CN206921858U - Light-emitting device - Google Patents
Light-emitting device Download PDFInfo
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- CN206921858U CN206921858U CN201720426448.9U CN201720426448U CN206921858U CN 206921858 U CN206921858 U CN 206921858U CN 201720426448 U CN201720426448 U CN 201720426448U CN 206921858 U CN206921858 U CN 206921858U
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- light
- emitting device
- lens
- packaging plastic
- chip
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Abstract
Light-emitting device is the utility model is related to, discloses a kind of light-emitting device.In the light-emitting device of the application, by setting the lens with micro-structural on packaging plastic surface, thus it is possible to vary the light of chip emission reaches the incidence angle of outgoing interface so that incidence angle is less than the critical angle for causing total reflection, so as to reach the purpose of increase light emission rate.In addition, the refractive index of lens is equal to or more than the refractive index of packaging plastic, so that nearly all light into packaging plastic can pass through the interface of packaging plastic and lens and reach outgoing interface.
Description
Technical field
It the utility model is related to light-emitting device, the more particularly to light-emitting device with Lenticular lens.
Background technology
In the light-emitting device that LED (Light Emitting Diode, light emitting diode) is formed, the light extraction of chip is improved
Rate is always the target that those skilled in the art constantly pursue.
The content of the invention
The purpose of this utility model is to provide a kind of light-emitting device, can reach the purpose of increase light emission rate.
In order to solve the above technical problems, embodiment of the present utility model discloses a kind of light-emitting device, light-emitting device bag
Include chip, substrate, packaging plastic and lens；
Chip is placed in the surface of substrate, packaging plastic covering chip；
Lens are placed in packaging plastic surface and have micro-structural, and the radian of micro-structural causes light to reach the incidence angle of outgoing interface
Less than the critical angle for causing total reflection.
Compared with prior art, the main distinction and its effect are the utility model embodiment：
In the light-emitting device of the application, by setting the lens with micro-structural on packaging plastic surface, thus it is possible to vary core
The light of piece transmitting reaches the incidence angle of outgoing interface so that incidence angle is less than the critical angle for causing total reflection, so as to reach increase
The purpose of light emission rate.
Further, the refractive index of lens is equal to or more than the refractive index of packaging plastic, can cause nearly all into envelope
The interface of packaging plastic and lens can be passed through and reach outgoing interface by filling the light of glue.
Further, it is unified in packaging plastic surface and forms the lens with micro-structural, compared to independent chip or independent SMD device
Part adds the production technology of lens simpler, efficient.
Further, lens and packaging plastic are subjected to gapless gluing, to avoid secondary reflection.
Brief description of the drawings
Fig. 1 is a kind of structural representation of light-emitting device in the utility model first embodiment；
Fig. 2 a are light in interfacial refraction, the schematic diagram of reflection.
Fig. 2 b are light intensity schematic diagrames.
Fig. 2 c are a kind of schematic diagrames of light-emitting device light outgoing in the utility model first embodiment.
Fig. 3 is a kind of structural representation of light-emitting device in the utility model first embodiment.
Fig. 4 is a kind of structural representation of light-emitting device in the utility model first embodiment.
Fig. 5 a-5b show package level chip device.
Fig. 5 c are a kind of structural representations of light-emitting device in the utility model first embodiment.
Fig. 6 is a kind of schematic flow sheet of the manufacture method of light-emitting device in the utility model second embodiment.
Embodiment
In the following description, in order that reader more fully understands the application and proposes many ins and outs.But this
Even if the those of ordinary skill in field is appreciated that without these ins and outs and many variations based on following embodiment
And modification, each claim of the application technical scheme claimed can also be realized.
It is new to this practicality below in conjunction with accompanying drawing to make the purpose of this utility model, technical scheme and advantage clearer
The embodiment of type is described in further detail.
The utility model first embodiment is related to a kind of light-emitting device.Fig. 1 is the structural representation of the light-emitting device.Such as
Shown in Fig. 1, the light-emitting device includes chip 1, substrate 2, packaging plastic 3 and lens 4.
Chip 1 is placed in the surface of substrate 2, and packaging plastic 3 covers chip 1.
Lens 4 are placed in the surface of packaging plastic 3 and have micro-structural, and the radian of above-mentioned micro-structural causes light to reach outgoing interface
Incidence angle is less than the critical angle for causing total reflection.
Alternatively, above-mentioned micro-structural corresponds to the hemispherical dome structure of one or more chips, formed by multistage cambered surface
Number of other, non-spherical shapes, or multiple edge body structure, the hemispherical dome structure corresponding to a chip is schematically illustrated in Fig. 1.In addition, can
To understand, in addition to above-mentioned several micro-structurals, it can also use other kinds of micro-structural or micro-structural not have to pair
The part that corresponds to chip should can be arranged in one or more chips, as long as chip emission can be changed
Light reaches the incidence angle of outgoing interface so that incidence angle is less than the critical angle for causing total reflection, so as to increase light emission rate.
In the light-emitting device of present embodiment, by setting the lens with micro-structural, Ke Yigai on packaging plastic surface
The light for becoming chip emission reaches the incidence angle of outgoing interface so that incidence angle is less than the critical angle for causing total reflection, so as to reach
Increase the purpose of light emission rate.
In a preference, the refractive index of lens 4 is equal to or more than the refractive index of packaging plastic 3.In optional embodiment party
In formula, the refractive index of lens 4 can be 1.1-2.4.The refractive index of lens is equal to or more than the refractive index of packaging plastic, so as to
To enable nearly all light into packaging plastic through the interface of packaging plastic and lens and reach outgoing interface, further carry
High light emission rate.However, it is to be appreciated that even if the refractive index of lens is slightly smaller than the refractive index of packaging plastic, be still able to so that
Most of light through the interface of packaging plastic and lens and reaches outgoing interface from chip.
It is well known that when the total reflection phenomenon of light is the interface that light is transmitted into optically thinner medium from optically denser medium, it is all anti-
It is emitted back towards the phenomenon of optically denser medium.As shown in Figure 2 a, packaging plastic is optically denser medium relative to air, is obtained according to the refractive index law of light
Know that Sin θ 1/Sin θ 2=n2/n1 (1), wherein θ 1 are incidence angles, θ 2 is refraction angle, and θ 3 is angle of reflection, n1、n2It is packaging plastic respectively
With the refractive index of air.When light injects optically thinner medium by optically denser medium and refraction angle θ 2 is equal to 90 degree, formula (1) is：
Sinθ1=n2/n1, θ now1Referred to as critical angle.When incidence angle >=critical angle, incident ray is all reflected
Return in former medium, total reflection phenomenon produces.
Assuming that the refractive index of packaging plastic is 1.414, the refractive index of air is 1, when packaging plastic and Air Interface are plane,
Critical angle when then producing total reflection is equal to 45 degree.The distribution shape of LED chip emergent light, i.e. the spatial distribution of chip light intensity can
Approximation sees cosine shape, as shown in Figure 2 b, I asθThe light intensity for being θ for exit facet angle, wherein Io are perpendicular to exit facet
Light intensity and exit facet angle, θ are zero degree, are the largest light intensity perpendicular to exit facet.When packaging plastic and Air Interface are plane,
Critical angle is 45 degree, it is meant that the light intensity that 45 degree of incidence angle ＞ will all be returned in packaging plastic and can not be emitted in air, that is,
Say that the light of this part is all wasted.And this part light occupies very big ratio, theoretically calculate, than the light within 45 degree more
It is more.
If being subject to Lenticular lens on chip, as shown in Figure 2 c, by taking hemispherical micro-structural as an example, and lens are assumed
Refractive index >=packaging plastic refractive index, and be preferably used refractive index identical with packaging plastic glued glue carry out gapless glue
Close, then will not be totally reflected.Because when the refractive index of refractive index >=packaging plastic of lens in packaging plastic lens interface
The incident light in direction changes the direction of the launch, and when reaching outgoing interface (i.e. lens air interface) because having certain radian
Micro-structural and further change incidence angle so that it is significantly smaller than critical angle, avoid the generation of total reflection phenomenon, carry
The high luminous flux of outgoing.Other kinds of micro-structural, such as aspherical, multiple edge body micro-structural can equally reach identical effect
Fruit.
It is unified in packaging plastic surface and forms the lens with micro-structural, adds compared to independent chip or single SMD light sources
The production technology of mirror is simpler, efficient.Specifically：
Lens 4 can be made by carrying out photoetching to packaging plastic surface or lens 4 can be used similar to packaging plastic 3
Material is made by 3D printing or by dispensing on the surface of packaging plastic 3, realizes that gapless is binded with packaging plastic 3, wherein 3D
The refractive index of printing or point glue material is equal to or more than the refractive index of packaging plastic 3 to avoid secondary reflection.
The material of lens 4 can also be made up in advance of 3D printing, injection molding, compressing or sinter molding after again with
Packaging plastic 3 carries out gapless gluing, wherein the refractive index for carrying out the glued glue of gluing is equal to the refractive index of lens 4, to avoid two
Secondary reflection.
In each embodiment of the application, lens 4 can be organic material or inorganic material, such as silica gel, PC (poly- carbon
Acid esters), PMMA (polymethyl methacrylate), glass, crystal, ceramics etc..
Above-mentioned light-emitting device can be chip on board (COB, Chip On Board) device, surface mount (SMD,
Surface Mount Device) composition device, or wafer-level package (CSP, Chip Scale Package) device.SMD
The device of composition can be by the SMD devices for device, single SMD or the other forms that SMD arrays are formed.
When above-mentioned light-emitting device is chip on board device, as shown in figure 3, substrate 2 is light source substrate, in the surrounding of chip 1
Provided with box dam 5, packaging plastic 3 is filled in box dam 5 and covers chip 1, and being unified in the surface of packaging plastic 3 and being formed has the saturating of micro-structural
Mirror 4, each micro-structural correspond to one or more chips 1；
When above-mentioned light-emitting device is surface mount device, as shown in figure 4, substrate 2 is thermal conductivity printed substrate, often
Individual surface mount device includes chip 1, after each surface mount device (SMD) is covered by packaging plastic 3, is unified in the surface of packaging plastic 3
The lens 4 with micro-structural are formed, each micro-structural corresponds to one or more surface mount devices；
Above-mentioned light-emitting device can also be wafer-level package device, chip electrode be directly welded in PCB (Printed,
Circuit Board, printed circuit board (PCB)) (as shown in Figure 5 a) or directly it is welded on the electrode of surface mount device (such as on circuit
Shown in Fig. 5 b), the structure of light-emitting device now is similar with the COB light-emitting devices shown in Fig. 3, Fig. 4 and SMD light-emitting devices.
It is appreciated that the chip of wafer-level package is typically flip chip structure (Flip Chip).When above-mentioned light-emitting device
When being wafer-level package device, the structure of above-mentioned light-emitting device can also as shown in Figure 5 c, wherein, substrate 2 is light source substrate, core
Piece 1 is CSP flip-chips, and packaging plastic 3 covers each chip 1, is unified in each surface of packaging plastic 3 and forms the lens with micro-structural
4, each micro-structural corresponds to one or more wafer-level package devices.
Furthermore, it is to be understood that in each embodiment of the application, can also be in other kinds of light-emitting device
Lens with micro-structural are set on chip, are not limited to above-mentioned three kinds of light-emitting devices.
The utility model second embodiment is related to a kind of manufacture method of light-emitting device.Fig. 6 is the system of the light-emitting device
Make the schematic flow sheet of method.As shown in fig. 6, the manufacture method of the light-emitting device comprises the following steps：
In step 601, there is provided a substrate, and in the surface chip placement of substrate.
Then into step 602, packaging plastic is filled to cover chip.
Then into step 603, the lens with micro-structural are formed on packaging plastic surface, wherein the radian of above-mentioned micro-structural
So that the incidence angle that light reaches outgoing interface (i.e. lens air interface) is less than the critical angle for causing total reflection.Alternatively, it is above-mentioned
Micro-structural corresponds to the hemispherical dome structure of one or more chips, the number of other, non-spherical shapes formed by multistage cambered surface, or multiple edge body
Structure.Furthermore, it is to be understood that in addition to above-mentioned several micro-structurals, can also be micro- using other kinds of micro-structural or one
Structure does not have to that corresponding to one or more chips the part for corresponding to a chip can be arranged to, as long as can change
The light of chip emission reaches the incidence angle of outgoing interface so that incidence angle is less than the critical angle for causing total reflection, so as to increase
Light rate.
It is saturating with micro-structural by being formed on packaging plastic surface in the manufacture method of present embodiment light-emitting device
Mirror, thus it is possible to vary the light of chip emission reaches the incidence angle of outgoing interface so that incidence angle is less than the critical angle for quoting total reflection,
So as to reach the purpose of increase light emission rate.
In a preference, in step 603, the refractive index of lens is equal to or more than the refractive index of packaging plastic.Can
In the embodiment of choosing, the refractive index of lens can be 1.1-2.4.The refractive index of lens is equal to or more than the refraction of packaging plastic
Rate, so that nearly all light into packaging plastic can pass through the interface of packaging plastic and lens and reach departure angle
Face, further increase light emission rate.However, it is to be appreciated that even if the refractive index of lens is slightly smaller than the refractive index of packaging plastic, also
It is to enable to most of light from chip through the interface of packaging plastic and lens and reach outgoing interface.
It is unified in packaging plastic surface and forms the lens with micro-structural, adds the production technology of lens simpler compared to independent chip
It is single, efficient.Specifically：
In step 603, lens are formed by carrying out photoetching to packaging plastic surface, or by 3D printings or passed through
Lens are made on packaging plastic surface for dispensing, or will be ready-made by 3D printing, injection molding, compressing or sinter molding
Lens carry out gapless gluing with packaging plastic 3.
Lens and packaging plastic are carried out gapless gluing by glued glue, wherein the refractive index of glued glue is equal to the refraction of lens
Rate.Lens and packaging plastic are subjected to gapless gluing, to avoid secondary reflection.
Above-mentioned light-emitting device can be chip on board device, surface mount device, or wafer-level package device.In addition, can
To understand, in each embodiment of the application, can also be set on the chip in other kinds of light-emitting device has
The lens of micro-structural, it is not limited to above-mentioned three kinds of light-emitting devices.
Present embodiment is the method embodiment corresponding with first embodiment, and present embodiment can be implemented with first
Mode is worked in coordination implementation.The relevant technical details mentioned in first embodiment are still effective in the present embodiment, in order to
Reduce and repeat, repeat no more here.Correspondingly, the relevant technical details mentioned in present embodiment are also applicable in the first implementation
In mode.
It should be noted that in the claim and specification of this patent, such as first and second or the like relation
Term is used merely to make a distinction an entity or operation with another entity or operation, and not necessarily requires or imply
Any this actual relation or order be present between these entities or operation.Moreover, term " comprising ", "comprising" or its
Any other variant is intended to including for nonexcludability so that process, method, article including a series of elements or
Equipment not only includes those key elements, but also the other element including being not expressly set out, or also include for this process,
Method, article or the intrinsic key element of equipment.In the absence of more restrictions, wanted by what sentence " including one " limited
Element, it is not excluded that other identical element in the process including the key element, method, article or equipment also be present.
Although by referring to some preferred embodiments of the present utility model, the utility model has been shown and
Description, but it will be understood by those skilled in the art that can to it, various changes can be made in the form and details, without inclined
From spirit and scope of the present utility model.
Claims (10)
1. a kind of light-emitting device, it is characterised in that the light-emitting device includes chip, substrate, packaging plastic and lens；
The chip is placed in the surface of the substrate, and the packaging plastic covers the chip；
The lens are placed in the packaging plastic surface and have micro-structural, and the radian of the micro-structural causes light to reach outgoing interface
Incidence angle be less than and cause the critical angle of total reflection.
2. light-emitting device according to claim 1, it is characterised in that the micro-structural corresponds to one or more chips
Hemispherical dome structure, the number of other, non-spherical shapes that is formed by multistage cambered surface, or multiple edge body structure.
3. light-emitting device according to claim 1, it is characterised in that the refractive index of the lens is equal to or more than the envelope
Fill the refractive index of glue.
4. light-emitting device according to claim 3, it is characterised in that the refractive index of the lens is 1.1-2.4.
5. light-emitting device according to claim 1, it is characterised in that the lens to the packaging plastic surface by carrying out
Photoetching is made,
Or the lens are made by 3D printing or by dispensing on the packaging plastic surface.
6. light-emitting device according to claim 1, it is characterised in that the lens pass through 3D printing, injection molding, compacting
Shaping or sinter molding are made in advance and to carry out gapless with the packaging plastic glued, wherein, carry out the folding of the glued glue of gluing
Penetrate the refractive index that rate is equal to the lens.
7. light-emitting device according to any one of claim 1 to 6, it is characterised in that the light-emitting device is core on plate
Piece COB devices, the substrate are light source substrates；
The light-emitting device also includes box dam, is surrounded by box dam in the chip, the packaging plastic is filled in the box dam
And cover the chip.
8. light-emitting device according to any one of claim 1 to 6, it is characterised in that the light-emitting device is surface patch
The device of SMD compositions is filled, the substrate is thermal conductivity printed substrate.
9. light-emitting device according to any one of claim 1 to 6, it is characterised in that the lens are silica gel, poly- carbonic acid
Ester, polymethyl methacrylate, glass, ceramics or crystal.
10. light-emitting device according to any one of claim 1 to 6, it is characterised in that the light-emitting device is chip-scale
CSP devices are encapsulated, the substrate is light source substrate, and the chip is flip-chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720426448.9U CN206921858U (en) | 2017-04-21 | 2017-04-21 | Light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720426448.9U CN206921858U (en) | 2017-04-21 | 2017-04-21 | Light-emitting device |
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| Publication Number | Publication Date |
|---|---|
| CN206921858U true CN206921858U (en) | 2018-01-23 |
Family
ID=61307279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720426448.9U Active CN206921858U (en) | 2017-04-21 | 2017-04-21 | Light-emitting device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735881A (en) * | 2017-04-21 | 2018-11-02 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacturing method |
| CN108987554A (en) * | 2018-07-25 | 2018-12-11 | 武汉华星光电技术有限公司 | Area source and preparation method thereof, display device |
| WO2019201794A1 (en) * | 2018-04-19 | 2019-10-24 | Siteco Beleuchtungstechnik Gmbh | Led module with silicone lens in 3d printing |
-
2017
- 2017-04-21 CN CN201720426448.9U patent/CN206921858U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735881A (en) * | 2017-04-21 | 2018-11-02 | 上海威廉照明电气有限公司 | Light-emitting device and its manufacturing method |
| WO2019201794A1 (en) * | 2018-04-19 | 2019-10-24 | Siteco Beleuchtungstechnik Gmbh | Led module with silicone lens in 3d printing |
| CN108987554A (en) * | 2018-07-25 | 2018-12-11 | 武汉华星光电技术有限公司 | Area source and preparation method thereof, display device |
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