JPH0550754U - Light emitting device - Google Patents
Light emitting deviceInfo
- Publication number
- JPH0550754U JPH0550754U JP101152U JP10115291U JPH0550754U JP H0550754 U JPH0550754 U JP H0550754U JP 101152 U JP101152 U JP 101152U JP 10115291 U JP10115291 U JP 10115291U JP H0550754 U JPH0550754 U JP H0550754U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- lead frame
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】 指向性を高める。
【構成】 リードフレーム１３，１５の発光素子１１周
辺を除く部分を反射効率の小さい黒色樹脂等１６で被覆
する。
【効果】 発光素子周辺以外のリードフレーム等での反
射を防止し、散乱光をなくす。
(57) [Summary] [Purpose] To improve directivity. [Structure] Parts of the lead frames 13 and 15 excluding the periphery of the light emitting element 11 are covered with a black resin 16 having a low reflection efficiency. [Effect] The reflection on the lead frame other than the periphery of the light emitting element is prevented and scattered light is eliminated.
Description
【０００１】[0001]
本考案は、発光装置に関し、特に樹脂封止されたオートフオーカス用発光装置 等に係る。 The present invention relates to a light emitting device, and more particularly to a resin-sealed light emitting device for autofocus.
【０００２】[0002]
従来の発光装置を図３に示す。図示の如く、発光素子１を、皿状の反射板２を 有する一方の搭載用リードフレーム３に搭載し、ボンデイングワイヤ４により他 方の結線用リードフレーム５と電気的に接続した後、発光素子１の外部周辺を透 光性樹脂６で封止して外囲器を形成したものである。 A conventional light emitting device is shown in FIG. As shown in the figure, the light emitting element 1 is mounted on one mounting lead frame 3 having a dish-shaped reflecting plate 2, and is electrically connected to the other connecting lead frame 5 by a bonding wire 4, and then the light emitting element is mounted. The outer periphery of 1 is sealed with a transparent resin 6 to form an envelope.
【０００３】[0003]
従来の発光装置では、図４の如く、発光素子１からの光は、透光性樹脂６から 外部へ出射する際、透光性樹脂６の界面で内側に反射し、リードフレーム３，５ で再度反射した後、散乱光（迷光）として外部に放射する場合がある。この場合 、反射板２以外のリードフレーム３，５からの放射となる。 In the conventional light emitting device, as shown in FIG. 4, when the light from the light emitting element 1 is emitted from the transparent resin 6, the light is reflected inside by the interface of the transparent resin 6, and the light is emitted from the lead frames 3, 5. After being reflected again, it may be emitted to the outside as scattered light (stray light). In this case, the radiation is from the lead frames 3 and 5 other than the reflection plate 2.
【０００４】 このような指向性の低い発光装置を、均一な発光パターンを要求されるカメラ のオートフオーカス用光源等に使用すると、誤測距の原因となり、実用が困難で あつた。When such a light emitting device having a low directivity is used as a light source for an autofocus of a camera which requires a uniform light emitting pattern, it causes erroneous distance measurement and is difficult to put into practical use.
【０００５】 本考案は、上記課題に鑑み、反射板以外での光の放射を防止し得る発光装置の 提供を目的とする。The present invention has been made in view of the above problems, and an object of the present invention is to provide a light emitting device capable of preventing the emission of light other than the reflection plate.
【０００６】[0006]
本考案請求項１による課題解決手段は、図１，２の如く、リードフレーム１３ に発光素子１１が搭載され、これらが透光性樹脂により封止されて透光樹脂体１ ７が形成された発光装置において、前記発光素子１１の周辺を除くリードフレー ム１３は、透光樹脂体１７の界面で反射した光がリードフレーム１３で再反射す るのを防止するよう反射防止材１６で被覆されたものである。 As shown in FIGS. 1 and 2, a light emitting element 11 is mounted on a lead frame 13 and these are sealed with a translucent resin to form a translucent resin body 17 as shown in FIGS. In the light emitting device, the lead frame 13 excluding the periphery of the light emitting element 11 is covered with an antireflection material 16 so as to prevent the light reflected at the interface of the translucent resin body 17 from being re-reflected by the lead frame 13. It is a thing.
【０００７】 本考案請求項２による課題解決手段は、請求項１記載の反射防止材１６は、光 吸収性のよい黒色樹脂または黒色セラミツクからなるものである。According to a second aspect of the present invention, the antireflection material 16 according to the first aspect is made of a black resin or a black ceramic having good light absorption.
【０００８】[0008]
上記請求項１，２による課題解決手段において、発光素子１１からの光は、透 光樹脂体１７を通過して外部へ出射するが、出射しようとする光の一部は、透光 樹脂体１７の界面で内側に反射し、リードフレーム１３，１５側に照射される。 In the problem solving means according to claims 1 and 2, the light from the light emitting element 11 passes through the transparent resin body 17 and is emitted to the outside. However, a part of the light to be emitted is part of the transparent resin body 17. The light is reflected inward at the interface and is irradiated to the lead frames 13 and 15 side.
【０００９】 このとき、リードフレーム１３，１５の周囲の反射防止材１６は光を吸収し、 再び外部に出射するのを防止する。At this time, the antireflection material 16 around the lead frames 13 and 15 absorbs light and prevents it from being emitted to the outside again.
【００１０】[0010]
図１は本考案の一実施例による発光装置の断面図である。図示の如く、本実施 例の発光装置は、均一な発光パターンを要求されるカメラのオートフオーカス用 光源等に使用されるもので、発光素子１１が、反射板１２を有する一方の搭載用 リードフレーム１３上に搭載され、金線等のボンデイングワイヤ１４により他方 の結線用リードフレーム１５と電気的に接続され、前記発光素子１１の周辺を除 くリードフレーム１３，１５は、反射効率の低い反射防止材１６で被覆され、前 記発光素子１１の周辺は透光性樹脂で被覆されて透光樹脂体１７が形成されたも のである。 FIG. 1 is a sectional view of a light emitting device according to an embodiment of the present invention. As shown in the figure, the light emitting device of this embodiment is used for a light source for an autofocus of a camera which requires a uniform light emitting pattern. One light emitting element 11 has a reflector 12 and one mounting lead. The lead frames 13 and 15 mounted on the frame 13 and electrically connected to the other connecting lead frame 15 by a bonding wire 14 such as a gold wire. A light-transmitting resin body 17 is formed by covering the periphery of the light emitting element 11 with a light-transmitting resin.
【００１１】 前記発光素子１１は、可視光や赤外線の発光ダイオード（ＬＥＤ）等が使用さ れている。As the light emitting element 11, a visible light or infrared light emitting diode (LED) or the like is used.
【００１２】 前記反射板１２は、皿状に形成され、前記搭載用リードフレーム１３の先端に 配されている。The reflector 12 is formed in a dish shape and is arranged at the tip of the mounting lead frame 13.
【００１３】 前記反射防止材１６は、光吸収性のよい黒色エポキシ樹脂もしくは黒色セラミ ツク等が使用され、既存の射出形成法等により形成される。The antireflection material 16 is made of a black epoxy resin or a black ceramic having a good light absorption property, and is formed by an existing injection forming method or the like.
【００１４】 前記透光樹脂体１７は、発光素子１１およびボンデイングワイヤ１４を保護す るもので、熱硬化性のエポキシ樹脂や、熱可塑性のポリイミド樹脂等が使用され 、前記反射防止材１６の形成後、その上部を覆うように成形される。The translucent resin body 17 protects the light emitting element 11 and the bonding wire 14, and is made of a thermosetting epoxy resin, a thermoplastic polyimide resin, or the like, and forms the antireflection material 16. After that, it is molded so as to cover the upper part thereof.
【００１５】 上記構成の発光装置において、発光素子１１からの光は、反射板１２にて前方 に反射され、透光樹脂体１７を通過して外部へ出射しようとする。In the light emitting device having the above structure, the light from the light emitting element 11 is reflected forward by the reflection plate 12, passes through the translucent resin body 17, and tries to be emitted to the outside.
【００１６】 ここで、出射しようとする光の一部は、透光樹脂体１７の界面で内側に反射し 、リードフレーム１３，１５に当たる。Here, a part of the light to be emitted is reflected inward at the interface of the translucent resin body 17 and hits the lead frames 13 and 15.
【００１７】 このとき、リードフレーム１３，１５に反射防止材１６を被覆しているので、 リードフレーム１３，１５に当つた光は反射せず、再び散乱光（迷光）として外 部に出射することはない。At this time, since the lead frames 13 and 15 are coated with the antireflection material 16, the light impinging on the lead frames 13 and 15 is not reflected and is emitted to the outside again as scattered light (stray light). There is no.
【００１８】 特に、反射防止材１６として、光吸収性の高い黒色樹脂もしくは黒色セラミツ ク等が使用されているため、その反射を極力少なくでき、透光樹脂体１７の内部 での光の散乱を防止できる。In particular, since black resin or black ceramic having a high light absorption property is used as the antireflection material 16, the reflection thereof can be minimized and the scattering of light inside the translucent resin body 17 can be prevented. It can be prevented.
【００１９】 このように、リードフレームの外部周辺を反射効果の小さい材料で外囲器を形 成することにより、指向性の高い発光装置を提供でき、均一な発光パターンを要 求されるカメラのオートフオーカス用光源等に適用可能となつた。As described above, by forming the envelope around the outer periphery of the lead frame with a material having a small reflection effect, it is possible to provide a light emitting device with high directivity and to provide a uniform light emitting pattern for a camera. It can be applied to light sources for autofocus.
【００２０】 なお、本考案は、上記実施例に限定されるものではなく、本考案の範囲内で上 記実施例に多くの修正および変更を加え得ることは勿論である。The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made to the above embodiment within the scope of the present invention.
【００２１】 例えば、図２の如く、透光樹脂体１７と外部との光出射において光の集光度を 高めるための集光レンズ２１を形成してもよい。この場合も、上記実施例と同様 、反射板１２以外のリードフレーム１３，１５での光の反射を防止することがで き、かつ上記実施例よりも高出力化できる。For example, as shown in FIG. 2, a condensing lens 21 may be formed to increase the degree of condensing light when the light is emitted between the translucent resin body 17 and the outside. Also in this case, as in the above-described embodiment, it is possible to prevent the reflection of light by the lead frames 13 and 15 other than the reflection plate 12, and it is possible to achieve a higher output than in the above-described embodiment.
【００２２】[0022]
以上の説明から明らかな通り、請求項１，２によると、リードフレームを、反 射率の低い反射防止材により被覆しているので、リードフレームでの不必要な光 の反射を防止することができる。したがつて、散乱光の発生を防止でき、指向性 の高い発光装置を提供でき、均一な発光パターンを要求されるカメラのオートフ オーカス用光源等に適用可能になるといつた優れた効果がある。 As is clear from the above description, according to claims 1 and 2, since the lead frame is coated with the antireflection material having a low reflectance, it is possible to prevent unnecessary reflection of light on the lead frame. it can. Therefore, it is possible to prevent the generation of scattered light, provide a light emitting device with high directivity, and have an excellent effect when it can be applied to a light source for an autofocus of a camera that requires a uniform light emitting pattern.
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の一実施例を示す発光装置の断面図FIG. 1 is a sectional view of a light emitting device showing an embodiment of the present invention.
【図２】本考案の他の実施例を示す発光装置の断面図FIG. 2 is a sectional view of a light emitting device showing another embodiment of the present invention.
【図３】従来の発光装置の断面図FIG. 3 is a sectional view of a conventional light emitting device.
【図４】従来の発光装置の透光性樹脂内での光路を示す
図FIG. 4 is a diagram showing an optical path in a transparent resin of a conventional light emitting device.
１１ 発光素子 １３ リードフレーム １６ 反射防止材 １７ 透光性樹脂 11 Light-Emitting Element 13 Lead Frame 16 Antireflection Material 17 Translucent Resin
Claims (2)
これらが透光性樹脂により封止されて透光樹脂体が形成
された発光装置において、前記発光素子の周辺を除くリ
ードフレームは、透光樹脂体の界面で反射した光がリー
ドフレームで再反射するのを防止するよう反射防止材で
被覆されたことを特徴とする発光装置。1. A light emitting device is mounted on a lead frame,
In a light emitting device in which these are sealed with a translucent resin to form a translucent resin body, in the lead frame excluding the periphery of the light emitting element, the light reflected at the interface of the translucent resin body is re-reflected by the lead frame. A light-emitting device characterized by being coated with an antireflection material so as to prevent the occurrence of light.
のよい黒色樹脂または黒色セラミツクからなることを特
徴とする発光装置。2. The light emitting device according to claim 1, wherein the antireflection material is made of a black resin or a black ceramic having good light absorption.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991101152U JP2556821Y2 (en) | 1991-12-09 | 1991-12-09 | Light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991101152U JP2556821Y2 (en) | 1991-12-09 | 1991-12-09 | Light emitting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0550754U true JPH0550754U (en) | 1993-07-02 |
| JP2556821Y2 JP2556821Y2 (en) | 1997-12-08 |
Family
ID=14293083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991101152U Expired - Fee Related JP2556821Y2 (en) | 1991-12-09 | 1991-12-09 | Light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2556821Y2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011507238A (en) * | 2007-12-14 | 2011-03-03 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus comprising at least one optoelectronic semiconductor element |
| US8070339B2 (en) | 2008-02-22 | 2011-12-06 | Stanley Electric Co., Ltd. | Vehicle lamp |
| WO2012090576A1 (en) | 2010-12-28 | 2012-07-05 | 日亜化学工業株式会社 | Light-emitting apparatus and method of manufacturing thereof |
| US8710525B2 (en) | 2010-03-15 | 2014-04-29 | Nichia Corporation | Light emitting device |
| JP2014209602A (en) * | 2013-03-29 | 2014-11-06 | 日亜化学工業株式会社 | Light emitting device and manufacturing method of the same |
| US9054279B2 (en) | 2007-01-11 | 2015-06-09 | Osram Opto Semiconductors Gmbh | Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing |
| KR20150111101A (en) * | 2014-03-25 | 2015-10-05 | 엘지이노텍 주식회사 | Light emitting device package |
| US9240536B2 (en) | 2010-06-15 | 2016-01-19 | Osram Opto Semiconductors Gmbh | Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6973886B2 (en) | 2017-06-30 | 2021-12-01 | 出光興産株式会社 | Thermosetting material and molding method of the thermosetting material |
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| JPH03258158A (en) * | 1990-03-08 | 1991-11-18 | Canon Inc | Original reader |
-
1991
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|---|---|---|---|---|
| JPS6159364U (en) * | 1984-09-25 | 1986-04-21 | ||
| JPH01157465U (en) * | 1988-04-08 | 1989-10-30 | ||
| JPH03258158A (en) * | 1990-03-08 | 1991-11-18 | Canon Inc | Original reader |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9054279B2 (en) | 2007-01-11 | 2015-06-09 | Osram Opto Semiconductors Gmbh | Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing |
| JP2011507238A (en) * | 2007-12-14 | 2011-03-03 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus comprising at least one optoelectronic semiconductor element |
| US8070339B2 (en) | 2008-02-22 | 2011-12-06 | Stanley Electric Co., Ltd. | Vehicle lamp |
| US8710525B2 (en) | 2010-03-15 | 2014-04-29 | Nichia Corporation | Light emitting device |
| US10020434B2 (en) | 2010-06-15 | 2018-07-10 | Osram Opto Semiconductors Gmbh | Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component |
| US9240536B2 (en) | 2010-06-15 | 2016-01-19 | Osram Opto Semiconductors Gmbh | Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component |
| JP5772833B2 (en) * | 2010-12-28 | 2015-09-02 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
| US8960970B2 (en) | 2010-12-28 | 2015-02-24 | Nichia Corporation | Light emitting device and method for manufacturing same |
| US8475013B2 (en) | 2010-12-28 | 2013-07-02 | Nichia Corporation | Light emitting device and method for manufacturing same |
| CN102834941A (en) * | 2010-12-28 | 2012-12-19 | 日亚化学工业株式会社 | Light-emitting apparatus and method of manufacturing thereof |
| WO2012090576A1 (en) | 2010-12-28 | 2012-07-05 | 日亜化学工業株式会社 | Light-emitting apparatus and method of manufacturing thereof |
| JP2014209602A (en) * | 2013-03-29 | 2014-11-06 | 日亜化学工業株式会社 | Light emitting device and manufacturing method of the same |
| KR20150111101A (en) * | 2014-03-25 | 2015-10-05 | 엘지이노텍 주식회사 | Light emitting device package |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2556821Y2 (en) | 1997-12-08 |
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