TWM614189U - Optical sensing module - Google Patents

Abstract

An optical sensing module, which includes a substrate, a light-emitting chip, and a sensor The test chip, at least one packaging glue and a housing, the substrate has a mounting surface, the housing system is arranged on the mounting surface, the light emitting chip and the sensing chip are separately arranged in the housing, and at least one packaging glue system respectively covers the light emitting The chip and the sensing chip, and the housing has a transmitting hole and a receiving hole, the transmitting hole and the receiving hole are respectively located above the light emitting chip and the sensing chip.

Description

Optical sensing module

The present invention relates to a sensing module, in particular to an optical sensing module.

Ambient light sensor is an optical element that can perceive the surrounding light conditions. It adjusts the display or camera according to the light detected by the ambient light sensor. The distance sensor uses the "time of flight" method. To detect the distance of an object, the "time of flight method" is to emit a particularly short light pulse and measure the time from when the light pulse is emitted to the time it is reflected by the object. The distance between the object and the object is calculated by measuring the time interval. However, Xi After the conventional distance sensor is packaged, since the light emitted by the light emitting element is reflected by the surface of the object, the power of the light is often greatly reduced, which makes the light signal received by the adjacent light receiving chip defective. As a result, the signal of the smart electronic device with the sensor cannot be judged stably and accurately.

Therefore, the light emitting path of the light emitting element in the existing distance sensor usually needs to be provided with a material with a light concentrating effect or a structure designed with a light concentrating effect to enhance the light emission intensity of the light emitting unit. For example, the Republic of China Invention Patent Announcement No. I627572 No. "Mobile Device and Proximity Sensing Module", Republic of China Invention Patent Publication No. I619208 "Packaging Method of Optical Module with Concentrating Structure", etc., which can further form a transparent packaging material of a predetermined shape on the light emitting A lens is formed above the element or optical sensor to achieve the effect of condensing or guiding light. However, molding technology is generally used to process the lens formed from a transparent packaging material. If the lens design is poor, Whether it comes from the optical design of the lens body, the error of the mold cavity size or the mechanical error of the mold alignment, the error of the lens size and position will affect the operation of the optical module. Furthermore, most of the existing light sensing devices It is close-range sensing, so there is a need for improvement.

In view of the above-mentioned problems, the present invention provides an optical sensor module that can improve the efficiency of light emission through the design of an optical lens structure.

One embodiment of the present invention provides an optical sensing module, which includes a substrate, a light-emitting chip, a sensing chip, at least one encapsulating compound, and a housing. The substrate has a mounting surface, and the housing system is mounted on the mounting surface. , The light-emitting chip and the sensing chip are separately arranged in the housing, at least one encapsulant system covers the light-emitting chip and the sensing chip respectively, and the housing has an emission hole and a receiving hole, the emission hole and the receiving hole Respectively above the light-emitting chip and the sensing chip.

In one embodiment, the substrate material may be a bismaleimide triazine substrate, a glass fiber substrate, a metal substrate, a ceramic substrate, or the like.

In one embodiment, the shell is made of opaque material, which can be blocked by any The light is made of opaque materials, such as resin, metal, nylon, plastic, liquid crystal polymer, or other opaque materials.

In one embodiment, the light emitting chip is visible light or invisible light.

In one embodiment, the at least one encapsulant further includes at least one lens portion and a bottom portion, and the lens portion is similar to a convex lens to provide a light-concentrating effect.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

10: Optical sensing module

101: substrate

102: light-emitting chip

1011: Mounting surface

1012: groove

103: sensor chip

104: Encapsulation colloid

1041: lens part

1042: bottom

105: shell

106: Shading parts

1051: launch hole

1052: receiving hole

1053: Microstructure

1054: light shielding layer

1055: top surface

L: distance range

R: light signal

M: Object to be tested

FIG. 1 is a schematic cross-sectional view of the optical sensing module according to the first embodiment of the new type.

2 is a schematic cross-sectional view of an optical sensing module according to another embodiment of the new type.

3 is a schematic cross-sectional view of an optical sensing module according to another embodiment of the new type.

4 is a schematic cross-sectional view of an optical sensing module according to another embodiment of the new type.

5A to 5D are the manufacturing flowcharts of the optical sensing module according to the embodiment of the new type.

1 is a schematic cross-sectional view of the optical sensing module according to the first embodiment of the new type. Please refer to FIG. 1. As shown in the figure, the optical sensing module 10 includes a substrate 101, a light emitting chip 102, and a sensing chip. 103. At least one packaging compound 104 and a housing 105. The substrate 101 has a mounting surface 1011. The mounting surface 1011 may include wiring, bonding wire pads or vias (not drawn), etc., the light emitting chip 102 and the sensing chip 103 Are separated from each other on the substrate 101, and are electrically connected to the mounting surface 1011 Then, the material of the substrate 101 can be a bismaleimide triazine substrate, a glass fiber substrate, a metal substrate, a ceramic substrate, etc., and the light-emitting chip 102 can emit a wavelength of about 700 to 1100 nanometers (nanometer, Infrared light in the range of nm) or visible light with a wavelength falling in the range of about 380 to 780 nm (for example: blue light with a wavelength falling in the range of 450-480 nm, green light with a wavelength falling in the range of 500-560 nm) Light or red light with a wavelength in the range of 600-700nm), but not limited to this. Specifically, the light-emitting chip 102 may be a light-emitting diode, a laser diode, or a vertical cavity surface-emitting laser (VCSEL), but not limited to this. Moreover, the sensor chip 103 can sense light from different directions (azimuths) (including visible light and invisible light, such as red light (R), green light (G), Blue light (B), white light (W), ultraviolet light (UV), infrared light (IR)) and other functions. Specifically, the sensor chip 102 can be an integrated proximity sensor (PS) or an ambient light sensor (ALS) ) Functional single chip, etc., but not limited to this.

At least one encapsulant 104 is molded to cover the light-emitting chip 102 and the sensing chip 103, respectively, to prevent the chips from being corroded by moisture and being separated from each other. However, the encapsulant 104 is not limited to this. It can also be set on the mounting surface 1011 by curing in a specific shape by means of Transfer Molding or Injection Molding. The at least one encapsulant 104 can be made of a light-transmitting resin. The light-permeable resin can be, for example, polyphthalamide, polycyclohexane dimethyl terephthalate, epoxy resin, or silicone, etc., and its refractive index is about 1.3 to 1.8. In a preferred embodiment , The refractive index is about 1.5 to 1.6. In this embodiment, it is made of a material with a refractive index of about 1.54.

In addition, the housing 105 can also be molded by a mold (not shown) Or it is pre-molded and placed on the substrate 101. The housing 105 can be made of any opaque material that can block light, such as plastic materials, polymers, resins, metals, metal alloys, or other opaque materials. When made of transparent or translucent materials, opaque dyes can be added, such as Carbon Black or filler, such as titanium dioxide (TiO2) and other materials with this opaque characteristic to block light Throughout, the housing 105 also has a transmitting hole 1051 and a receiving hole 1052, the transmitting hole 1051 and the receiving hole 1052 are respectively provided above the light emitting chip 102 and the sensing chip 103.

2 is a schematic cross-sectional view of an optical sensing module according to another embodiment of the new type. Please refer to FIG. 2. The difference between this embodiment and the first embodiment is that the encapsulant 104 on the light-emitting chip 102 may further include At least one lens portion 1041 and a bottom portion 1042, and at least one lens portion 1041 is used to increase the luminous efficiency, so it can be a convex lens, and the surface curvature of the light-emitting surface 1043 of the at least one lens portion 1041 can be spherical, aspheric, or curved Surface, paraboloid, hyperboloid or free-form surface, etc., in the embodiment of the present invention, the distance between the farthest end points (major diameter) D of the lens portion 1041 as seen in a plan view and the first of the lens portion 1041 The ratio of the height H1 (hereinafter referred to as the diameter-to-height ratio) and the ratio of the first height H1 of the lens portion 1041 to the second height H2 of the bottom 1042 are used as a measure of whether the encapsulant 104 can effectively prevent air bubbles during the molding process Comparison basis, specifically, when the diameter-to-height ratio of the lens portion 1041 is too small, it means that the space of the lens portion 1041 is too narrow. Although it can effectively produce a light-gathering effect, it is easy to cause the top of the lens portion 1041 or light out during the molding process. Bubbles are generated on the surface 1043; when the diameter-to-height ratio of the lens portion 1041 is too large, although the generation of bubbles can be reduced, they cannot be effectively collected Emission angle, so the diameter-to-height ratio range described in the implementation of the present invention can be about 0.5, 0.8, 0.9, 1.3, 1.5, 2, 2.5 or fall between 0.5 and 2.5. Preferably, the diameter-to-height ratio It can be about 0.8~1.5 or 0.9~1.3, and the ratio of the first height H1 to the second height H2 can be 0.5 to 3, preferably, the ratio can be 1 to 2 or 0.7 to 1.5 After passing through the above-mentioned ratio limitation, it is found that the lens portion 1041 or the light-emitting surface 1043 will not have the problem of generating bubbles during the molding process of the encapsulating gel 104 and achieve the light-gathering effect at the same time. In addition, in order to increase the light-collecting effect, The inner wall of the receiving hole 1052 may have an inclination angle θ, and the inclination angle may be about 30 to 90 degrees.

FIG. 3 is a schematic cross-sectional view of an optical sensing module of another embodiment of the new type. Please refer to FIG. 3. The difference between this embodiment and the second embodiment is that the housing 105 can be adapted to meet the needs of use. A microstructure 1053 is formed on the inner side wall of the receiving hole 1052, and the distance between the top surface 1055 of the receiving hole 1052 and the mounting surface 1011 is between .05mm~5mm. In a preferred embodiment, the top surface of the receiving hole 1052 The distance between the mounting surface 1011 and the mounting surface 1011 is between 0.5 mm and 3.0 mm. As shown in the figure, in order to solve the problem that the sun light interferes with the sensing chip 103 in the prior art, which causes the sensing accuracy of the sensing chip 103 to decrease, the micro The structure 1053 has the effect of blocking light. The microstructure 1053 can be irregular or regular unevenness (non-flat surface). Specifically, the regular unevenness can be a sawtooth shape, and the shape of the protrusions (ie, tooth shape) ) Is rectangular, arc-shaped, triangular or other geometric shapes, etc., and the protrusions can be spaced apart or continuously adjacent to each other as required. It should be understood that the irregular concave-convex shape can be inconsistent in shape (such as mixing and matching various shapes) , The size is inconsistent, the arrangement is inconsistent or the spacing is different, preferably, the microstructure 1053 is concave The difference between the convex highest point and the lowest point is less than 2mm. Specifically, a light shielding layer 1054 can be placed on the inner wall of the receiving hole 1052. The light shielding layer 1054 can shield stray light signals by absorption or reflection. The light shielding layer 1054 can be formed of a metal material, a semiconductor material or an insulating material. The material of the light shielding layer 1054 is well-known to those skilled in the art and is commercially available, so it will not be described in detail here.

FIG. 4 is a schematic cross-sectional view of an optical sensing module according to another embodiment of the present invention. Please refer to FIG. 4. The difference between this embodiment and the above-mentioned embodiment is that the optical sensing module 10 further includes a light-shielding member 106. The shading member 106 is made of opaque material. The shading member 106 is disposed on the mounting surface 1011 of the substrate 101, and one side of the shading member 106 is against the inner wall of the receiving hole 1052, so that the shading member 106 It shields at least part of the interference of light that penetrates the substrate 101 and enters the receiving hole 1052. In other words, the light shielding member 106 can effectively block the light leakage gap between the substrate 101 and the receiving hole 1052. Specifically, the light shielding member 106 can be formed into a single piece. Or ring shape, and can have elasticity or flexibility. Further, when the shading member 106 is a one-piece state, it is arranged on the side close to the light-emitting chip 102, in a preferred embodiment At least one groove 1012 can be re-molded on the mounting surface 1011 of the substrate 101 or on the packaging compound 104, and the position of the groove 1012 can be at the center of the substrate 101 or close to one side of the receiving hole 1052, so as the housing 105 When molded or set on the substrate 101 by the compression molding process, the light leakage gap between the substrate 101 and the receiving hole 1052 can be blocked more effectively. The above design can make the light emitting chip 102 of the optical sensing module 10 in this embodiment After the emitted light signal R is reflected by a test object M located in a distance range L, it is injected into the sensor chip 103 from the receiving hole and can still accurately detect the distance of the test object M. This distance range The distance around L may be 1, 4, 5, 6, 8, 10, 12, 15 meters or the distance range L falls within 1-10 meters.

Please refer to Figs. 5A to 5D, which are the manufacturing flow chart of the optical sensor module of the new embodiment, and please refer to Figs. 1 to 4 together, which includes the following steps: Step (a): Provide a substrate 101, The mounting surface 1011 of the substrate 101 defines a light-emitting area 1013 and a receiving area 1014. The light-emitting chip 102 and the sensing chip 103 are separately arranged in the light-emitting area 1013 and the receiving area 1014. The area of the receiving area 1014 and the light-emitting area The ratio of the area of 1013 is between 0.25 and 4. In a preferred embodiment, the ratio is between 0.3 and 2. The light receiving effect can be further improved through the above proportional relationship.

Step (b): At least one encapsulant 104 covers the light-emitting chip 102 and the sensing chip 103. In this embodiment, the refractive index of the encapsulant 104 is about 1.5~1.6. The encapsulant 104 covers the light-emitting chip 102 and the sensing chip 103, and each encapsulant 104 is formed with a lens portion 1041 and a bottom 1042, and further defines the diameter-to-height ratio of the lens portion, which is about 0.5~2.5. Preferably, the aspect ratio can be about 0.9 to 1.5, thereby effectively improving the luminous efficiency of the light emitting chip 102 and the sensing effect of the sensing chip 103, and at the same time improving the bubble generation on the light emitting surface 1043 on the top of the encapsulant 104 Missing.

Step (c): Use a cutting tool to cut a groove 1012 at the center of the substrate 101. Specifically, a groove 1012 is cut between the light-emitting area 1013 and the receiving area. In a preferred embodiment, the cutting depth is It can be cut from the packaging glue 104 to the mounting surface 1011 of the substrate 101 or from the packaging glue 104 to be lower than the mounting surface 1011 The depth of the horizontal plane.

Step (d): The housing 105 is arranged on the mounting surface 1011 of the substrate 101. The housing 105 has a transmitting hole 1051 and a receiving hole 1052, and the inner wall of the receiving hole 1052 can be formed with a microstructure 1053. Specifically, It further includes a shading member 106 arranged in the receiving hole 1052. One side of the shading member 106 is arranged on the mounting surface 1011, and the other side adjacent to one side abuts the inner wall of the receiving hole 1052 and is close to the transmitting hole. The direction of the hole 1051, therefore, when the shell 105 is molded or pre-molded on the substrate 101 by the compression molding process, the shell 105 can be embedded in the groove 1012, thereby increasing the contact area to enhance the shell 105 and the substrate 101 The combination between the light-emitting chip 1002 and the sensor chip 1033 can be effectively shielded from light. In addition, the light-shielding member 106 shields at least part of the interference of the light that penetrates the substrate 101 and enters the receiving hole 1052 to prevent the light emitting chip 1002 and the sensing chip 1033 from interacting with each other. Interference. Furthermore, the microstructure 1053 can reduce the interference caused by sunlight to the sensor chip 103, which leads to the problem that the sensing accuracy of the sensor chip 103 is reduced.

It can be seen from the above that the present invention proposes an optical sensing module, which includes a substrate, a light-emitting chip, a sensing chip, at least one packaging compound, and a housing. The substrate has a mounting surface, and the housing system is mounted on the mounting surface. On the surface, the light-emitting chip and the sensing chip are separately arranged in the housing, at least one encapsulant system covers the light-emitting chip and the sensing chip respectively, and the housing has an emission hole and a receiving hole, the emission hole and The receiving holes are respectively above the light emitting chip and the sensing chip.

Therefore, after the present model is implemented, it can indeed provide a kind of The design of the optical lens structure achieves an optical sensing module that can improve the efficiency of light emission.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The scope of protection of this new model shall be subject to the scope of the attached patent application.

In summary, the effect of this new model is that it has the patent requirements of "industrial applicability", "novelty" and "progressiveness" of the invention; the applicant filed a new patent with the Jun Office in accordance with the provisions of the Patent Law Apply.

10: Optical sensing module

101: substrate

1011: Mounting surface

102: light-emitting chip

103: sensor chip

104: Encapsulation colloid

105: shell

1051: launch hole

1052: receiving hole

Claims (13)

An optical sensing module includes: a substrate with a mounting surface; a light-emitting chip arranged on the mounting surface and electrically connected to the substrate; a sensing chip arranged on the mounting surface and electrically connected to the substrate Substrate; at least one encapsulation compound covering the light-emitting chip and the sensing chip, the at least one encapsulation body having at least one lens portion and at least one bottom, the at least one lens portion is disposed above the at least one bottom; and a shell The body is arranged on the mounting surface, and the housing is provided with a transmitting hole and a receiving hole, the transmitting hole and the receiving hole are respectively located above the light-emitting chip and the sensing chip. According to the optical sensor module described in claim 1, wherein the at least one lens portion has a long diameter and a first height, and the at least one bottom has a second height. According to the optical sensor module described in item 2 of the scope of patent application, the ratio of the first height to the second height is about 0.5 to 3. According to the optical sensing module described in item 2 of the scope of patent application, the ratio of the long diameter to the first height is about 0.5 to 2.5. According to the optical sensing module described in item 2 of the scope of patent application, wherein the at least one lens portion has a light-emitting surface, and the surface curvature of the light-emitting surface is spherical, aspherical, arcuate, parabolic, hyperboloid, or Free-form surface. The optical sensor module described in item 2 of the scope of patent application, wherein the distance between the top surface of the receiving hole and the mounting surface is between 0.5 mm and 5 mm. For example, the optical sensing module of any one of items 2 to 6 in the scope of patent application, wherein the inner wall of the receiving hole is formed with a microstructure. The optical sensing module described in item 7 of the scope of patent application, wherein the microstructure is irregular or regular concave-convex shape. The optical sensor module described in item 8 of the scope of patent application, wherein the surface of the microstructure is coated with a light shielding layer. According to the optical sensor module described in item 7 of the scope of patent application, the at least one encapsulant system is formed by molding. According to the optical sensing module described in claim 10, the optical sensing module further includes a light-shielding member disposed on the mounting surface of the substrate, and one side of the light-shielding member abuts against The inner wall of the receiving hole. For the optical sensing module described in item 11 of the scope of patent application, the shading member can be made of a material with elasticity or flexibility. For the optical sensing module described in item 12 of the scope of patent application, the shape of the shading member can be a block or a ring.

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