CN205159360U - A preparation facilities for inverting glued membrane of LED chip - Google Patents
A preparation facilities for inverting glued membrane of LED chip Download PDFInfo
- Publication number
- CN205159360U CN205159360U CN201520821694.5U CN201520821694U CN205159360U CN 205159360 U CN205159360 U CN 205159360U CN 201520821694 U CN201520821694 U CN 201520821694U CN 205159360 U CN205159360 U CN 205159360U
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- China
- Prior art keywords
- preparation facilities
- light
- absorbing member
- transparent substrates
- light absorbing
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- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000012528 membrane Substances 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 31
- 239000010408 film Substances 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 32
- 238000000034 method Methods 0.000 abstract description 15
- 238000007711 solidification Methods 0.000 abstract description 14
- 230000008023 solidification Effects 0.000 abstract description 14
- 230000008033 biological extinction Effects 0.000 abstract 3
- 230000003760 hair shine Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000004026 adhesive bonding Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a preparation facilities for inverting glued membrane of LED chip, illuminator below including the printing opacity base plate and locating the printing opacity base plate, be equipped with the extinction part on the printing opacity base plate, illuminator's light permeable printing opacity base plate shines to the extinction part on, the upper surface of printing opacity base plate is equipped with the recess, the extinction part inlay in in the recess. Adopt the utility model discloses, the mode that adopts " solid light - heat - " realizes glue solidification, and the flexibility is strong, and simultaneously, in the solidification process, the LED chip need together not get into the oven along with glue and solidify, realization automation more easily.
Description
Technical field
The utility model relates to LED technical field, particularly relates to a kind of preparation facilities of the glued membrane for flip LED chips.
Background technology
Along with developing rapidly of semiconductor industry, the range of application of encapsulation technology is increasingly extensive, and packing forms is variation more.Wherein, Flip Chip (Flip-Chip), also claim " crystalline substance that falls encapsulates " or " brilliant package method ", it is a kind of chip interconnects technology, is again a kind of desirable die bonding technology.The LED light source of Flip Chip support is compared with conventional package light source, and have thermal resistance low, voltage is low, the feature that high current density light efficiency is high, and comprehensive study shows to cover potentiality and the advantage that brilliant LED light source has its uniqueness in application.
Flip Chip comprises die bond technique and gluing process, wherein, gluing process be by point gum machine by the glue that is mixed evenly and fluorescent material drop in the upper surface of LED chip, and the LED chip after having put glue is put into baking box, toast with about 50 DEG C and under vacuumizing state at least 20 minutes, air residual in glue is discharged, then by sample with 150 DEG C of bakings 1 hour, glue is solidified completely.Therefore, existing gluing process is the solidification (such as, making glue realize solidification by the heat in baking box) directly being realized glue by heat, and limitation is large; Meanwhile, in the curing process, LED chip need together enter baking box with glue and be cured, and is unfavorable for the making of automation LED chip.
Summary of the invention
Technical problem to be solved in the utility model is, provides a kind of preparation facilities of the glued membrane for flip LED chips, structure is simple, easy to operate, flexibility is strong, can ensure the performance of LED chip.
In order to solve the problems of the technologies described above, the utility model provides a kind of preparation facilities of the glued membrane for flip LED chips, comprise transparent substrates and be located at the light-emitting device below transparent substrates, the upper surface of described transparent substrates is provided with light absorbing member, and the light-transmissive transparent substrates of described light-emitting device exposes on light absorbing member.
As the improvement of such scheme, the shape of described light absorbing member is consistent with the molding pattern of glued membrane.
As the improvement of such scheme, described transparent substrates is glass substrate.
As the improvement of such scheme, the thickness of described light absorbing member is 0.1 ~ 10 micron.
As the improvement of such scheme, described light absorbing member is metallic film, graphite film or composite material film.
As the improvement of such scheme, described metallic film is aluminium film, iron thin film or Copper thin film.
As the improvement of such scheme, the region on described transparent substrates beyond light absorbing member is provided with reflecting part.
As the improvement of such scheme, the upper surface of described transparent substrates is also provided with box dam.
Enforcement the beneficial effects of the utility model are:
The utility model is by light-emitting device emission of light, light therethrough transparent substrates exposes on light absorbing member, light absorbing member absorbs light and light is converted into heat energy, by heat energy, glue is cured again, namely the utility model adopts the mode of " Gu light-Re-" to realize glue curing, and flexibility is strong.
In addition, the glue after solidification is fixed on the upper surface of LED chip, i.e. alternative gluing process of the prior art, therefore, in the curing process, LED chip need together not enter baking box with glue and be cured glue, saves space, more easily realizes automation.
Accompanying drawing explanation
Fig. 1 is the first example structure schematic diagram of the utility model for the preparation facilities of the glued membrane of flip LED chips;
Fig. 2 is the second example structure schematic diagram of the utility model for the preparation facilities of the glued membrane of flip LED chips.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, the utility model is described in further detail.Only this statement, the present invention occurs in the text or is about to the up, down, left, right, before and after occurred, the orientation word such as inside and outside, only with accompanying drawing of the present invention for benchmark, it is not to concrete restriction of the present invention.
See Fig. 1, Fig. 1 shows first embodiment of the utility model for the preparation facilities 100 of the glued membrane of flip LED chips, described preparation facilities 100 comprises transparent substrates 1 and is located at the light-emitting device 2 below transparent substrates 1, the upper surface of described transparent substrates 1 is provided with light absorbing member 3, and the light-transmissive transparent substrates 1 of described light-emitting device 2 exposes on light absorbing member 3.Described transparent substrates 1 is preferably glass substrate, has good light transmission.
During use, by the glue that is mixed evenly and fluorescent material 4 drop in the upper surface of transparent substrates 1, start light-emitting device 2, light-emitting device 2 is to transparent substrates 1 emission of light, light therethrough transparent substrates 1 exposes on light absorbing member 3, and light absorbing member 3 absorbs light and is heat energy by transform light energy, simultaneously, light absorbing member 3 provides heat energy for the glue of transparent substrates 1 upper surface, realizes the solidification of glue.Finally, the glue after solidification is taken out, and is fixed on the upper surface of LED chip, i.e. alternative gluing process of the prior art.Wherein, the light that light-emitting device 2 is launched can be incandescence, ultraviolet light or blue light, but not as restriction.
As from the foregoing, existing gluing process is the solidification directly being realized glue by heat, and limitation is large, compared with prior art, the utility model by being first heat energy by light energy conversion, then realizes solidification by heat energy to glue, luminous energy can be incandescence, ultraviolet light or blue light, and flexibility is strong.Meanwhile, adopt the utility model, make glue in the curing process, LED chip need together not enter baking box with glue and be cured, and saves space, more easily realizes automation.
Further, the shape of described light absorbing member and the molding pattern of glued membrane consistent.It should be noted that, the shape of light absorbing member can be arranged according to the molding pattern of glued membrane, and the setting position of light absorbing member 3 is consistent with the molding pattern of glued membrane.Glue in the curing process, the glue be only positioned at above light absorbing member 3 could receive light absorbing member 3 heat is provided, thus realize the local solidification of glue, flexibility is strong, therefore, in process of production, the pattern of groove can be set according to the actual requirements, to produce more accurate glued membrane, better to mate the LED chip of difformity, performance.
The thickness of described light absorbing member is 0.1 ~ 10 micron, ensure glue can receive better light absorbing member 3 heat is provided.
Described light absorbing member 3 is made up of colored inorganic exotic material, is preferably metallic film, graphite film or composite material film, but not as restriction.More preferably, described metallic film is the compound film of aluminium film, iron thin film, Copper thin film or aluminium, copper, iron, has good heat conductivility, can ensure the transmission of heat.
See Fig. 2, Fig. 2 shows second embodiment of the utility model for the preparation facilities 100 of the glued membrane of flip LED chips, with the first embodiment shown in Fig. 1 unlike, region on transparent substrates 1 described in the present embodiment beyond light absorbing member 3 is provided with reflecting part 5, described light absorbing member 3 and reflecting part 5 non-overlapping copies.By the light that reflecting part 5 can prevent the region absorption light-emitting device 2 beyond light absorbing member 3 from launching effectively, make the region corresponding to reflecting part 5 keep lower temperature, prevent the solidification of the fluorescent glue above reflecting part 5; Meanwhile, reflecting part 5 can reflect light, makes light emission to light absorbing member 3, ensures that light absorbing member 3 can receive more luminous energy further, realizes local solidification.
Further, the upper surface of described transparent substrates 1 is also provided with box dam, can effectively prevent glue from overflowing transparent substrates 1 by box dam, ensures that glue is in the upper surface of transparent substrates 1 all the time, ensures solidification effect.
As from the foregoing, the utility model by being first heat energy by light energy conversion, then realizes solidification by heat energy to glue, and flexibility is strong; Meanwhile, in the curing process, LED chip need together not enter baking box with glue and be cured glue, can ensure the performance of LED chip.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection range of the present utility model.
Claims (8)
1. the preparation facilities for the glued membrane of flip LED chips, it is characterized in that, described preparation facilities comprises transparent substrates and is located at the light-emitting device below transparent substrates, the upper surface of described transparent substrates is provided with light absorbing member, and the light-transmissive transparent substrates of described light-emitting device exposes on light absorbing member.
2. preparation facilities as claimed in claim 1, it is characterized in that, the shape of described light absorbing member is consistent with the molding pattern of glued membrane.
3. preparation facilities as claimed in claim 1, it is characterized in that, described transparent substrates is glass substrate.
4. preparation facilities as claimed in claim 1, it is characterized in that, the thickness of described light absorbing member is 0.1 ~ 10 micron.
5. preparation facilities as claimed in claim 1, it is characterized in that, described light absorbing member is metallic film, graphite film or composite material film.
6. preparation facilities as claimed in claim 5, it is characterized in that, described metallic film is aluminium film, iron thin film or Copper thin film.
7. preparation facilities as claimed in claim 1, it is characterized in that, the region on described transparent substrates beyond light absorbing member is provided with reflecting part.
8. the preparation facilities as described in any one of claim 1 ~ 7, is characterized in that, the upper surface of described transparent substrates is also provided with box dam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520821694.5U CN205159360U (en) | 2015-10-23 | 2015-10-23 | A preparation facilities for inverting glued membrane of LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520821694.5U CN205159360U (en) | 2015-10-23 | 2015-10-23 | A preparation facilities for inverting glued membrane of LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205159360U true CN205159360U (en) | 2016-04-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520821694.5U Active CN205159360U (en) | 2015-10-23 | 2015-10-23 | A preparation facilities for inverting glued membrane of LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205159360U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105374924A (en) * | 2015-10-23 | 2016-03-02 | 佛山市中昊光电科技有限公司 | Preparation apparatus and method of glue film and preparation method of flip LED chip |
-
2015
- 2015-10-23 CN CN201520821694.5U patent/CN205159360U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105374924A (en) * | 2015-10-23 | 2016-03-02 | 佛山市中昊光电科技有限公司 | Preparation apparatus and method of glue film and preparation method of flip LED chip |
| CN105374924B (en) * | 2015-10-23 | 2018-03-06 | 佛山市中昊光电科技有限公司 | The preparation method of the preparation facilities of glued membrane, preparation method and flip LED chips |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A preparation facilities for inverting glued membrane of LED chip Effective date of registration: 20170418 Granted publication date: 20160413 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: FOSHAN EVERCORE OPTOELECTRONIC TECHNOLOGY CO.,LTD. Registration number: 2017990000256 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20160413 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: FOSHAN EVERCORE OPTOELECTRONIC TECHNOLOGY CO.,LTD. Registration number: 2017990000256 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |