JPH1084137A - Light emitting device and manufacture thereof - Google Patents

Light emitting device and manufacture thereof

Info

Publication number
JPH1084137A
JPH1084137A JP8257729A JP25772996A JPH1084137A JP H1084137 A JPH1084137 A JP H1084137A JP 8257729 A JP8257729 A JP 8257729A JP 25772996 A JP25772996 A JP 25772996A JP H1084137 A JPH1084137 A JP H1084137A
Authority
JP
Japan
Prior art keywords
sealing member
light emitting
light
emitting device
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8257729A
Other languages
Japanese (ja)
Inventor
Katsuki Nakajima
克起 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Priority to JP8257729A priority Critical patent/JPH1084137A/en
Publication of JPH1084137A publication Critical patent/JPH1084137A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which can increase its light utilization efficiency and light coupling efficiency with an optical fiber, by collecting forward light emitted therefrom. SOLUTION: A resin molded part 15 has a double structure of an inner sealing member 16 and an outer sealing member 17. The inner sealing member 16 is made of transparent resin material having a relatively large refractive index, and is shaped to, e.g. a truncated cone. The outer sealing member 17 is made of transparent or semi-transparent resin material having a relatively small refractive index. Such a light emitting element 13 as an LED is sealed on a side of the inner sealing member 16 having a small area, while an end face of a side of the inner sealing member 16 having a large area is exposed from the outer sealing member 17.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、発光デバイスおよ
びその製造方法に関する。特に、LEDチップのような
発光素子を樹脂モールドした発光デバイス及びその製造
方法に関する。
[0001] The present invention relates to a light emitting device and a method for manufacturing the same. In particular, the present invention relates to a light emitting device in which a light emitting element such as an LED chip is resin-molded, and a method for manufacturing the same.

【0002】[0002]

【従来の技術】図1は従来より用いられている発光デバ
イスAの構造を示す断面図である。この発光デバイスA
は、2本のリード1a,1bを備えている。一方のリー
ド1aの先端には凹球面状をした反射板2が形成されて
おり、反射板2の上にLED(発光ダイオード)等の発
光素子3がダイボンドにより実装されている。また、発
光素子3と他方のリード1bとはAu線4によりワイヤ
ボンディングされている。発光素子3やAu線4等を保
護するため、発光デバイスAは一種類の透明な封止部材
(エポキシ樹脂)5で封止することでパッケージされて
いる。
2. Description of the Related Art FIG. 1 is a sectional view showing a structure of a light emitting device A conventionally used. This light emitting device A
Has two leads 1a and 1b. A reflector 2 having a concave spherical shape is formed at the tip of one lead 1a, and a light emitting element 3 such as an LED (light emitting diode) is mounted on the reflector 2 by die bonding. The light emitting element 3 and the other lead 1b are wire-bonded by the Au wire 4. In order to protect the light emitting element 3 and the Au wire 4, the light emitting device A is packaged by being sealed with one kind of transparent sealing member (epoxy resin) 5.

【0003】しかして、発光素子3を発光させると、発
光素子3から前方へ出射された光は、封止部材5の前面
から外部へ取り出される。また、発光素子3から背面方
向および側方へ出射される光を反射板2によって前方へ
反射させることによって、発光デバイスAの前面輝度を
高めている。
When the light emitting element 3 emits light, the light emitted forward from the light emitting element 3 is extracted from the front surface of the sealing member 5 to the outside. In addition, the light emitted from the light emitting element 3 toward the back and side is reflected forward by the reflector 2, thereby increasing the front luminance of the light emitting device A.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、図1の
ような発光デバイスAにあっては、反射板2は比較的小
さなものであるため一部の光を前面へ向かわせるに過ぎ
ず、また封止部材5の表面で全反射して背面方向や側面
方向へ向かう光もあり、発光素子3から出た光は透明な
封止部材5の全面から出射されていた。このため、発光
デバイスAのある方向から出射される光を利用しようと
すると、別な方向へ出射される光を利用することができ
ず、光の利用効率が悪かった。
However, in the light emitting device A as shown in FIG. 1, since the reflector 2 is relatively small, only a part of the light is directed to the front, and the light is not sealed. There is also light that is totally reflected on the surface of the stop member 5 and travels in the back direction or the side direction, and the light emitted from the light emitting element 3 is emitted from the entire surface of the transparent sealing member 5. For this reason, when trying to use light emitted from one direction of the light emitting device A, light emitted in another direction cannot be used, and the light use efficiency is poor.

【0005】特に、発光デバイスAをプラスチック光フ
ァイバ6と結合させる場合には、図2に示すように、発
光素子3から出射した光Rのうち大部分は光ファイバ6
(図2にはコアのみを示している)のコア径よりも外側
の領域へ出射されて光ファイバ6と結合しないので、光
結合効率が低く、発光デバイスAと光ファイバ6との結
合効率は数%であった。例えば、コアの直径が1mmの
光ファイバ6の場合には、光結合効率は約6.5%でし
かなかった。
In particular, when the light emitting device A is coupled with the plastic optical fiber 6, as shown in FIG.
(Only the core is shown in FIG. 2). The light is emitted to a region outside the core diameter and does not couple with the optical fiber 6, so that the optical coupling efficiency is low, and the coupling efficiency between the light emitting device A and the optical fiber 6 is low. A few percent. For example, in the case of the optical fiber 6 having a core diameter of 1 mm, the optical coupling efficiency was only about 6.5%.

【0006】光の利用効率を向上させるためには、封止
部材の外周面や背面に金属蒸着膜を設け、側面方向や背
面へ出射された光を金属蒸着膜で反射させる方法があ
る。しかし、金属蒸着膜は湿気に弱いので、金属蒸着膜
が露出しないよう非透湿性の保護膜で包み込むように覆
って保護する必要がある。また、金属蒸着膜をリード等
から電気的に絶縁する必要がある。このため、発光デバ
イスの構造が複雑となり、製造が困難になるという問題
があった。
In order to improve the light use efficiency, there is a method in which a metal vapor-deposited film is provided on the outer peripheral surface or the rear surface of the sealing member, and light emitted to the side direction or the rear surface is reflected by the metal vapor-deposited film. However, since the metal deposition film is vulnerable to moisture, it is necessary to cover and cover the metal deposition film with a moisture-impermeable protective film so as not to be exposed. Further, it is necessary to electrically insulate the metal deposition film from the leads and the like. For this reason, there has been a problem that the structure of the light emitting device becomes complicated and manufacturing becomes difficult.

【0007】また、光ファイバとの結合効率を向上させ
るためには、図2から分かるように、発光素子3と光フ
ァイバ6の端面との距離を短くすればよい。しかしなが
ら、このためには発光素子3から封止部材5の光出射面
(前面)までの距離を短くする必要があるので、封止部
材5の前面から発光素子3に湿気が到達し易くなり、発
光デバイスの劣化速度が大きくなる。従って、発光素子
から封止部材の前面までの距離を短くすることは、実際
上困難であった。
In order to improve the coupling efficiency with the optical fiber, the distance between the light emitting element 3 and the end face of the optical fiber 6 may be shortened, as can be seen from FIG. However, for this purpose, it is necessary to shorten the distance from the light emitting element 3 to the light emitting surface (front surface) of the sealing member 5, so that moisture easily reaches the light emitting element 3 from the front surface of the sealing member 5, The deterioration speed of the light emitting device increases. Therefore, it was practically difficult to shorten the distance from the light emitting element to the front surface of the sealing member.

【0008】また、光ファイバと発光デバイスを結合し
て使用する場合、発光デバイスの製造工程等における封
止部材内で発光素子の位置ばらつきが存在すると、発光
デバイス(封止部材)の中心と光ファイバの光軸とを位
置合せしても、発光素子と光ファイバの光軸とが一致せ
ず、これが原因で光結合効率の低下を招いていた。
Further, when an optical fiber and a light emitting device are combined and used, if there is a variation in the position of the light emitting element in the sealing member in the manufacturing process of the light emitting device, etc., the center of the light emitting device (sealing member) and the light Even if the optical axis of the fiber is aligned, the light emitting element and the optical axis of the optical fiber do not match, which causes a reduction in optical coupling efficiency.

【0009】本発明は叙上の従来例の欠点に鑑みてなさ
れたものであり、その目的とするところは、発光デバイ
スにおける光の利用効率を向上させ、また発光デバイス
と光ファイバとを結合させる場合には、その光結合効率
を向上させることにある。
The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has as its object to improve the light use efficiency of a light emitting device and to couple a light emitting device to an optical fiber. In such a case, the object is to improve the optical coupling efficiency.

【0010】[0010]

【発明の開示】請求項1に記載の発光デバイスは、発光
素子を透明ないし半透明のパッケージ内に封止し、発光
素子から出射した光をパッケージの外部へ取り出す発光
デバイスにおいて、前記パッケージは高屈折率材料から
なる透明な封止部材と低屈折率材料からなる透明ないし
半透明の封止部材とからなり、前記高屈折率材料からな
る封止部材の外側に前記低屈折率材料からなる封止部材
が形成されていることを特徴としている。
The light emitting device according to claim 1, wherein the light emitting element is sealed in a transparent or translucent package and light emitted from the light emitting element is taken out of the package. A sealing member made of a transparent sealing member made of a refractive index material and a transparent or translucent sealing member made of a low refractive index material, and a sealing member made of the low refractive index material outside a sealing member made of the high refractive index material. It is characterized in that a stop member is formed.

【0011】請求項1に記載の発光デバイスにあって
は、高屈折率材料からなる封止部材の外側に低屈折率材
料からなる封止部材が形成されているから、高屈折率材
料からなる封止部材から両封止部材の境界面へ向かう光
を全反射させることによって光の進む方向を変換するこ
とができる。従って、高屈折率材料からなる封止部材と
低屈折率材料からなる封止部材の境界面の形状を工夫す
ることにより、発光素子から出射されて境界面で反射し
た光を一方向に集めることができる。よって、発光デバ
イスから一方向に出射される光の光量を増大させること
ができ、発光デバイスの一方向の面から大部分の光を取
り出すことができるようになり、光の利用効率を向上さ
せることができる。
In the light emitting device according to the first aspect, since the sealing member made of the low refractive index material is formed outside the sealing member made of the high refractive index material, the light emitting device is made of the high refractive index material. The direction in which light travels can be changed by totally reflecting light from the sealing member toward the boundary surface between the two sealing members. Therefore, by devising the shape of the boundary surface between the sealing member made of the high-refractive-index material and the sealing member made of the low-refractive-index material, light emitted from the light emitting element and reflected at the boundary surface can be collected in one direction. Can be. Accordingly, the amount of light emitted from the light emitting device in one direction can be increased, and most of the light can be extracted from the surface of the light emitting device in one direction, thereby improving the light use efficiency. Can be.

【0012】請求項2に記載の発光デバイスは、発光素
子を透明ないし半透明のパッケージ内に封止し、発光素
子から出射した光をパッケージの外部へ取り出す発光デ
バイスにおいて、前記パッケージは高屈折率材料からな
る透明な封止部材と低屈折率材料からなる透明ないし半
透明の封止部材とからなり、前記発光素子から出射され
た光が、前記高屈折率材料からなる封止部材と前記低屈
折率材料からなる封止部材との境界面で全反射されてパ
ッケージから外部へ取り出されるようにしたことを特徴
としている。
According to a second aspect of the present invention, in the light emitting device, the light emitting element is sealed in a transparent or translucent package, and the light emitted from the light emitting element is taken out of the package. A light-emitting element comprising a transparent sealing member made of a material and a transparent or translucent sealing member made of a low-refractive-index material; It is characterized in that the light is totally reflected at the interface with the sealing member made of a refractive index material and is taken out of the package.

【0013】請求項2に記載の発光デバイスにあって
は、封止部材が高屈折率材料からなる封止部材と低屈折
率材料とから構成されているから、高屈折率材料からな
る封止部材と低屈折率材料からなる封止部材の境界面で
光を全反射させることによって光の進む方向を変換する
ことができる。従って、高屈折率材料からなる封止部材
と低屈折率材料からなる封止部材の境界面の形状を工夫
することにより、発光素子から出射されて境界面で反射
した光を一方向に集めることができる。よって、発光デ
バイスから一方向に出射される光の光量を増大させるこ
とができ、発光デバイスの一方向の面から大部分の光を
取り出すことができるようになり、光の利用効率を向上
させることができる。
In the light emitting device according to the second aspect, since the sealing member is composed of the sealing member made of the high refractive index material and the low refractive index material, the sealing made of the high refractive index material is used. The direction in which light travels can be changed by totally reflecting light at the interface between the member and the sealing member made of a low refractive index material. Therefore, by devising the shape of the boundary surface between the sealing member made of the high-refractive-index material and the sealing member made of the low-refractive-index material, light emitted from the light emitting element and reflected at the boundary surface can be collected in one direction. Can be. Accordingly, the amount of light emitted from the light emitting device in one direction can be increased, and most of the light can be extracted from the surface of the light emitting device in one direction, thereby improving the light use efficiency. Can be.

【0014】また、請求項1及び2に記載の発光デバイ
スにあっては、光の利用効率を向上させて発光デバイス
から一方向へ出射される光の量を増加させているから、
この方向において発光デバイスと光ファイバとを結合さ
せることにより、発光デバイスと光ファイバとの結合効
率を向上させることができる。
Further, in the light emitting device according to the first and second aspects, the efficiency of light utilization is improved to increase the amount of light emitted from the light emitting device in one direction.
By coupling the light emitting device and the optical fiber in this direction, the coupling efficiency between the light emitting device and the optical fiber can be improved.

【0015】しかも、請求項1及び2に記載の発光デバ
イスによれば、樹脂等からなる封止部材を少なくとも2
重構造としているので、湿気に対して強い構造となる。
従って、金属蒸着膜を用いる方法や発光素子と封止部材
の前面との距離を短くする方法のように湿度に対する耐
久性が悪化することがない。
Further, according to the light emitting device according to the first and second aspects, the sealing member made of resin or the like is at least two-sided.
Due to the heavy structure, the structure is strong against moisture.
Therefore, the durability against humidity is not deteriorated unlike the method using a metal deposition film or the method of shortening the distance between the light emitting element and the front surface of the sealing member.

【0016】さらに、請求項1及び2に記載の発光デバ
イスによれば、発光素子の実装位置ばらつき等があって
も、発光素子と光ファイバとの光結合効率にばらつきを
生じることがない。
Further, according to the light emitting device of the first and second aspects, even if the mounting position of the light emitting element varies, the optical coupling efficiency between the light emitting element and the optical fiber does not vary.

【0017】請求項3に記載の発光デバイスの製造方法
は、請求項1に記載された発光デバイスを製造するため
の方法であって、低屈折率材料により予め成形されてい
る前記封止部材の中空内部に発光素子を配置する工程
と、前記低屈折率材料からなる封止部材の中空内部に透
明な高屈折率材料を注入して、低屈折率材料からなる封
止部材中に高屈折率材料からなる封止部材を成形すると
共に高屈折率材料からなる封止部材内に前記発光素子を
封止する工程と、を備えたことを特徴としている。
According to a third aspect of the present invention, there is provided a method for manufacturing a light emitting device according to the first aspect, wherein the sealing member is formed of a low refractive index material in advance. Disposing a light-emitting element in the hollow interior, injecting a transparent high-refractive-index material into the hollow interior of the sealing member made of the low-refractive-index material; Forming a sealing member made of a material and sealing the light emitting element in a sealing member made of a high refractive index material.

【0018】請求項3に記載の発光デバイスの製造方法
によれば、発光デバイスの製造工程において発光素子に
余分な振動や外力が加わったり、成形圧が加わったりす
る恐れが少なく、発光デバイス製造の歩留りを向上させ
ることができ、信頼性の高い発光デバイスを得ることが
できる。
According to the method for manufacturing a light emitting device according to the third aspect, there is little possibility that extra vibration, external force, or molding pressure is applied to the light emitting element in the manufacturing process of the light emitting device. The yield can be improved, and a highly reliable light-emitting device can be obtained.

【0019】[0019]

【発明の実施の形態】図3(a)(b)は、本発明の一
実施形態による発光デバイスBを示す断面図及び正面図
である。この発光デバイスBにあっては、板棒状をした
一方のリード11aの先端に皿状をした反射板12が形
成されており、反射板12の内面にLED(発光ダイオ
ード)チップやLD(半導体レーザー)チップ等の発光
素子13がダイボンドされ、発光素子13と他方のリー
ド11bとはAu線のようなボンディングワイヤ14に
よって接続されている。発光素子13やリード11a,
11b先端部などは錐台形状をした樹脂モールド部15
(パッケージ)に封止されており、発光素子13やボン
ディングワイヤ14は樹脂モールド部15によって保護
されている。
3 (a) and 3 (b) are a sectional view and a front view showing a light emitting device B according to an embodiment of the present invention. In this light emitting device B, a dish-shaped reflector 12 is formed at the tip of one of the plate-shaped leads 11a, and an LED (light emitting diode) chip or an LD (semiconductor laser) is formed on the inner surface of the reflector 12. A light emitting element 13 such as a chip is die-bonded, and the light emitting element 13 and the other lead 11b are connected by a bonding wire 14 such as an Au wire. The light emitting element 13 and the leads 11a,
11b is a resin mold portion 15 having a frustum shape at the tip end and the like.
(The package), and the light emitting element 13 and the bonding wire 14 are protected by the resin mold portion 15.

【0020】樹脂モールド部15は2重構造となってお
り、内側は屈折率の高い透明樹脂材料(エポキシ樹脂、
ポリカーボネイト樹脂など)からなる封止部材(以下、
内側封止部材という)16となっており、その外側には
内側封止部材16を包むようにして屈折率の低い透明も
しくは半透明の樹脂材料(メタクリル樹脂、シリコン樹
脂、フッ素樹脂など)からなる封止部材(以下、外側封
止部材という)17が形成されている。内側封止部材1
6は錐台形状をしており、面積の小さな側の端面の近傍
において内側封止部材16の中心軸上に発光素子13が
封止されており、面積の大きな側の端面が光出射面(前
面)となっていて外側封止部材17から露出している。
The resin mold portion 15 has a double structure, and a transparent resin material having a high refractive index (epoxy resin,
A sealing member (hereinafter, referred to as a polycarbonate resin)
The outside sealing member 16 is formed of a transparent or translucent resin material (methacrylic resin, silicon resin, fluororesin, etc.) having a low refractive index so as to wrap the inside sealing member 16. A member (hereinafter, referred to as an outer sealing member) 17 is formed. Inner sealing member 1
Numeral 6 has a frustum shape, and the light emitting element 13 is sealed on the central axis of the inner sealing member 16 in the vicinity of the end face on the small area side, and the end face on the large area side is the light emitting surface ( Front surface) and is exposed from the outer sealing member 17.

【0021】また、外側封止部材17は略錐台形状もし
くは円筒状もしくは角筒状をしており、面積の大きな側
の端面からはリード11a,11bが延出し、この端面
の外周部にはフランジ18が形成されており、面積の小
さな側の端面には内側封止部材16が露出している。フ
ランジ18の一部には切り欠き19が設けられている。
なお、内側封止部材16及び外側封止部材17について
言う錐台形状とは、図3に示すような円錐台形状に限ら
ず、角錐台形状でもよい。さらには、幾何学的な錐台形
状に限らず、ほぼ錐台形状を保ったままで変形したもの
でもよい。
The outer sealing member 17 has a substantially frustum shape, a cylindrical shape, or a rectangular tube shape, and leads 11a and 11b extend from an end surface having a larger area. A flange 18 is formed, and the inner sealing member 16 is exposed at the end surface on the side with the smaller area. A notch 19 is provided in a part of the flange 18.
The frustum shape referred to for the inner sealing member 16 and the outer sealing member 17 is not limited to the truncated cone shape as shown in FIG. 3, but may be a truncated pyramid shape. Further, the shape is not limited to the geometrical frustum shape, and may be a shape deformed while substantially maintaining the frustum shape.

【0022】しかして、図3(a)に示すように、発光
素子13から前方へ出射された光Rは内側封止部材16
の前面から出射される。また、発光素子13から側面方
向へ出射された光Rのうち、内側封止部材16と外側封
止部材17の境界面Kで全反射した光Rは、前方へ向け
て進行方向を変換されて内側封止部材16の前面から外
部へ出射される。従って、従来であれば、発光デバイス
Bの側面から漏れていた光Rを発光デバイスBの前面へ
向けることができ、発光デバイスBの前面(光出射面)
からの出射光量を増大させ、発光デバイスBの光利用効
率を向上させることができる。
As shown in FIG. 3A, the light R emitted forward from the light emitting element 13 is
Is emitted from the front surface. Further, of the light R emitted from the light emitting element 13 in the lateral direction, the light R totally reflected at the boundary surface K between the inner sealing member 16 and the outer sealing member 17 is changed in the traveling direction toward the front. The light is emitted from the front surface of the inner sealing member 16 to the outside. Therefore, conventionally, the light R leaking from the side surface of the light emitting device B can be directed to the front surface of the light emitting device B, and the front surface (light emitting surface) of the light emitting device B
, The light use efficiency of the light emitting device B can be improved.

【0023】すなわち、図4に示すように、内側封止部
材16の屈折率をn1、外側封止部材17の屈折率をn2
とし、内側封止部材16の外周面(境界面K)の傾斜角
をγ、発光素子13からの光の出射角をθとすると、 θ ≦ γ+cos-1(n2/n1) であれば、発光素子13から出射されて内側封止部材1
6と外側封止部材17の境界面Kに達した光は両封止部
材16,17の境界面Kで反射されて内側封止部材16
の前面から出射される。従って、その分だけ発光デバイ
スBの前面から出射される光量が増加し、光の利用効率
が増大することになる。
That is, as shown in FIG. 4, the refractive index of the inner sealing member 16 is n 1 and the refractive index of the outer sealing member 17 is n 2.
Assuming that the inclination angle of the outer peripheral surface (boundary surface K) of the inner sealing member 16 is γ and the emission angle of light from the light emitting element 13 is θ, if θ ≦ γ + cos −1 (n 2 / n 1 ), The inner sealing member 1 emitted from the light emitting element 13
The light that has reached the boundary surface K between the inner sealing member 16 and the outer sealing member 17 is reflected by the boundary surface K between the two sealing members 16 and 17.
Is emitted from the front surface. Therefore, the amount of light emitted from the front surface of the light emitting device B increases by that much, and the light use efficiency increases.

【0024】このように発光デバイスAの光利用効率が
向上するので、発光デバイスBの前面に光ファイバ20
の端面を接触させるよう接続することにより、発光デバ
イスBから光ファイバ20に入射する光量を増加させる
ことができ、発光デバイスBと光ファイバ20との光結
合効率を向上させることができる。特に、図3に想像線
で示すように、内側封止部材16の開口端の直径を、光
ファイバ20の直径と同等か、それ以下とし、内側封止
部材16の端面を光ファイバ20の端面に突き合せるこ
とにより、発光デバイスBから出射される光のほぼすべ
てを光ファイバ20へ導くことができ、光結合効率を高
くすることができる。
As described above, since the light use efficiency of the light emitting device A is improved, the optical fiber 20 is disposed in front of the light emitting device B.
Can be increased so that the amount of light incident on the optical fiber 20 from the light emitting device B can be increased, and the optical coupling efficiency between the light emitting device B and the optical fiber 20 can be improved. In particular, as shown by an imaginary line in FIG. 3, the diameter of the open end of the inner sealing member 16 is equal to or smaller than the diameter of the optical fiber 20, and the end surface of the inner sealing member 16 is the end surface of the optical fiber 20. , Almost all of the light emitted from the light emitting device B can be guided to the optical fiber 20, and the optical coupling efficiency can be increased.

【0025】また、この発光デバイスBでは、内側封止
部材16と外側封止部材17との2重構造となっている
ので、封止性が高くなる。従って、湿気の侵入によって
発光素子13が劣化しにくく、発光デバイスBの耐環境
性や耐久性が向上する。
Further, the light emitting device B has a double structure of the inner sealing member 16 and the outer sealing member 17, so that the sealing property is improved. Therefore, the light emitting element 13 is hardly deteriorated by the invasion of moisture, and the environmental resistance and durability of the light emitting device B are improved.

【0026】このような発光デバイスBは、例えば、光
ファイバセンサ用投光モジュール、光電スイッチ、電子
機器の光送信器、光ファイバ通信用投光モジュール、電
子機器の表示灯などに用いて、長検出距離化、長伝送距
離化を達成し、高SN比を実現することができる。ま
た、表示灯として用いる場合には、その視認性も向上す
る。
Such a light emitting device B is used for a light emitting module for an optical fiber sensor, a photoelectric switch, a light transmitter for an electronic device, a light emitting module for an optical fiber communication, an indicator for an electronic device, and the like. A longer detection distance and longer transmission distance can be achieved, and a high SN ratio can be realized. When used as an indicator light, its visibility is also improved.

【0027】さらに、光電スイッチなどの投光装置に用
いる場合には、指向性を高めるための投光用レンズの必
要がなくなり、コストダウンを図れる。
Further, when used in a light projecting device such as a photoelectric switch, there is no need for a light projecting lens for improving the directivity, and the cost can be reduced.

【0028】また、内側封止部材16を錐台形状とした
発光デバイスBにあっては、発光素子13から出射され
た光を両封止部材16,17の境界面Kで全反射させる
ことにより、発光デバイスBの前面における光の出射角
度を小さくすることができるので、発光デバイスBの出
射開口数(NA)を小さくすることが可能になる。
In the light emitting device B in which the inner sealing member 16 has a frustum shape, the light emitted from the light emitting element 13 is totally reflected by the boundary surface K between the sealing members 16 and 17. Since the light emission angle at the front surface of the light emitting device B can be reduced, the light emitting device B can have a small emission numerical aperture (NA).

【0029】本発明の発光デバイスは、上記のような特
徴を有しているから、発光デバイスBの光を効率良く利
用でき、発光素子に注入する電流を抑えることができ、
発光デバイスBの長寿命化、低消費電力化、低発熱化を
図れる。
Since the light emitting device of the present invention has the above-mentioned features, the light of the light emitting device B can be used efficiently, and the current injected into the light emitting element can be suppressed.
It is possible to extend the life of the light emitting device B, reduce power consumption, and reduce heat generation.

【0030】また、封止部材が多重構造となっているの
で、発光素子の保護機能を保ったままで、さまざまな形
状の発光デバイスを製作することができる。
Further, since the sealing member has a multi-layer structure, light emitting devices of various shapes can be manufactured while maintaining the protection function of the light emitting element.

【0031】次に、上記発光デバイスBを成形により製
造する方法を説明する。まず、外側封止部材17の形状
を図5(a)(b)(c)の斜視図、平面図及び断面図
により説明する。外側封止部材17は、外形が例えば円
柱状ないし円錐台状をしており、一端にはフランジ18
が設けられており、フランジ18の一部には切り欠き1
9が設けられている。また、外側封止部材17の中心に
は、円柱状孔21と円錐状孔22とが連続するように形
成され、円柱状孔21の両側面から円錐状孔22の一部
側面にかけては平板状の凹部23が形成されている。
Next, a method of manufacturing the light emitting device B by molding will be described. First, the shape of the outer sealing member 17 will be described with reference to perspective views, plan views, and cross-sectional views of FIGS. 5A, 5B, and 5C. The outer sealing member 17 has, for example, a cylindrical or frusto-conical outer shape, and has a flange 18 at one end.
The flange 18 has a notch 1
9 are provided. A cylindrical hole 21 and a conical hole 22 are formed at the center of the outer sealing member 17 so as to be continuous, and a flat plate is formed from both side surfaces of the cylindrical hole 21 to some side surfaces of the conical hole 22. Are formed.

【0032】図6はこの外側封止部材17を成形するた
めの成形金型の構造を示す断面図であって、上金型24
と下金型25からなっている。下金型25には外側封止
部材17の外形を成形するためのキャビティ26が形成
されており、キャビティ26内の底面中央部には、円柱
状孔21と円錐状孔22を成形するための突起部27が
形成され、例えば外周面には樹脂を注入するためのゲー
ト口28が設けられている。また、上金型24の下面に
は、平板状の凹部23を成形するためのプレート部29
が設けられており、上金型24と下金型25を閉じると
プレート部29の内側面が円柱状孔21と円錐状孔22
の側面に密着するようになっている(図6の2点鎖線
は、上金型24を閉じたときのプレート部29の位置を
示す)。従って、上金型24と下金型25を閉じた状態
でゲート口28からキャビティ26内にメタクリル樹脂
(PMMA)のような樹脂材料を加圧注入した後、上金
型24と下金型25を開いて脱型することにより外側封
止部材17が成形される。
FIG. 6 is a sectional view showing the structure of a molding die for molding the outer sealing member 17.
And a lower mold 25. A cavity 26 for forming the outer shape of the outer sealing member 17 is formed in the lower mold 25, and a cylindrical hole 21 and a conical hole 22 for forming a cylindrical hole 21 and a conical hole 22 are formed in the center of the bottom surface in the cavity 26. A projection 27 is formed, and a gate port 28 for injecting a resin is provided on the outer peripheral surface, for example. A plate portion 29 for forming the flat recess 23 is formed on the lower surface of the upper mold 24.
When the upper mold 24 and the lower mold 25 are closed, the inner side surface of the plate portion 29 has a cylindrical hole 21 and a conical hole 22.
(A two-dot chain line in FIG. 6 shows the position of the plate portion 29 when the upper mold 24 is closed). Accordingly, a resin material such as methacrylic resin (PMMA) is injected under pressure into the cavity 26 from the gate port 28 with the upper mold 24 and the lower mold 25 closed, and then the upper mold 24 and the lower mold 25 are closed. The outer sealing member 17 is formed by opening and removing the mold.

【0033】なお、外側封止部材17は、上記のように
メタクリル樹脂を用いて射出成形することができるが、
外側封止部材17を成形するための成形樹脂材料として
は、比較的低屈折率の熱硬化性樹脂で注型するのが理想
的である。
The outer sealing member 17 can be injection-molded using methacrylic resin as described above.
As a molding resin material for molding the outer sealing member 17, it is ideal to cast a thermosetting resin having a relatively low refractive index.

【0034】図7(a)は内側封止部材16を成形する
ための成形金型を示す一部破断した断面図、図7(b)
はその下金型の一部破断した平面図である。下金型30
には、外側封止部材17の外形と同じ形状のキャビティ
31が形成されており、開口のフランジ成形部32には
外側封止部材17の切り欠き19と一致した形状の位置
決め部33が設けられている。キャビティ31の底面に
は、樹脂を注入するためのゲート口34が設けられてい
る。上金型35,35は2分割されており、両上金型3
5,35の対向部分にはリード11a,11bを挟み込
むための凹欠部36,36が設けられている。
FIG. 7A is a partially broken sectional view showing a molding die for molding the inner sealing member 16, and FIG.
Is a partially broken plan view of the lower mold. Lower mold 30
Is formed with a cavity 31 having the same shape as the outer shape of the outer sealing member 17, and a positioning portion 33 having a shape corresponding to the notch 19 of the outer sealing member 17 is provided in the flange forming portion 32 of the opening. ing. A gate port 34 for injecting a resin is provided on the bottom surface of the cavity 31. The upper dies 35, 35 are divided into two, and both upper dies 3
The concave portions 36, 36 for sandwiching the leads 11a, 11b are provided in the opposing portions of 5,5.

【0035】しかして、内側封止部材16を成形する場
合には、図8に示すように、下金型30のキャビティ3
1内に予め成形されている外側封止部材17を挿入して
納める(通常は、1つの金型により同時多数個取りされ
るが、ここでは1つだけを示す)。このとき外側封止部
材17のフランジ18に設けられている切り欠き19と
キャビティ31開口の位置決め部33を一致させること
により外側封止部材17の方向が位置決めされ、リード
11a,11bの挿入方向が一定方向に決められる。ま
た、このときゲート口34は外側封止部材17の円錐状
孔22に対向する。ついで、発光素子13を実装された
一対のリード11a,11bを外側封止部材17の円柱
状孔21及び凹部23に挿入して位置決めした後、図9
に示すように、上金型35,35を下金型30の上面に
載せて閉じ、上金型35,35の凹欠部36,36間に
リード11a,11bを挟み込んで固定すると共に上金
型35,35によってキャビティ31を密閉する。この
状態でゲート口34からポリカーボネイト樹脂のような
樹脂材料を注入することにより外側封止部材17の内部
に内側封止部材16を成形し、発光素子13を内側封止
部材16により封止する。こうして製作された発光デバ
イスBは、上金型35,35を開いてキャビティ31か
ら取り出され、各リード11a,11bがリードフレー
ムから切り離される。
When the inner sealing member 16 is to be formed, as shown in FIG.
The outer sealing member 17 formed in advance is inserted into the inside 1 (usually, a large number of pieces are taken simultaneously by one mold, but only one is shown here). At this time, by aligning the notch 19 provided on the flange 18 of the outer sealing member 17 with the positioning portion 33 of the opening of the cavity 31, the direction of the outer sealing member 17 is determined, and the insertion direction of the leads 11a and 11b is changed. Determined in a certain direction. At this time, the gate port 34 faces the conical hole 22 of the outer sealing member 17. Next, after a pair of leads 11a and 11b on which the light emitting element 13 is mounted are inserted and positioned in the cylindrical hole 21 and the concave portion 23 of the outer sealing member 17, FIG.
As shown in the figure, the upper molds 35, 35 are placed on the upper surface of the lower mold 30 and closed, and the leads 11a, 11b are sandwiched and fixed between the concave notches 36, 36 of the upper molds 35, 35, and the upper mold is fixed. The cavity 31 is sealed by the molds 35, 35. In this state, the inner sealing member 16 is molded inside the outer sealing member 17 by injecting a resin material such as polycarbonate resin from the gate port 34, and the light emitting element 13 is sealed by the inner sealing member 16. The light emitting device B manufactured in this manner is taken out of the cavity 31 by opening the upper molds 35, 35, and the respective leads 11a, 11b are separated from the lead frame.

【0036】なお、外側封止部材17がメタクリル樹脂
であれば、ポリカーボネイト樹脂を上記のように射出成
形することにより内側封止部材16を成形することがで
きるが、外側封止部材17が熱硬化性樹脂製であれば、
金型温度を150℃程度にしてエポキシ樹脂により注型
成形することもできる。
If the outer sealing member 17 is a methacrylic resin, the inner sealing member 16 can be formed by injection molding a polycarbonate resin as described above. If it is made of conductive resin,
Casting molding with an epoxy resin at a mold temperature of about 150 ° C. is also possible.

【0037】上記のようにして発光デバイスBを製造す
ることにより、2種類の封止部材16,17を有する発
光デバイスBの信頼性を向上させることができる。すな
わち、上記本発明の方法とは異なり、先に発光素子13
を内側封止部材16に封止した後、その外側に外側封止
部材17を成形すると、外側封止部材17の成形収縮に
よって内側封止部材16に圧縮応力が発生し、内部の発
光素子13に大きなストレスを加えることになる。ま
た、外側封止部材17単独で成形せず、外側封止部材1
7を発光素子13の実装されたリード11a,11bと
一体成形すると、リード11a先端の発光素子13は外
側封止部材17の内側で宙に浮いた状態で保持されるこ
とになり、外側封止部材17のハンドリング中にボンデ
ィングワイヤ14が外れたりする恐れがある。これに対
し、本発明の方法によれば、発光素子13に大きなスト
レスが加わったり、ボンディングワイヤ14が外れたり
する恐れがなく、製造工程における取り扱いが簡単にな
ると共に発光デバイスBの歩留りが向上する。
By manufacturing the light emitting device B as described above, the reliability of the light emitting device B having the two kinds of sealing members 16 and 17 can be improved. That is, unlike the method of the present invention, the light emitting element 13
Is sealed in the inner sealing member 16 and then the outer sealing member 17 is molded on the outside thereof. When the outer sealing member 17 is molded and contracted, a compressive stress is generated in the inner sealing member 16 and the inner light emitting element 13 Will put a great deal of stress on you. Further, the outer sealing member 17 is not formed by itself,
When the lead 7 is integrally formed with the leads 11a and 11b on which the light emitting element 13 is mounted, the light emitting element 13 at the tip of the lead 11a is held in a state of being suspended inside the outer sealing member 17, and thus the outer sealing is performed. During the handling of the member 17, the bonding wire 14 may come off. On the other hand, according to the method of the present invention, there is no fear that a large stress is applied to the light emitting element 13 or the bonding wire 14 comes off, so that the handling in the manufacturing process is simplified and the yield of the light emitting device B is improved. .

【0038】なお、このようにして発光デバイスBを製
造する場合、円柱状孔21の内部にも内側封止部材16
が充填されるので、ここから光が漏れて光損失となる恐
れがあるが、ここは反射板12の陰になっているので、
光が漏れる恐れはほとんどない。
When the light emitting device B is manufactured as described above, the inner sealing member 16 is also provided inside the cylindrical hole 21.
Is filled, there is a possibility that light leaks from here, resulting in light loss. However, since this is behind the reflection plate 12,
There is little risk of light leaking.

【0039】(第2の実施形態)図10は本発明の別な
実施形態による発光デバイスCを示す断面図である。こ
の発光デバイスCにあっては、内側封止部材16を円柱
状もしくは角柱状に形成している(すなわち、第1の実
施形態においてγ=0とした場合に相当する)。この場
合でも、発光素子13から出射された光Rは、内側封止
部材16と外側封止部材17との境界面Kで全反射され
ることによって外側へ広がることなく内側封止部材16
内部を伝搬する。従って、内側封止部材16の直径ない
し発光デバイスCの光出射開口を、光ファイバ20の直
径よりも小さくしておくことにより、光ファイバ20と
の結合効率や光利用効率を向上させることができる。
(Second Embodiment) FIG. 10 is a sectional view showing a light emitting device C according to another embodiment of the present invention. In this light emitting device C, the inner sealing member 16 is formed in a columnar or prismatic shape (that is, it corresponds to the case where γ = 0 in the first embodiment). Also in this case, the light R emitted from the light emitting element 13 is totally reflected at the boundary surface K between the inner sealing member 16 and the outer sealing member 17 and does not spread to the outside without being spread outward.
Propagate inside. Therefore, by making the diameter of the inner sealing member 16 or the light emission opening of the light emitting device C smaller than the diameter of the optical fiber 20, the coupling efficiency with the optical fiber 20 and the light use efficiency can be improved. .

【0040】シミュレーションによれば、コア径が直径
1mmのプラスチック光ファイバ20について光結合効
率を求めた結果では、本発明の発光デバイスCによれ
ば、従来例の発光デバイスAの光結合効率の1.92倍
となり、大幅な性能向上が見込めた。
According to the simulation, the light coupling efficiency of the plastic optical fiber 20 having a core diameter of 1 mm was found to be 1% of the light coupling efficiency of the conventional light emitting device A according to the light emitting device C of the present invention. It was .92 times, and significant performance improvement was expected.

【0041】また、本発明の発光デバイスにあっては、
両封止部材16,17の屈折率n1、n2を調整して発光
デバイスのNA(開口数)が光ファイバ20のNAに等
しくなるようにすることにより、光ファイバ20からの
出射光のNAを光ファイバ20の長さに依存せず、一定
となるようにすることができる。例えば、プラスチック
光ファイバ(POF)20はNA=0.5であるので、
図9の実施形態でいえば、両封止部材16,17の屈折
率n1、n2が、 (n1 2−n2 21/2≒0.5 となるような光学材料を選択すればよい。
In the light emitting device of the present invention,
By adjusting the refractive indices n 1 and n 2 of the sealing members 16 and 17 so that the NA (numerical aperture) of the light emitting device becomes equal to the NA of the optical fiber 20, the light emitted from the optical fiber 20 is reduced. The NA can be made constant without depending on the length of the optical fiber 20. For example, since the plastic optical fiber (POF) 20 has NA = 0.5,
Speaking in the embodiment of FIG. 9, selected refractive indexes n 1, n 2 of Ryofutome members 16 and 17, an optical material such that (n 1 2 -n 2 2) 1/2 ≒ 0.5 do it.

【0042】さらに、本発明の発光デバイスにあって
は、製造工程におけるばらつき等によって発光素子13
が発光デバイスの中心軸がずれていても、発光素子13
が内側封止部材16内に封止されている限り、光ファイ
バ20との光結合効率が変化したり、ばらついたりする
ことがない。すなわち、図9の実施形態で説明すれば、
発光素子13が内側封止部材16の内部にあれば、実線
で示すように発光素子13が内側封止部材16の中心に
位置していても、破線で示すように発光素子13が内側
封止部材16の中心から外れた位置にあっても、境界面
Kで反射することによって発光素子13の位置ばらつき
は問題とならなくなる。
Further, in the light emitting device of the present invention, the light emitting element 13
Are not aligned even if the center axis of the light emitting device is shifted.
As long as is sealed in the inner sealing member 16, the optical coupling efficiency with the optical fiber 20 does not change or fluctuate. That is, in the embodiment of FIG. 9,
If the light emitting element 13 is inside the inner sealing member 16, even if the light emitting element 13 is located at the center of the inner sealing member 16 as shown by the solid line, the light emitting element 13 is sealed inside as shown by the broken line. Even at a position deviated from the center of the member 16, the position variation of the light emitting element 13 does not pose a problem due to reflection at the boundary surface K.

【0043】(第3の実施形態)図11は、本発明のさ
らに別な実施形態による発光デバイスDを示す断面図で
ある。この発光デバイスDにあっては、内側封止部材1
6と外側封止部材17の双方を透明樹脂によって形成し
ており、発光素子13は錐台形状をした内側封止部材1
6の背面において外側封止部材17の内部に封止されて
いる。
(Third Embodiment) FIG. 11 is a sectional view showing a light emitting device D according to still another embodiment of the present invention. In this light emitting device D, the inner sealing member 1
6 and the outer sealing member 17 are both formed of a transparent resin, and the light emitting element 13 has a frustum-shaped inner sealing member 1.
6 is sealed inside the outer sealing member 17 on the back surface.

【0044】このようにして発光素子13を外側封止部
材17の内部に封止した場合であっても、発光素子13
から外側封止部材17中へ出射された光のうち前方の内
側封止部材16中へ入射した光は、第1の実施形態の場
合と同様にして内側封止部材16と外側封止部材17と
の境界面Kで全反射して内側封止部材16の前面から外
部へ出射される。
Even when the light emitting element 13 is sealed inside the outer sealing member 17 in this manner, the light emitting element 13
Out of the light emitted into the outer sealing member 17 through the inner sealing member 16 in the same manner as in the first embodiment. The light is totally reflected at the boundary surface K between the inner sealing member 16 and emitted from the front surface of the inner sealing member 16 to the outside.

【0045】従って、このような実施形態においても、
光の利用効率を向上させることができ、光ファイバ20
と接続する場合には、光ファイバ20との光結合効率を
向上させることができる。
Therefore, even in such an embodiment,
The use efficiency of light can be improved,
When the optical fiber 20 is connected, the optical coupling efficiency with the optical fiber 20 can be improved.

【0046】また、この場合には、発光素子13の位置
は内側封止部材16の背面にできるだけ近いほうが好ま
しいが、発光素子13を内側封止部材16の背面に近づ
けても発光デバイスCの封止性能に影響を与えることは
ない。
In this case, it is preferable that the position of the light emitting element 13 is as close as possible to the back surface of the inner sealing member 16. It does not affect the stopping performance.

【0047】(第4の実施形態)発光素子13の発光面
積は必ずしも十分に小さいとは限らず、発光面積が大き
い場合には、錐台形状をした内側封止部材16の場合に
は内側封止部材16と外側封止部材17の境界面Kで全
反射することなく境界面Kを通過する光の量も増加す
る。
(Fourth Embodiment) The light emitting area of the light emitting element 13 is not always small enough. When the light emitting area is large, the inner sealing member 16 having a frustum shape is used. The amount of light passing through the boundary surface K without being totally reflected at the boundary surface K between the stop member 16 and the outer sealing member 17 also increases.

【0048】このような場合には、大きな発光面積を有
する発光素子13の場合は、内側封止部材16の側面を
湾曲させるのが有効である。図12は本発明のさらに別
な実施形態による発光デバイスEを示す断面図であっ
て、このような発光デバイスの例を示しており、内側封
止部材16の後部側面を放物面状に形成して境界面Kに
湾曲面41を形成している。外側封止部材17と内側封
止部材16の間の境界面Kをこのような形状にすれば、
発光素子13から出射されて側面方向へ向かった光のう
ち前方へ向かせることができる光の量をより増加させる
ことができるので、光の利用効率がより向上する。特
に、発光面積の大きな発光素子13を用いている場合に
有効である。
In such a case, in the case of the light emitting element 13 having a large light emitting area, it is effective to curve the side surface of the inner sealing member 16. FIG. 12 is a cross-sectional view showing a light emitting device E according to still another embodiment of the present invention, showing an example of such a light emitting device, wherein the rear side surface of the inner sealing member 16 is formed in a parabolic shape. Thus, a curved surface 41 is formed on the boundary surface K. If the boundary surface K between the outer sealing member 17 and the inner sealing member 16 has such a shape,
Since the amount of light emitted from the light emitting element 13 and directed to the side, which can be directed forward, can be further increased, the light use efficiency is further improved. This is particularly effective when the light emitting element 13 having a large light emitting area is used.

【0049】(第5の実施形態)図13は本発明のさら
に別な実施形態による発光デバイスFを示す断面図であ
る。この発光デバイスFにあっては、内側封止部材16
の前面(光出射面)に凸レンズ状やフレネルレンズ状の
集光素子部42を形成している。内側封止部材16の前
面に凸レンズ状やフレネルレンズ状などの集光素子部4
2を設けているので、内側封止部材16の前面から外部
へ出射される光の発散を抑えることができる。なお、集
光素子部42の形成領域は外側封止部材17の前面にま
で及んでいてもよい。また、集光素子部42は、凸レン
ズ等の接着により形成してもよく、内側封止部材16に
一体成形されていてもよい。
(Fifth Embodiment) FIG. 13 is a sectional view showing a light emitting device F according to still another embodiment of the present invention. In this light emitting device F, the inner sealing member 16
A light-collecting element 42 in the form of a convex lens or Fresnel lens is formed on the front surface (light-emitting surface) of the light-emitting device. A light-collecting element portion 4 such as a convex lens shape or a Fresnel lens shape is provided on the front surface of the inner sealing member 16.
2, the divergence of light emitted from the front surface of the inner sealing member 16 to the outside can be suppressed. The formation region of the light-collecting element section 42 may extend to the front surface of the outer sealing member 17. Further, the light-collecting element section 42 may be formed by bonding a convex lens or the like, or may be formed integrally with the inner sealing member 16.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来例の発光デバイスを示す断面図である。FIG. 1 is a cross-sectional view showing a conventional light emitting device.

【図2】従来例の発光デバイスと光ファイバとの光の結
合する様子を示す概略説明図である。
FIG. 2 is a schematic explanatory view showing how light is coupled between a light emitting device and an optical fiber in a conventional example.

【図3】(a)(b)は本発明の一実施形態による発光
デバイスを示す断面図及び正面図である。
3A and 3B are a cross-sectional view and a front view showing a light emitting device according to one embodiment of the present invention.

【図4】同上の発光デバイスにおいて発光素子から出射
された光の挙動を説明する一部破断した断面図である。
FIG. 4 is a partially broken sectional view for explaining the behavior of light emitted from the light emitting element in the above light emitting device.

【図5】(a)(b)(c)は同上の発光デバイスに用
いられている外側封止部材の形状を示す斜視図、平面図
及び断面図である。
FIGS. 5A, 5B, and 5C are a perspective view, a plan view, and a cross-sectional view illustrating a shape of an outer sealing member used in the light emitting device of the above.

【図6】同上の外側封止部材を成形するための成形金型
を示す一部破断した断面図である。
FIG. 6 is a partially broken sectional view showing a molding die for molding the outer sealing member of the above.

【図7】(a)は内側封止部材を成形するための成形金
型を示す一部破断した断面図、(b)はその下金型の一
部破断した平面図である。
FIG. 7A is a partially cutaway sectional view showing a molding die for molding an inner sealing member, and FIG. 7B is a partially cutaway plan view of a lower mold thereof.

【図8】内側封止部材を成形するための成形金型(断
面)と、当該金型内に挿入される外側封止部材と、発光
素子を実装されたリードフレームとを示す図である。
FIG. 8 is a view showing a molding die (cross section) for molding an inner sealing member, an outer sealing member inserted into the die, and a lead frame on which a light emitting element is mounted.

【図9】成形金型内で外側封止部材の内部に樹脂を注入
して内側封止部材を成形する様子を示す断面図である。
FIG. 9 is a cross-sectional view showing a state in which a resin is injected into an outer sealing member in a molding die to form an inner sealing member.

【図10】本発明の別な実施形態による発光デバイスを
示す断面図である。
FIG. 10 is a sectional view showing a light emitting device according to another embodiment of the present invention.

【図11】本発明のさらに別な実施形態による発光デバ
イスを示す断面図である。
FIG. 11 is a sectional view showing a light emitting device according to still another embodiment of the present invention.

【図12】本発明のさらに別な実施形態による発光デバ
イスを示す断面図である。
FIG. 12 is a cross-sectional view illustrating a light emitting device according to yet another embodiment of the present invention.

【図13】本発明のさらに別な実施形態による発光デバ
イスを示す断面図である。
FIG. 13 is a sectional view showing a light emitting device according to still another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

13 発光素子 15 樹脂モールド部(パッケージ) 16 内側封止部材 17 外側封止部材 K 内側封止部材と外側封止部材との境界面 Reference Signs List 13 light emitting element 15 resin molded part (package) 16 inner sealing member 17 outer sealing member K boundary surface between inner sealing member and outer sealing member

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 発光素子を透明ないし半透明のパッケー
ジ内に封止し、発光素子から出射した光をパッケージの
外部へ取り出す発光デバイスにおいて、 前記パッケージは高屈折率材料からなる透明な封止部材
と低屈折率材料からなる透明ないし半透明の封止部材と
からなり、前記高屈折率材料からなる封止部材の外側に
前記低屈折率材料からなる封止部材が形成されているこ
とを特徴とする発光デバイス。
1. A light emitting device in which a light emitting element is sealed in a transparent or translucent package and light emitted from the light emitting element is taken out of the package, wherein the package is a transparent sealing member made of a high refractive index material. And a transparent or translucent sealing member made of a low refractive index material, wherein a sealing member made of the low refractive index material is formed outside the sealing member made of the high refractive index material. Light emitting device.
【請求項2】 発光素子を透明ないし半透明のパッケー
ジ内に封止し、発光素子から出射した光をパッケージの
外部へ取り出す発光デバイスにおいて、 前記パッケージは高屈折率材料からなる透明な封止部材
と低屈折率材料からなる透明ないし半透明の封止部材と
からなり、前記発光素子から出射された光が、前記高屈
折率材料からなる封止部材と前記低屈折率材料からなる
封止部材との境界面で全反射されてパッケージから外部
へ取り出されるようにしたことを特徴とする発光デバイ
ス。
2. A light-emitting device in which a light-emitting element is sealed in a transparent or translucent package and light emitted from the light-emitting element is taken out of the package, wherein the package is a transparent sealing member made of a high refractive index material. And a transparent or translucent sealing member made of a low-refractive-index material, and light emitted from the light-emitting element, wherein a sealing member made of the high-refractive-index material and a sealing member made of the low-refractive-index material A light emitting device which is totally reflected at a boundary surface between the light emitting device and the package and taken out of the package.
【請求項3】 請求項1に記載された発光デバイスを製
造するための方法であって、 低屈折率材料により予め成形されている前記封止部材の
中空内部に発光素子を配置する工程と、 前記低屈折率材料からなる封止部材の中空内部に透明な
高屈折率材料を注入して、低屈折率材料からなる封止部
材中に高屈折率材料からなる封止部材を成形すると共に
高屈折率材料からなる封止部材内に前記発光素子を封止
する工程と、を備えた発光デバイスの製造方法。
3. A method for manufacturing a light-emitting device according to claim 1, wherein a light-emitting element is disposed in a hollow interior of the sealing member which is pre-formed with a low refractive index material; Injecting a transparent high-refractive-index material into the hollow interior of the sealing member made of the low-refractive-index material, and molding the sealing member made of the high-refractive-index material into the sealing member made of the low-refractive-index material. Sealing the light emitting element in a sealing member made of a refractive index material.
JP8257729A 1996-09-06 1996-09-06 Light emitting device and manufacture thereof Pending JPH1084137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8257729A JPH1084137A (en) 1996-09-06 1996-09-06 Light emitting device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8257729A JPH1084137A (en) 1996-09-06 1996-09-06 Light emitting device and manufacture thereof

Publications (1)

Publication Number Publication Date
JPH1084137A true JPH1084137A (en) 1998-03-31

Family

ID=17310292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8257729A Pending JPH1084137A (en) 1996-09-06 1996-09-06 Light emitting device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPH1084137A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101077A (en) * 2001-09-25 2003-04-04 Pentax Corp Light-emitting diode
JP2008516463A (en) * 2004-10-12 2008-05-15 クリー インコーポレイテッド Side-coupled optical coupling device
JP2009070679A (en) * 2007-09-13 2009-04-02 Koito Mfg Co Ltd Lamp unit of vehicle headlight, and vehicle headlight
JP2010500739A (en) * 2006-08-09 2010-01-07 パナソニック株式会社 Light emitting device
US7918567B2 (en) 2004-06-10 2011-04-05 Olympus Corporation Light emitting device, manufacturing method for light emitting device, illumination device using light emitting device, and projector
JP2012507846A (en) * 2008-11-05 2012-03-29 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー LED with molded bidirectional optical components
JP2016114952A (en) * 2016-01-18 2016-06-23 凸版印刷株式会社 Colored forgery prevention structure and colored forgery prevention medium
US10099503B2 (en) 2011-05-25 2018-10-16 Toppan Printing Co., Ltd. Coloring forgery prevention structure and coloring forgery prevention medium

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101077A (en) * 2001-09-25 2003-04-04 Pentax Corp Light-emitting diode
US7918567B2 (en) 2004-06-10 2011-04-05 Olympus Corporation Light emitting device, manufacturing method for light emitting device, illumination device using light emitting device, and projector
JP2008516463A (en) * 2004-10-12 2008-05-15 クリー インコーポレイテッド Side-coupled optical coupling device
JP2010500739A (en) * 2006-08-09 2010-01-07 パナソニック株式会社 Light emitting device
JP2009070679A (en) * 2007-09-13 2009-04-02 Koito Mfg Co Ltd Lamp unit of vehicle headlight, and vehicle headlight
JP2012507846A (en) * 2008-11-05 2012-03-29 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー LED with molded bidirectional optical components
US10099503B2 (en) 2011-05-25 2018-10-16 Toppan Printing Co., Ltd. Coloring forgery prevention structure and coloring forgery prevention medium
JP2016114952A (en) * 2016-01-18 2016-06-23 凸版印刷株式会社 Colored forgery prevention structure and colored forgery prevention medium

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