CN109445179A - Light-emitting diode lamp-plate, its protection packaging method, backlight module and display device - Google Patents
Light-emitting diode lamp-plate, its protection packaging method, backlight module and display device Download PDFInfo
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- CN109445179A CN109445179A CN201811231458.2A CN201811231458A CN109445179A CN 109445179 A CN109445179 A CN 109445179A CN 201811231458 A CN201811231458 A CN 201811231458A CN 109445179 A CN109445179 A CN 109445179A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 82
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000003292 glue Substances 0.000 claims abstract description 46
- 239000011241 protective layer Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000006748 scratching Methods 0.000 description 3
- 230000002393 scratching effect Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 208000007578 phototoxic dermatitis Diseases 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a kind of light-emitting diode lamp-plates, its protection packaging method, backlight module and display device; the light-emitting diode lamp-plate; it include: bottom plate, multiple light-emitting diode chip for backlight unit on bottom plate, protection structure corresponding with each light-emitting diode chip for backlight unit；Protection structure is made of protection packaging glue；It protects structure to cover corresponding light-emitting diode chip for backlight unit, and there is gap between adjacent protection structure；Light-emitting diode chip for backlight unit is mini light-emitting diode chip for backlight unit or micro-led chip.In light-emitting diode lamp-plate provided in an embodiment of the present invention; by the way that protection structure corresponding with each light-emitting diode chip for backlight unit is arranged; the protection structure can cover corresponding light-emitting diode chip for backlight unit; to play the role of protecting light-emitting diode chip for backlight unit; furthermore; there is gap between adjacent protection structure, the usage amount to form the protection packaging glue of protection structure can be reduced, and be easier to form multiple protection structures in homogeneous thickness.
Description
Technical field
The present invention relates to field of display technology, espespecially a kind of light-emitting diode lamp-plate, its protection packaging method, backlight module
And display device.
Background technique
With the development of light emitting diode (Light Emitting Diode, LED), mini LED and miniature LED (Mini-
LEDµ-LED) due to cost, the factors such as display effect become the main composition of next-generation display technology, and major technique is
Micron order chip is encapsulated into (Chip on Board, COB) technology using chip on board, no encapsulation is fixed on printed circuit board
On (Printed Circuit Board, PCB), reduce bracket, the use of the materials such as gold thread simplifies process route, reduces
Cost, while the diminution of size, make it possible highdensity arrangement, and then reach the resolution ratio of display level.
But since the LED chip on chip is directly exposed, and pad size is small, and the push-pull effort that can be born is minimum, therefore in mesh
It needs to be protected using protection packaging glue under preceding technical conditions, in case LED chip is peeled off.The prior art mainly adopts encapsulatings
Mode carries out protection encapsulation, and whole face coats protection packaging glue, after carrying out baking-curing, certain thickness protective layer is formed, due to only
Encapsulating mouth can be set in specific position, the protective layer of the position close apart from encapsulating mouth is thicker, the position remote apart from encapsulating mouth
Protective layer is relatively thin, and the uniformity of the thickness of the protective layer because obtained from is easy to appear deviation, and more wastes colloid.
Summary of the invention
The embodiment of the invention provides a kind of light-emitting diode lamp-plate, its protection packaging method, backlight module and display dresses
It sets, to solve the problems, such as the uniformity difference and waste colloid of the protective layer of LED chip existing in the prior art.
In a first aspect, the embodiment of the invention provides a kind of light-emitting diode lamp-plates, comprising: bottom plate is located at the bottom plate
On multiple light-emitting diode chip for backlight unit, protection structure corresponding with each light-emitting diode chip for backlight unit；
The protection structure is made of protection packaging glue；The protection structure covers the corresponding light-emitting diodes tube core
Piece, and there is gap between the adjacent protection structure；
The light-emitting diode chip for backlight unit is mini light-emitting diode chip for backlight unit or micro-led chip.
In one possible implementation, it in above-mentioned light-emitting diode lamp-plate provided in an embodiment of the present invention, is hanging down
Directly on the direction of bottom plate, the protection structure first reduces the change increased afterwards in the perimeter presence for being parallel to the section of the bottom plate
Change trend.
In one possible implementation, in above-mentioned light-emitting diode lamp-plate provided in an embodiment of the present invention, bottom plate
On multiple light-emitting diode chip for backlight unit be uniformly distributed.
Second aspect, the embodiment of the invention provides a kind of protection packaging methods of light-emitting diode lamp-plate, comprising:
There is provided a surface be equipped with multiple light-emitting diode chip for backlight unit bottom plate, and provide one have it is multiple with it is described shine two
The halftone of the one-to-one through-hole of pole pipe chip；
The halftone is placed in the bottom plate to be equipped on the surface of the light-emitting diode chip for backlight unit side, and in the net
Version scratches protection packaging glue away from the surface of the bottom plate side, so that the protection packaging glue after each through-hole by forming
Cover the protection structure of the corresponding light-emitting diode chip for backlight unit；
Remove the halftone；
Wherein, the light-emitting diode chip for backlight unit is mini light-emitting diode chip for backlight unit or micro-led chip.
In one possible implementation, described to mention in above-mentioned protection packaging method provided in an embodiment of the present invention
For one with multiple halftones with the one-to-one through-hole of the light-emitting diode chip for backlight unit, comprising:
One halftone with multiple through-holes is provided；Multiple through-holes and each light-emitting diode chip for backlight unit correspond,
And the size of the through-hole is greater than the size of the corresponding light-emitting diode chip for backlight unit.
In one possible implementation, in above-mentioned protection packaging method provided in an embodiment of the present invention, described
After removing the halftone, further includes:
It is each it is described protection it is Structured cured during, each protection structure is patterned using mold, so that respectively
The protection structure exists after first reducing in the perimeter in the section for being parallel to the bottom plate on the direction perpendicular to the bottom plate
The variation tendency of increase.
In one possible implementation, in above-mentioned protection packaging method provided in an embodiment of the present invention, the mould
Having the surface towards the bottom plate side has and the one-to-one groove of the protection structure；
On the direction on the surface perpendicular to the mold, section of the groove on the direction for being parallel to the mold
Perimeter have first reduce the variation tendency increased afterwards.
In one possible implementation, described to adopt in above-mentioned protection packaging method provided in an embodiment of the present invention
Each protection structure is patterned with mold, comprising:
In such a way that the groove on the mold is towards the protection structure, and by the groove on the mold
After being aligned with the protection structure, the mold is pressed on the protection structure；
After each protection is Structured cured, the mold is demoulded.
The third aspect, the embodiment of the invention provides a kind of light-emitting diode lamp-plate, the Light-Emitting Diode lamp plate is above-mentioned
Protection packaging method is prepared.
Fourth aspect, the embodiment of the invention provides a kind of backlight modules, comprising: above-mentioned light-emitting diode lamp-plate.
5th aspect, the embodiment of the invention provides a kind of display devices, comprising: above-mentioned backlight module.
The present invention has the beneficial effect that:
Light-emitting diode lamp-plate provided in an embodiment of the present invention, its protect packaging method, backlight module and display device, should
Light-emitting diode lamp-plate, comprising: bottom plate, multiple light-emitting diode chip for backlight unit on bottom plate, with each light-emitting diode chip for backlight unit
Corresponding protection structure；Protection structure is made of protection packaging glue；Structure is protected to cover corresponding light-emitting diode chip for backlight unit, and phase
There is gap between adjacent protection structure；Light-emitting diode chip for backlight unit is mini light-emitting diode chip for backlight unit or micro-led core
Piece.In light-emitting diode lamp-plate provided in an embodiment of the present invention, tied by the way that protection corresponding with each light-emitting diode chip for backlight unit is arranged
Structure, the protection structure can cover corresponding light-emitting diode chip for backlight unit, thus play the role of protecting light-emitting diode chip for backlight unit, this
Outside, there is gap between adjacent protection structure, the usage amount to form the protection packaging glue of protection structure can be reduced, and compare
It is relatively easy to form multiple protection structures in homogeneous thickness.
Detailed description of the invention
Fig. 1 is one of the structural schematic diagram of light-emitting diode lamp-plate provided in an embodiment of the present invention；
Fig. 2 is the second structural representation of light-emitting diode lamp-plate provided in an embodiment of the present invention；
Fig. 3 is the light path schematic diagram of the light of two light-emitting diode chip for backlight unit outgoing adjacent in the embodiment of the present invention；
Fig. 4 is the protection packaging method flow chart of light-emitting diode lamp-plate provided in an embodiment of the present invention；
Fig. 5 to Fig. 8 is the structural schematic diagram corresponding to each step in protection packaging method provided in an embodiment of the present invention；
Wherein, 11, bottom plate；111, light-emitting diode chip for backlight unit；12, halftone；121, through-hole；13, protection packaging glue；131, it protects
Protection structure；14, mold；141, groove；15, light-emitting window.
Specific embodiment
Aiming at the problem that uniformity difference and waste colloid of the protective layer of LED chip existing in the prior art, the present invention
Embodiment provide a kind of light-emitting diode lamp-plate, its protect packaging method, backlight module and display device.
With reference to the accompanying drawing, to light-emitting diode lamp-plate provided in an embodiment of the present invention, its protection packaging method, backlight mould
The specific embodiment of group and display device is described in detail.The thickness of each film layer and shape do not reflect true ratio in attached drawing
Example, purpose is schematically illustrate the content of present invention.
In a first aspect, the embodiment of the invention provides a kind of light-emitting diode lamp-plates, comprising: bottom plate 11 is located at bottom plate 11
On multiple light-emitting diode chip for backlight unit 111, protection structure 131 corresponding with each light-emitting diode chip for backlight unit 111；
Protection structure 131 is made of protection packaging glue；Protection structure 131 covers corresponding light-emitting diode chip for backlight unit 111, and
There is gap between adjacent protection structure 131；
Light-emitting diode chip for backlight unit is mini light emitting diode (mini LED) chip or micro-led (micro
LED) chip.
In light-emitting diode lamp-plate provided in an embodiment of the present invention, by the way that guarantor corresponding with each light-emitting diode chip for backlight unit is arranged
Protection structure, the protection structure can cover corresponding light-emitting diode chip for backlight unit, to play the work of protection light-emitting diode chip for backlight unit
With, in addition, having gap between adjacent protection structure, the usage amount to form the protection packaging glue of protection structure can be reduced,
And it is easier to form multiple protection structures in homogeneous thickness.
As shown in Figure 1, the surface of bottom plate 11 is equipped with multiple light-emitting diode chip for backlight unit 111, the light-emitting diode chip for backlight unit 111 is excellent
It is selected as mini LED chip or miniature LED chip, the size of mini LED chip is generally at 100 μm to 200 μm, micro LED core
The size of piece is generally at 100 μm or less.In addition it is also possible to be the diode chip for backlight unit of common specification, herein not to light emitting diode
The size of chip is defined.Since light-emitting diode chip for backlight unit 111 is general directly exposed, and pad size is small, and what can be born pushes away
Pulling force is minimum, each to protect by the way that protection structure 131 corresponding with each light-emitting diode chip for backlight unit 111 is arranged in the embodiment of the present invention
Structure 131 is preferably corresponded with each light-emitting diode chip for backlight unit 111, which can cover corresponding luminous two
Pole pipe chip 111 makes light-emitting diode chip for backlight unit 131 be not easy to take off so as to protect corresponding light-emitting diode chip for backlight unit 111
Fall, be also not readily susceptible to external force damage, further, since and there is gap between adjacent protection structure 131, it is, each protect
Protection structure 131 is independent from each other, and protection packaging glue is arranged compared to flood, can save protection packaging glue, reduce cost, and
And protection packaging is carried out without encapsulating mode, it is easier to obtain the uniform multiple protection structures of thickness.In addition, protection structure
131 are made of protection packaging glue, and protection packaging glue is generally transparent material, thus structure 131 is protected to will not influence light-emitting diodes
Tube chip 131 goes out optical property.
Further, in above-mentioned light-emitting diode lamp-plate provided in an embodiment of the present invention, as shown in Fig. 2, the bottom of perpendicular to
On the direction of plate 11, protection structure 131 exists in the perimeter for being parallel to the section of bottom plate 11 first reduces the variation tendency increased afterwards.
It is also understood that there is the part of the surface being recessed inwardly in protection structure 131, as shown in Fig. 2, perpendicular to bottom plate
In section on 11 direction, the edge of protection 131 two sides of structure is recessed inwardly, and is referred to as bi-concave design, due to
Protection structure 131 has a structure in which that the light that 111 side of light-emitting diode chip for backlight unit can be made to emit around is easier to send out
Raw total reflection, the light for avoiding 111 side of light-emitting diode chip for backlight unit from being emitted are injected into other regions, reduce light emitting diode
Light between chip 111 influences, and increases the light shot right above light-emitting diode chip for backlight unit 111.Fig. 3 is adjacent two
The index path of the emergent light of a light-emitting diode chip for backlight unit 111, from the graph, it is apparent that 111 side of light-emitting diode chip for backlight unit
When the light of outgoing is transmitted to the edge of protection structure 131, total reflection occurs in the edge of protection structure 131, and directive is protected again
Inside protection structure 131, after multiple total reflection, it is emitted right above light-emitting diode chip for backlight unit 111, improves light emitting diode
The convergence degree of 111 emergent light of chip, from figure 3, it can be seen that between the light that two neighboring light-emitting diode chip for backlight unit 111 is emitted
There is no interfere with each other.The upper surface of protection structure 131 plays the role of light-emitting window, in the specific implementation, protects structure 131
It can be flat surface at light-emitting window 15, can also outwardly protrude, herein without limitation.
In addition, in the specific implementation, on the direction perpendicular to bottom plate 11, protection structure 131 is being parallel to referring to Fig. 2
The perimeter in the section of bottom plate 11 there may also be multiple variation tendencies for first reducing and increasing afterwards, for example, the perimeter can in reduce,
Increase, reduce the variation tendency increased again, herein without limitation.
In the specific implementation, multiple luminous on bottom plate in above-mentioned light-emitting diode lamp-plate provided in an embodiment of the present invention
Diode chip for backlight unit is uniformly distributed.So as to so that light-emitting diode lamp-plate outgoing light uniformity it is preferable, it is aobvious being applied to
When in showing device, preferable display effect can be reached.
Second aspect, based on the same inventive concept, the embodiment of the invention provides a kind of protection of light-emitting diode lamp-plate
Packaging method, above-mentioned light-emitting diode lamp-plate can be packaged using the protection packaging method.Due to the protection packaging method
The principle solved the problems, such as is similar to above-mentioned light-emitting diode lamp-plate, therefore the implementation of the protection packaging method may refer to above-mentioned hair
The implementation of optical diode lamp plate, overlaps will not be repeated.
A kind of protection packaging method of light-emitting diode lamp-plate provided in an embodiment of the present invention, as shown in Figure 4, comprising:
S201, referring concurrently to Fig. 5, provide the bottom plate 11 that a surface is equipped with multiple light-emitting diode chip for backlight unit 111, and provide
One with multiple halftones 12 with the one-to-one through-hole 121 of light-emitting diode chip for backlight unit 111；
S202, referring concurrently to Fig. 6, by halftone 12 be placed in surface of the bottom plate 11 equipped with 111 side of light-emitting diode chip for backlight unit it
On, as shown in fig. 7, and halftone 12 away from 11 side of bottom plate surface scratch protection packaging glue 13 so that protection packaging glue 13
The protection structure 131 of corresponding light-emitting diode chip for backlight unit 111 is covered by being formed after each through-hole 121；
S203, halftone is removed, obtains structure as shown in Figure 1；
Wherein, light-emitting diode chip for backlight unit is mini light emitting diode (mini LED) chip or micro-led
(micro LED) chip.
Protection packaging method provided in an embodiment of the present invention, by using the mode shape for scratching protection packaging glue on halftone
Each protection knot that at the protection structure for covering each light-emitting diode chip for backlight unit, the usage amount of protection packaging glue can be reduced, and formed
The thickness of structure is more uniform.
As shown in figure 5, the surface of bottom plate 11 is equipped with multiple light-emitting diode chip for backlight unit 111, the light-emitting diode chip for backlight unit 111 is excellent
It is selected as mini LED chip or miniature LED chip, in addition it is also possible to be the diode chip for backlight unit of common specification, herein not to luminous two
The size of pole pipe chip is defined.There are multiple through-holes 121, multiple through-holes 121 and multiple light-emitting diodes tube cores on halftone 12
Piece 111 corresponds, and corresponds that can be understood as through-hole 121 corresponding with the position of light-emitting diode chip for backlight unit 111 herein,
Be exactly the through-hole 121 on halftone 12 arrangement mode it is consistent with the arrangement mode of light-emitting diode chip for backlight unit 111 on bottom plate 11, and
The spacing of adjacent through-hole 121 is suitable with light-emitting diode chip for backlight unit 111, to guarantee the subsequent protection envelope scratched on halftone
Dress glue can be flowed at the position of corresponding light-emitting diode chip for backlight unit by through-hole, to form corresponding protection structure.Specific
When implementation, above-mentioned halftone is preferably steel mesh, by using the halftone of the available thinner thickness of steel mesh, so as to accurately control
Through-hole leaks through the amount of protection packaging glue, to have the function that accurately to control protection structure, furthermore can also use other materials system
Make halftone, herein without limitation.
Illustrated so that the shape of each through-hole 121 on halftone 12 is circle as an example in Fig. 5, in the specific implementation, through-hole
It may be other shapes, such as rectangular, oval or polygon etc., the shape of through-hole be not defined herein, in order to make
The light that light-emitting diode chip for backlight unit is emitted to all directions is relatively uniform, preferably by through-hole 121 be provided in round or ellipse
Etc. shapes.
In above-mentioned steps S202, as shown in fig. 6, halftone 12 is placed in bottom plate 11 with 111 side of light-emitting diode chip for backlight unit
Surface on, can determine the distance between halftone 12 and bottom plate 11, according to the actual situation to guarantee subsequent protection packaging glue
It can be stable by covering corresponding light-emitting diode chip for backlight unit 111 after through-hole.As shown in fig. 7, deviating from bottom plate 11 in halftone 12
The surface of side scratches protection packaging glue 13, can be by the surface of doctor blade protection packaging glue 13, due to protection packaging glue
13 have mobility, thus protection packaging glue 13 can flow to the surface of corresponding light-emitting diode chip for backlight unit 111 by through-hole 121
On, in step S203, after halftone 12 is removed, as shown in Figure 1, protection packaging glue on light-emitting diode chip for backlight unit 111 due to
Surface tension forms hemispherical or approximate hemispherical protection structure 131, it is, protecting on the direction in figure from bottom to top
Perimeter of the protection structure 131 in the section for being parallel to bottom plate 11 is gradually reduced.In the specific implementation, can by the thickness of halftone,
The parameters such as the time of the size of through-hole, the distance between halftone and lamp plate, and blade coating protection packaging glue, to adjust protection structure
Thickness, surface radian etc..
To sum up, in the embodiment of the present invention, to light-emitting diode chip for backlight unit by the way of scratching protection packaging glue on halftone
Protection encapsulation is carried out, the protection packaging glue through the through-hole on halftone is made to form protection knot at corresponding light-emitting diode chip for backlight unit
Structure, each thickness for protecting structure is relatively uniform, and compared to the whole face coating protection packaging glue by the way of encapsulating, can be very big
Degree reduction protection packaging glue usage amount, and stay in the protection packaging glue on halftone surface can with recycling and reusing,
The utilization rate for improving protection packaging glue, reduces costs.
Further, in above-mentioned protection packaging method provided in an embodiment of the present invention, in above-mentioned steps S201, a tool is provided
There is the multiple and one-to-one through-hole of light-emitting diode chip for backlight unit halftone, may include:
One halftone with multiple through-holes is provided；Multiple through-holes and each light-emitting diode chip for backlight unit correspond, and through-hole
Size is greater than the size of corresponding light-emitting diode chip for backlight unit.
Referring to Fig. 6, the halftone 12 of the size of corresponding light-emitting diode chip for backlight unit 111 is greater than using 121 size of through-hole, thus
Make it is subsequent on halftone scratch protection packaging glue after, can there is enough protection packaging glue to drain to light-emitting diode chip for backlight unit 111
Surface, to form the protection structure for covering entire light-emitting diode chip for backlight unit 111, in addition, the size of through-hole 121 can not mistake
Greatly, to guarantee to be independent from each other between the protection structure formed, that is, guarantee that adjacent protecting is not overlapped between structure.?
When it is implemented, can according to by it is to be formed protection structure size, the thickness of halftone, the size of through-hole, halftone is arranged
The distance between lamp plate, and the parameters such as time of blade coating protection packaging glue.
Further, in above-mentioned protection packaging method provided in an embodiment of the present invention, as shown in figure 4, above-mentioned steps S203
Later, can also include:
S204, referring concurrently to Fig. 8, in each 131 solidification process of protection structure, using mold 14 to each protection structure 131
It is patterned, so as to respectively protect structure 131 in the perimeter in the section for being parallel to bottom plate 11, on the direction perpendicular to bottom plate 11
In the presence of the variation tendency increased afterwards is first reduced, as shown in Figure 2.
Since protection packaging glue has mobility, thus the protection structure 131 that protection packaging glue is formed also just has certain journey
The mobility of degree, thus in the solidification process of protection structure 131, figure can be carried out using 14 pairs of protection structures 131 of mold
Change, to obtain structure shown in Fig. 2, in the specific implementation, after halftone 12 is removed, in order to improve the solidification speed of protection structure
Degree, can be solidified by the way of heat cure.As shown in Fig. 2, protecting structure 131 on the direction perpendicular to bottom plate 11
Exist in the perimeter for being parallel to the section of bottom plate 11 and first reduce the variation tendency increased afterwards, it is understood that is to protect structure 131
In the presence of the part of the surface being recessed inwardly, in the section on the direction perpendicular to bottom plate 11, protect the edge of 131 two sides of structure equal
It is recessed inwardly, is referred to as bi-concave design, since protection structure 131 has a structure in which, light emitting diode can be made
The light that 111 side of chip emits around is easier to be totally reflected, the light for avoiding 111 side of light-emitting diode chip for backlight unit from being emitted
Line is injected into other regions, and the light reduced between light-emitting diode chip for backlight unit 111 influences, and increases light-emitting diode chip for backlight unit
Light shot right above 111, optimize light-emitting diode chip for backlight unit emergent ray holds back photosensitiveness, improves asking for light interference
Topic.Fig. 3 is the index path of the emergent light of two adjacent light-emitting diode chip for backlight unit 111, from the graph, it is apparent that luminous two
When the light of 111 side of pole pipe chip outgoing is transmitted to the edge of protection structure 131, sent out in the edge of protection structure 131
Raw total reflection inside directive protection structure 131, after multiple total reflection, is emitted right above light-emitting diode chip for backlight unit 111 again,
The convergence degree of 111 emergent light of light-emitting diode chip for backlight unit is improved, from figure 3, it can be seen that two neighboring light-emitting diode chip for backlight unit
There is no interfere with each other between the light of 111 outgoing.The upper surface of protection structure 131 plays the role of light-emitting window, specific
When implementation, protecting structure 131 can be flat surface at light-emitting window 15, can also outwardly protrude, herein without limitation.
In the specific implementation, on the direction perpendicular to bottom plate 11, protection structure 131 is being parallel to the section of bottom plate 11
There may also be multiple variation tendencies for first reducing and increasing afterwards for perimeter, for example, the perimeter can increase again in reduction, increase, reduction
Big variation tendency, herein without limitation.
Specifically, in above-mentioned protection packaging method provided in an embodiment of the present invention, as shown in figure 8, mold 14 is towards bottom plate
The surface of 11 sides has and the protection one-to-one groove 141 of structure 131；
On the direction on the surface perpendicular to mold 14, the week in section of the groove 141 on the direction for being parallel to mold 14
Length, which has, first reduces the variation tendency increased afterwards.
As shown in figure 8, the groove 141 and each protection structure 131 on 14 surface of mold correspond, corresponding herein can
Be interpreted as groove 141 with protection the position of structure 131 it is corresponding, that is, the groove 141 on mold 14 arrangement mode with
Protect the arrangement mode of structure 131 consistent, and the capacity in groove 141 is suitable with the protection volume of structure 131, so that protection is tied
Structure 131 can substantially fill up groove 141 and without too many remaining protection structure 131, thus the protection structure after making graphically
131 have the part of the surface being recessed inwardly, and adjacent protection structure 131 is mutually indepedent.
On the direction on the surface perpendicular to mold 14, the week in section of the groove 141 on the direction for being parallel to mold 14
It is long have first reduces the variation tendency increased afterwards, that is to say, that the shape of groove 141 with by it is to be formed graphically after protection
The shape of structure 131 is consistent, to guarantee the available protection structure 131 with shape as shown in Figure 2 after graphical.?
When it is implemented, on the direction perpendicular to mold 14, groove 141 the perimeter for being parallel to the section of mold 14 there may also be
It is multiple first to reduce the variation tendency increased afterwards, for example, the variation tendency that the perimeter can increase again in reduction, increase, reduction, this
Place is without limitation.
In the specific implementation, it in above-mentioned protection packaging method provided in an embodiment of the present invention, in above-mentioned steps S204, uses
Mold is patterned each protection structure, comprising:
Referring to Fig. 8, in such a way that the groove 141 on mold 14 is towards protection structure 131, and by the groove on mold 14
After 141 are aligned with protection structure 131, mold 14 is pressed on protection structure 131；
After structure 131 to be protected solidifies, mold 14 is demoulded.
Since the groove 141 on mold 14 is used to be patterned protection structure 131, thus mold 14 is being pressed in guarantor
Before on protection structure 131, need to align each groove structure 341 on mold 14 with each protection structure 131, after contraposition
Mold 14 is pressed on protection structure 131, mold 14 can be pressed in each protection structure 131 by way of applying external force F
On, heavier mold 14 itself can also be used, is pressed on each protection structure 131 by the self weight F of mold 14.Specific
When implementation, in order to improve the curing rate of protection structure, it can be solidified by the way of heat cure after halftone 12 is removed,
Thus during patterned, protection 131 expanded by heating of structure is easier to fill up entire groove 14, optimization protection structure 131
Molding effect.
Later, after the solidification of each protection structure 131, then mold 14 demoulded, to guarantee that protection structure 131 can be at
Type, it is small-sized due to light-emitting diode chip for backlight unit 111, thus the size of corresponding each protection structure 131 also very little, Er Qiebao
Protection structure 131 is to be made of the protection packaging glue with mobility, thus structure 131 is protected to have certain flexibility, can
It is relatively easy to and mold separation, to realize demoulding.
The third aspect, based on the same inventive concept, the embodiment of the invention provides a kind of light-emitting diode lamp-plates, this shines
Diode lamp plate is prepared by above-mentioned protection packaging method.The principle solved the problems, such as due to the light-emitting diode lamp-plate with it is above-mentioned
Protect packaging method similar, therefore the implementation of the light-emitting diode lamp-plate may refer to the implementation of above-mentioned protection packaging method, weight
Multiple place repeats no more.
Fourth aspect the embodiment of the invention provides a kind of backlight module, including above-mentioned shines based on the same inventive concept
Diode lamp plate.Since the principle that the backlight module solves the problems, such as is similar to above-mentioned light-emitting diode lamp-plate, the backlight mould
The implementation of group may refer to the implementation of above-mentioned light-emitting diode lamp-plate, and overlaps will not be repeated.Specifically, above-mentioned backlight module
It can be straight-down negative, or side entering type, herein without limitation.Since above-mentioned light-emitting diode lamp-plate is using mutually independent
Protection structure carries out protection encapsulation to light-emitting diode chip for backlight unit, is more advantageous to light-emitting diode chip for backlight unit and realizes highdensity arrangement side
Formula, and then reach the resolution ratio of display level, it is advantageously implemented backlight subarea control.
5th aspect, based on the same inventive concept, the embodiment of the present invention provides a kind of display device, including above-mentioned backlight mould
Group.The display device is preferably liquid crystal display device.The principle and above-mentioned backlight module phase solved the problems, such as due to the display device
Seemingly, therefore the implementation of the display device may refer to the implementation of above-mentioned backlight module, and overlaps will not be repeated.
Light-emitting diode lamp-plate, protection packaging method, backlight module and display device provided in an embodiment of the present invention, pass through
Protection structure corresponding with each light-emitting diode chip for backlight unit is set, which can cover corresponding light-emitting diode chip for backlight unit,
To play the role of protecting light-emitting diode chip for backlight unit, in addition, having gap between adjacent protection structure, can reduce to be formed
The usage amount of the protection packaging glue of structure is protected, covering can be formed by using the mode for scratching protection packaging glue on halftone
Each protection structure, can be relatively easy to form multiple protection structures in homogeneous thickness.In addition, being tied by using mold to protection
The problem of structure is patterned, and can hold back photosensitiveness with optimized emission diode chip for backlight unit emergent ray, improves light interference.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of light-emitting diode lamp-plate characterized by comprising bottom plate, multiple light-emitting diodes on the bottom plate
Tube chip, protection structure corresponding with each light-emitting diode chip for backlight unit；
The protection structure is made of protection packaging glue；The protection structure covers the corresponding light-emitting diode chip for backlight unit, and
There is gap between the adjacent protection structure；
The light-emitting diode chip for backlight unit is mini light-emitting diode chip for backlight unit or micro-led chip.
2. light-emitting diode lamp-plate as described in claim 1, which is characterized in that on the direction perpendicular to bottom plate, the guarantor
Protection structure exists in the perimeter for being parallel to the section of the bottom plate first reduces the variation tendency increased afterwards.
3. a kind of protection packaging method of light-emitting diode lamp-plate characterized by comprising
The bottom plate that a surface is equipped with multiple light-emitting diode chip for backlight unit is provided, and provide one there is the multiple and light emitting diode
The halftone of the one-to-one through-hole of chip；
The halftone is placed in the bottom plate to be equipped on the surface of the light-emitting diode chip for backlight unit side, and is carried on the back in the halftone
Surface from the bottom plate side scratches protection packaging glue, so that the protection packaging glue is by forming covering after each through-hole
The protection structure of the corresponding light-emitting diode chip for backlight unit；
Remove the halftone；
Wherein, the light-emitting diode chip for backlight unit is mini light-emitting diode chip for backlight unit or micro-led chip.
4. as claimed in claim 3 protection packaging method, which is characterized in that it is described provide one have it is multiple with it is described shine two
The halftone of the one-to-one through-hole of pole pipe chip, comprising:
One halftone with multiple through-holes is provided；Multiple through-holes and each light-emitting diode chip for backlight unit correspond, and institute
The size for stating through-hole is greater than the size of the corresponding light-emitting diode chip for backlight unit.
5. protection packaging method as claimed in claim 3, which is characterized in that it is described remove the halftone after, further includes:
It is each it is described protection it is Structured cured during, each protection structure is patterned using mold so that it is each described in
It protects structure in the perimeter in the section for being parallel to the bottom plate, exists on the direction perpendicular to the bottom plate and first reduce and increase afterwards
Variation tendency.
6. protection packaging method as claimed in claim 5, which is characterized in that surface of the mold towards the bottom plate side
With with the one-to-one groove of the protection structure；
On the direction on the surface perpendicular to the mold, the week in section of the groove on the direction for being parallel to the mold
Length, which has, first reduces the variation tendency increased afterwards.
7. as claimed in claim 6 protection packaging method, which is characterized in that it is described using mold to each protection structure into
Row is graphical, comprising:
In such a way that the groove on the mold is towards the protection structure, and by the mold the groove and institute
It states after protecting structure to be aligned, the mold is pressed on the protection structure；
After the protection is Structured cured, the mold is demoulded.
8. a kind of light-emitting diode lamp-plate, which is characterized in that the Light-Emitting Diode lamp plate is as described in claim any one of 3-7
Protection packaging method be prepared.
9. a kind of backlight module characterized by comprising such as the described in any item light-emitting diode lamp-plates of claim 1~2.
10. a kind of display device characterized by comprising backlight module as claimed in claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811231458.2A CN109445179A (en) | 2018-10-22 | 2018-10-22 | Light-emitting diode lamp-plate, its protection packaging method, backlight module and display device |
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| CN201811231458.2A CN109445179A (en) | 2018-10-22 | 2018-10-22 | Light-emitting diode lamp-plate, its protection packaging method, backlight module and display device |
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| CN110570753A (en) * | 2019-09-17 | 2019-12-13 | 京东方科技集团股份有限公司 | Display device and assembling method thereof |
| CN111722432A (en) * | 2019-03-20 | 2020-09-29 | 海信视像科技股份有限公司 | LED lamp panel, preparation method, backlight module and display device |
| CN111933777A (en) * | 2020-08-12 | 2020-11-13 | 广州市鸿利显示电子有限公司 | Dot type glue sealing method for Mini LED and LED chip |
| CN112164323A (en) * | 2020-08-28 | 2021-01-01 | 福州大学 | Mu LED backlight source for mixing light by utilizing double-concave diffusion unit structure and manufacturing method thereof |
| CN112382206A (en) * | 2020-11-13 | 2021-02-19 | Tcl华星光电技术有限公司 | Back plate and LED panel |
| CN112992958A (en) * | 2020-07-21 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | LED display unit, LED display screen and manufacturing method thereof |
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