JPH0997927A - Led lamp - Google Patents
Led lampInfo
- Publication number
- JPH0997927A JPH0997927A JP7252645A JP25264595A JPH0997927A JP H0997927 A JPH0997927 A JP H0997927A JP 7252645 A JP7252645 A JP 7252645A JP 25264595 A JP25264595 A JP 25264595A JP H0997927 A JPH0997927 A JP H0997927A
- Authority
- JP
- Japan
- Prior art keywords
- led
- lead
- led lamp
- chip
- molding die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＬＥＤランプおよびＬ
ＥＤランプの製造方法に係り、特に成形用型からリード
を引き抜いて製造されるサイドビュ型のＬＥＤランプお
よびＬＥＤランプの製造方法に関する。BACKGROUND OF THE INVENTION The present invention relates to an LED lamp and an L lamp.
The present invention relates to a method for manufacturing an ED lamp, and more particularly to a side-view type LED lamp manufactured by pulling out leads from a molding die and a method for manufacturing the LED lamp.
【０００２】[0002]
【従来の技術】図４に、従来のサイドビュ型のＬＥＤラ
ンプ３０を示す。図４において、直方体状の支持体２０
の取付面２０ａにはリード２１が取り付けられており、
リード２１のＬＥＤ取付端２１ａにはＬＥＤチップ２２
が取り付けられている。ＬＥＤチップ２２の光軸２３は
取付面２０ａに垂直方向にあり、取付面２０ａ上にはＬ
ＥＤチップ２２を内蔵するように半球状の光透過性の樹
脂レンズ２４が光軸２３に対称に取り付けられている。2. Description of the Related Art FIG. 4 shows a conventional side-view type LED lamp 30. In FIG. 4, a rectangular parallelepiped support 20
The lead 21 is attached to the attachment surface 20a of
The LED chip 22 is attached to the LED mounting end 21a of the lead 21.
Is attached. The optical axis 23 of the LED chip 22 is in the direction perpendicular to the mounting surface 20a, and L is on the mounting surface 20a.
A hemispherical light-transmitting resin lens 24 is attached symmetrically to the optical axis 23 so as to incorporate the ED chip 22.
【０００３】図４においては、リード２１の方向に対し
て横方向に光が出射され、サイドビュ型のＬＥＤランプ
が示されている。FIG. 4 shows a side-view type LED lamp in which light is emitted laterally to the direction of the lead 21.
【０００４】図４に示す従来のサイドビュ型のＬＥＤラ
ンプ３０は、二分される鋳型を用い、支持体２０と樹脂
レンズ２４の対向する両側から二つの鋳型を合わせ、そ
れらの内部に樹脂を圧入し、いわゆるモールドタイプと
して製造される。The conventional side-view type LED lamp 30 shown in FIG. 4 uses a mold that is divided into two parts. The two molds are aligned from opposite sides of the support 20 and the resin lens 24, and the resin is press-fitted inside them. , Manufactured as a so-called mold type.
【０００５】また、図５に示すように、成形用型を用い
て製造される、いわゆるキャスティングタイプのＬＥＤ
ランプ４０が知られている。ＬＥＤランプ４０では、リ
ード２１のＬＥＤ取付端２１ａに取り付けられたＬＥＤ
チップ２２は円筒状の光透過性の樹脂体２５に内蔵され
ている。樹脂体２５は、製造時においてリード２１を成
形用型から引き抜くことが可能であるような外形状を有
し、具体的にはリード２１と反対方向にはより太い部分
がないような形状を有し、例えば図４に示す樹脂レンズ
２２等のような横方向に出っ張った部分がないように構
成されている。Also, as shown in FIG. 5, a so-called casting type LED manufactured by using a molding die is used.
Lamp 40 is known. In the LED lamp 40, the LED mounted on the LED mounting end 21 a of the lead 21
The chip 22 is embedded in a cylindrical light-transmitting resin body 25. The resin body 25 has an outer shape that allows the lead 21 to be pulled out from the molding die during manufacturing, and specifically has a shape that does not have a thicker portion in the direction opposite to the lead 21. However, for example, there is no laterally protruding portion such as the resin lens 22 shown in FIG.
【０００６】ＬＥＤランプ４０では樹脂体２５の先端部
には半球状のレンズ部２５ａが構成されている。ＬＥＤ
ランプ４０は、サイドビュ型と異なり、光軸２３の方向
に外部へ光が出射され、いわばトップビュウ型のＬＥＤ
ランプである。In the LED lamp 40, a hemispherical lens portion 25a is formed at the tip of the resin body 25. LED
Unlike the side-view type, the lamp 40 emits light to the outside in the direction of the optical axis 23, so to speak, a top-view type LED.
It is a lamp.
【０００７】[0007]
【発明が解決しようとする課題】従来のサイドビュ型の
ＬＥＤランプは図４に示すように、モールドタイプとし
て製造可能であるものであり、キャスティングタイプと
して成形用型を用いて製造可能なものではなかった。As shown in FIG. 4, a conventional side-view type LED lamp can be manufactured as a mold type, not as a casting type using a molding mold. It was
【０００８】モールドタイプのＬＥＤランプは、金型の
費用が高価で製造コストが高く、また細かいデザインの
変更に対応しにくいという問題があった。The mold type LED lamp has a problem that the cost of the mold is high, the manufacturing cost is high, and it is difficult to cope with a fine design change.
【０００９】また、キャスティングタイプとして成形用
型を用いて製造可能であるものは、図５に示すようにト
ップビュウ型のものしか知られていなかった。As a casting type, only a top-view type as shown in FIG. 5 can be manufactured by using a molding die.
【００１０】そこで本発明の目的は、上記従来技術の有
する問題を解消し、製造コストが安価なキャスティング
タイプで製造可能なサイドビュ型のＬＥＤランプとその
製造方法を提供することである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a side-view type LED lamp which can be manufactured by a casting type which is inexpensive in manufacturing cost, and a method for manufacturing the LED lamp, which solves the above problems of the prior art.
【００１１】[0011]
【課題を解決するための手段】上記目的の達成のため
に、本発明のＬＥＤランプは、リードと、このリードの
ＬＥＤ取付端に取り付けられたＬＥＤチップと、このＬ
ＥＤチップを内蔵するように被覆しかつ成型用型から前
記リード側に引き抜き得る外形状を有する光透過型被覆
体とからなり、前記光透過型被覆体は前記ＬＥＤチップ
の光軸に対し所定角度で削落されて形成された反射面を
有することを特徴とする。In order to achieve the above object, the LED lamp of the present invention comprises a lead, an LED chip attached to the LED mounting end of the lead, and the LED chip.
And a light-transmissive coating having an outer shape capable of being coated so as to contain an ED chip and being pulled out from the molding die to the lead side, the light-transmissive coating having a predetermined angle with respect to the optical axis of the LED chip. It is characterized by having a reflection surface formed by being scraped off.
【００１２】好適には、前記光透過型被覆体はリードの
方向に軸線を有する筒形状を有する。[0012] Preferably, the light transmissive coating has a tubular shape having an axis in the direction of the lead.
【００１３】また、好適には、前記光透過型被覆体は円
筒形状を有することを特徴とする。Further, it is preferable that the light transmissive coating has a cylindrical shape.
【００１４】また、好適には、前記反射面は前記光軸に
対し４５度の角度をなすことを特徴とする。Preferably, the reflecting surface forms an angle of 45 degrees with the optical axis.
【００１５】また、好適には、前記リードは互いに平行
な複数のリードからなり、前記反射面の法線は前記複数
のリード端子がなす平面と０度と９０度の間で設定され
た交差角度で交差していることを特徴とする。Further, preferably, the lead is composed of a plurality of leads parallel to each other, and a normal line of the reflecting surface is a crossing angle set between 0 degree and 90 degrees with a plane formed by the plurality of lead terminals. It is characterized by intersecting at.
【００１６】また、本発明のＬＥＤランプの製造方法
は、リードのＬＥＤ取付端に取り付けられたＬＥＤチッ
プを、このＬＥＤチップを内蔵するように被覆しかつ前
記リード側に引き抜き得る外形状を有する光透過型被覆
体を形成するための成形用型に収容し、前記成形用型に
樹脂を封入して熱硬化させ、前記リード側を前記成形用
型から引き抜くことを特徴とする。In the method for manufacturing an LED lamp of the present invention, the LED chip mounted on the LED mounting end of the lead is coated with the LED chip therein so that the LED chip has an external shape capable of being pulled out. It is characterized in that it is housed in a molding die for forming a transmission type covering body, resin is sealed in the molding die and thermally cured, and the lead side is pulled out from the molding die.
【００１７】[0017]
【作用】リードのＬＥＤ取付端に取り付けられたＬＥＤ
チップから出射した光は、光軸方向を主軸として光透過
型被覆体内を進行し、ＬＥＤチップの光軸に対し所定角
度で削落されて反射面で反射し、リード方向と異なる方
向に外部へ光を出射する。[Operation] LED mounted on the LED mounting end of the lead
The light emitted from the chip travels in the light-transmitting type coating body with the optical axis direction as the main axis, is cut off at a predetermined angle with respect to the optical axis of the LED chip, and is reflected by the reflecting surface to the outside in a direction different from the lead direction. Emits light.
【００１８】光透過型被覆体はリード側へ成型用型から
引き抜き得る外形状、例えば円筒形状を有するので、キ
ャスティングタイプで製造可能である。Since the light transmission type covering has an external shape that can be pulled out from the molding die to the lead side, for example, a cylindrical shape, it can be manufactured as a casting type.
【００１９】[0019]
【実施例】以下に図面を参照して本発明の実施例につい
て説明する。図１に本発明の一実施例に係るサイドビュ
型のＬＥＤランプ１５を示す。図１において、２本の平
行なリード１、１のうちの一方のリード１のＬＥＤ取付
端１ａにはＬＥＤチップ２が取り付けられている。ＬＥ
Ｄチップ２の光軸３はリード１の方向にある。ＬＥＤ取
付端１ａのＬＥＤチップ２は光透過型の樹脂体４に内蔵
されている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a side-view type LED lamp 15 according to an embodiment of the present invention. In FIG. 1, an LED chip 2 is attached to the LED attachment end 1 a of one of the two parallel leads 1, 1. LE
The optical axis 3 of the D chip 2 is in the direction of the lead 1. The LED chip 2 at the LED mounting end 1a is built in a light transmissive resin body 4.
【００２０】樹脂体４は、図示しない成型用型からリー
ド１、１側に引き抜き得る外形状である円筒形状を有
し、この円筒形状の軸線はリード１の方向と平行であ
る。樹脂体４の横方向には出っ張っているものは何も無
く、リード１、１は円筒部の内側に収まるように延びて
いる。The resin body 4 has a cylindrical shape which is an outer shape that can be pulled out from the molding die (not shown) to the leads 1 and 1, and the axis of this cylindrical shape is parallel to the direction of the lead 1. There is nothing protruding in the lateral direction of the resin body 4, and the leads 1 and 1 extend so as to fit inside the cylindrical portion.
【００２１】樹脂体４の先端部４ａには円筒部の一部を
平面で削落して形成された楕円形の反射面５が形成され
ている。反射面５は光軸３と４５度の角度で交わる平面
である。なお、反射面５と光軸３との交わる角度はＬＥ
Ｄランプ１５の用途に応じて、４５度以外の角度でもよ
い。An elliptical reflecting surface 5 formed by cutting off a part of the cylindrical portion with a flat surface is formed on the tip portion 4a of the resin body 4. The reflecting surface 5 is a plane that intersects the optical axis 3 at an angle of 45 degrees. The angle at which the reflecting surface 5 and the optical axis 3 intersect is LE.
The angle may be other than 45 degrees depending on the application of the D lamp 15.
【００２２】また、図１では、反射面は、反射面５の法
線７は２本のリード１、１のなす平面と、０度から９０
度の間で選択された交差角度で交わるように形成されて
いる。Further, in FIG. 1, the reflection surface is such that the normal line 7 of the reflection surface 5 is the plane formed by the two leads 1 and 1 and 0 to 90 degrees.
Formed to intersect at a selected intersection angle between degrees.
【００２３】なお、図２に示すＬＥＤランプ１６は、反
射面５が光軸３と４５度で交わる平面であるとともに、
反射面５の法線７と２本のリード１、１のなす平面との
交差する交差角度が４５度に選択された例である。ま
た、図３に示すＬＥＤランプ１７は、反射面５が光軸３
と４５度で交わる平面であるとともに、反射面５の法線
７と２本のリード１、１のなす平面との交差する交差角
度が０度に選択された例である。反射面５と光軸３との
交わる角度や前記交差角度は、ＬＥＤランプの使用目的
に応じて選択される。The LED lamp 16 shown in FIG. 2 is a plane in which the reflecting surface 5 intersects the optical axis 3 at 45 degrees, and
This is an example in which the intersecting angle at which the normal line 7 of the reflecting surface 5 and the plane formed by the two leads 1, 1 intersect is selected to be 45 degrees. Further, in the LED lamp 17 shown in FIG. 3, the reflecting surface 5 has the optical axis 3
In this example, the intersecting angle between the normal line 7 of the reflecting surface 5 and the plane formed by the two leads 1 and 1 is selected to be 0 degree. The angle at which the reflecting surface 5 and the optical axis 3 intersect and the intersecting angle are selected according to the purpose of use of the LED lamp.
【００２４】次に、ＬＥＤランプ１５の製造方法につい
て説明する。リード１のＬＥＤ取付端１ａに取り付けら
れたＬＥＤチップ２を成形用型に支持して収容する。こ
の成型用型は円筒形状を有し、この円筒形状の端面は円
筒軸線に対して４５度で削落され反射面５に対応する面
が形成されている。２本のリード１、１はこれらのなす
平面が、反射面５に対応する成型用型の面の法線と０度
から９０度の間で選択された交差角度で交わるように支
持されている。次に、成形用型に熱硬化型の樹脂を封入
する。加熱して樹脂を硬化させ、リード１、１をＬＥＤ
チップ２と反対側へ成形用型から引き抜き、樹脂体４と
成型用型とを分離し、ＬＥＤランプ１５が得られる。Next, a method of manufacturing the LED lamp 15 will be described. The LED chip 2 mounted on the LED mounting end 1a of the lead 1 is supported and housed in a molding die. This molding die has a cylindrical shape, and the end surface of this cylindrical shape is cut off at 45 degrees with respect to the cylinder axis to form a surface corresponding to the reflecting surface 5. The two leads 1 and 1 are supported so that the plane formed by these leads intersects with the normal line of the surface of the molding die corresponding to the reflecting surface 5 at a crossing angle selected from 0 to 90 degrees. . Next, a thermosetting resin is sealed in the molding die. Heat to cure the resin, LED leads 1 and 1
The LED body 15 is obtained by pulling out the resin body 4 and the molding die from the molding die to the side opposite to the chip 2.
【００２５】次に、本実施例の作用について説明する。
リード１のＬＥＤ取付端１ａに取り付けられたＬＥＤチ
ップ２から出射した光は、光軸３方向を主軸として樹脂
体４内を進行し、ＬＥＤチップ２の光軸３に対し４５度
で削落されて反射面５で反射し、リード１、１方向と４
５度をなす出射方向６に外部へ光が出射する。樹脂体４
の側部の円筒面が円筒レンズとして機能する。この円筒
レンズの焦点距離は樹脂体４の円筒面の曲率を選択する
ことで可能である。Next, the operation of this embodiment will be described.
The light emitted from the LED chip 2 attached to the LED attachment end 1a of the lead 1 travels in the resin body 4 with the optical axis 3 direction as the main axis, and is cut off at 45 degrees with respect to the optical axis 3 of the LED chip 2. Reflected by the reflection surface 5, and leads 1, 1 and 4
Light is emitted to the outside in the emission direction 6 forming 5 degrees. Resin body 4
The cylindrical surface on the side of the functions as a cylindrical lens. The focal length of the cylindrical lens can be selected by selecting the curvature of the cylindrical surface of the resin body 4.
【００２６】本実施例の構成によれば、樹脂体４はリー
ド１、１側へ成型用型から引き抜き得る外形状である円
筒形状を有するので、キャスティングタイプで製造可能
であるサイドビュ型のＬＥＤランプ１５等を提供するこ
とができる。According to the construction of this embodiment, the resin body 4 has a cylindrical shape which is an outer shape that can be pulled out from the molding die to the leads 1 and 1, so that a side-view type LED lamp which can be manufactured as a casting type. 15 can be provided.
【００２７】上述の実施例の説明において、光透過型被
覆体の外形状として円筒形状を例にして説明したが、光
透過型被覆体は円筒形状に限らず、成型用型からリード
側に引き抜き得る外形状であれがよく、例えば直方体の
筒体でもよい。In the description of the above-mentioned embodiments, the outer shape of the light-transmitting type covering body is described as an example, but the light-transmitting type covering body is not limited to the cylindrical shape and is pulled out from the molding die to the lead side. Any external shape may be used, and for example, a rectangular parallelepiped cylinder may be used.
【００２８】また、光透過型被覆体として樹脂体４を例
にしたが、光透過型の被覆体であれば樹脂に限る必要は
ない。Although the resin body 4 is used as an example of the light-transmitting type cover, it is not limited to the resin as long as it is a light-transmitting type cover.
【００２９】[0029]
【発明の効果】以上説明したように、本発明の構成によ
れば、光透過型被覆体をリード側へ成型用型から引き抜
き得る外形状にするとともに、ＬＥＤチップの光軸に対
し所定角度で削落されて形成された反射面を有するよう
にしたので、サイドビュ型のＬＥＤランプをキャスティ
ングタイプで製造することが可能になる。この結果、製
造コストが安価なサイドビュ型のＬＥＤランプを提供す
ることができる。As described above, according to the structure of the present invention, the light transmission type covering body is formed into an external shape which can be pulled out from the molding die to the lead side, and at a predetermined angle with respect to the optical axis of the LED chip. Since the reflective surface is formed by being scraped off, the side-view type LED lamp can be manufactured by the casting type. As a result, it is possible to provide a side-view type LED lamp whose manufacturing cost is low.
【図１】本発明のＬＥＤランプの一実施例の構成を示す
斜視図（ａ）と縦断面図（ｂ）。FIG. 1 is a perspective view (a) and a vertical sectional view (b) showing a configuration of an embodiment of an LED lamp of the present invention.
【図２】本発明の他の変形例を示す斜視図（ａ）と縦断
面図（ｂ）。FIG. 2 is a perspective view (a) and a vertical sectional view (b) showing another modification of the present invention.
【図３】本発明のさらに他の変形例を示す斜視図（ａ）
と縦断面図（ｂ）。FIG. 3 is a perspective view showing still another modified example of the present invention (a).
And a vertical sectional view (b).
【図４】従来のサイドビュウ型のＬＥＤランプの構成を
示す斜視図。FIG. 4 is a perspective view showing a configuration of a conventional side-view type LED lamp.
【図５】トップビュウ型の従来のＬＥＤランプの構成を
示す斜視図。FIG. 5 is a perspective view showing a configuration of a conventional top-view type LED lamp.
１ リード ２ ＬＥＤチップ ３ 光軸 ４ 樹脂体（光透過型被覆体） ５ 反射面 ６ 出射方向 ７ 反射面の法線 １５、１６、１７ ＬＥＤランプ 1 Lead 2 LED Chip 3 Optical Axis 4 Resin Body (Light Transmission Type Cover) 5 Reflection Surface 6 Emission Direction 7 Normal Line of Reflection Surface 15, 16, 17 LED Lamp
Claims (2)
り付けられたＬＥＤチップと、このＬＥＤチップを内蔵
するように被覆しかつ成型用型から前記リード側に引き
抜き得る外形状を有する光透過型被覆体とからなり、前
記光透過型被覆体は前記ＬＥＤチップの光軸に対し所定
角度で削落されて形成された反射面を有することを特徴
とするＬＥＤランプ。1. A light transmission type having a lead, an LED chip attached to an LED mounting end of the lead, and an outer shape that covers the LED chip so as to be built therein and can be pulled out from the molding die to the lead side. An LED lamp comprising a cover, and the light-transmissive cover having a reflection surface formed by being cut off at a predetermined angle with respect to the optical axis of the LED chip.
ＥＤチップを、このＬＥＤチップを内蔵するように被覆
しかつ前記リード側に引き抜き得る外形状を有する光透
過型被覆体を形成するための成形用型に収容し、前記成
形用型に樹脂を封入して熱硬化させ、前記リード側を前
記成形用型から引き抜くことを特徴とするＬＥＤランプ
の製造方法。2. L attached to the LED mounting end of the lead
The ED chip is housed in a molding die for covering the LED chip and forming a light-transmitting type covering body having an outer shape that can be pulled out to the lead side, and a resin is sealed in the molding die. Then, it is heat-cured, and the lead side is pulled out from the molding die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7252645A JPH0997927A (en) | 1995-09-29 | 1995-09-29 | Led lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7252645A JPH0997927A (en) | 1995-09-29 | 1995-09-29 | Led lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0997927A true JPH0997927A (en) | 1997-04-08 |
Family
ID=17240242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7252645A Pending JPH0997927A (en) | 1995-09-29 | 1995-09-29 | Led lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0997927A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006044328A1 (en) * | 2004-10-12 | 2006-04-27 | Cree, Inc. | Side-emitting optical coupling device |
| US7350930B2 (en) | 2004-11-17 | 2008-04-01 | Samsung Electronics Co., Ltd. | Illuminating unit with reflective collimator and image projection system including the same |
| US7543965B2 (en) | 2004-10-29 | 2009-06-09 | Samsung Electronic Co., Ltd | Side light-emitting device, backlight unit having the side light-emitting device, and liquid crystal display apparatus employing the backlight unit |
| JP2011183031A (en) * | 2010-03-10 | 2011-09-22 | Daito Giken:Kk | Game machine |
| US9557033B2 (en) | 2008-03-05 | 2017-01-31 | Cree, Inc. | Optical system for batwing distribution |
| CN109445179A (en) * | 2018-10-22 | 2019-03-08 | 青岛海信电器股份有限公司 | Light-emitting diode lamp-plate, its protection packaging method, backlight module and display device |
-
1995
- 1995-09-29 JP JP7252645A patent/JPH0997927A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006044328A1 (en) * | 2004-10-12 | 2006-04-27 | Cree, Inc. | Side-emitting optical coupling device |
| US8541795B2 (en) | 2004-10-12 | 2013-09-24 | Cree, Inc. | Side-emitting optical coupling device |
| US9287474B2 (en) | 2004-10-12 | 2016-03-15 | Cree, Inc. | Side-emitting optical coupling device |
| US7543965B2 (en) | 2004-10-29 | 2009-06-09 | Samsung Electronic Co., Ltd | Side light-emitting device, backlight unit having the side light-emitting device, and liquid crystal display apparatus employing the backlight unit |
| US7350930B2 (en) | 2004-11-17 | 2008-04-01 | Samsung Electronics Co., Ltd. | Illuminating unit with reflective collimator and image projection system including the same |
| US9557033B2 (en) | 2008-03-05 | 2017-01-31 | Cree, Inc. | Optical system for batwing distribution |
| JP2011183031A (en) * | 2010-03-10 | 2011-09-22 | Daito Giken:Kk | Game machine |
| CN109445179A (en) * | 2018-10-22 | 2019-03-08 | 青岛海信电器股份有限公司 | Light-emitting diode lamp-plate, its protection packaging method, backlight module and display device |
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| A02 | Decision of refusal |
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