CN205335256U - Integrate LED packaging structure - Google Patents
Integrate LED packaging structure Download PDFInfo
- Publication number
- CN205335256U CN205335256U CN201620059292.0U CN201620059292U CN205335256U CN 205335256 U CN205335256 U CN 205335256U CN 201620059292 U CN201620059292 U CN 201620059292U CN 205335256 U CN205335256 U CN 205335256U
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- led chip
- circuit layer
- substrate
- encapsulating structure
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Abstract
The utility model provides an integrate LED packaging structure, includes base plate, LED chip, the top surface of this base plate is equipped with the top surface circuit layer, the LED chip form to be established ties through this top surface circuit layer interconnect or parallelly connected electricity is connected, and the top surface of this base plate is provided with the recess, the LED chip sets up in this recess, and this recess intussuseption is filled with the cladding the encapsulation glue film of LED chip, the bottom surface of this base plate still is equipped with the bottom surface circuit layer, and it has the electrically conductive hole of this top surface circuit layer with this bottom surface circuit layer intercommunication to open on this base plate, and the integration is provided with control on this base plate the circuit component of LED chip, circuit component with LED chip electric connection. This integrate LED packaging structure has better integrated level, the good advantage of heat dissipation.
Description
Technical field
This utility model relates to LED encapsulation technology field, particularly to a kind of integrated LED encapsulating structure。
Background technology
LED chip and light emitting diode (LED, Lightingemitteddiode), be utilize under electric field action, the Sony ericsson mobile comm ab that PN junction is luminous。LED chip has high life, environmental protection, energy-conservation feature, is the new light sources of environmental protection, and current LED chip is to be widely used in field of LED illumination。
Always well known, LED chip needs external circuit to light driving, existing LED light device is mainly additionally arranging one drive circuit in outside, and drive circuit includes all kinds of driving element, is respectively welded in various boards by LED chip, drive circuit and other control elements, so, needing during assembling to install in LED light device by each circuit board group, assembling flow path is loaded down with trivial details, and makes LED light device monnolithic case huge, need substantial amounts of raw material, be unfavorable for automated production。If can in single lighting source, integration packaging plurality of LEDs chip, then can significantly simplify the design of whole lamp and the production process of LED light device, be substantially reduced cost。
Utility model content
The purpose of this utility model is in that to overcome the shortcoming of prior art, it is provided that a kind of integrated LED encapsulating structure with better integrated level。
The purpose of this utility model is achieved through the following technical solutions: a kind of integrated LED encapsulating structure, including substrate, LED chip, the end face of this substrate is provided with end face circuit layer, described LED chip is interconnected to form the electrical connection of serial or parallel connection by this end face circuit layer, the end face of this substrate is provided with groove, described LED chip is arranged in this groove, the encapsulation glue-line being coated with described LED chip it is filled with in this groove, the bottom surface of this substrate is additionally provided with bottom surface circuit layer, this substrate has the conductive hole connected with this bottom surface circuit layer by this end face circuit layer, integrally disposed on this substrate have the component controlling described LED chip, described component electrically connects with described LED chip。
Preferably, described conductive hole includes positive conductive hole and negative conductive hole, and this bottom surface circuit layer is provided with the positive conductive pad connecting this positive conductive hole and the negative conductive pad connecting this negative conductive hole。
Preferably, this positive conductive pad and this negative conductive pad are sheet metal structure the bottom surface thermally coupled with this substrate。
Preferably, this encapsulation glue-line is formed by transparent adhesive tape and fluorescent material mixing manufacture。
Preferably, described LED chip is flip LED chips structure。
Preferably, this substrate is made by silicon materials。
Preferably, described component is surface mount elements, and described component is arranged at the periphery of described LED chip, and described component is electrically connected with the formation of described LED chip by this end face circuit layer。
Preferably, described conductive hole is metallization plated hole or metal-filled holes。
This utility model has the advantage that
1, this utility model by by direct for component paster on this substrate and these integrated chips on same substrate, be conducive to better taking shape on this substrate by encapsulation glue-line by arranging this groove, when applying on light fixture, eliminate the special position placing component in traditional handicraft, there is good integrated level, mounting process simplifies, and production cost is greatly reduced。
2, this utility model is additionally provided with this positive conductive pad and this negative conductive pad, by this positive conductive pad and this negative conductive pad design are become the laminated structure that area is bigger, be conducive to heat that these LED chips produce to the bottom conductive of this substrate, what make even heat is distributed to the accumulation avoiding heat on this substrate, further it is connected to by this positive conductive pad and this negative conductive pad on the radiating piece of outside and dispels the heat, be conducive to extending the life-span of these LED chips。
Accompanying drawing explanation
Fig. 1 is the top-level view of this utility model integrated LED encapsulating structure first embodiment；
Fig. 2 is the bottom view of integrated LED encapsulating structure first embodiment shown in Fig. 1；
Fig. 3 is the side view of integrated LED encapsulating structure first embodiment shown in Fig. 1；
Detailed description of the invention
Below in conjunction with accompanying drawing and detailed description of the invention, the present invention is described in further detail。
Embodiment one (refer to Fig. 1 to Fig. 3):
A kind of integrated LED encapsulating structure that this utility model provides, including substrate 10, LED chip 21, the end face of this substrate 10 is provided with end face circuit layer (not shown), and these LED chips 21 are interconnected to form the electrical connection of serial or parallel connection by this end face circuit layer。In the present embodiment, these LED chips 21 are flip LED chips structure。Wherein, this end face circuit layer is printed circuit or is formed by connecting by printed circuit and gold thread。
Wherein, the end face of this substrate 10 is provided with groove 13, these LED chips 21 are arranged in this groove 13, the encapsulation glue-line 51 being coated with these LED chips 21 it is filled with in this groove 13, by arranging this groove 13 and be conducive to better being taken shape in by this encapsulation glue-line 51 on this substrate 10, covering these LED chips 21 and keep apart with following component 31, actually also can as required partial circuit element 31 be arranged in this groove 13。Wherein, this encapsulation glue-line 51 is formed by transparent adhesive tape and fluorescent material mixing manufacture。This substrate 10 is made by silicon materials。Integrally disposed on this substrate 10 have the component 31 controlling these LED chips 21, and these components 31 are arranged on this end face circuit layer。These components 31 are surface mount elements, and these components 31 are arranged at the periphery of these LED chips 21, and these components 31 are electrically connected with the formation of these LED chips 21 by this end face circuit layer。This utility model by being integrated in same substrate on these LED chips 21 by these direct pasters of component 31 on this substrate 10, when applying on light fixture, eliminate the special position placing component 31 in traditional handicraft, there is good integrated level, mounting process simplifies, and production cost is greatly reduced。
Additionally, the bottom surface of this substrate 10 is additionally provided with bottom surface circuit layer (not shown), this substrate 10 having the conductive hole connected with this bottom surface circuit layer by this end face circuit layer, these conductive holes are metallization plated hole or metal-filled holes。This bottom surface circuit layer can be printed circuit。These conductive holes include positive conductive hole 11 and negative conductive hole 12, and this bottom surface circuit layer is provided with the positive conductive pad 41 connecting this positive conductive hole 11 and the negative conductive pad 42 connecting this negative conductive hole 12。This positive conductive pad 41 and this negative conductive pad 42 are sheet metal structure the bottom surface thermally coupled with this substrate 10。This positive conductive pad 41 and this negative conductive pad 42 are designed to the laminated structure that area is bigger by the present embodiment, be conducive to heat that these LED chips produce to the bottom conductive of this substrate, what make even heat is distributed to the accumulation avoiding heat on this substrate, further it is connected to by this positive conductive pad 41 and this negative conductive pad 42 on the radiating piece of outside and dispels the heat, be conducive to extending the life-span of these LED chips 21。
The foregoing is only preferred embodiment of the present utility model; not in order to limit this utility model; all within spirit of the present utility model and principle, any amendment of making, equivalent replacements, improvement etc., should be included within the scope that this utility model is protected。
Claims (8)
1. an integrated LED encapsulating structure, including substrate, LED chip, the end face of this substrate is provided with end face circuit layer, described LED chip is interconnected to form the electrical connection of serial or parallel connection by this end face circuit layer, it is characterized in that: the end face of this substrate is provided with groove, described LED chip is arranged in this groove, the encapsulation glue-line being coated with described LED chip it is filled with in this groove, the bottom surface of this substrate is additionally provided with bottom surface circuit layer, this substrate has the conductive hole connected with this bottom surface circuit layer by this end face circuit layer, integrally disposed on this substrate have the component controlling described LED chip, described component electrically connects with described LED chip。
2. integrated LED encapsulating structure according to claim 1, it is characterized in that: described conductive hole includes positive conductive hole and negative conductive hole, this bottom surface circuit layer is provided with the positive conductive pad connecting this positive conductive hole and the negative conductive pad connecting this negative conductive hole。
3. integrated LED encapsulating structure according to claim 2, it is characterised in that: this positive conductive pad and this negative conductive pad are sheet metal structure the bottom surface thermally coupled with this substrate。
4. integrated LED encapsulating structure according to claim 1, it is characterised in that: this encapsulation glue-line is formed by transparent adhesive tape and fluorescent material mixing manufacture。
5. integrated LED encapsulating structure according to claim 4, it is characterised in that: described LED chip is flip LED chips structure。
6. integrated LED encapsulating structure according to claim 1, it is characterised in that: this substrate is made by silicon materials。
7. integrated LED encapsulating structure according to claim 1, it is characterised in that: described component is surface mount elements, and described component is arranged at the periphery of described LED chip, and described component is electrically connected with the formation of described LED chip by this end face circuit layer。
8. integrated LED encapsulating structure according to claim 1, it is characterised in that: described conductive hole is metallization plated hole or metal-filled holes。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620059292.0U CN205335256U (en) | 2016-01-21 | 2016-01-21 | Integrate LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620059292.0U CN205335256U (en) | 2016-01-21 | 2016-01-21 | Integrate LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205335256U true CN205335256U (en) | 2016-06-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620059292.0U Expired - Fee Related CN205335256U (en) | 2016-01-21 | 2016-01-21 | Integrate LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205335256U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328636A (en) * | 2016-10-12 | 2017-01-11 | 聚灿光电科技股份有限公司 | Integrated LED device and preparing method thereof |
-
2016
- 2016-01-21 CN CN201620059292.0U patent/CN205335256U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106328636A (en) * | 2016-10-12 | 2017-01-11 | 聚灿光电科技股份有限公司 | Integrated LED device and preparing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160622 Termination date: 20190121 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |