JPH0422355B2 - - Google Patents
Info
- Publication number
- JPH0422355B2 JPH0422355B2 JP27037284A JP27037284A JPH0422355B2 JP H0422355 B2 JPH0422355 B2 JP H0422355B2 JP 27037284 A JP27037284 A JP 27037284A JP 27037284 A JP27037284 A JP 27037284A JP H0422355 B2 JPH0422355 B2 JP H0422355B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting element
- emitting diode
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 230000004907 flux Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- -1 wire bonded Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は信号灯、車輌用灯具、表示灯、光通信
装置及び各種センサ等の光源として使用される可
視光又は赤外線を放射する発光ダイオードに関す
るものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a light emitting diode that emits visible light or infrared rays and is used as a light source for signal lights, vehicle lights, indicator lights, optical communication devices, various sensors, etc. It is.
一般にこの種の光源用発光ダイオードとして
は、第５図に示した構造のものが公知である。こ
の公知の発光ダイオードにおいて、１はGaP系又
はGaAsP系の発光素子であり、該発光素子は一
方のリードフレーム２の凹部２ａ内にマウントさ
れ、他方のリードフレーム３との間においてワイ
ヤ４がボンデイングされ、これらが一体的に樹脂
モールドされると共に凸状のレンズ部５が形成さ
れたものである。このレンズ部５の前端側、即ち
光束が照射される側の端部５ａは、光線を光軸Ｘ
に沿つて略平行光線にすべく球面形状に形成され
ている。
Generally, as this type of light emitting diode for a light source, one having the structure shown in FIG. 5 is known. In this known light emitting diode, 1 is a GaP-based or GaAsP-based light emitting element, and the light emitting element is mounted in a recess 2a of one lead frame 2, and a wire 4 is bonded between it and the other lead frame 3. These are integrally molded with resin, and a convex lens portion 5 is formed. The front end side of this lens portion 5, that is, the end portion 5a on the side where the light beam is irradiated, directs the light beam to the optical axis
It is formed into a spherical shape so that the rays are approximately parallel along the rays.
このような構成の発光ダイオードにおいて、発
光素子１から放射される光線の内、球面状の端部
５ａで略平行光線になる範囲は角度θ1（約60゜）で
ある。又、リードフレーム２に設けた凹部２ａは
その内部が光沢メツキされており、発光素子１か
ら側面方向に出る光を前面側に反射させている
が、この反射光において、第６図に示したよう
に、実線の矢印が発光素子１の中心から放射され
た光で、点線の矢印が素子端面から放射された光
であつて、これら光線の内前面側に反射されて有
効光線となるのはθ2（約20゜）の範囲である。従つ
て、全体として見た時に前面側に向う有効光線の
角度範囲はθ1＋2θ2であり、その他の角度範囲θ3
（約40゜）が有効光線として全く利用されない範囲
になる。尚、前記したGaP系及びGaAsP系の発
光素子の発光指向特性は第７図のグラフ中で曲線
６で示した通りである。 In the light emitting diode having such a configuration, among the light rays emitted from the light emitting element 1, the range in which the light rays become substantially parallel at the spherical end portion 5a is at an angle θ 1 (approximately 60°). Moreover, the inside of the recess 2a provided in the lead frame 2 is gloss plated, and the light emitted from the light emitting element 1 in the side direction is reflected to the front side. As shown, the solid line arrow is the light emitted from the center of the light emitting element 1, and the dotted line arrow is the light emitted from the end face of the element, and these light rays are reflected to the inner front side and become effective light rays. The range is θ 2 (approximately 20°). Therefore, when viewed as a whole, the angular range of the effective rays directed toward the front side is θ 1 +2θ 2 , and the other angular range θ 3
(approximately 40 degrees) is the range where it is not used as an effective ray at all. The light emission directivity characteristics of the GaP-based and GaAsP-based light emitting elements described above are as shown by curve 6 in the graph of FIG.
このグラフに基いて前記した有効光線となる範
囲を見ると、発光素子１から放射される光の内、
前面側θ1の角度範囲と側面側の限られた角度範囲
θ2が利用されることになるが、角度範囲θ2の輝度
は極めて少なくこれらの範囲が利用されたにして
も大巾な照度アツプは望めない。特に第６図にお
ける凹部２ａでの反射を詳細に考えると、凹部２
ａの開口部の直径は発光素子１の外形寸法の約３
〜５倍であり、発光素子１は一般に素子全体で発
光するため、点光源とみなすことができず、実際
の凹部２ａでの反射光はほとんどが無効な方向に
反射されることが多い。従つて、凹部２ａによる
反射面があつたにしても発光素子１から放射され
る輝度の高い角度範囲θ3が全く利用されず、しか
も反射面からの光も一部しか利用できないので発
光ダイオード全体としての照度アツプは期待でき
ない。 Looking at the range of effective light rays described above based on this graph, out of the light emitted from the light emitting element 1,
The angular range θ 1 on the front side and the limited angular range θ 2 on the side side will be used, but the brightness in the angular range θ 2 is extremely small, and even if these ranges are used, the illuminance will be very large. I can't hope for an uptick. In particular, if we consider in detail the reflection at the recess 2a in FIG.
The diameter of the opening a is approximately 3 of the external dimension of the light emitting element 1.
~5 times, and since the light emitting element 1 generally emits light as a whole, it cannot be regarded as a point light source, and most of the actual light reflected by the recess 2a is often reflected in an invalid direction. Therefore, even if there is a reflective surface due to the concave portion 2a, the angular range θ 3 in which the luminance is high emitted from the light emitting element 1 is not utilized at all, and only a portion of the light from the reflective surface can be used, so that the entire light emitting diode is We cannot expect an increase in illuminance as a result.
本発明は、従来例における発光素子から放射さ
れた光の利用度の悪い問題点を解決しようとする
ものである。
The present invention aims to solve the problem of poor utilization of light emitted from light emitting elements in conventional examples.
本発明は前記した問題点を解決するための具体
的手段として、発光素子をリードフレーム、ステ
ム又は基板上にマウントし、ワイヤーボンデイン
グすると共に樹脂モールドしてレンズ部を形成し
た発光ダイオードにおいて、該レンズ部に光透過
性の樹脂で形成され且つ中心部が中空で側面外周
が曲面に形成されたキヤツプを被着させ、前記側
面外周の曲面は、前記発光素子から放射される光
束を全反射するように略放物曲面に形成されたこ
とを特徴とする発光ダイオードを提供するもので
あつて、キヤツプを被着させることで発光素子か
らの側面方向の放射光を全部前面側に略平行光線
として反射し、これら反射光が全て有効光線とし
て利用できるので発光ダイオードの輝度を大巾に
アツプさせることができる。
The present invention provides a light emitting diode in which a light emitting element is mounted on a lead frame, a stem, or a substrate, wire bonded, and resin molded to form a lens part, as a specific means for solving the above-mentioned problems. A cap made of a light-transmitting resin and having a hollow center and a curved side surface is attached to the cap, and the curved surface of the side surface completely reflects the light beam emitted from the light emitting element. The present invention provides a light emitting diode characterized in that it is formed into a substantially parabolic curved surface, and by covering the cap with a cap, all of the light emitted from the light emitting element in the side direction is reflected toward the front side as substantially parallel light. However, since all of these reflected lights can be used as effective rays, the brightness of the light emitting diode can be greatly increased.
次に本発明を図示の実施例に基き更に詳しく説
明すると、１１はGaP系及びGaAsP系の発光素
子であり、該発光素子は一方のリードフレーム１
２の頂部にマウントされると共に他方のリードフ
レーム１３との間においてワイヤー１４がボンデ
イングされ電気的に接続されている。このように
接続された発光素子１１と両リードフレーム１
２，１３の上端部分を光透過性の樹脂によりモー
ルドしてレンズ部１５を形成し、該レンズ部の光
束が照射される側の端部１５ａは球面形状に形成
されている。前記構成は一般に使用されている発
光ダイオードの構成と変りがない。
Next, the present invention will be explained in more detail based on the illustrated embodiment. Reference numeral 11 denotes a GaP-based and GaAsP-based light emitting element, and the light emitting element is attached to one lead frame 1.
A wire 14 is mounted on the top of the lead frame 2 and electrically connected to the other lead frame 13 by bonding. The light emitting element 11 and both lead frames 1 connected in this way
The upper end portions of the lenses 2 and 13 are molded with a light-transmitting resin to form a lens portion 15, and the end portion 15a of the lens portion on the side to which the light beam is irradiated is formed into a spherical shape. The configuration is the same as that of commonly used light emitting diodes.
このような構成の発光ダイオードに対して被着
されるキヤツプ１６は前記レンズ部１５と同じ材
料又はガラス等の光透過性の材料で全体形状を椀
形に形成し、上面１６ａを平坦にすると共に中心
部に中空部１７が形成され、該中空部にレンズ部
１５が挿着される。この場合レンズ部１５に傷を
付けないようにするため、中空部１７の内径はレ
ンズ部１５の外径よりも稍々大きめにし、レンズ
部１５に嵌着させた時にわずかな間隙１８が存す
る。前記キヤツプ１６の外周面は曲面１６ｂに形
成されており、該曲面は前記発光素子１１を焦点
とする略放物曲面に形成されており、発光素子１
１から放射される光線の内、レンズ部１５の端部
１５ａに至らない側面方向の光線全部を前面側に
光軸Ｘと略平行になるように反射させるものであ
る。この場合、レンズ部１５とキヤツプ１６との
間にわずかな間隙１８が存するけれども、該間隙
における空気層での屈折又は光学的損失はわずか
であり、反射光の方向を変えるまでには至らな
い。 The cap 16 attached to the light emitting diode having such a configuration is made of the same material as the lens portion 15 or a light-transmitting material such as glass, and has a bowl-shaped overall shape, and has a flat upper surface 16a. A hollow part 17 is formed in the center, and the lens part 15 is inserted into the hollow part. In this case, in order to avoid damaging the lens part 15, the inner diameter of the hollow part 17 is made slightly larger than the outer diameter of the lens part 15, so that a slight gap 18 exists when the lens part 15 is fitted. The outer peripheral surface of the cap 16 is formed into a curved surface 16b, and the curved surface is formed into a substantially parabolic curved surface with the light emitting element 11 as the focal point.
Among the light rays emitted from the lens part 1, all the light rays in the side direction that do not reach the end 15a of the lens part 15 are reflected to the front side so as to be substantially parallel to the optical axis X. In this case, although there is a slight gap 18 between the lens portion 15 and the cap 16, the refraction or optical loss in the air layer in this gap is slight and does not change the direction of the reflected light.
レンズ部１５とキヤツプ１６との間に存する間
隙１８での屈折及び光学的損失を全くなくすため
には、第４図に示したように、その間隙１８内に
光透過性の樹脂１９を充填硬化させる。この樹脂
１９によつて空気層がなくなつて、屈折及び光学
的損失がなくなると共にレンズ部１５に対するキ
ヤツプ１６の被着状態が安定するのである。この
場合に使用される樹脂１９はレンズ部１５と略同
じ樹脂で、その屈折率が略同じものが選ばれる。 In order to completely eliminate refraction and optical loss in the gap 18 existing between the lens part 15 and the cap 16, as shown in FIG. 4, a light-transmitting resin 19 is filled and hardened in the gap 18. let This resin 19 eliminates the air layer, eliminates refraction and optical loss, and stabilizes the adhesion of the cap 16 to the lens portion 15. The resin 19 used in this case is selected to be substantially the same resin as the lens portion 15 and has substantially the same refractive index.
いづれにしても、キヤツプ１６の外周面の曲面
１６ｂが放物曲面に形成されているので発光素子
１１から横方向に出る光線を全部有効光線となる
ように前部側に反射させるものである。尚、実施
例において発光素子をリードフレームに取付けた
場合について述べたが、ステム又は基板上にマウ
ントした場合でも同じである。 In any case, since the curved surface 16b of the outer peripheral surface of the cap 16 is formed into a parabolic curved surface, all the light rays emitted from the light emitting element 11 in the lateral direction are reflected toward the front side so as to become effective light rays. In the embodiments, the case where the light emitting element is mounted on a lead frame has been described, but the same applies even when the light emitting element is mounted on a stem or a substrate.
以上説明したように本発明に係る発光ダイオー
ドは、レンズ部に対して中心部が中空で側面外周
が曲面、即ち発光素子を焦点とする略放物曲面に
形成されており、発光素子から放射される光束の
内、発光ダイオードのレンズ部の上部曲面（レン
ズ面）から外れた全ての光束を略放物曲面により
前面側に光軸と略平行に反射させて導出すること
ができ、有効光束が増大して発光ダイオードの照
度を大巾にアツプさせることができるといいう優
れた効果を奏する。
As explained above, the light emitting diode according to the present invention has a hollow center with respect to the lens portion and a curved side surface, that is, a substantially parabolic curved surface with the light emitting element as the focal point, and the light emitting diode emits light from the light emitting element. Of the luminous flux that deviates from the upper curved surface (lens surface) of the lens part of the light emitting diode, all the luminous flux that deviates from the upper curved surface (lens surface) of the lens part of the light emitting diode can be reflected to the front side by the substantially parabolic curved surface in a direction substantially parallel to the optical axis, and the effective luminous flux is This has the excellent effect of greatly increasing the illuminance of the light emitting diode.
又、レンズ部に被着させたキヤツプとの間に存
する間隙に光透過性樹脂を充填硬化させることに
よつて空気層による光学的損失が皆無になるばか
りでなく、キヤツプの被着が安定するという優れ
た効果も奏する。 In addition, by filling and curing the light-transmitting resin in the gap between the cap and the lens part, not only is there no optical loss caused by the air layer, but the adhesion of the cap is stabilized. It also has this excellent effect.
第１図は本発明に係る発光ダイオードの断面
図、第２図は同発光ダイオードのキヤツプを分離
して示した斜視図、第３図は同発光ダイオードの
キヤツプを被着させた状態の斜視図、第４図は同
発光ダイオードの他の例を示す断面図、第５図は
従来例の発光ダイオードの断面図、第６図は同発
光ダイオードの要部のみを拡大して示した略図、
第７図は発光素子の発光指向特性のグラフであ
る。
１１……発光素子、１２，１３……リードフレ
ーム、１４……ワイヤー、１５……レンズ部、１
６……キヤツプ、１６ｂ……放物曲面、１７……
中空部、１８……間隙、１９……光透過性の樹
脂。
Fig. 1 is a sectional view of a light emitting diode according to the present invention, Fig. 2 is a perspective view showing the cap of the light emitting diode separated, and Fig. 3 is a perspective view of the light emitting diode with the cap attached. , FIG. 4 is a cross-sectional view showing another example of the same light-emitting diode, FIG.
FIG. 7 is a graph of the light emission directional characteristics of the light emitting element. 11... Light emitting element, 12, 13... Lead frame, 14... Wire, 15... Lens section, 1
6... Cap, 16b... Parabolic surface, 17...
Hollow part, 18... Gap, 19... Light-transmitting resin.
Claims (1)
上にマウントし、ワイヤーボンデイングすると共
に樹脂モールドしてレンズ部を形成した発光ダイ
オードにおいて、該レンズ部に光透過性の樹脂で
形成され且つ中心部が中空で側面外周が曲面に形
成されたキヤツプを被着させ、前記側面外周の曲
面は、前記発光素子から放射される光束を全反射
するように略放物曲面に形成されたことを特徴と
する発光ダイオード。 ２ レンズ部とキヤツプとの間隙に光透過性の液
状樹脂を充填固定したことを特徴とする前記１項
記載の発光ダイオード。[Claims] 1. A light-emitting diode in which a light-emitting element is mounted on a lead frame, a stem, or a substrate, and a lens portion is formed by wire bonding and resin molding, wherein the lens portion is formed of a light-transmitting resin. Further, a cap having a hollow center and a curved outer periphery of the side surface is attached, and the curved surface of the outer periphery of the side surface is formed into a substantially parabolic curved surface so as to totally reflect the luminous flux emitted from the light emitting element. A light emitting diode featuring 2. The light emitting diode according to item 1 above, wherein a light-transmitting liquid resin is filled and fixed in the gap between the lens portion and the cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59270372A JPS61147586A (en) | 1984-12-21 | 1984-12-21 | Light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59270372A JPS61147586A (en) | 1984-12-21 | 1984-12-21 | Light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61147586A JPS61147586A (en) | 1986-07-05 |
| JPH0422355B2 true JPH0422355B2 (en) | 1992-04-16 |
Family
ID=17485341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59270372A Granted JPS61147586A (en) | 1984-12-21 | 1984-12-21 | Light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61147586A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2608893B2 (en) * | 1987-07-10 | 1997-05-14 | 松下電器産業株式会社 | Optical pattern detector |
| JP4344978B2 (en) * | 2001-01-30 | 2009-10-14 | ラボ・スフィア株式会社 | Interior lighting device |
| US20040264188A1 (en) * | 2001-09-11 | 2004-12-30 | Hare Tazawa | Condensing element and forming method threfor and condensing element-carrying led lamp and linear light emitting device using led lamp as light source |
| JP2005109289A (en) * | 2003-10-01 | 2005-04-21 | Nichia Chem Ind Ltd | Light-emitting device |
| JP2005223112A (en) * | 2004-02-05 | 2005-08-18 | Citizen Electronics Co Ltd | Surface mounting light emitting diode |
-
1984
- 1984-12-21 JP JP59270372A patent/JPS61147586A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61147586A (en) | 1986-07-05 |
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