JPH1084137A - Light emitting device and manufacture thereof - Google Patents

Light emitting device and manufacture thereof

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Publication number
JPH1084137A
JPH1084137A JP8257729A JP25772996A JPH1084137A JP H1084137 A JPH1084137 A JP H1084137A JP 8257729 A JP8257729 A JP 8257729A JP 25772996 A JP25772996 A JP 25772996A JP H1084137 A JPH1084137 A JP H1084137A
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JP
Japan
Prior art keywords
sealing member
light emitting
light
emitting device
refractive index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8257729A
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Japanese (ja)
Inventor
Katsuki Nakajima
克起 中島
Original Assignee
Omron Corp
オムロン株式会社
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Application filed by Omron Corp, オムロン株式会社 filed Critical Omron Corp
Priority to JP8257729A priority Critical patent/JPH1084137A/en
Publication of JPH1084137A publication Critical patent/JPH1084137A/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device which can increase its light utilization efficiency and light coupling efficiency with an optical fiber, by collecting forward light emitted therefrom. SOLUTION: A resin molded part 15 has a double structure of an inner sealing member 16 and an outer sealing member 17. The inner sealing member 16 is made of transparent resin material having a relatively large refractive index, and is shaped to, e.g. a truncated cone. The outer sealing member 17 is made of transparent or semi-transparent resin material having a relatively small refractive index. Such a light emitting element 13 as an LED is sealed on a side of the inner sealing member 16 having a small area, while an end face of a side of the inner sealing member 16 having a large area is exposed from the outer sealing member 17.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、発光デバイスおよびその製造方法に関する。 The present invention relates to relates to a light emitting device and a manufacturing method thereof. 特に、LEDチップのような発光素子を樹脂モールドした発光デバイス及びその製造方法に関する。 In particular, a light emitting element such as an LED chip to a light emitting device and a manufacturing method thereof molded with resin.

【0002】 [0002]

【従来の技術】図1は従来より用いられている発光デバイスAの構造を示す断面図である。 BACKGROUND OF THE INVENTION FIG. 1 is a cross-sectional view showing the structure of a light emitting device A which has been used conventionally. この発光デバイスA The light-emitting device A
は、2本のリード1a,1bを備えている。 The two leads 1a, and a 1b. 一方のリード1aの先端には凹球面状をした反射板2が形成されており、反射板2の上にLED(発光ダイオード)等の発光素子3がダイボンドにより実装されている。 The tip of one lead 1a are formed reflector 2 in which the concave spherical, the light-emitting element 3 of the LED (light emitting diode) or the like on the reflective plate 2 is mounted by die bonding. また、発光素子3と他方のリード1bとはAu線4によりワイヤボンディングされている。 Moreover, it is wire-bonded by Au wire 4 and the light emitting element 3 and the other lead 1b. 発光素子3やAu線4等を保護するため、発光デバイスAは一種類の透明な封止部材(エポキシ樹脂)5で封止することでパッケージされている。 To protect the light-emitting element 3 and Au wire 4 or the like, the light emitting device A is packaged by sealing with 5 one kind of transparent sealing member (epoxy resin).

【0003】しかして、発光素子3を発光させると、発光素子3から前方へ出射された光は、封止部材5の前面から外部へ取り出される。 [0003] Thus, when the light emitting elements 3, light from the light-emitting element 3 is emitted forward it is taken from the front of the sealing member 5 to the outside. また、発光素子3から背面方向および側方へ出射される光を反射板2によって前方へ反射させることによって、発光デバイスAの前面輝度を高めている。 Moreover, by reflecting forward the light emitted from the light emitting element 3 toward the rear and side by the reflective plate 2, to enhance the front brightness of the light emitting device A.

【0004】 [0004]

【発明が解決しようとする課題】しかしながら、図1のような発光デバイスAにあっては、反射板2は比較的小さなものであるため一部の光を前面へ向かわせるに過ぎず、また封止部材5の表面で全反射して背面方向や側面方向へ向かう光もあり、発光素子3から出た光は透明な封止部材5の全面から出射されていた。 [SUMMARY OF THE INVENTION However, in the light emitting device A shown in FIG. 1, the reflecting plate 2 is only a portion of the light because it is relatively small in directing the front face, also sealed There is also a light directed to the total reflection on the surface of the stop member 5 toward the back or side direction, light emitted from the light emitting element 3 has been emitted from the entire surface of the transparent sealing member 5. このため、発光デバイスAのある方向から出射される光を利用しようとすると、別な方向へ出射される光を利用することができず、光の利用効率が悪かった。 Therefore, the attempt to use the light emitted from the direction of the light emitting devices A, can not be utilized light emitted to a different direction, utilization efficiency of light is low.

【0005】特に、発光デバイスAをプラスチック光ファイバ6と結合させる場合には、図2に示すように、発光素子3から出射した光Rのうち大部分は光ファイバ6 In particular, in the case of the light emitting device A coupled to a plastic optical fiber 6, as shown in FIG. 2, the majority of the light R emitted from the light emitting element 3 is an optical fiber 6
(図2にはコアのみを示している)のコア径よりも外側の領域へ出射されて光ファイバ6と結合しないので、光結合効率が低く、発光デバイスAと光ファイバ6との結合効率は数%であった。 Since than the core diameter of the (shows core only in FIG. 2) is emitted to the outside of the region do not bind to the optical fiber 6, the optical coupling efficiency is low, the coupling efficiency of the light emitting device A and the optical fiber 6 is was a few percent. 例えば、コアの直径が1mmの光ファイバ6の場合には、光結合効率は約6.5%でしかなかった。 For example, when the diameter of the core is an optical fiber 6 of 1mm, the optical coupling efficiency was only about 6.5%.

【0006】光の利用効率を向上させるためには、封止部材の外周面や背面に金属蒸着膜を設け、側面方向や背面へ出射された光を金属蒸着膜で反射させる方法がある。 [0006] In order to improve the utilization efficiency of light, a metal deposition film provided on the outer peripheral surface and the back surface of the sealing member, there is a method for reflecting the light emitted to the side direction and back in the metal evaporated film. しかし、金属蒸着膜は湿気に弱いので、金属蒸着膜が露出しないよう非透湿性の保護膜で包み込むように覆って保護する必要がある。 However, the metal deposited film so weak to moisture, it is necessary to protect covering to wrap in moisture impermeable protective film so that the metal deposited film is not exposed. また、金属蒸着膜をリード等から電気的に絶縁する必要がある。 Further, it is necessary to electrically insulate the metal vapor deposited film from the lead or the like. このため、発光デバイスの構造が複雑となり、製造が困難になるという問題があった。 Therefore, the structure of the light emitting device becomes complicated, there is a problem that manufacturing is difficult.

【0007】また、光ファイバとの結合効率を向上させるためには、図2から分かるように、発光素子3と光ファイバ6の端面との距離を短くすればよい。 [0007] In order to improve the coupling efficiency between the optical fiber, as can be seen from FIG. 2, may be shortened distance between the light emitting element 3 and the end face of the optical fiber 6. しかしながら、このためには発光素子3から封止部材5の光出射面(前面)までの距離を短くする必要があるので、封止部材5の前面から発光素子3に湿気が到達し易くなり、発光デバイスの劣化速度が大きくなる。 However, since for this purpose it is necessary to shorten the distance from the light emitting element 3 to the light emitting surface of the sealing member 5 (front), easily moisture reaches from the front surface of the sealing member 5 to the light-emitting element 3, degradation rate of the light emitting device is increased. 従って、発光素子から封止部材の前面までの距離を短くすることは、実際上困難であった。 Therefore, shortening the distance to the front surface of the sealing member from the light-emitting element, it is difficult in practice.

【0008】また、光ファイバと発光デバイスを結合して使用する場合、発光デバイスの製造工程等における封止部材内で発光素子の位置ばらつきが存在すると、発光デバイス(封止部材)の中心と光ファイバの光軸とを位置合せしても、発光素子と光ファイバの光軸とが一致せず、これが原因で光結合効率の低下を招いていた。 Further, when used in coupling the optical fiber emitting device, the positional variation of the light emitting element in the sealing member in the manufacturing process or the like of the light emitting device is present, the center and the light emitting device (sealing member) be aligned with the optical axis of the fiber, not coincident with the optical axis of the light emitting element and the optical fiber, which is resulting in decrease in optical coupling efficiency due.

【0009】本発明は叙上の従来例の欠点に鑑みてなされたものであり、その目的とするところは、発光デバイスにおける光の利用効率を向上させ、また発光デバイスと光ファイバとを結合させる場合には、その光結合効率を向上させることにある。 [0009] The present invention has been made in view of the shortcomings of prior art on ordination, it is an object to improve the light usage efficiency of the light-emitting device, also to bond the light emitting device and the optical fiber case is to improve the optical coupling efficiency.

【0010】 [0010]

【発明の開示】請求項1に記載の発光デバイスは、発光素子を透明ないし半透明のパッケージ内に封止し、発光素子から出射した光をパッケージの外部へ取り出す発光デバイスにおいて、前記パッケージは高屈折率材料からなる透明な封止部材と低屈折率材料からなる透明ないし半透明の封止部材とからなり、前記高屈折率材料からなる封止部材の外側に前記低屈折率材料からなる封止部材が形成されていることを特徴としている。 The light emitting device of claim 1 DISCLOSURE OF INVENTION seals a light emitting element to a transparent or a translucent package, the light emitting device to extract light emitted from the light emitting element to the outside of the package, the package is high a transparent sealing member made of a refractive index material consists of a transparent or translucent sealing member made of a low refractive index material, comprising the low refractive index material on the outside of the sealing member made of the high refractive index material sealed is characterized in that stop member is formed.

【0011】請求項1に記載の発光デバイスにあっては、高屈折率材料からなる封止部材の外側に低屈折率材料からなる封止部材が形成されているから、高屈折率材料からなる封止部材から両封止部材の境界面へ向かう光を全反射させることによって光の進む方向を変換することができる。 [0011] In the light emitting device of claim 1, since the sealing member made of a low refractive index material on the outside of the sealing member made of a high refractive index material is formed, consisting of a high refractive index material it can be converted to a direction of travel of light by totally reflecting the light directed from the sealing member to the boundary surface of the Ryofutome member. 従って、高屈折率材料からなる封止部材と低屈折率材料からなる封止部材の境界面の形状を工夫することにより、発光素子から出射されて境界面で反射した光を一方向に集めることができる。 Thus, by devising the shape of the boundary surface of the sealing member made of a sealing member and a low refractive index material made of a high refractive index material, to collect light reflected by the is emitted interface from the light emitting element in one direction can. よって、発光デバイスから一方向に出射される光の光量を増大させることができ、発光デバイスの一方向の面から大部分の光を取り出すことができるようになり、光の利用効率を向上させることができる。 Therefore, it is possible to increase the amount of light emitted from the light emitting device in one direction, made from one side of the light emitting device to be able to take out most of the light, to improve the utilization efficiency of light can.

【0012】請求項2に記載の発光デバイスは、発光素子を透明ないし半透明のパッケージ内に封止し、発光素子から出射した光をパッケージの外部へ取り出す発光デバイスにおいて、前記パッケージは高屈折率材料からなる透明な封止部材と低屈折率材料からなる透明ないし半透明の封止部材とからなり、前記発光素子から出射された光が、前記高屈折率材料からなる封止部材と前記低屈折率材料からなる封止部材との境界面で全反射されてパッケージから外部へ取り出されるようにしたことを特徴としている。 [0012] The light emitting device of claim 2, sealing the light emitting element in a transparent or translucent package in a light-emitting device to extract light emitted from the light emitting element to the outside of the package, the package is a high refractive index consists of a transparent sealing member and the transparent or translucent sealing member made of a low refractive index material made of a material, the light emitted from the light emitting element, a low the sealing member made of the high refractive index material is totally reflected at the boundary surface between the sealing member made of a refractive index material is characterized in that it has to be taken out from the package to the outside.

【0013】請求項2に記載の発光デバイスにあっては、封止部材が高屈折率材料からなる封止部材と低屈折率材料とから構成されているから、高屈折率材料からなる封止部材と低屈折率材料からなる封止部材の境界面で光を全反射させることによって光の進む方向を変換することができる。 [0013] In the light-emitting device according to claim 2, since the sealing member is composed of a sealing member made of a high refractive index material and the low refractive index material, sealing made of a high refractive index material it can be converted to a direction of travel of light by totally reflecting the light at the boundary surface of the sealing member made of members and a low refractive index material. 従って、高屈折率材料からなる封止部材と低屈折率材料からなる封止部材の境界面の形状を工夫することにより、発光素子から出射されて境界面で反射した光を一方向に集めることができる。 Thus, by devising the shape of the boundary surface of the sealing member made of a sealing member and a low refractive index material made of a high refractive index material, to collect light reflected by the is emitted interface from the light emitting element in one direction can. よって、発光デバイスから一方向に出射される光の光量を増大させることができ、発光デバイスの一方向の面から大部分の光を取り出すことができるようになり、光の利用効率を向上させることができる。 Therefore, it is possible to increase the amount of light emitted from the light emitting device in one direction, made from one side of the light emitting device to be able to take out most of the light, to improve the utilization efficiency of light can.

【0014】また、請求項1及び2に記載の発光デバイスにあっては、光の利用効率を向上させて発光デバイスから一方向へ出射される光の量を増加させているから、 [0014] In the light-emitting device according to claim 1 and 2, because to improve the utilization efficiency of light and increase the amount of light emitted from the light emitting device in one direction,
この方向において発光デバイスと光ファイバとを結合させることにより、発光デバイスと光ファイバとの結合効率を向上させることができる。 By combining a light emitting device and the optical fiber in this direction, it is possible to improve the coupling efficiency between the light emitting device and the optical fiber.

【0015】しかも、請求項1及び2に記載の発光デバイスによれば、樹脂等からなる封止部材を少なくとも2 [0015] Moreover, according to the light emitting device according to claim 1 and 2, the sealing member made of resin or the like at least two
重構造としているので、湿気に対して強い構造となる。 Because it is a heavy structure, a strong structure against moisture.
従って、金属蒸着膜を用いる方法や発光素子と封止部材の前面との距離を短くする方法のように湿度に対する耐久性が悪化することがない。 Therefore, it does not deteriorate the durability against humidity as in the method of shortening the distance between the front face of the methods and the light-emitting element and the sealing member using a metal deposition film.

【0016】さらに、請求項1及び2に記載の発光デバイスによれば、発光素子の実装位置ばらつき等があっても、発光素子と光ファイバとの光結合効率にばらつきを生じることがない。 Furthermore, according to the light emitting device according to claim 1 and 2, even the mounting position variations in the light-emitting element, does not occur a variation in optical coupling efficiency between the light emitting element and the optical fiber.

【0017】請求項3に記載の発光デバイスの製造方法は、請求項1に記載された発光デバイスを製造するための方法であって、低屈折率材料により予め成形されている前記封止部材の中空内部に発光素子を配置する工程と、前記低屈折率材料からなる封止部材の中空内部に透明な高屈折率材料を注入して、低屈折率材料からなる封止部材中に高屈折率材料からなる封止部材を成形すると共に高屈折率材料からなる封止部材内に前記発光素子を封止する工程と、を備えたことを特徴としている。 The method of manufacturing the light emitting device according to claim 3 is a method for manufacturing a light-emitting device according to claim 1, of the sealing member which is previously molded by a low refractive index material placing a light emitting element into the hollow interior, by injecting a transparent high refractive index material into the hollow interior of the sealing member made of the low refractive index material, high refractive index in the sealing member made of a low refractive index material It is characterized by comprising a step of sealing the light emitting element in the sealing member made of a high refractive index material with molding a sealing member made of material.

【0018】請求項3に記載の発光デバイスの製造方法によれば、発光デバイスの製造工程において発光素子に余分な振動や外力が加わったり、成形圧が加わったりする恐れが少なく、発光デバイス製造の歩留りを向上させることができ、信頼性の高い発光デバイスを得ることができる。 According to the method of manufacturing the light emitting device according to claim 3, applied or extra vibration or an external force to the light emitting element in the manufacturing process of the light emitting device, less risk of or applied molding pressure, the light emitting device manufacturing it is possible to improve the yield, it is possible to obtain a highly reliable light-emitting device.

【0019】 [0019]

【発明の実施の形態】図3(a)(b)は、本発明の一実施形態による発光デバイスBを示す断面図及び正面図である。 PREFERRED EMBODIMENTS FIG. 3 (a) (b) is a cross-sectional view and a front view showing a light emitting device B according to an embodiment of the present invention. この発光デバイスBにあっては、板棒状をした一方のリード11aの先端に皿状をした反射板12が形成されており、反射板12の内面にLED(発光ダイオード)チップやLD(半導体レーザー)チップ等の発光素子13がダイボンドされ、発光素子13と他方のリード11bとはAu線のようなボンディングワイヤ14によって接続されている。 In the light-emitting device B is reflected plate 12 in which the dish-shaped at the tip of one lead 11a in which the plate bar-like form, LED on the inner surface of the reflector 12 (light emitting diode) chip and LD (semiconductor laser ) is die-bonded light emitting element 13 such as a chip, are connected by bonding wires 14 such as Au wires and the light emitting element 13 and the other lead 11b. 発光素子13やリード11a, Emitting element 13 and the lead 11a,
11b先端部などは錐台形状をした樹脂モールド部15 11b distal end resin mold 15 in which the frustum shape such as
(パッケージ)に封止されており、発光素子13やボンディングワイヤ14は樹脂モールド部15によって保護されている。 Are sealed to the (package), the light emitting element 13 and the bonding wires 14 are protected by the resin mold portion 15.

【0020】樹脂モールド部15は2重構造となっており、内側は屈折率の高い透明樹脂材料(エポキシ樹脂、 The resin mold portion 15 has a double structure, the inner having a high refractive index transparent resin material (epoxy resin,
ポリカーボネイト樹脂など)からなる封止部材(以下、 A sealing member (hereinafter made of polycarbonate resin, etc.),
内側封止部材という)16となっており、その外側には内側封止部材16を包むようにして屈折率の低い透明もしくは半透明の樹脂材料(メタクリル樹脂、シリコン樹脂、フッ素樹脂など)からなる封止部材(以下、外側封止部材という)17が形成されている。 Has a inner sealing that member) 16, a sealing consisting of a lower transparent or translucent resin material having a refractive index so as to wrap the inner sealing member 16 on the outside (methacrylic resin, silicone resin, fluorine resin) member (hereinafter, outer referred sealing member) 17 is formed. 内側封止部材1 Inner sealing member 1
6は錐台形状をしており、面積の小さな側の端面の近傍において内側封止部材16の中心軸上に発光素子13が封止されており、面積の大きな側の端面が光出射面(前面)となっていて外側封止部材17から露出している。 6 is a frustum shape, the small light emitting element 13 on the center axis of the inner sealing member 16 in the vicinity of the end face of the side have been sealed, the end face the light emitting surface of the large side of the area of ​​the area ( It is exposed from the outer sealing member 17 has a front surface).

【0021】また、外側封止部材17は略錐台形状もしくは円筒状もしくは角筒状をしており、面積の大きな側の端面からはリード11a,11bが延出し、この端面の外周部にはフランジ18が形成されており、面積の小さな側の端面には内側封止部材16が露出している。 Further, the outer sealing member 17 has a Ryakukiridai shape or cylindrical or rectangular tube, the lead 11a from an end face of the large side of the area, 11b are extended, the outer periphery of the end face flange 18 is formed, on the end face on the small side of the area is exposed inner sealing member 16. フランジ18の一部には切り欠き19が設けられている。 19 notches on the part of the flange 18 is provided.
なお、内側封止部材16及び外側封止部材17について言う錐台形状とは、図3に示すような円錐台形状に限らず、角錐台形状でもよい。 Note that the frustum say about the inner sealing member 16 and the outer sealing member 17 is not limited to the truncated cone shape as shown in FIG. 3, may be a truncated pyramid shape. さらには、幾何学的な錐台形状に限らず、ほぼ錐台形状を保ったままで変形したものでもよい。 Furthermore, not limited to the geometric frustum shape, or a modification while maintaining a substantially frustum shape.

【0022】しかして、図3(a)に示すように、発光素子13から前方へ出射された光Rは内側封止部材16 [0022] Thus, as shown in FIG. 3 (a), the light R from the light emitting element 13 is emitted forward inner sealing member 16
の前面から出射される。 Is the exit from the front. また、発光素子13から側面方向へ出射された光Rのうち、内側封止部材16と外側封止部材17の境界面Kで全反射した光Rは、前方へ向けて進行方向を変換されて内側封止部材16の前面から外部へ出射される。 Further, of the light R emitted from the light emitting element 13 to the lateral, the light R is totally reflected at the boundary surface K of the inner sealing member 16 and the outer sealing member 17, it is changing the traveling direction frontward It is emitted from the front surface of the inner sealing member 16 to the outside. 従って、従来であれば、発光デバイスBの側面から漏れていた光Rを発光デバイスBの前面へ向けることができ、発光デバイスBの前面(光出射面) Therefore, if conventional, can direct the light R that has leaked from the side surface of the light emitting device B to the front surface of the light-emitting device B, the front surface of the light-emitting devices B (light emitting surface)
からの出射光量を増大させ、発光デバイスBの光利用効率を向上させることができる。 Increasing the amount of light emitted from, thereby improving the light utilization efficiency of the light emitting device B.

【0023】すなわち、図4に示すように、内側封止部材16の屈折率をn 1 、外側封止部材17の屈折率をn 2 [0023] That is, as shown in FIG. 4, n 1 the refractive index of the inner sealing member 16, the refractive index of the outer sealing member 17 n 2
とし、内側封止部材16の外周面(境界面K)の傾斜角をγ、発光素子13からの光の出射角をθとすると、 θ ≦ γ+cos -1 (n 2 /n 1 ) であれば、発光素子13から出射されて内側封止部材1 And then, the inclination angle of the outer peripheral surface of the inner sealing member 16 (the boundary surface K) gamma, when the exit angle of light from the light emitting element 13 and theta, if θ ≦ γ + cos -1 (n 2 / n 1) , inward emitted from the light emitting element 13 the sealing member 1
6と外側封止部材17の境界面Kに達した光は両封止部材16,17の境界面Kで反射されて内側封止部材16 6 and the outer sealing member inner sealing member 16 light reaching the boundary surface K is reflected by the boundary surface K of Ryofutome members 16, 17 of the 17
の前面から出射される。 Is the exit from the front. 従って、その分だけ発光デバイスBの前面から出射される光量が増加し、光の利用効率が増大することになる。 Therefore, the amount corresponding increased amount of light emitted from the front surface of the light emitting device B, so that the utilization efficiency of light is increased.

【0024】このように発光デバイスAの光利用効率が向上するので、発光デバイスBの前面に光ファイバ20 [0024] Since the light utilization efficiency of such light emitting devices A are improved, the optical fiber in front of the light emitting device B 20
の端面を接触させるよう接続することにより、発光デバイスBから光ファイバ20に入射する光量を増加させることができ、発光デバイスBと光ファイバ20との光結合効率を向上させることができる。 Of by connecting for contacting the end faces, it is possible to increase the amount of light incident from the light emitting device B to the optical fiber 20, it is possible to improve the optical coupling efficiency between the light emitting device B and the optical fiber 20. 特に、図3に想像線で示すように、内側封止部材16の開口端の直径を、光ファイバ20の直径と同等か、それ以下とし、内側封止部材16の端面を光ファイバ20の端面に突き合せることにより、発光デバイスBから出射される光のほぼすべてを光ファイバ20へ導くことができ、光結合効率を高くすることができる。 In particular, as shown in phantom in FIG. 3, the diameter of the open end of the inner sealing member 16, or equivalent diameter of the optical fiber 20, and below, the end face of the optical fiber 20 to the end face of the inner sealing member 16 in by butting, almost all light emitted from the light emitting device B can be guided to the optical fiber 20 can increase the optical coupling efficiency.

【0025】また、この発光デバイスBでは、内側封止部材16と外側封止部材17との2重構造となっているので、封止性が高くなる。 Further, in the light emitting device B, so it has a double structure of an inner sealing member 16 and the outer sealing member 17, sealing performance is high. 従って、湿気の侵入によって発光素子13が劣化しにくく、発光デバイスBの耐環境性や耐久性が向上する。 Thus, the ingress of moisture hardly emitting element 13 deteriorates, environment resistance and durability of the light emitting device B can be improved.

【0026】このような発光デバイスBは、例えば、光ファイバセンサ用投光モジュール、光電スイッチ、電子機器の光送信器、光ファイバ通信用投光モジュール、電子機器の表示灯などに用いて、長検出距離化、長伝送距離化を達成し、高SN比を実現することができる。 [0026] Such a light emitting device B, for example, projection module for an optical fiber sensor, a photoelectric switch, the optical transmitter of the electronic device, the light projection module for optical fiber communication, using the display lamps, etc. of the electronic device, the length detection distance of, to achieve long transmission distances of, it is possible to realize a high SN ratio. また、表示灯として用いる場合には、その視認性も向上する。 When used as a display lamp, also improved its visibility.

【0027】さらに、光電スイッチなどの投光装置に用いる場合には、指向性を高めるための投光用レンズの必要がなくなり、コストダウンを図れる。 Furthermore, when used in light emitting devices such as a photoelectric switch, there is no need of the light projecting lens for increasing the directivity, thereby the cost.

【0028】また、内側封止部材16を錐台形状とした発光デバイスBにあっては、発光素子13から出射された光を両封止部材16,17の境界面Kで全反射させることにより、発光デバイスBの前面における光の出射角度を小さくすることができるので、発光デバイスBの出射開口数(NA)を小さくすることが可能になる。 [0028] Also, with the inner sealing member 16 to the light emitting devices B which was frustum shape, by totally reflecting the light emitted from the light emitting element 13 at the interface K of Ryofutome members 16 and 17 , it is possible to reduce the emission angle of the light in front of the light emitting device B, it is possible to reduce emission aperture of the light emitting device B a (NA).

【0029】本発明の発光デバイスは、上記のような特徴を有しているから、発光デバイスBの光を効率良く利用でき、発光素子に注入する電流を抑えることができ、 The light emitting device of the present invention, because they have characteristics as described above, the light emitting device B can be efficiently utilized, it is possible to suppress the current to be injected to the light emitting element,
発光デバイスBの長寿命化、低消費電力化、低発熱化を図れる。 Long life of the light emitting device B, low power consumption, low heat generation achieved.

【0030】また、封止部材が多重構造となっているので、発光素子の保護機能を保ったままで、さまざまな形状の発光デバイスを製作することができる。 Further, since the sealing member is in the multiple structure, while maintaining the protection of the light emitting element, it is possible to manufacture a light emitting device of various shapes.

【0031】次に、上記発光デバイスBを成形により製造する方法を説明する。 [0031] Next, a method for producing by molding the light emitting device B. まず、外側封止部材17の形状を図5(a)(b)(c)の斜視図、平面図及び断面図により説明する。 First, the shape of the outer sealing member 17 perspective view of FIG. 5 (a) (b) (c), the plan view and a cross-sectional view. 外側封止部材17は、外形が例えば円柱状ないし円錐台状をしており、一端にはフランジ18 Outer sealing member 17, has an outer shape, for example cylindrical or frusto-conical, flange at one end 18
が設けられており、フランジ18の一部には切り欠き1 Is provided, the notch on the part of the flange 18 1
9が設けられている。 9 is provided. また、外側封止部材17の中心には、円柱状孔21と円錐状孔22とが連続するように形成され、円柱状孔21の両側面から円錐状孔22の一部側面にかけては平板状の凹部23が形成されている。 Further, in the center of the outer sealing member 17 is formed to a cylindrical bore 21 and the conical hole 22 is continuous, flat from both sides of the cylindrical bore 21 toward a partially side of the conical hole 22 recess 23 is formed.

【0032】図6はこの外側封止部材17を成形するための成形金型の構造を示す断面図であって、上金型24 [0032] FIG. 6 is a sectional view showing a structure of a molding die for molding the outer sealing member 17, the upper die 24
と下金型25からなっている。 It is made from the lower mold 25 and. 下金型25には外側封止部材17の外形を成形するためのキャビティ26が形成されており、キャビティ26内の底面中央部には、円柱状孔21と円錐状孔22を成形するための突起部27が形成され、例えば外周面には樹脂を注入するためのゲート口28が設けられている。 The lower mold 25 has a cavity 26 for forming the outer shape of the outer sealing member 17 is formed on the bottom surface central portion of the cavity 26, for forming a cylindrical hole 21 and the conical hole 22 protrusions 27 are formed, for example, on the outer circumferential surface gate port 28 for injecting a resin is provided. また、上金型24の下面には、平板状の凹部23を成形するためのプレート部29 Further, on the lower surface of the upper mold 24, the plate portion 29 for molding a plate-shaped recess 23
が設けられており、上金型24と下金型25を閉じるとプレート部29の内側面が円柱状孔21と円錐状孔22 Is provided, the inner surface of the plate portion 29 close to the upper die 24 and the lower die 25 is a cylindrical hole 21 and the conical hole 22
の側面に密着するようになっている(図6の2点鎖線は、上金型24を閉じたときのプレート部29の位置を示す)。 It comes into close contact of the side surface (a two-dot chain line in FIG. 6 shows the position of the plate portion 29 when closing the upper mold 24). 従って、上金型24と下金型25を閉じた状態でゲート口28からキャビティ26内にメタクリル樹脂(PMMA)のような樹脂材料を加圧注入した後、上金型24と下金型25を開いて脱型することにより外側封止部材17が成形される。 Therefore, after the resin material, such as a methacrylic resin (PMMA) was pressure injected into the cavity 26 from the gate opening 28 in the closed state of the upper mold 24 and lower mold 25, upper metal mold 24 and the lower mold 25 the outer sealing member 17 is formed by demolding open.

【0033】なお、外側封止部材17は、上記のようにメタクリル樹脂を用いて射出成形することができるが、 It should be noted, the outer sealing member 17, may be injection molded using a methacrylic resin as described above,
外側封止部材17を成形するための成形樹脂材料としては、比較的低屈折率の熱硬化性樹脂で注型するのが理想的である。 The molding resin material for forming the outer sealing member 17, to cast at a relatively low refractive index thermosetting resin is ideal.

【0034】図7(a)は内側封止部材16を成形するための成形金型を示す一部破断した断面図、図7(b) [0034] FIGS. 7 (a) is a sectional view partially cutaway showing a molding die for molding the inner sealing member 16, and FIG. 7 (b)
はその下金型の一部破断した平面図である。 Is a plan view partially cutaway of the lower mold. 下金型30 The lower die 30
には、外側封止部材17の外形と同じ形状のキャビティ31が形成されており、開口のフランジ成形部32には外側封止部材17の切り欠き19と一致した形状の位置決め部33が設けられている。 In is formed the same shape of the cavity 31 and the outer shape of the outer sealing member 17, notches 19 and the positioning portion 33 having a shape matching the outer sealing member 17 is provided in the flange forming portion 32 of the opening ing. キャビティ31の底面には、樹脂を注入するためのゲート口34が設けられている。 The bottom surface of the cavity 31, the gate port 34 for injecting a resin is provided. 上金型35,35は2分割されており、両上金型3 Upper mold 35 is divided into two parts, both the upper mold 3
5,35の対向部分にはリード11a,11bを挟み込むための凹欠部36,36が設けられている。 Concave portions 36, 36 for sandwiching the lead 11a, and 11b are provided on opposite portions of the 5 and 35.

【0035】しかして、内側封止部材16を成形する場合には、図8に示すように、下金型30のキャビティ3 [0035] Thus, in the case of forming the inner sealing member 16, as shown in FIG. 8, the cavity 3 of the lower mold 30
1内に予め成形されている外側封止部材17を挿入して納める(通常は、1つの金型により同時多数個取りされるが、ここでは1つだけを示す)。 Pay by inserting the outer sealing member 17 is previously molded in one (usually, but are many co-cavity by one mold, only one shown here). このとき外側封止部材17のフランジ18に設けられている切り欠き19とキャビティ31開口の位置決め部33を一致させることにより外側封止部材17の方向が位置決めされ、リード11a,11bの挿入方向が一定方向に決められる。 At this time, by matching the notches 19 and the cavity 31 opening of the positioning portion 33 is provided on the flange 18 of the outer sealing member 17 is the direction of the outer sealing member 17 is positioned, the lead 11a, the insertion direction 11b It is determined in a certain direction. また、このときゲート口34は外側封止部材17の円錐状孔22に対向する。 The gate port 34 this time is opposite to the conical bore 22 of the outer sealing member 17. ついで、発光素子13を実装された一対のリード11a,11bを外側封止部材17の円柱状孔21及び凹部23に挿入して位置決めした後、図9 Next, after positioning by inserting a pair of leads 11a mounted to the light emitting element 13, and 11b to the cylindrical bore 21 and the recess 23 of the outer sealing member 17, FIG. 9
に示すように、上金型35,35を下金型30の上面に載せて閉じ、上金型35,35の凹欠部36,36間にリード11a,11bを挟み込んで固定すると共に上金型35,35によってキャビティ31を密閉する。 As shown in, the upper with the upper mold 35 and 35 closed placed on top of the lower die 30 is fixed by sandwiching the lead 11a, and 11b between the concave portions 36 of the upper die 35 and 35 sealing the cavity 31 by the mold 35. この状態でゲート口34からポリカーボネイト樹脂のような樹脂材料を注入することにより外側封止部材17の内部に内側封止部材16を成形し、発光素子13を内側封止部材16により封止する。 Molding the inner sealing member 16 within the outer sealing member 17 by injecting a resin material such as polycarbonate resin from the gate opening 34 in this state, to seal the light emitting element 13 by the inner sealing member 16. こうして製作された発光デバイスBは、上金型35,35を開いてキャビティ31から取り出され、各リード11a,11bがリードフレームから切り離される。 The light emitting device B thus fabricated is taken out from the cavity 31 to open the upper mold 35 and 35, each lead 11a, 11b is separated from the lead frame.

【0036】なお、外側封止部材17がメタクリル樹脂であれば、ポリカーボネイト樹脂を上記のように射出成形することにより内側封止部材16を成形することができるが、外側封止部材17が熱硬化性樹脂製であれば、 It should be noted, if the methacrylic resin outer sealing member 17, but the polycarbonate resin can be molded inner sealing member 16 by injection molding as described above, the outer sealing member 17 thermoset if it is made of sexual resin,
金型温度を150℃程度にしてエポキシ樹脂により注型成形することもできる。 The mold temperature may also be cast by epoxy resin in the order of 0.99 ° C..

【0037】上記のようにして発光デバイスBを製造することにより、2種類の封止部材16,17を有する発光デバイスBの信頼性を向上させることができる。 [0037] By manufacturing the on to the light emitting device B as described above, it is possible to improve the reliability of the light emitting device B having two sealing members 16 and 17. すなわち、上記本発明の方法とは異なり、先に発光素子13 That is, unlike the method of the present invention, previously to the light emitting element 13
を内側封止部材16に封止した後、その外側に外側封止部材17を成形すると、外側封止部材17の成形収縮によって内側封止部材16に圧縮応力が発生し、内部の発光素子13に大きなストレスを加えることになる。 After sealing the inside sealing member 16, when forming the outer sealing member 17 on the outside, compressive stress is generated inside the sealing member 16 by the molding shrinkage of the outer sealing member 17, the interior of the light emission element 13 It will add a great stress on. また、外側封止部材17単独で成形せず、外側封止部材1 Further, without forming an outer sealing member 17 alone, the outer sealing member 1
7を発光素子13の実装されたリード11a,11bと一体成形すると、リード11a先端の発光素子13は外側封止部材17の内側で宙に浮いた状態で保持されることになり、外側封止部材17のハンドリング中にボンディングワイヤ14が外れたりする恐れがある。 7 implemented leads 11a of the light emitting element 13, when 11b integrally molded, the light emitting element 13 of the leads 11a tip would be held in a state of floating in the air inside the outer sealing member 17, outer sealing bonding wires 14 during handling member 17 is likely to be dislodged. これに対し、本発明の方法によれば、発光素子13に大きなストレスが加わったり、ボンディングワイヤ14が外れたりする恐れがなく、製造工程における取り扱いが簡単になると共に発光デバイスBの歩留りが向上する。 In contrast, according to the method of the present invention, or applied a large stress to the light emitting element 13, the bonding wire 14 is no possibility to come off, the yield of the light emitting device B can be improved with the handling in the manufacturing process is simplified .

【0038】なお、このようにして発光デバイスBを製造する場合、円柱状孔21の内部にも内側封止部材16 [0038] In the case of manufacturing a light emitting device B In this manner, inside also the inner sealing member of the cylindrical hole 21 16
が充填されるので、ここから光が漏れて光損失となる恐れがあるが、ここは反射板12の陰になっているので、 Because There is filled, it may become light loss light leaks from here, because here is the shadow of the reflector 12,
光が漏れる恐れはほとんどない。 Light there is little possibility of leaks.

【0039】(第2の実施形態)図10は本発明の別な実施形態による発光デバイスCを示す断面図である。 [0039] (Second Embodiment) FIG. 10 is a sectional view showing a light emitting device C according to another embodiment of the present invention. この発光デバイスCにあっては、内側封止部材16を円柱状もしくは角柱状に形成している(すなわち、第1の実施形態においてγ=0とした場合に相当する)。 In the light-emitting device C forms an inner sealing member 16 in a columnar shape or a prismatic shape (i.e., corresponds to the case where a gamma = 0 in the first embodiment). この場合でも、発光素子13から出射された光Rは、内側封止部材16と外側封止部材17との境界面Kで全反射されることによって外側へ広がることなく内側封止部材16 In this case, the light R emitted from the light emitting element 13, the inner sealing member without spreading outward by being totally reflected by the boundary surface K between the inner sealing member 16 and the outer sealing member 17 16
内部を伝搬する。 Propagating inside. 従って、内側封止部材16の直径ないし発光デバイスCの光出射開口を、光ファイバ20の直径よりも小さくしておくことにより、光ファイバ20との結合効率や光利用効率を向上させることができる。 Accordingly, the light exit opening of diameter or the light emitting device C of the inner sealing member 16, by previously smaller than the diameter of the optical fiber 20, it is possible to improve the coupling efficiency and the light utilization efficiency of the optical fiber 20 .

【0040】シミュレーションによれば、コア径が直径1mmのプラスチック光ファイバ20について光結合効率を求めた結果では、本発明の発光デバイスCによれば、従来例の発光デバイスAの光結合効率の1.92倍となり、大幅な性能向上が見込めた。 According to the simulation, the result of core diameter was determined optical coupling efficiency for a plastic optical fiber 20 having a diameter of 1mm, according to the light emitting device C of the present invention, the first optical coupling efficiency of the light emitting device A of the prior art become a .92-fold, it was expected a significant performance improvement.

【0041】また、本発明の発光デバイスにあっては、 Further, in the light-emitting device of the present invention,
両封止部材16,17の屈折率n 1 、n 2を調整して発光デバイスのNA(開口数)が光ファイバ20のNAに等しくなるようにすることにより、光ファイバ20からの出射光のNAを光ファイバ20の長さに依存せず、一定となるようにすることができる。 By the refractive index n 1 of Ryofutome member 16, 17, n 2 and adjusted to the light emitting device NA (numerical aperture) is set to be equal to the NA of the optical fiber 20, the light emitted from the optical fiber 20 NA the not depend on the length of the optical fiber 20 can be made to be constant. 例えば、プラスチック光ファイバ(POF)20はNA=0.5であるので、 For example, since the plastic optical fiber (POF) 20 is a NA = 0.5,
図9の実施形態でいえば、両封止部材16,17の屈折率n 1 、n 2が、 (n 1 2 −n 2 21/2 ≒0.5 となるような光学材料を選択すればよい。 Speaking in the embodiment of FIG. 9, selected refractive indexes n 1, n 2 of Ryofutome members 16 and 17, an optical material such that (n 1 2 -n 2 2) 1/2 ≒ 0.5 do it.

【0042】さらに、本発明の発光デバイスにあっては、製造工程におけるばらつき等によって発光素子13 [0042] Further, in the light-emitting device of the present invention, the light emitting by variations in the manufacturing process device 13
が発光デバイスの中心軸がずれていても、発光素子13 There be offset center axis of the light emitting device, the light emitting element 13
が内側封止部材16内に封止されている限り、光ファイバ20との光結合効率が変化したり、ばらついたりすることがない。 There as long as it is sealed in the inner sealing member 16, the optical coupling efficiency between the optical fiber 20 may change, never or varied. すなわち、図9の実施形態で説明すれば、 That is, if explained in the embodiment of FIG. 9,
発光素子13が内側封止部材16の内部にあれば、実線で示すように発光素子13が内側封止部材16の中心に位置していても、破線で示すように発光素子13が内側封止部材16の中心から外れた位置にあっても、境界面Kで反射することによって発光素子13の位置ばらつきは問題とならなくなる。 If the light emitting element 13 inside the inner sealing member 16, even when the light emitting element 13 as shown by a solid line located in the center of the inner sealing member 16, the light emitting element 13 as shown by the broken line inside the sealing even at a position deviated from the center of the member 16, positional variation of the light emitting element 13 by reflecting at the interface K is not a problem.

【0043】(第3の実施形態)図11は、本発明のさらに別な実施形態による発光デバイスDを示す断面図である。 [0043] (Third Embodiment) FIG. 11 is a sectional view showing a light emitting device D according to still another embodiment of the present invention. この発光デバイスDにあっては、内側封止部材1 In the light-emitting device D, the inner sealing member 1
6と外側封止部材17の双方を透明樹脂によって形成しており、発光素子13は錐台形状をした内側封止部材1 6 and forms by both the transparent resin of the outer sealing member 17, the light emitting element 13 inside the sealing member 1 in which the frustum shape
6の背面において外側封止部材17の内部に封止されている。 It is sealed within the outer sealing member 17 in the back of the 6.

【0044】このようにして発光素子13を外側封止部材17の内部に封止した場合であっても、発光素子13 [0044] Even when sealing the light emitting element 13 this way the inside of the outer sealing member 17, the light emitting element 13
から外側封止部材17中へ出射された光のうち前方の内側封止部材16中へ入射した光は、第1の実施形態の場合と同様にして内側封止部材16と外側封止部材17との境界面Kで全反射して内側封止部材16の前面から外部へ出射される。 The light incident into the front of the inner sealing member 16 of the light emitted into the outer sealing member 17 from the first embodiment in the inner sealing member 16 in the same manner as the outer sealing member 17 is emitted from the front surface of the inner sealing member 16 to the outside is totally reflected at the boundary surface K between.

【0045】従って、このような実施形態においても、 [0045] Thus, even in such an embodiment,
光の利用効率を向上させることができ、光ファイバ20 It is possible to improve the utilization efficiency of light, the optical fiber 20
と接続する場合には、光ファイバ20との光結合効率を向上させることができる。 When connecting the can improve the optical coupling efficiency between the optical fiber 20.

【0046】また、この場合には、発光素子13の位置は内側封止部材16の背面にできるだけ近いほうが好ましいが、発光素子13を内側封止部材16の背面に近づけても発光デバイスCの封止性能に影響を与えることはない。 [0046] Also, in this case, the position of the light emitting element 13 is more preferably as close as possible to the back of the inner sealing member 16, even closer to the light emitting element 13 on the back of the inner sealing member 16 of the light emitting device C sealing It does not affect the sealing performance.

【0047】(第4の実施形態)発光素子13の発光面積は必ずしも十分に小さいとは限らず、発光面積が大きい場合には、錐台形状をした内側封止部材16の場合には内側封止部材16と外側封止部材17の境界面Kで全反射することなく境界面Kを通過する光の量も増加する。 [0047] (Fourth Embodiment) emitting area of ​​the light emitting element 13 is not limited to the necessarily small enough, when the light emitting area is large, the inner seal in the case of the inner sealing member 16 in which the frustum-shaped also it increases the amount of light passing through the no boundary surface K being totally reflected at the boundary surface K of the stop member 16 and the outer sealing member 17.

【0048】このような場合には、大きな発光面積を有する発光素子13の場合は、内側封止部材16の側面を湾曲させるのが有効である。 [0048] In such a case, if the light emitting device 13 having a large emission area, it is effective to bend the sides of the inner sealing member 16. 図12は本発明のさらに別な実施形態による発光デバイスEを示す断面図であって、このような発光デバイスの例を示しており、内側封止部材16の後部側面を放物面状に形成して境界面Kに湾曲面41を形成している。 Figure 12 is a sectional view showing a light emitting device E according to still another embodiment of the present invention, it shows an example of such a light-emitting device, forming the rear side of the inner sealing member 16 to the parabolic to form a curved surface 41 to the boundary surface K. 外側封止部材17と内側封止部材16の間の境界面Kをこのような形状にすれば、 If the interface K between the outer sealing member 17 and inner sealing member 16 in such a shape,
発光素子13から出射されて側面方向へ向かった光のうち前方へ向かせることができる光の量をより増加させることができるので、光の利用効率がより向上する。 Since it is emitted from the light emitting element 13 can further increase the amount of light which can be suited to the front of the light toward the side direction, the light utilization efficiency is further improved. 特に、発光面積の大きな発光素子13を用いている場合に有効である。 In particular, it is effective in the case of using a large light-emitting element 13 of the light emitting area.

【0049】(第5の実施形態)図13は本発明のさらに別な実施形態による発光デバイスFを示す断面図である。 [0049] (Fifth Embodiment) FIG. 13 is a sectional view showing a light emitting device F according to still another embodiment of the present invention. この発光デバイスFにあっては、内側封止部材16 In the light-emitting device F, the inner sealing member 16
の前面(光出射面)に凸レンズ状やフレネルレンズ状の集光素子部42を形成している。 Forming a light-collecting element portion 42 of the convex lens or a Fresnel lens shape on the front (light emitting surface) of the. 内側封止部材16の前面に凸レンズ状やフレネルレンズ状などの集光素子部4 Condensing element unit 4, such as inside the front convex lens-shaped sealing member 16 and a Fresnel lens shape
2を設けているので、内側封止部材16の前面から外部へ出射される光の発散を抑えることができる。 Since 2 is provided, it is possible to suppress the divergence of the light emitted from the front surface of the inner sealing member 16 to the outside. なお、集光素子部42の形成領域は外側封止部材17の前面にまで及んでいてもよい。 The formation region of the light focusing element 42 may extend to the front surface of the outer sealing member 17. また、集光素子部42は、凸レンズ等の接着により形成してもよく、内側封止部材16に一体成形されていてもよい。 Further, the condensing element 42 may be formed by bonding a convex lens or the like, it may be integrally molded to the inner sealing member 16.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】従来例の発光デバイスを示す断面図である。 1 is a cross-sectional view of a light emitting device of a conventional example.

【図2】従来例の発光デバイスと光ファイバとの光の結合する様子を示す概略説明図である。 2 is a schematic diagram showing the state of coupling of light between the light emitting device and the optical fiber of the prior art.

【図3】(a)(b)は本発明の一実施形態による発光デバイスを示す断面図及び正面図である。 [3] (a) (b) is a cross-sectional view and a front view showing a light emitting device according to an embodiment of the present invention.

【図4】同上の発光デバイスにおいて発光素子から出射された光の挙動を説明する一部破断した断面図である。 4 is a sectional view partially broken illustrating the behavior of light emitted from the light emitting element in the light emitting device of the same.

【図5】(a)(b)(c)は同上の発光デバイスに用いられている外側封止部材の形状を示す斜視図、平面図及び断面図である。 [5] (a) (b) (c) is a perspective view showing the shape of the outer sealing member used in the light-emitting device of the same, it is a plan view and a cross-sectional view.

【図6】同上の外側封止部材を成形するための成形金型を示す一部破断した断面図である。 6 is a sectional view partially broken showing a molding die for molding the outer sealing member of the same.

【図7】(a)は内側封止部材を成形するための成形金型を示す一部破断した断面図、(b)はその下金型の一部破断した平面図である。 7 (a) is a sectional view partially broken showing a molding die for molding the inner sealing member, (b) is a plan view partially cutaway of the lower mold.

【図8】内側封止部材を成形するための成形金型(断面)と、当該金型内に挿入される外側封止部材と、発光素子を実装されたリードフレームとを示す図である。 [8] the molding die for molding the inner sealing member and (cross) is a diagram showing the outer sealing member to be inserted into the mold, the lead frame is mounted a light emitting element.

【図9】成形金型内で外側封止部材の内部に樹脂を注入して内側封止部材を成形する様子を示す断面図である。 9 is a sectional view showing a state in which by injecting resin into the interior of the outer sealing member in the molding die for molding the inner sealing member.

【図10】本発明の別な実施形態による発光デバイスを示す断面図である。 It is a sectional view showing a light emitting device according to another embodiment of the invention; FIG.

【図11】本発明のさらに別な実施形態による発光デバイスを示す断面図である。 11 is a sectional view showing a light emitting device according to still another embodiment of the present invention.

【図12】本発明のさらに別な実施形態による発光デバイスを示す断面図である。 12 is a sectional view showing a light emitting device according to still another embodiment of the present invention.

【図13】本発明のさらに別な実施形態による発光デバイスを示す断面図である。 13 is a sectional view showing a light emitting device according to still another embodiment of the present invention.

【符号の説明】 DESCRIPTION OF SYMBOLS

13 発光素子 15 樹脂モールド部(パッケージ) 16 内側封止部材 17 外側封止部材 K 内側封止部材と外側封止部材との境界面 13 light-emitting element 15 the resin mold portion (package) 16 interface between the inner sealing member 17 outside the sealing member K inner sealing member and the outer sealing member

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 発光素子を透明ないし半透明のパッケージ内に封止し、発光素子から出射した光をパッケージの外部へ取り出す発光デバイスにおいて、 前記パッケージは高屈折率材料からなる透明な封止部材と低屈折率材料からなる透明ないし半透明の封止部材とからなり、前記高屈折率材料からなる封止部材の外側に前記低屈折率材料からなる封止部材が形成されていることを特徴とする発光デバイス。 1. A sealed light emitting element in a transparent or translucent package in a light-emitting device to extract light emitted from the light emitting element to the outside of the package, the package is transparent sealing member made of a high refractive index material characterized in that a composed of a transparent or translucent sealing member made of a low refractive index material, a sealing member made of the low refractive index material on the outside of the sealing member made of the high refractive index material are formed a light-emitting device that.
  2. 【請求項2】 発光素子を透明ないし半透明のパッケージ内に封止し、発光素子から出射した光をパッケージの外部へ取り出す発光デバイスにおいて、 前記パッケージは高屈折率材料からなる透明な封止部材と低屈折率材料からなる透明ないし半透明の封止部材とからなり、前記発光素子から出射された光が、前記高屈折率材料からなる封止部材と前記低屈折率材料からなる封止部材との境界面で全反射されてパッケージから外部へ取り出されるようにしたことを特徴とする発光デバイス。 2. A sealing in the package a light emitting element transparent or translucent, the light emitting device to extract light emitted from the light emitting element to the outside of the package, the package is transparent sealing member made of a high refractive index material and consists of a transparent or translucent sealing member made of a low refractive index material, the sealing member light emitted from the light emitting element, comprising a sealing member made of the high refractive index material from said low refractive index material light emitting device is characterized in that so as to be taken out to the outside from the total reflection has been packaged at the boundary surface between.
  3. 【請求項3】 請求項1に記載された発光デバイスを製造するための方法であって、 低屈折率材料により予め成形されている前記封止部材の中空内部に発光素子を配置する工程と、 前記低屈折率材料からなる封止部材の中空内部に透明な高屈折率材料を注入して、低屈折率材料からなる封止部材中に高屈折率材料からなる封止部材を成形すると共に高屈折率材料からなる封止部材内に前記発光素子を封止する工程と、を備えた発光デバイスの製造方法。 3. A method for manufacturing a light-emitting device according to claim 1, placing a light emitting element into the hollow interior of the sealing member which is previously molded by a low refractive index material, said injecting transparent high refractive index material into the hollow interior of the sealing member made of a low refractive index material, high with forming the sealing member made of a high refractive index material in the sealing member made of a low refractive index material method of manufacturing a light emitting device including a step of sealing the light emitting element in the sealing member made of a refractive index material.
JP8257729A 1996-09-06 1996-09-06 Light emitting device and manufacture thereof Pending JPH1084137A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8257729A JPH1084137A (en) 1996-09-06 1996-09-06 Light emitting device and manufacture thereof

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JP8257729A JPH1084137A (en) 1996-09-06 1996-09-06 Light emitting device and manufacture thereof

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JPH1084137A true JPH1084137A (en) 1998-03-31

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101077A (en) * 2001-09-25 2003-04-04 Pentax Corp Light-emitting diode
JP2008516463A (en) * 2004-10-12 2008-05-15 クリー インコーポレイテッドCree Inc. Side-emitting optical coupling device
JP2009070679A (en) * 2007-09-13 2009-04-02 Koito Mfg Co Ltd Lamp unit of vehicle headlight, and vehicle headlight
JP2010500739A (en) * 2006-08-09 2010-01-07 パナソニック株式会社 The light-emitting device
US7918567B2 (en) 2004-06-10 2011-04-05 Olympus Corporation Light emitting device, manufacturing method for light emitting device, illumination device using light emitting device, and projector
JP2012507846A (en) * 2008-11-05 2012-03-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ It led with a molded two-way optical components
JP2016114952A (en) * 2016-01-18 2016-06-23 凸版印刷株式会社 Colored forgery prevention structure and colored forgery prevention medium
US10099503B2 (en) 2011-05-25 2018-10-16 Toppan Printing Co., Ltd. Coloring forgery prevention structure and coloring forgery prevention medium

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003101077A (en) * 2001-09-25 2003-04-04 Pentax Corp Light-emitting diode
US7918567B2 (en) 2004-06-10 2011-04-05 Olympus Corporation Light emitting device, manufacturing method for light emitting device, illumination device using light emitting device, and projector
JP2008516463A (en) * 2004-10-12 2008-05-15 クリー インコーポレイテッドCree Inc. Side-emitting optical coupling device
JP2010500739A (en) * 2006-08-09 2010-01-07 パナソニック株式会社 The light-emitting device
JP2009070679A (en) * 2007-09-13 2009-04-02 Koito Mfg Co Ltd Lamp unit of vehicle headlight, and vehicle headlight
JP2012507846A (en) * 2008-11-05 2012-03-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ It led with a molded two-way optical components
US10099503B2 (en) 2011-05-25 2018-10-16 Toppan Printing Co., Ltd. Coloring forgery prevention structure and coloring forgery prevention medium
JP2016114952A (en) * 2016-01-18 2016-06-23 凸版印刷株式会社 Colored forgery prevention structure and colored forgery prevention medium

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