TWM539704U - Packaging structure of optical module - Google Patents

Description

Optical module packaging structure

This creation is related to the package structure, especially the package structure of an optical module.

The optical sensing module is widely used. It can be seen in both automated machinery and smart devices. For example, when a smart phone is close to the user's cheek or into the pocket, the optical sensor is installed in the smart type. The optical sensing module on the mobile phone can immediately turn off the mobile phone screen to save power or avoid the user's accidental touch. The principle is that the optical sensing module can use a light emitting chip (such as an LED chip) to emit a light source, a light source. After being reflected by an external object, it is received by the sensing chip of the optical sensing module, and then converted into an electronic signal for subsequent processing.

The conventional optical sensing module is manufactured by disposing an illuminating chip and a sensing wafer on a substrate through a wafer processing process, and then coating the luminescent wafer with the two encapsulants by Molding and the The wafer is sensed, and finally a masking layer is formed over the encapsulants by a molding process to complete the entire package structure.

Wherein, when the second molding process is performed, the stress generated on the luminescent wafer and the sensing wafer may affect the product characteristics of the wafer, resulting in a decrease in wafer stability or even a functional failure. Therefore, the conventional optical sensation The test module still has its shortcomings and needs to be improved.

Based on the above description, the main purpose of the present invention is to provide a package structure of an optical module, the package structure of the optical module can reduce the stress generated on the wafer, thereby reducing the interference of the stress on the wafer and improving the performance of the whole product. .

The package structure of the optical module comprises a substrate, a light-emitting chip, a sensing chip, two encapsulants and a shielding layer. The substrate has a bearing surface, and the light-emitting chip is set by a Die Attach Film. The sensing chip is disposed on the bearing surface and spaced apart from the light emitting chip by a die attach film, and the two encapsulants respectively cover the light emitting chip and the sensing chip. The shielding layer is disposed on the bearing surface and the two encapsulants. The shielding layer is provided with a light emitting hole and a light receiving hole respectively located above the light emitting chip and the sensing wafer.

Preferably, each of the encapsulant and the shielding layer are formed by molding.

Thereby, when the molding process is performed to form each of the encapsulant and the shielding layer, the die attach film can reduce the stress caused by the molding process on the illuminating wafer and the sensing wafer, thereby reducing the stress on the illuminating The interference between the chip and the sensing chip, so the package structure of the optical module provided by the present invention has the advantages of structural stability and better product performance.

The detailed construction and features provided by this creation will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the detailed description and the specific embodiments set forth in the present invention are only used to illustrate the present invention and are not intended to limit the scope of the patent application.

The package structure 10 of the optical module provided by the preferred embodiment of the present invention comprises a substrate 20, an illuminating wafer 30, a sensing wafer 40, two encapsulants 50, and a shielding layer 60.

In the preferred embodiment, the substrate 20 may be a bismaleimide triazine (commonly known as BT) substrate, a glass fiber substrate (commonly known as FR4) or a direct copper-clad substrate (commonly known as DBC), but is not limited thereto. Thereby, the production cost of the substrate 20 is low, and the substrate 20 has a bearing surface 22.

The illuminating wafer 30 is disposed on the carrying surface 22 by a die attach film 70a. In the preferred embodiment, the illuminating wafer 30 is an LED chip and can be used to emit a light source.

The sensing wafer 40 is disposed on the carrying surface 22 by a die attach film 70b, and the sensing wafer 40 and the light emitting wafer 30 are spaced apart from each other, wherein the sensing wafer 40 can be used to sense the emitted light emitted by the light emitting wafer 30. light source.

The two encapsulants 50 are made of a light transmissive material in the preferred embodiment, such as a transparent epoxy resin (Epoxy Resin), and the two encapsulants 50 are formed by molding and respectively coating the light emitting chip 30. And the sensing wafer 40, it is worth mentioning that each of the encapsulants 50 forms a first lens portion 52 and a second lens portion 54, a first lens portion 52 and a second portion above the light emitting chip 30 and the sensing wafer 40, respectively. The lens portion 54 is hemispherical, and the curvatures of the first and second lens portions (52, 54) can be adjusted at the time of manufacture as needed.

The shielding layer 60 is integrally formed in the preferred embodiment and is made of an opaque material, such as an epoxy resin (Epoxy Resin), and the shielding layer 60 is formed by molding and disposed on the bearing surface. Above the 22 and 2 encapsulants 50, the shielding layer 60 is provided with a light emitting aperture 62 and a light receiving aperture 64 and is respectively located above the light emitting chip 30 and the sensing wafer 40. It is worth mentioning that the first lens portion 52 and the second portion The lens portions 54 are housed in the light emitting holes 62 and the light receiving holes 64, respectively.

Next, the packaging process of the optical module provided by the present invention is introduced. In the first step A, the substrate 20 is first provided, and the light-emitting chip 30 and the sensing wafer 40 are respectively disposed on the substrate 20 by the die attach film (70a, 70b). The second step B is followed by molding the two encapsulants 50 to respectively illuminate the illuminating wafer 30 and the sensing wafer 40, and each encapsulant 50 forms a first lens portion on the luminescent wafer 30 and the sensing wafer 40, respectively. 52 and the second lens portion 54, the third step C also integrally forms the shielding layer 60 on the bearing surface 22 and the two encapsulant 50 by molding, and simultaneously forms the light emitting hole 62 and the light receiving in the shielding layer 60. The holes 64 are located above the light emitting wafer 30 and the sensing wafer 40, respectively, and the light emitting holes 62 and the light receiving holes 64 may accommodate the first lens portion 52 and the second lens portion 54, respectively.

In summary, the illuminating wafer 30 and the sensing wafer 40 are respectively disposed on the carrying surface 22 by the die attach film (70a, 70b). In the secondary molding process of performing the encapsulant 50 and the shielding layer 60, the wafer adhesive film is used. (70a, 70b) can reduce the stress generated by the molding process on the luminescent wafer 30 and the sensing wafer 40, reduce the interference of the stress on the luminescent wafer 30 and the sensing wafer 40, thereby improving the structural stability of the product and providing excellent performance.

Finally, it must be explained again that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention. The substitution or variation of other equivalent elements should also be the scope of the patent application of the present application. Covered.

10‧‧‧Package structure of optical module
20‧‧‧Substrate
30‧‧‧Lighting chip
40‧‧‧Sensor wafer
50‧‧‧Package colloid
60‧‧‧shading layer
22‧‧‧ bearing surface
70a‧‧‧ wafer adhesive film
70b‧‧‧ wafer adhesive film
52‧‧‧First lens section
54‧‧‧second lens section
62‧‧‧Light emitting aperture
64‧‧‧Light receiving hole

Figure 1 is a plan view of a preferred embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line 1-2 of Fig. 1 showing the positional relationship of the internal components of the package structure.

10‧‧‧Package structure of optical module

20‧‧‧Substrate

30‧‧‧Lighting chip

40‧‧‧Sensor wafer

50‧‧‧Package colloid

60‧‧‧shading layer

22‧‧‧ bearing surface

70a‧‧‧ wafer adhesive film

70b‧‧‧ wafer adhesive film

52‧‧‧First lens section

54‧‧‧second lens section

62‧‧‧Light emitting aperture

64‧‧‧Light receiving hole

Claims (7)

The package structure of an optical module comprises: a substrate having a bearing surface; an illuminating wafer disposed on the bearing surface by a die attach film; and a sensing wafer bonded by the wafer (Die Attach Film) is disposed on the bearing surface and spaced apart from the light emitting chip; two encapsulants respectively covering the light emitting chip and the sensing wafer; and a shielding layer disposed on the bearing surface and the two encapsulants The shielding layer is provided with a light emitting hole and a light receiving hole and is respectively located above the light emitting chip and the sensing wafer. The package structure of the optical module according to claim 1, wherein each of the encapsulant and the shielding layer are formed by molding. The package structure of the optical module of claim 1, wherein each of the encapsulants forms a first and second lens portions above the illuminating wafer and the sensing wafer. The package structure of the optical module according to claim 3, wherein the first and second lens portions are hemispherical. The package structure of the optical module according to claim 3, wherein the first and second lens portions are respectively received in the light emitting hole and the light receiving hole. The package structure of the optical module according to claim 1, wherein each of the encapsulant systems is made of a light transmissive material, and the shielding layer is made of an opaque material. The package structure of the optical module according to claim 1, wherein the shielding layer is integrally formed.