JPS61187384A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JPS61187384A JPS61187384A JP60028009A JP2800985A JPS61187384A JP S61187384 A JPS61187384 A JP S61187384A JP 60028009 A JP60028009 A JP 60028009A JP 2800985 A JP2800985 A JP 2800985A JP S61187384 A JPS61187384 A JP S61187384A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- light
- cap
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は信号灯、車輌用灯具、表示灯、光通信装置及び
各種センナ等の光源として使用される可視光又は赤外線
を放射する発光ダイオードに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a light emitting diode that emits visible light or infrared rays and is used as a light source for signal lights, vehicle lights, indicator lights, optical communication devices, various sensors, etc. It is.
一般にこの種の光源用発光ダイオードとしては、第６図
に示した構造のものが公知である。この公知の発光ダイ
オードにおいて、１はＧａＰ系又はＧａＡｓＰ系の発光
素子であり、該発光素子は一方のリードフレーム２の凹
部２ａ内にマウントされ、使方のリードフレーム３との
間においてワイヤ４がボンディングされ、これらが一体
内に樹脂モールドされると共に凸状のレンズ部５が形成
されたものである。このレンズ部５の前端側、即ち光束
が照射される側の端部５ａは、光線を光軸Ｘに沿って平
行光線にすべく球面形状に形成されている。Generally, as this type of light emitting diode for a light source, one having the structure shown in FIG. 6 is known. In this known light emitting diode, 1 is a GaP-based or GaAsP-based light emitting element, and the light emitting element is mounted in a recess 2a of one lead frame 2, and a wire 4 is connected between it and the lead frame 3 in use. These are bonded and resin-molded into one body, and a convex lens portion 5 is formed. The front end side of the lens portion 5, that is, the end portion 5a on the side where the light beam is irradiated is formed into a spherical shape so as to make the light beam parallel to the optical axis X.
このような構成の発光ダイオードにおいて、発光素子１
から放射される光線の内、球面状の端部５ａで平行光線
になる範囲は角度θ１ （約６０°）である。又、リー
ドフレーム２に設けた凹ＮＳ２ ａはその内部が光沢メ
ッキされており、発光素子１から側面方向に出る光を前
面側に反射させているが、この反射光において、第７図
に示したように、実線の矢印が発光素子１の中心から放
射された光で、点線の矢印が素子端面から放射された光
であって、これら光線の自前面側に反射されそ有効光線
となるのはθ２ （約２０°）の範囲である。従って、
全体として見た時に前面側に向う有効光線の角度範囲は
θ１＋２６２であり、その他の角度範囲θ３ （約４０
°）が有効光線として全く利用されない範囲になる。尚
、前記したＧａＰ系及びＧａＡＳＰ系の発光素子の発光
指向特性は第８図のグラフ中で曲線６で示した通りであ
る。In the light emitting diode having such a configuration, the light emitting element 1
Among the light rays emitted from the spherical end portion 5a, the range in which the light rays become parallel is an angle θ1 (approximately 60°). Furthermore, the inside of the concave NS2a provided in the lead frame 2 is brightly plated, and reflects the light emitted from the light emitting element 1 in the side direction toward the front side. As shown above, the solid line arrow is the light emitted from the center of the light emitting element 1, and the dotted line arrow is the light emitted from the end face of the element, and these light rays are reflected to the self-front side and become effective light rays. is in the range of θ2 (approximately 20°). Therefore,
When viewed as a whole, the angular range of the effective rays directed toward the front side is θ1+262, and the other angular range θ3 (approximately 40
°) is a range in which it is not used as an effective ray at all. The light emission directivity characteristics of the GaP-based and GaASP-based light emitting elements described above are as shown by curve 6 in the graph of FIG.
このグラフに基いて前記した有効光線となる範囲を見る
と、発光素子１から放射される光の内、前面側θ１の角
度範囲と側面側の限られた角１ａ範囲θ２が利用される
ことになるが、角度範囲θ２の輝度は極めて少なくこれ
らの範囲が利用されたにして６大巾な照度アップは望め
ない。特に第７図における凹部２ａでの反射を詳細に考
えると、凹部２ａの開口部の直径は発光素子１の外形寸
法の約３〜５倍であり、発光素子１は一般に素子全体で
発光するため、点光源とみなすことができず、実際の四
部２ａでの反射光はほとんどが無効な方向に反射される
ことが多い。従って、凹部２ａによる反射面があったに
しても発光素子１から放射される輝度の高い角度範囲θ
３が全く利用されず、しかも反射面からの光も一部しか
利用できないので発光ダイオード全体としての照度アッ
プは期待できない。Looking at the range of effective light rays described above based on this graph, it can be seen that of the light emitted from the light emitting element 1, the angular range θ1 on the front side and the limited angle 1a range θ2 on the side side are utilized. However, the brightness in the angular range θ2 is extremely low, and even if these ranges were utilized, it would not be possible to increase the illuminance by a wide range. In particular, if we consider in detail the reflection at the recess 2a in FIG. 7, the diameter of the opening of the recess 2a is about 3 to 5 times the external dimension of the light emitting element 1, and the light emitting element 1 generally emits light from the entire element. , cannot be regarded as a point light source, and most of the actual light reflected by the four parts 2a is often reflected in an invalid direction. Therefore, even if there is a reflective surface due to the recess 2a, the angular range θ where the luminance is high is emitted from the light emitting element 1.
3 is not used at all, and only a portion of the light from the reflective surface can be used, so it cannot be expected to increase the illuminance of the light emitting diode as a whole.
前記問題点を解決するために同一出願人に係る先願の発
明（特願昭５９−２７０３７２）がある。In order to solve the above problem, there is an invention (Japanese Patent Application No. 59-270372) filed by the same applicant.
この先願の発明にあっては、全体的な照度アップを図る
点で優れており、発光ダイオードとキャップとがＭ嵌又
は同質材料で接着させている。この事は、次のような不
都合を避けるためである。即ち、発光ダイオードとキャ
ップとを仮りに圧入または一体成型した場合に、発光ダ
イオードに対して外側から締付作用が働き、内部応力が
生じたり、内部残留応力が残ったりし、熱変化によって
膨張したり収縮したりすることによって内部応力も変化
し、それによって発光ダイオードチップ及びワイヤーが
破損することを避けたものであるが、遊嵌の場合は不安
定であり、接着の場合は手数がかかる。The invention of this prior application is excellent in increasing the overall illuminance, and the light emitting diode and the cap are bonded by M-fitting or the same material. This is to avoid the following inconvenience. In other words, if the light-emitting diode and the cap are press-fitted or integrally molded, a tightening action acts on the light-emitting diode from the outside, causing internal stress or residual internal stress, which may cause expansion due to thermal changes. This is to avoid damage to the light emitting diode chip and wires due to changes in internal stress due to shrinkage or shrinkage, but loose fitting is unstable and bonding is time consuming.
本発明は、従来例における発光素子から放射された光の
利用度の悪い問題点及び圧入又は一体成形における内部
応力の問題点、更に安定性と製造工数の問題点を解決し
ようとでるものである。The present invention is an attempt to solve the problem of poor utilization of light emitted from a light emitting element in conventional examples, the problem of internal stress in press-fitting or integral molding, and the problem of stability and manufacturing man-hours. .
本発明は前記した問題点を解決するための具体的手段と
して、発光素子をリードフレーム、ステム又は垂板上に
マウントし、ワイヤーボンディングすると共に樹脂モー
ルドしてレンズ部を形成した発光ダイオードと光透過性
の軟質材料で形成されたキャップとからなり、該キャッ
プはその中央部に前記発光ダイオードが嵌る筒状の孔を
設け、キャップの背面側をドーム状の曲面に形成し、前
記孔に前記発光ダイオードを挿着させて一体的に形成し
たことを特徴とする発光ダイオードを提供するものであ
って、艷１１ツブを被着させることで発光素子からの側
面方向の放射光を全部前面側に平行光線として反射し、
これら反射光が全て有効光線として利用できるので発光
ダイオードの輝度を大巾にアップさせると共に、キシツ
ブを軟質材料で形成しであるために発光ダイオードとの
間で弾性的に係合して一体化が安定すると共に、熱によ
る［及び収縮があってもキャップで吸収し、発光ダイオ
ードに内部応力を発生させないのである。As a specific means for solving the above problems, the present invention provides a light-emitting diode and a light-transmitting device in which a light-emitting element is mounted on a lead frame, a stem, or a hanging plate, wire-bonded, and resin-molded to form a lens part. The cap has a cylindrical hole in the center thereof into which the light emitting diode fits, the back side of the cap is formed into a dome-shaped curved surface, and the light emitting diode is inserted into the hole. The present invention provides a light emitting diode characterized in that it is integrally formed by inserting a diode therein, and by attaching a tab 11, all of the light emitted from the light emitting element in the side direction is directed parallel to the front side. reflected as a ray of light,
Since all of this reflected light can be used as effective light, the brightness of the light emitting diode can be greatly increased, and since the tube is made of a soft material, it can be elastically engaged with the light emitting diode and integrated. In addition to being stable, even if there is heat and shrinkage, it is absorbed by the cap, and no internal stress is generated in the light emitting diode.
次に本発明を図示の実施例に基き更に詳しく説明すると
、第１図に示した第１実施例において、１１はＧａＰ系
及びＧａＡｓＰ系の発光素子であり、該発光素子は一方
のリードフレーム１２の頂部にマウントされると共に他
方のリードフレーム１３との闇においてワイＶ−１４が
ボンディングされ電気的に接続されている。このように
接続された発光素子１１と両リードフレーム１２．１３
の上端部分を光透過性の樹脂によりモールドしてレンズ
部１５を形成し、該レンズ部の光束が照射される側の端
部１５ａは球面形状に形成され、基部側にはフランジ部
１５ｂが形成されている。前記構成は一般に使用されて
いる発光ダイオードの構成と変りがない。Next, the present invention will be explained in more detail based on the illustrated embodiment. In the first embodiment shown in FIG. The wire V-14 is mounted on the top of the lead frame 13 and is electrically connected to the other lead frame 13 by bonding. The light emitting element 11 and both lead frames 12 and 13 connected in this way
The upper end portion is molded with a light-transmitting resin to form a lens portion 15, the end portion 15a of the lens portion on the side to which the light beam is irradiated is formed in a spherical shape, and the flange portion 15b is formed on the base side. has been done. The configuration is the same as that of commonly used light emitting diodes.
このような構成の発光ダイオードに対して被着されるキ
ャップ１６は樹脂例えば塩化ビニール又はゴム例えばシ
リコンゴム等の光透過性の輸質材料で全体形状をドーム
状に形成すると共に中央部に筒状の孔１７が形成され、
該孔１７に前記発光ダイオードのレンズ部１５が挿着さ
れる。この場合孔１７の内径はレンズ部１５の外径と略
同径にするか梢々小さめにし、レンズ部１５を孔１７に
挿着した際にキャップ１６自体の弾性により圧着するよ
うにしである。更に前記孔１７に沿ってキャップ１６の
基部側に発光ダイオード１５のフランジ部１５ｂと係合
する口字状の係合部１８が形成されている。そして、前
記キャップ１６の外周面即ち背面側はドーム状の曲面１
９に形成されており、該曲面は前記発光素子１１から放
射される光束の内、レンズ部１５の端部１５ａに至らな
い側面方向の光束全部を能面側に光＠Ｘと略平行になる
ように反射させるものである。この場合、前記キャップ
１６の正面視の形状は丸形又は角形等任意の形状のもの
が選べ、前記孔１７においても、発光ダイオードのレン
ズ部１５が挿着される範囲を円筒形に形成し、他の部分
はラッパ状又は角筒状に形成しても良い。The cap 16 that is attached to the light emitting diode having such a structure is made of a light-transmitting material such as resin such as vinyl chloride or rubber such as silicone rubber, and has a dome-like overall shape and a cylindrical shape in the center. A hole 17 is formed,
The lens portion 15 of the light emitting diode is inserted into the hole 17 . In this case, the inner diameter of the hole 17 is made approximately the same as the outer diameter of the lens portion 15, or is made smaller in diameter, so that when the lens portion 15 is inserted into the hole 17, it is pressed by the elasticity of the cap 16 itself. Furthermore, a mouth-shaped engaging portion 18 that engages with the flange portion 15b of the light emitting diode 15 is formed on the base side of the cap 16 along the hole 17. The outer peripheral surface, that is, the back side of the cap 16 has a dome-shaped curved surface 1.
9, and the curved surface directs all of the luminous flux emitted from the light emitting element 11 in the side direction that does not reach the end 15a of the lens portion 15 to the Noh surface side so that it becomes approximately parallel to the light @X. It reflects the light. In this case, the shape of the cap 16 when viewed from the front can be selected from any shape such as round or square, and the range in which the lens portion 15 of the light emitting diode is inserted in the hole 17 is also formed into a cylindrical shape, The other portions may be formed into a trumpet shape or a rectangular tube shape.
第２図に示した第２実施例は発光ダイオードのレンズ部
１５の形状が変ったものであり、他の部分は前記第１実
施例と実質的に同一であるので同一符号を付してその説
明を省略する。即ち、発光ダイオード１５はその基部側
に７ランジ部のないものが使用された場合で、これに取
付けられるキャップ１６は発光ダイオード１５の基部に
係合するＬ字状の係合部１８ａが形成され、両者の結合
を安定させる。In the second embodiment shown in FIG. 2, the shape of the lens portion 15 of the light emitting diode is changed, and other parts are substantially the same as the first embodiment, so they are designated by the same reference numerals. The explanation will be omitted. That is, when the light emitting diode 15 is used without a 7-lung portion on its base side, the cap 16 attached to this is formed with an L-shaped engaging portion 18a that engages with the base of the light emitting diode 15. , stabilizes the bond between the two.
更に第３図に示した第３実施例にあっては、キャップの
構造が第１実施例のものと異なるのみで他の部分は同一
であるので同一符号を付してその説明を省略する。即ち
、キャップ１６は発光ダイオード１５が取付けられる孔
１７ａが前面にまで貫通せず、発光ダイオード１５が挿
着される程度の大きさの孔に形成すれば良いのである。Further, in the third embodiment shown in FIG. 3, the only difference is the structure of the cap from that of the first embodiment, and other parts are the same, so the same reference numerals are given and the explanation thereof will be omitted. In other words, the hole 17a in which the light emitting diode 15 is attached to the cap 16 does not penetrate all the way to the front surface, and the hole 17a need only be formed to have a size that allows the light emitting diode 15 to be inserted therein.
この場合でも曲面１９での反射は同じである。Even in this case, the reflection on the curved surface 19 is the same.
いづれにしても、キャップ１６の外周面又は背面の曲面
１８がドーム状の曲面に形成されているので発光素子１
１から横方向に出る光束を全部り効光線となるように前
部側に反射させるものである。尚、各実施例において発
光素子をリードフレームに取付けた場合について述べた
が、ステム又は基板上にマウントした場合でも同じであ
る。In any case, since the outer peripheral surface or the curved surface 18 on the back surface of the cap 16 is formed into a dome-shaped curved surface, the light emitting element 1
The light beam emitted from the light source in the lateral direction is entirely reflected toward the front side so as to become an effective light beam. In each embodiment, the case where the light emitting element is mounted on a lead frame has been described, but the same applies even when the light emitting element is mounted on a stem or a substrate.
このように構成された発光ダイオードは、キャップが一
体的に取付けられているで、発光素子から出る光束を無
駄なく前面側に放射させることができ、又発光ダイオー
ドとキャップとの組立においても、キャップが軟質材料
であるため発光ダイオードのレンズ面に傷を付けること
なく、同時に内部応力を付与することなく組合せること
ができる。Since the light emitting diode configured in this way has a cap attached integrally, it is possible to radiate the luminous flux emitted from the light emitting element to the front side without waste, and when assembling the light emitting diode and the cap, the cap Since it is a soft material, it can be assembled without damaging the lens surface of the light emitting diode and at the same time without applying internal stress.
以上説明したように本発明に係る発光ダイオードは、レ
ンズ部が嵌る筒状の孔を有し側面外周又は背面が曲面、
即ら発光素子から放射される光束の内、発光ダイオード
のレンズ部の上部曲面（レンズ面）から外れた全ての光
束を前面側に光軸と略平行に反射させて取出すことがで
きるキャップを備えたので、有効光束が増大して発光ダ
イオードの照度を大巾にアップさせることができると共
に、キャップ自体が光透過性の軟質材料で形成されてい
るので、発光ダイオードと結合させた時に固有の弾性力
によって圧着することになり、発光ダイオードに対して
内部応力を生じさせないために熱による膨張及び収縮が
あっても発光素子及びワイＡ７−ｒｉを破壊することが
ない等の優れた効果を奏する。As explained above, the light emitting diode according to the present invention has a cylindrical hole into which a lens part fits, and a curved side surface or a curved back surface.
That is, the light emitting device is equipped with a cap that can reflect all the light flux that deviates from the upper curved surface (lens surface) of the lens part of the light emitting diode to the front side in a direction substantially parallel to the optical axis and extract it out of the light flux emitted from the light emitting element. Therefore, the effective luminous flux increases and the illuminance of the light emitting diode can be greatly increased.The cap itself is made of a light-transmitting soft material, so when combined with the light emitting diode, it has inherent elasticity. Since the light-emitting diode is crimped by force and no internal stress is generated in the light-emitting diode, the light-emitting element and wire A7-ri will not be destroyed even if they expand and contract due to heat.
又、キャップの基部側に発光ダイオードの端部と係合す
る口字状又はＬ字状の係合部を設けたことにより発光ダ
イオードとキャップとが位置ずれすることなく正確に結
合され、反射光にバラツキがなくなるばかりでなく安定
した一体化が望めるという優れた効果も奏する。In addition, by providing an opening-shaped or L-shaped engagement part on the base side of the cap that engages with the end of the light-emitting diode, the light-emitting diode and the cap are accurately coupled without misalignment, and the reflected light is This has the excellent effect of not only eliminating dispersion but also achieving stable integration.
第１図は本発明に係る第１実施例の発光ダイＡ−ドの断
面図、第２図は同第２実施例の発光ダイオードの断面図
、第３同周は第３実施例の発光ダイオードの断面図、第
４図は従来例の発光ダイオードの断面図、第５図は同発
光ダイオードの要部のみを拡大して示した略図、第６図
は発光素子の発光指向特性のグラフである。
１１・・・発光素子
１２．１３・・・リードフレーム
１４・・・ワイヤー
１５・・・レンズ部
１５ａ・・・レンズ面 １５ｂ・・・フランジ部１６・
・・ギャップ
１７ａ、１７ｂ−１
１８，１８ａ・・・係合部
１９・・・ドーム状の曲面
特許出願人 スタンレー電気株式会社第１図
第２図FIG. 1 is a cross-sectional view of a light emitting diode according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of a light emitting diode according to a second embodiment, and FIG. 4 is a sectional view of a conventional light emitting diode, FIG. 5 is a schematic diagram showing only the main parts of the same light emitting diode enlarged, and FIG. 6 is a graph of the light emission directional characteristics of the light emitting element. . 11... Light emitting element 12.13... Lead frame 14... Wire 15... Lens portion 15a... Lens surface 15b... Flange portion 16.
... Gaps 17a, 17b-1 18, 18a... Engaging portion 19... Dome-shaped curved surface Patent applicant Stanley Electric Co., Ltd. Figure 1 Figure 2
Claims (4)
マウントし、ワイヤーボンディングすると共に樹脂モー
ルドしてレンズ部を形成した発光ダイオードと光透過性
の軟質材料で形成されたキャップとからなり、該キャッ
プはその中央部に前記発光ダイオードが嵌る筒状の孔を
設け、キャップの背面側をドーム状の曲面に形成し、前
記孔に前記発光ダイオードを挿着させて一体的に形成し
たことを特徴とする発光ダイオード。(1) A light-emitting diode in which a light-emitting element is mounted on a lead frame, stem, or substrate, wire-bonded and resin-molded to form a lens portion, and a cap made of a light-transmitting soft material; is characterized in that a cylindrical hole into which the light emitting diode fits is provided in the center thereof, the back side of the cap is formed into a dome-shaped curved surface, and the light emitting diode is inserted into the hole and formed integrally. light emitting diode.
スチック又はゴムであることを特徴とする前記１項記載
の発光ダイオード。(2) The light emitting diode according to item 1 above, wherein the light-transmitting soft material is plastic or rubber having a hardness of 40 to 80 degrees.
オードの端部と係合するコ字状又はＬ字状の係合部を設
けたことを特徴とする前記１項記載の発光ダイオード。(3) The light emitting diode according to item 1, wherein a U-shaped or L-shaped engagement portion is provided on the base side of the cap along the hole to engage with an end of the light emitting diode.
通状態にある前記第１項記載の発光ダイオート。(4) The light emitting diode according to item 1, wherein the hole provided in the center of the cap is penetrating or non-penetrating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60028009A JPS61187384A (en) | 1985-02-15 | 1985-02-15 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60028009A JPS61187384A (en) | 1985-02-15 | 1985-02-15 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61187384A true JPS61187384A (en) | 1986-08-21 |
Family
ID=12236786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60028009A Pending JPS61187384A (en) | 1985-02-15 | 1985-02-15 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61187384A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104491A (en) * | 1992-09-17 | 1994-04-15 | Rohm Co Ltd | Light emitting sdiode lamp |
| US5825051A (en) * | 1996-10-12 | 1998-10-20 | Preh-Werke Gmbh & Co. Kg | Optoelectronic component with central hollow |
| JP2004281605A (en) * | 2003-03-14 | 2004-10-07 | Toyoda Gosei Co Ltd | Led package |
| JP2008211262A (en) * | 1997-07-07 | 2008-09-11 | Asahi Rubber:Kk | Translucent coating material for light-emitting diodes and fluorescent color light source |
| JP2009027199A (en) * | 2008-11-04 | 2009-02-05 | Toyoda Gosei Co Ltd | Light-emitting diode |
| WO2009039680A1 (en) * | 2007-09-27 | 2009-04-02 | Helio Optoelectronics Corporation | Manufacturing method of led having multi-layer lenses and the structure thereof |
| US9583683B2 (en) | 2000-09-12 | 2017-02-28 | Lumileds Llc | Light emitting devices with optical elements and bonding layers |
-
1985
- 1985-02-15 JP JP60028009A patent/JPS61187384A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104491A (en) * | 1992-09-17 | 1994-04-15 | Rohm Co Ltd | Light emitting sdiode lamp |
| US5825051A (en) * | 1996-10-12 | 1998-10-20 | Preh-Werke Gmbh & Co. Kg | Optoelectronic component with central hollow |
| JP2008211262A (en) * | 1997-07-07 | 2008-09-11 | Asahi Rubber:Kk | Translucent coating material for light-emitting diodes and fluorescent color light source |
| JP2008252119A (en) * | 1997-07-07 | 2008-10-16 | Asahi Rubber:Kk | Transparent coating member for light-emitting diode and fluorescent color light source |
| US9583683B2 (en) | 2000-09-12 | 2017-02-28 | Lumileds Llc | Light emitting devices with optical elements and bonding layers |
| US10312422B2 (en) | 2000-09-12 | 2019-06-04 | Lumileds Llc | Light emitting devices with optical elements and bonding layers |
| JP2004281605A (en) * | 2003-03-14 | 2004-10-07 | Toyoda Gosei Co Ltd | Led package |
| WO2009039680A1 (en) * | 2007-09-27 | 2009-04-02 | Helio Optoelectronics Corporation | Manufacturing method of led having multi-layer lenses and the structure thereof |
| JP2009027199A (en) * | 2008-11-04 | 2009-02-05 | Toyoda Gosei Co Ltd | Light-emitting diode |
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