JP2556821Y2 - Light emitting device - Google Patents
Light emitting deviceInfo
- Publication number
- JP2556821Y2 JP2556821Y2 JP1991101152U JP10115291U JP2556821Y2 JP 2556821 Y2 JP2556821 Y2 JP 2556821Y2 JP 1991101152 U JP1991101152 U JP 1991101152U JP 10115291 U JP10115291 U JP 10115291U JP 2556821 Y2 JP2556821 Y2 JP 2556821Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting device
- lead frame
- reflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本考案は、発光装置に関し、特に
樹脂封止されたオートフオーカス用発光装置等に係る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly to a resin-sealed light emitting device for an autofocus.
【０００２】[0002]
【従来の技術】従来の発光装置を図３に示す。図示の如
く、発光素子１を、皿状の反射板２を有する一方の搭載
用リードフレーム３に搭載し、ボンデイングワイヤ４に
より他方の結線用リードフレーム５と電気的に接続した
後、発光素子１の外部周辺を透光性樹脂６で封止して外
囲器を形成したものである。2. Description of the Related Art FIG. 3 shows a conventional light emitting device. As shown in the drawing, the light emitting element 1 is mounted on one mounting lead frame 3 having a dish-shaped reflecting plate 2 and electrically connected to the other connection lead frame 5 by a bonding wire 4. Is sealed with a light-transmitting resin 6 to form an envelope.
【０００３】[0003]
【考案が解決しようとする課題】従来の発光装置では、
図４の如く、発光素子１からの光は、透光性樹脂６から
外部へ出射する際、透光性樹脂６の界面で内側に反射
し、リードフレーム３，５で再度反射した後、散乱光
（迷光）として外部に放射する場合がある。この場合、
反射板２以外のリードフレーム３，５からの放射とな
る。[Problems to be Solved by the Invention] In the conventional light emitting device,
As shown in FIG. 4, when the light from the light emitting element 1 is emitted from the light transmitting resin 6 to the outside, the light is reflected inside at the interface of the light transmitting resin 6, reflected again by the lead frames 3 and 5, and then scattered. It may be emitted to the outside as light (stray light). in this case,
The radiation is emitted from the lead frames 3 and 5 other than the reflection plate 2.
【０００４】このような指向性の低い発光装置を、均一
な発光パターンを要求されるカメラのオートフオーカス
用光源等に使用すると、誤測距の原因となり、実用が困
難であつた。When such a light emitting device having low directivity is used as a light source for an auto focus of a camera which requires a uniform light emitting pattern, it causes erroneous distance measurement and is difficult to be practically used.
【０００５】本考案は、上記課題に鑑み、反射板以外で
の光の放射を防止し得る発光装置の提供を目的とする。The present invention has been made in view of the above problems, and has as its object to provide a light emitting device capable of preventing light emission from a portion other than a reflector.
【０００６】[0006]
【課題を解決するための手段】本考案請求項１による課
題解決手段は、図１，２の如く、リードフレーム１３上
に発光素子１１が搭載され、これらが透光性樹脂により
封止されて透光樹脂体１７が形成された発光装置におい
て、透光樹脂体１７の界面で反射した光がリードフレー
ム１３，１５で再反射するのを防止するための反射防止
材１６が発光素子１１の周辺を除くリードフレーム１
３，１５を包含するように形成され、反射防止材１６の
上部を覆うように透光樹脂体１７が形成されたものであ
る。According to the first aspect of the present invention, as shown in FIGS. 1 and 2, a light emitting element 11 is mounted on a lead frame 13 and these are made of a transparent resin. is sealed in the light emitting device translucent resin body 17 is formed, the anti-reflection for the light reflected at the interface between the light transmissive resin member 17 to prevent the re-reflected by the lead frame 13, 15
Material 16 is lead frame 1 excluding the periphery of light emitting element 11
3 and 15 and is formed to include the anti-reflection material 16.
The translucent resin body 17 is formed so as to cover the upper part .
【０００７】本考案請求項２による課題解決手段は、請
求項１記載の反射防止材１６は、光吸収性のよい黒色樹
脂または黒色セラミツクからなるものである。According to a second aspect of the present invention, the antireflection member 16 according to the first aspect is made of a black resin or a black ceramic having good light absorbency.
【０００８】[0008]
【作用】上記請求項１，２による課題解決手段におい
て、発光素子１１からの光は、透光樹脂体１７を通過し
て外部へ出射するが、出射しようとする光の一部は、透
光樹脂体１７の界面で内側に反射し、リードフレーム１
３，１５側に照射される。In the means for solving the problems according to the first and second aspects, light from the light emitting element 11 passes through the light-transmitting resin body 17 and is emitted to the outside. Reflected inward at the interface of the resin body 17, the lead frame 1
Irradiated on the 3, 15 side.
【０００９】このとき、リードフレーム１３，１５の周
囲の反射防止材１６は光を吸収し、再び外部に出射する
のを防止する。また、反射防止材１６が発光素子１１の
周辺を除くリードフレーム１３，１５を包含するように
形成され、反射防止材１６の上部を覆うように透光樹脂
体１７が形成されているので、反射防止材１６および透
光樹脂体１７によって外囲器が構成され、リードフレー
ム１３，１５および発光素子１１が内包保護される。 At this time, the antireflection member 16 around the lead frames 13 and 15 absorbs light and prevents the light from being emitted to the outside again. Further, the anti-reflection material 16 is
So as to cover the lead frames 13 and 15 excluding the periphery
A transparent resin is formed so as to cover the upper part of the anti-reflection material 16.
Since the body 17 is formed, the anti-reflection material 16 and the transparent
The optical resin body 17 forms an envelope, and the lead frame
The systems 13, 15 and the light emitting element 11 are protected.
【００１０】[0010]
【実施例】図１は本考案の一実施例による発光装置の断
面図である。図示の如く、本実施例の発光装置は、均一
な発光パターンを要求されるカメラのオートフオーカス
用光源等に使用されるもので、発光素子１１が、反射板
１２を有する一方の搭載用リードフレーム１３上に搭載
され、金線等のボンデイングワイヤ１４により他方の結
線用リードフレーム１５と電気的に接続され、前記発光
素子１１の周辺を除くリードフレーム１３，１５は、反
射効率の低い反射防止材１６で被覆され、前記発光素子
１１の周辺は透光性樹脂で被覆されて透光樹脂体１７が
形成されたものである。FIG. 1 is a sectional view of a light emitting device according to an embodiment of the present invention. As shown in the figure, the light emitting device of the present embodiment is used for a light source for an auto focus of a camera which requires a uniform light emitting pattern, and the light emitting element 11 has one mounting lead having a reflection plate 12. The lead frames 13 and 15 mounted on the frame 13 and electrically connected to the other connection lead frame 15 by a bonding wire 14 such as a gold wire. The light-emitting element 11 is covered with a light-transmitting resin, and the periphery of the light-emitting element 11 is covered with a light-transmitting resin.
【００１１】前記発光素子１１は、可視光や赤外線の発
光ダイオード（ＬＥＤ）等が使用されている。As the light emitting element 11, a visible light or infrared light emitting diode (LED) or the like is used.
【００１２】前記反射板１２は、皿状に形成され、前記
搭載用リードフレーム１３の先端に配されている。The reflection plate 12 is formed in a dish shape and is disposed at the tip of the mounting lead frame 13.
【００１３】前記反射防止材１６は、光吸収性のよい黒
色エポキシ樹脂もしくは黒色セラミツク等が使用され、
既存の射出形成法等により形成される。The anti-reflection material 16 is made of black epoxy resin or black ceramic having good light absorption.
It is formed by an existing injection molding method or the like.
【００１４】前記透光樹脂体１７は、発光素子１１およ
びボンデイングワイヤ１４を保護するもので、熱硬化性
のエポキシ樹脂や、熱可塑性のポリイミド樹脂等が使用
され、前記反射防止材１６の形成後、その上部を覆うよ
うに成形される。The light-transmitting resin body 17 protects the light emitting element 11 and the bonding wire 14 and is made of a thermosetting epoxy resin or a thermoplastic polyimide resin. , So as to cover the upper part.
【００１５】上記構成の発光装置において、発光素子１
１からの光は、反射板１２にて前方に反射され、透光樹
脂体１７を通過して外部へ出射しようとする。In the light emitting device having the above structure, the light emitting element 1
The light from No. 1 is reflected forward by the reflection plate 12, passes through the light-transmitting resin body 17, and is emitted to the outside.
【００１６】ここで、出射しようとする光の一部は、透
光樹脂体１７の界面で内側に反射し、リードフレーム１
３，１５に当たる。Here, a part of the light to be emitted is reflected inward at the interface of the light transmitting resin body 17 and
Hits 3,15.
【００１７】このとき、リードフレーム１３，１５に反
射防止材１６を被覆しているので、リードフレーム１
３，１５に当つた光は反射せず、再び散乱光（迷光）と
して外部に出射することはない。At this time, since the lead frames 13 and 15 are covered with the antireflection material 16, the lead frame 1
The light striking 3, 15 is not reflected, and is not emitted to the outside again as scattered light (stray light).
【００１８】特に、反射防止材１６として、光吸収性の
高い黒色樹脂もしくは黒色セラミツク等が使用されてい
るため、その反射を極力少なくでき、透光樹脂体１７の
内部での光の散乱を防止できる。In particular, since black resin or black ceramic having high light absorption is used as the anti-reflection material 16, its reflection can be minimized and light scattering inside the light-transmitting resin body 17 can be prevented. it can.
【００１９】このように、リードフレームの外部周辺を
反射効果の小さい材料で外囲器を形成することにより、
指向性の高い発光装置を提供でき、均一な発光パターン
を要求されるカメラのオートフオーカス用光源等に適用
可能となつた。As described above, by forming the envelope around the outside of the lead frame with a material having a small reflection effect,
A light emitting device having high directivity can be provided, and the light emitting device can be applied to a light source for an auto focus of a camera which requires a uniform light emitting pattern.
【００２０】なお、本考案は、上記実施例に限定される
ものではなく、本考案の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.
【００２１】例えば、図２の如く、透光樹脂体１７と外
部との光出射において光の集光度を高めるための集光レ
ンズ２１を形成してもよい。この場合も、上記実施例と
同様、反射板１２以外のリードフレーム１３，１５での
光の反射を防止することができ、かつ上記実施例よりも
高出力化できる。For example, as shown in FIG. 2, a condensing lens 21 for increasing the degree of condensing light when light is emitted between the light transmitting resin body 17 and the outside may be formed. Also in this case, similarly to the above-described embodiment, it is possible to prevent reflection of light on the lead frames 13 and 15 other than the reflection plate 12, and to achieve higher output than in the above-described embodiment.
【００２２】[0022]
【考案の効果】以上の説明から明らかな通り、請求項
１，２によると、リードフレームを、反射率の低い反射
防止材により包含しているので、リードフレームでの不
必要な光の反射を防止することができる。したがつて、
散乱光の発生を防止でき、指向性の高い発光装置を提供
でき、均一な発光パターンを要求されるカメラのオート
フオーカス用光源等に適用可能になるといつた優れた効
果がある。また、反射防止材がリードフレームを包含す
るように形成することにより、反射防止材は外囲器の一
部になるので、リードフレームを外的応力等から保護す
ることができる。 As is apparent from the above description, according to the first and second aspects, since the lead frame is covered by the anti-reflective material having a low reflectance, unnecessary reflection of light on the lead frame is prevented. Can be prevented. Therefore,
It is possible to provide a light emitting device with high directivity, which can prevent generation of scattered light, and has an excellent effect when it can be applied to a light source for an auto focus of a camera which requires a uniform light emitting pattern. Also, the anti-reflection material covers the lead frame.
The anti-reflective material is one part of the envelope
To protect the lead frame from external stress, etc.
Can be
【図面の簡単な説明】[Brief description of the drawings]
【図１】本考案の一実施例を示す発光装置の断面図FIG. 1 is a sectional view of a light emitting device showing an embodiment of the present invention.
【図２】本考案の他の実施例を示す発光装置の断面図FIG. 2 is a sectional view of a light emitting device showing another embodiment of the present invention.
【図３】従来の発光装置の断面図FIG. 3 is a cross-sectional view of a conventional light emitting device.
【図４】従来の発光装置の透光性樹脂内での光路を示す
図FIG. 4 is a diagram showing an optical path in a translucent resin of a conventional light emitting device.
１１ 発光素子 １３ リードフレーム １６ 反射防止材 １７ 透光性樹脂 DESCRIPTION OF SYMBOLS 11 Light emitting element 13 Lead frame 16 Anti-reflection material 17 Translucent resin
Claims (2)
れ、これらが透光性樹脂により封止されて透光樹脂体が
形成された発光装置において、前記透光樹脂体の界面で
反射した光がリードフレームで再反射するのを防止する
ための反射防止材が前記発光素子の周辺を除くリードフ
レームを包含するように形成され、前記反射防止材の上
部を覆うように前記透光樹脂体が形成されたことを特徴
とする発光装置。1. A light emitting element is mounted on a lead frame, the light emitting device to which they are translucent resin member is sealed by a translucent resin is formed, the light reflected at the interface between the translucent resin member Prevent re-reflection on lead frame
Anti-reflection material for the lead
Formed on the anti-reflective material,
A light-emitting device, wherein the light- transmitting resin body is formed so as to cover the portion .
のよい黒色樹脂または黒色セラミツクからなることを特
徴とする発光装置。2. The light-emitting device according to claim 1, wherein the anti-reflection material is made of black resin or black ceramic having good light absorbency.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991101152U JP2556821Y2 (en) | 1991-12-09 | 1991-12-09 | Light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991101152U JP2556821Y2 (en) | 1991-12-09 | 1991-12-09 | Light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0550754U JPH0550754U (en) | 1993-07-02 |
| JP2556821Y2 true JP2556821Y2 (en) | 1997-12-08 |
Family
ID=14293083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991101152U Expired - Fee Related JP2556821Y2 (en) | 1991-12-09 | 1991-12-09 | Light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2556821Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200024162A (en) | 2017-06-30 | 2020-03-06 | 이데미쓰 고산 가부시키가이샤 | Thermosetting material and molding method of the thermosetting material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007001706A1 (en) | 2007-01-11 | 2008-07-17 | Osram Opto Semiconductors Gmbh | Housing for optoelectronic component and arrangement of an optoelectronic component in a housing |
| DE102007060206A1 (en) * | 2007-12-14 | 2009-06-18 | Osram Opto Semiconductors Gmbh | Arrangement with at least one optoelectronic semiconductor component |
| JP5212785B2 (en) | 2008-02-22 | 2013-06-19 | スタンレー電気株式会社 | Vehicle headlamp |
| JP5691681B2 (en) | 2010-03-15 | 2015-04-01 | 日亜化学工業株式会社 | Light emitting device |
| DE102010023815A1 (en) | 2010-06-15 | 2011-12-15 | Osram Opto Semiconductors Gmbh | Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component |
| WO2012090576A1 (en) | 2010-12-28 | 2012-07-05 | 日亜化学工業株式会社 | Light-emitting apparatus and method of manufacturing thereof |
| JP6476567B2 (en) * | 2013-03-29 | 2019-03-06 | 日亜化学工業株式会社 | Light emitting device |
| KR102157065B1 (en) * | 2014-03-25 | 2020-09-17 | 엘지이노텍 주식회사 | Light emitting device package |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6159364U (en) * | 1984-09-25 | 1986-04-21 | ||
| JPH0517898Y2 (en) * | 1988-04-08 | 1993-05-13 | ||
| JPH03258158A (en) * | 1990-03-08 | 1991-11-18 | Canon Inc | Original reader |
-
1991
- 1991-12-09 JP JP1991101152U patent/JP2556821Y2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20200024162A (en) | 2017-06-30 | 2020-03-06 | 이데미쓰 고산 가부시키가이샤 | Thermosetting material and molding method of the thermosetting material |
| US11926683B2 (en) | 2017-06-30 | 2024-03-12 | Idemitsu Kosan Co., Ltd. | Curable material and method for molding said thermally curable material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0550754U (en) | 1993-07-02 |
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