CN103311417A - Phosphor coating method for high-power LEDs - Google Patents
Phosphor coating method for high-power LEDs Download PDFInfo
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- CN103311417A CN103311417A CN2013102258085A CN201310225808A CN103311417A CN 103311417 A CN103311417 A CN 103311417A CN 2013102258085 A CN2013102258085 A CN 2013102258085A CN 201310225808 A CN201310225808 A CN 201310225808A CN 103311417 A CN103311417 A CN 103311417A
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- phosphor
- power led
- painting method
- fluorescent powder
- led fluorescent
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Abstract
The invention provides a phosphor coating method for high-power LEDs. The method includes the steps of adding phosphor and insulating heat-conducting glue to a rubber mixing mill for mixing according to the weight ratio of 1:4 to 1:12; after even mixing, sandwiching the glue with a film press and pressing the glue to obtain a phosphor film; fixing a chip on a substrate circuit; preheating a substrate to remove damp, and directly attaching the phosphor film to the substrate with the fixed chip through an automatic applicator; after the phosphor film solidifies, cutting to obtain lamp strips. The phosphor coating method for high-power LEDs has the advantages of simplicity in process, high efficiency and low cost, even coating of the phosphor is guaranteed, photochromic uniformity is guaranteed, and lighting efficiency is improved.
Description
(1) technical field
The invention belongs to LED encapsulation technology field, relate to a kind of method for packing of white light LEDs, be specifically related to the painting method of fluorescent material in the multi-chip high power packaging process of white LED.
(2) background technology
LED has the luminous efficiency height, volume is little, power consumption is low, long service life, advantage such as pollution-free, is optimal conventional light source substitute.Have only by improving and improving led chip preparation and encapsulation technology, reduce cost, improve light efficiency, the LED lamp just might be popularized in the general lighting field.
The mode that realizes white light LEDs has a lot, at present realized that the mode of industrialization is to apply fluorescent material at led chip, for example: the blue led chip applies and applies the fluorescent material that applies three primary colors or multiple color on green and red fluorescence powder and purple light or the ultraviolet leds chip on yellow fluorescent powder, the blue led chip.
The characteristic of phosphor powder layer directly has influence on the overall performance of white light LEDs.Adopted more at present and remained traditional dosing technology, directly spot printing phosphor gel on chip surface.Yet this method is difficult to shape and the thickness evenness of control phosphor powder layer, and then can cause between device colourity difference big, white light hot spot problem of non-uniform occurs.
(3) summary of the invention
The objective of the invention is provides a kind of evenly painting method of high-power LED fluorescent powder efficiently of coating of fluorescent material that guarantees for high-power multi-chip white light LEDs encapsulation.
The object of the present invention is achieved like this: it may further comprise the steps: with fluorescent material and insulating heat-conductive glue be added to by weight 1: 4～1: 12 carry out on the rubber mixing machine mixing, mixing even back is clipped in the middle sizing material with the press mold machine, sizing material is pressed into phosphor laminate, after chip is fixed on the chip circuit, earlier with substrate preheating dehumidifying, with the automatic rubberizing machine phosphor laminate is directly pasted on the substrate that chip is fixedly arranged, phosphor laminate is cut into the lamp bar after solidifying again again.
The present invention also has some technical characterictics like this:
1, described mixing condition is 30 ℃.
2, described phosphor gel film thickness is 200～1200 μ m.
3, described film substrate is release liners.
4, described substrate is 100 ℃ of following preheating dehumidifyings more than 40 minutes.
5, described condition of cure is 50～150 ℃.
6, described insulating heat-conductive glue is silica gel, epoxy resin.
7, described fluorescent material is the mixture of bloom or bloom and rouge and powder.
The invention has the beneficial effects as follows: 1) with the automatic rubberizing machine that fluorescent material is simple with the method technical process that the form of glued membrane pastes on substrate, the production efficiency height, cost of manufacture is low; 2) mode that pastes with glued membrane can make bondline thickness more even, reduces light because repeatedly reflecting absorbed phenomenon, improves light efficiency, guarantees photochromic uniformity.
(4) description of drawings
Fig. 1 is flow chart of the present invention.
(5) embodiment
The present invention is described in detail below in conjunction with the drawings and specific embodiments.
In conjunction with Fig. 1, present embodiment mixes yellow fluorescent powder by mass ratio with silica gel at 1: 8, and is repeatedly mixing under 30 ℃ of conditions, mixes until fluorescent material and silica gel.The sizing material that mixes is clipped in the middle of the two-layer release liners, and making thickness with the pressing of press mold machine is the thick glued membranes of 1000 μ m.After being fixed on chip on the chip circuit, at first with substrate 100 ℃ of following preheating dehumidifyings more than 40 minutes, the glued membrane that will be mixed with fluorescent material with the automatic rubberizing machine pastes on the substrate that chip is fixedly arranged again, segmentation is heated to 130 ℃ glued membrane is cured again.Glued membrane cuts according to size and the quantity of required single paster LED after solidifying again.
Claims (8)
1. high-power LED fluorescent powder painting method, it is characterized in that it may further comprise the steps: with fluorescent material and insulating heat-conductive glue be added to by weight 1: 4～1: 12 carry out on the rubber mixing machine mixing, mixing even back is clipped in the middle sizing material with the press mold machine, sizing material is pressed into phosphor laminate, after chip is fixed on the chip circuit, with substrate preheating dehumidifying, with the automatic rubberizing machine phosphor laminate is directly pasted on the substrate that chip is fixedly arranged earlier, phosphor laminate is cut into the lamp bar after solidifying again again.
2. a kind of high-power LED fluorescent powder painting method according to claim 1 is characterized in that described mixing condition is 30 ℃.
3. a kind of high-power LED fluorescent powder painting method according to claim 2 is characterized in that described phosphor gel film thickness is 200～1200 μ m.
4. a kind of high-power LED fluorescent powder painting method according to claim 3 is characterized in that described film substrate is release liners.
5. a kind of high-power LED fluorescent powder painting method according to claim 4 is characterized in that described substrate is 100 ℃ of following preheating dehumidifyings more than 40 minutes.
6. a kind of high-power LED fluorescent powder painting method according to claim 5 is characterized in that described condition of cure is 50～150 ℃.
7. a kind of high-power LED fluorescent powder painting method according to claim 6 is characterized in that described insulating heat-conductive glue is silica gel, epoxy resin.
8. a kind of high-power LED fluorescent powder painting method according to claim 7 is characterized in that described fluorescent material is the mixture of bloom or bloom and rouge and powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102258085A CN103311417A (en) | 2013-06-04 | 2013-06-04 | Phosphor coating method for high-power LEDs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102258085A CN103311417A (en) | 2013-06-04 | 2013-06-04 | Phosphor coating method for high-power LEDs |
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| CN103311417A true CN103311417A (en) | 2013-09-18 |
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| CN2013102258085A Pending CN103311417A (en) | 2013-06-04 | 2013-06-04 | Phosphor coating method for high-power LEDs |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882529A (en) * | 2015-05-14 | 2015-09-02 | 天津德高化成新材料股份有限公司 | Quick packaging method for COB-type LED chip |
| CN106684231A (en) * | 2016-12-30 | 2017-05-17 | 江苏稳润光电有限公司 | Chip scale package (CSP) piece and package method |
| CN110387234A (en) * | 2019-05-22 | 2019-10-29 | 三明学院 | A kind of hydrogel color fluorescence skin paste and preparation method thereof |
| CN112909152A (en) * | 2021-01-22 | 2021-06-04 | 深圳市鑫业新光电有限公司 | Adhesive film packaging process |
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| CN101740707A (en) * | 2009-12-11 | 2010-06-16 | 晶科电子（广州）有限公司 | Preformed fluorescent powder patch and method for encapsulating same and light emitting diode |
| CN102130282A (en) * | 2011-02-12 | 2011-07-20 | 西安神光安瑞光电科技有限公司 | Packaging structure and packaging method for white LED (light-emitting diode) |
| CN102723424A (en) * | 2012-05-25 | 2012-10-10 | 苏州晶品光电科技有限公司 | Method for preparing fluorescent wafer for LED (light-emitting diode) |
| CN103044892A (en) * | 2013-01-11 | 2013-04-17 | 华南师范大学 | Fluorescent and transparent polycarbonate grating for LED (light-emitting diode) and preparation method for same |
-
2013
- 2013-06-04 CN CN2013102258085A patent/CN103311417A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101740707A (en) * | 2009-12-11 | 2010-06-16 | 晶科电子（广州）有限公司 | Preformed fluorescent powder patch and method for encapsulating same and light emitting diode |
| CN102130282A (en) * | 2011-02-12 | 2011-07-20 | 西安神光安瑞光电科技有限公司 | Packaging structure and packaging method for white LED (light-emitting diode) |
| CN102723424A (en) * | 2012-05-25 | 2012-10-10 | 苏州晶品光电科技有限公司 | Method for preparing fluorescent wafer for LED (light-emitting diode) |
| CN103044892A (en) * | 2013-01-11 | 2013-04-17 | 华南师范大学 | Fluorescent and transparent polycarbonate grating for LED (light-emitting diode) and preparation method for same |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882529A (en) * | 2015-05-14 | 2015-09-02 | 天津德高化成新材料股份有限公司 | Quick packaging method for COB-type LED chip |
| CN104882529B (en) * | 2015-05-14 | 2017-11-03 | 天津德高化成新材料股份有限公司 | A kind of fast packing method of COB types LED chip |
| CN106684231A (en) * | 2016-12-30 | 2017-05-17 | 江苏稳润光电有限公司 | Chip scale package (CSP) piece and package method |
| CN110387234A (en) * | 2019-05-22 | 2019-10-29 | 三明学院 | A kind of hydrogel color fluorescence skin paste and preparation method thereof |
| CN110387234B (en) * | 2019-05-22 | 2022-07-12 | 三明学院 | Hydrogel color fluorescent skin patch and preparation method thereof |
| CN112909152A (en) * | 2021-01-22 | 2021-06-04 | 深圳市鑫业新光电有限公司 | Adhesive film packaging process |
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Application publication date: 20130918 |