitted the heat that produces and remove between circuit, damages because of overheated to avoid the IC chip.At last, the IC encapsulation removes and provides enough mechanical strengths to frangible chip, and suitable protection, the possibility of also having avoided meticulous integrated circuit to be polluted.
In the making of integrated circuit, chip (chip) is to make, form the step such as integrated circuit and cutting garden sheet (wafer sawing) via garden sheet (wafer) and complete.The garden sheet has an active surface (active surface), and it makes a general reference the surface with driving component (active element) of garden sheet.After the integrated circuit of sheet inside, garden is completed, the active surface of garden sheet also disposes a plurality of weld pads (bonding pad), so that finally can outwards be electrically connected at a carrier (carrier) via these weld pads by the formed chip of garden sheet cutting.Carrier is for example a lead frame (1eadframe).Chip is connected on carrier in the mode that routing engages (wire bonding), makes these weld pads of chip can be electrically connected at the contact of carrier, to consist of a chip-packaging structure.
And take optical sensor (Light Sensor) as example, optical sensor (Light Sensor) has respectively light-emitting diode chip for backlight unit and two kinds of assemblies of induction chip, and these two kinds of assemblies are namely to be connected on carrier in the mode that routing engages (wirebonding); Yet this kind encapsulating structure not only technique is numerous and diverse, and required time of paying and cost all exceed a lot.
The utility model content
The purpose of this utility model is to provide a kind of sensor package module, to improve the defective that exists in known technology.
For achieving the above object, the sensor package module that the utility model provides comprises:
One first support plate has a upper surface and with respect to a lower surface of this upper surface, and has one first through hole and one second through hole that is through to this lower surface by this upper surface on this first support plate;
One first sealing is disposed in this first through hole;
One second sealing is disposed in this second through hole;
One second support plate, be disposed at this lower surface of this first support plate, this second support plate has a upper surface and with respect to a lower surface of this upper surface, and have one the 3rd through hole and one the 4th through hole that are through to this lower surface by this upper surface on this second support plate, the 3rd through hole is disposed at this first through hole relatively, and the 4th through hole is disposed at this second through hole relatively;
One sensing module comprises:
One first substrate has a upper surface and with respect to a lower surface of this upper surface, and disposes a plurality of these upper surfaces that run through to the through hole of this lower surface;
One optical sensing subassembly is disposed at this upper surface of this first substrate;
Plural wires is connected to those through holes of this first substrate by this optical sensing subassembly;
A plurality of wire pins are disposed at this lower surface of this first substrate, and are connected with those wires; And
One the 3rd sealing coats this optical sensing subassembly and those wires on this upper surface of this first substrate;
One light emitting module comprises:
One second substrate has a upper surface and with respect to a lower surface of this upper surface, and disposes a plurality of these upper surfaces that run through to the through hole of this lower surface;
One luminescence component is disposed at this upper surface of this second substrate;
At least one wire is connected to those through holes of this second substrate by this luminescence component;
At least one wire pin is disposed at this lower surface of this second substrate, and is connected with this wire; And
One the 4th sealing coats this luminescence component and this wire on this upper surface of this second substrate;
Wherein, the equal and opposite in direction of this sensing module is in the size of the 3rd through hole, and is disposed in the 3rd through hole, and the equal and opposite in direction of this light emitting module is in the size of the 4th through hole, and is disposed in the 4th through hole.
In described sensor package module, the aperture of the 3rd through hole is greater than this first through hole, and the aperture of the 4th through hole is greater than this second through hole.
In described sensor package module, this first through hole, this second through hole, the 3rd through hole and the 4th through hole be shaped as rectangle.
In described sensor package module, the material of this first sealing, this second sealing, the 3rd sealing and the 4th sealing is transparent epoxy resin.
In described sensor package module, the material of this first support plate and this second support plate is opaque epoxy resin.
In described sensor package module, this first support plate and this second support plate are formed in one.
In described sensor package module, this luminescence component is light-emitting diode.
The sensor package module that the utility model proposes, by directly sensing module and light emitting module being placed on the support plate with relative groove, but direct-assembling forms a transducer, omit numerous and diverse technique, be easy to a large amount of manufacturings, but therefore Cost reduction, and shorten time of technique.
Description of drawings
Fig. 1 is the first support plate and the second support plate cutaway view of sensor package module of the present utility model;
Fig. 2 is the carrying board structure cutaway view of sensor package module of the present utility model;
Fig. 3 is sensing module and the light emitting module cutaway view of sensor package module of the present utility model;
Fig. 4 is sensor package module cutaway view of the present utility model.
Primary clustering symbol description in accompanying drawing:
1 sensor package module, 2 carrying board structures, 3 sensing modules, 4 light emitting modules;
10 first support plates, 101 upper surfaces, 103 lower surfaces;
12 first through holes, 121 first sealings;
14 second through holes, 141 second sealings;
20 second support plates, 201 upper surfaces, 203 lower surfaces, 205 first grooves, 207 second grooves;
22 the 3rd through holes;
24 the 4th through holes;
30 first substrates, 301 upper surfaces, 303 lower surfaces;
32 optical sensing subassemblies;
34 wires;
36 wire pins;
38 the 3rd sealings;
40 second substrates, 401 upper surfaces, 403 lower surfaces;
42 luminescence components;
44 wires;
46 wire pins;
48 the 4th sealings.
Embodiment
In order to solve the above-mentioned problem of mentioning, the utility model provides a kind of sensor package module, particularly light-emitting diode chip for backlight unit and induction chip is made with modular manner, and directly module is combined with support plate, reduces the time of technique.
The sensor package module that the utility model provides comprises: one first support plate has a upper surface and with respect to a lower surface of upper surface, and have one first through hole and one second through hole that is through to lower surface by upper surface on the first support plate; One first sealing is disposed in the first through hole; One second sealing is disposed in the second through hole; One second support plate is disposed at the lower surface of the first support plate, and the second support plate has a upper surface and with respect to a lower surface of upper surface, and has one the 3rd through hole and one the 4th through hole that is through to lower surface by upper surface on the second support plate; The 3rd through hole is disposed at the first through hole relatively, and the 4th through hole is disposed at the second through hole relatively; One sensing module comprises: a first substrate has a upper surface and with respect to a lower surface of upper surface, and disposes a plurality of upper surfaces that run through to the through hole of lower surface; One optical sensing subassembly is disposed at the upper surface of first substrate; Plural wires is connected to these a little through holes of first substrate by optical sensing subassembly; A plurality of wire pins are disposed at the lower surface of first substrate, and a little wires connect therewith; And one the 3rd sealing, optical sensing subassembly and this a little wires on the upper surface of coating first substrate; One light emitting module comprises: a second substrate has a upper surface and with respect to a lower surface of upper surface, and disposes a plurality of upper surfaces that run through to the through hole of lower surface; One luminescence component is disposed at the upper surface of second substrate; At least one wire is connected to these a little through holes of second substrate by luminescence component; At least one wire pin is disposed at the lower surface of second substrate, and is connected with wire; And one the 4th sealing, luminescence component and wire on the upper surface of coating second substrate; Wherein, the equal and opposite in direction of sensing module is in the size of the 3rd through hole, and is disposed in the 3rd through hole, and the equal and opposite in direction of light emitting module is in the size of the 4th through hole, and is disposed in the 4th through hole.
Understand more clearly and implemented for having the purpose of this utility model, technical characterictic and advantage, below coordinate accompanying drawing, illustrate technical characterictic of the present utility model and execution mode in follow-up specification, and enumerate preferred embodiment and further illustrate, so following examples explanation is not to limit the utility model, and is to express the signal relevant with the utility model feature with the accompanying drawing that is hereinafter contrasted.
See also Fig. 1 and Fig. 2, be the carrying board structure cutaway view of sensor package module of the present utility model.At first, see also Fig. 1, the carrying board structure 2 of sensor package module 1 comprises: one first support plate 10 and one second support plate 20; The first support plate 10 has a lower surface 103 that a upper surface 101 reaches with respect to upper surface 101, and has one first through hole 12 and one second through hole 14 that is through to lower surface 103 by upper surface 101 on the first support plate 10; One first sealing 121 is disposed in the first through hole 12, and one second sealing 141, is disposed in the second through hole 14.The second support plate 20, be disposed at the lower surface 103 of the first support plate 10, the second support plate 20 has a lower surface 203 that a upper surface 201 reaches with respect to upper surface 201, and has equally one the 3rd through hole 22 and one the 4th through hole 24 that is through to lower surface 203 by upper surface 201 on the second support plate 20; Wherein, the 3rd through hole 22 is disposed at the first through hole 12 relatively, and the 4th through hole 24 is disposed at the second through hole 14 relatively; Wherein the first sealing 121 and the second sealing 141 are all transparent epoxy resin.
Then, see also Fig. 2, owing to the first through hole 12 and the second through hole 14 inside filling up respectively the first sealing 121 and the second sealing 141, therefore when the second support plate 20 and the first support plate 10 in conjunction with the time, its 3rd through hole 22 and the 4th through hole 24 can form respectively groove the first groove 205 and the second groove 207 down; In the utility model, the aperture of the 3rd through hole 22 is greater than the first through hole 12, and the aperture of the 4th through hole 24 is greater than the second through hole 14, and is all rectangle, but the utility model is not limited pore size and shape; In addition, the first support plate 10 and the second support plate 20 can be formed in one.
Then, see also Fig. 3 and Fig. 4, for the optical sensing subassembly of sensor package module of the present utility model and luminescence component are combined cutaway view with carrying board structure.See also Fig. 3, sensor package module 1 includes a sensing module 3 and a light emitting module 4; Sensing module 3 comprises: a first substrate 30 has a lower surface 303 that a upper surface 301 reaches with respect to upper surface 301, and disposes a plurality of upper surfaces 301 that run through to the through hole (not being shown in figure) of lower surface 303; One optical sensing subassembly 32 is the upper surface 301 that is disposed at first substrate 30; Article two, wire 34, are connected to the through hole of first substrate 30 by optical sensing subassembly 32; Two wire pins 36 are disposed at the lower surface 303 of first substrate 30, and 36 of each wire pins are not connected with each wire 34, and wire pin 36 can be connected with external circuitry; And one the 3rd sealing 38, optical sensing subassembly 32 and two wires 34 on the upper surface 301 of coating first substrate 30.
One light emitting module 4 comprises: a second substrate 40 has a lower surface 403 that a upper surface 401 reaches with respect to upper surface 401, and disposes a plurality of upper surfaces 401 that run through to the through hole (not being shown in figure) of lower surface 403; One luminescence component 42 is disposed at the upper surface 401 of second substrate 40; Article one, wire 44, are connected to the through hole of second substrate 40 by luminescence component 42; A wire pin 46 is disposed at the lower surface 403 of second substrate 40, and is connected with wire 44, and wire pin 46 can be connected with external circuitry; And one the 4th sealing 48, luminescence component 42 and wire 44 on the upper surface 401 of coating second substrate 40; Wherein the 3rd sealing 38 and the 4th sealing 48 are all transparent epoxy resin.
The luminescence component 42 that the utility model uses is the enforcement state of infrared light light-emitting diode (IR-LED), because IR-LED is upper/lower electrode, therefore luminescence component 42 only need be connected with a wire pin 46 by a wire 44; If change luminescence component 42 into lateral electrode LED (as blue-ray LED), need configure two wires 44 and be connected to two wire pins 46, in this explanation.
Then, see also Fig. 4, when sensing module 3 and light emitting module 4 and carrying board structure 2 in conjunction with the time, sensing module 3 can be disposed in the first groove 205, its 3rd sealing 38 engages with the first sealing 121 up; And light emitting module 4 can be disposed in the second groove 207, and its 4th sealing 48 engages with the second sealing 141 up; Optical sensing subassembly 32 receives extraneous next light, that is the light receiving chip, and luminescence component 42 is LED light sources; Therefore, ambient light can enter in the optical sensing subassembly 32 of sensing module 3 via the first sealing 121, and the light of luminescence component 42 can penetrate via the second sealing 141; And for avoiding sensing module 3 and light emitting module 4 to influence each other, therefore the aperture of the first through hole 12 and the second through hole 14 needs the aperture less than the 3rd through hole 22 and the 4th through hole 24; And be placed in the first groove 205 and the second groove 207 when interior when sensing module 3 and light emitting module 4, its height is less than or equal to the height of the 3rd through hole and the 4th through hole, that is sensing module 3 and light emitting module 4 can not give prominence to the second support plate 20, makes the consistency of thickness of integral sensors package module 1.
The sensor package module 1 that the utility model proposes, by directly sensing module 3 and light emitting module 4 being placed on the carrying board structure 2 with relative groove, but direct-assembling forms a transducer, omit numerous and diverse technique, be easy to a large amount of manufacturings, but therefore Cost reduction, and shorten time of technique.
Although the utility model is described as above with aforesaid preferred embodiment; so it is not to limit the utility model; those skilled in the art are not within breaking away from spirit and scope of the present utility model; when doing a little change and retouching, the content that protection range therefore of the present utility model must be defined with the claim scope of application is as the criterion.
Claims (7)
1. a sensor package module, is characterized in that, comprises:
One first support plate has a upper surface and with respect to a lower surface of this upper surface, and has one first through hole and one second through hole that is through to this lower surface by this upper surface on this first support plate;
One first sealing is disposed in this first through hole;
One second sealing is disposed in this second through hole;
One second support plate, be disposed at this lower surface of this first support plate, this second support plate has a upper surface and with respect to a lower surface of this upper surface, and have one the 3rd through hole and one the 4th through hole that are through to this lower surface by this upper surface on this second support plate, the 3rd through hole is disposed at this first through hole relatively, and the 4th through hole is disposed at this second through hole relatively;
One sensing module comprises:
One first substrate has a upper surface and with respect to a lower surface of this upper surface, and disposes a plurality of these upper surfaces that run through to the through hole of this lower surface;
One optical sensing subassembly is disposed at this upper surface of this first substrate;
Plural wires is connected to those through holes of this first substrate by this optical sensing subassembly;
A plurality of wire pins are disposed at this lower surface of this first substrate, and are connected with those wires; And
One the 3rd sealing coats this optical sensing subassembly and those wires on this upper surface of this first substrate;
One light emitting module comprises:
One second substrate has a upper surface and with respect to a lower surface of this upper surface, and disposes a plurality of these upper surfaces that run through to the through hole of this lower surface;
One luminescence component is disposed at this upper surface of this second substrate;
At least one wire is connected to those through holes of this second substrate by this luminescence component;
At least one wire pin is disposed at this lower surface of this second substrate, and is connected with this wire; And
One the 4th sealing coats this luminescence component and this wire on this upper surface of this second substrate;
Wherein, the equal and opposite in direction of this sensing module is in the size of the 3rd through hole, and is disposed in the 3rd through hole, and the equal and opposite in direction of this light emitting module is in the size of the 4th through hole, and is disposed in the 4th through hole.
2. sensor package module according to claim 1, is characterized in that, the aperture of the 3rd through hole is greater than this first through hole, and the aperture of the 4th through hole is greater than this second through hole.
3. sensor package module according to claim 2, is characterized in that, this first through hole, this second through hole, the 3rd through hole and the 4th through hole be shaped as rectangle.
4. sensor package module according to claim 1, is characterized in that, the material of this first sealing, this second sealing, the 3rd sealing and the 4th sealing is transparent epoxy resin.
5. sensor package module according to claim 1, is characterized in that, the material of this first support plate and this second support plate is opaque epoxy resin.
6. sensor package module according to claim 1, is characterized in that, this first support plate and this second support plate are formed in one.
7. sensor package module according to claim 1, is characterized in that, this luminescence component is light-emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220638377 CN202977376U (en) | 2012-11-27 | 2012-11-27 | Sensor packaging module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220638377 CN202977376U (en) | 2012-11-27 | 2012-11-27 | Sensor packaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202977376U true CN202977376U (en) | 2013-06-05 |
Family
ID=48518419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220638377 Expired - Fee Related CN202977376U (en) | 2012-11-27 | 2012-11-27 | Sensor packaging module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202977376U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104517862A (en) * | 2013-09-29 | 2015-04-15 | 深南电路有限公司 | Fingerprint sensor encapsulation method and structure |
| CN104659041A (en) * | 2013-11-20 | 2015-05-27 | 硕达科技股份有限公司 | Packaging method of induction chip |
| CN105260043A (en) * | 2014-06-13 | 2016-01-20 | 宸鸿科技(厦门)有限公司 | Touch panel with fingerprint identification function |
| CN106971984A (en) * | 2016-11-23 | 2017-07-21 | 创智能科技股份有限公司 | Fingerprint sensing recognizes encapsulating structure |
-
2012
- 2012-11-27 CN CN 201220638377 patent/CN202977376U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104517862A (en) * | 2013-09-29 | 2015-04-15 | 深南电路有限公司 | Fingerprint sensor encapsulation method and structure |
| CN104517862B (en) * | 2013-09-29 | 2018-11-02 | 深南电路有限公司 | A kind of fingerprint sensor package method and structure |
| CN104659041A (en) * | 2013-11-20 | 2015-05-27 | 硕达科技股份有限公司 | Packaging method of induction chip |
| CN105260043A (en) * | 2014-06-13 | 2016-01-20 | 宸鸿科技(厦门)有限公司 | Touch panel with fingerprint identification function |
| CN106971984A (en) * | 2016-11-23 | 2017-07-21 | 创智能科技股份有限公司 | Fingerprint sensing recognizes encapsulating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20161127 |