CN112909152A - Adhesive film packaging process - Google Patents
Adhesive film packaging process Download PDFInfo
- Publication number
- CN112909152A CN112909152A CN202110089219.3A CN202110089219A CN112909152A CN 112909152 A CN112909152 A CN 112909152A CN 202110089219 A CN202110089219 A CN 202110089219A CN 112909152 A CN112909152 A CN 112909152A
- Authority
- CN
- China
- Prior art keywords
- glue
- adhesive film
- film
- powder
- finished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 89
- 238000012858 packaging process Methods 0.000 title claims abstract description 21
- 239000003292 glue Substances 0.000 claims abstract description 128
- 238000003756 stirring Methods 0.000 claims abstract description 67
- 239000000843 powder Substances 0.000 claims abstract description 49
- 238000004806 packaging method and process Methods 0.000 claims abstract description 16
- 238000007731 hot pressing Methods 0.000 claims abstract description 10
- 238000005303 weighing Methods 0.000 claims abstract description 10
- 238000007723 die pressing method Methods 0.000 claims abstract description 9
- 238000000748 compression moulding Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- 239000012528 membrane Substances 0.000 claims description 24
- 238000005520 cutting process Methods 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 9
- 238000009954 braiding Methods 0.000 claims description 4
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 abstract description 3
- 238000003860 storage Methods 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 abstract 2
- 239000000047 product Substances 0.000 description 9
- 238000005507 spraying Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wrappers (AREA)
Abstract
The invention discloses an adhesive film packaging process, which comprises the following steps: s1, preparing materials: selecting the adhesive film powder and the adhesive film glue which need to be used according to the adhesive film packaging requirement, weighing the adhesive film powder and the adhesive film glue in proportion, and weighing corresponding parts for later use; s2, stirring: putting the weighed glue film powder and glue film glue into a vacuum stirrer, and carrying out vacuum stirring on the glue film powder and the glue film glue to ensure that the glue film powder and the glue film glue are fully fused to form semi-finished glue; s3, compression molding: and (3) guiding the semi-finished glue prepared by vacuum stirring into a film pressing machine, carrying out hot pressing by the film pressing machine at the hot pressing temperature of 150 ℃, and carrying out die pressing on the guided semi-finished glue to prepare the semi-finished glue film. The adhesive film packaging process provided by the invention is mainly characterized by simple operation, low cost, small limitation, convenient storage and use, flat surface of a packaging end product, uniform light emission and high concentration.
Description
Technical Field
The invention relates to the field of packaging, in particular to an adhesive film packaging process.
Background
At present, when packaging is carried out in the market, powder, glue and a solvent required by packaging are usually mixed, the mixture is placed into spraying equipment for spraying after circulation, the operation mode is slow to implement, a powder sprayer and a discharge tester are matched with each other, the test is needed once every time the spraying is carried out, a heating table is placed for repeatedly baking products, particularly amber powder spraying, the baking frequency is up to 30 times, the labor cost is high, the efficiency is low, the used glue is soft glue with low hardness coefficient, and the glue cannot be stored below 0 ℃ due to the stress effect of the glue, foams when meeting moisture and is not beneficial to use, so that a glue film packaging process is provided.
Disclosure of Invention
The invention aims to solve the problems that a powder sprayer and a discharge tester are required to be matched with each other, the labor cost is high, the efficiency is low, and the storage and the use are not facilitated in the conventional packaging process.
In order to achieve the purpose, the invention adopts the following technical scheme:
the adhesive film packaging process is characterized by comprising the following steps:
s1, preparing materials: selecting the adhesive film powder and the adhesive film glue which need to be used according to the adhesive film packaging requirement, weighing the adhesive film powder and the adhesive film glue in proportion, and weighing corresponding parts for later use;
s2, stirring: putting the weighed glue film powder and glue film glue into a vacuum stirrer, and carrying out vacuum stirring on the glue film powder and the glue film glue to ensure that the glue film powder and the glue film glue are fully fused to form semi-finished glue;
s3, compression molding: guiding the semi-finished glue prepared by vacuum stirring into a laminator, carrying out hot pressing by the laminator at the hot pressing temperature of 150 ℃, and carrying out die pressing on the guided semi-finished glue to prepare a semi-finished glue film;
s4, cutting: putting the semi-finished rubber membrane prepared by die pressing into cutting machine equipment, cutting the semi-finished rubber membrane into required specification and size according to the use requirement of a rubber membrane to prepare a single PCS rubber membrane, and laying the single PCS rubber membrane on a blue membrane for later use;
s5, die bonding: placing the blue film paved with the single PCS adhesive film on a die bonder, enabling the die bonder to work to jack up the adhesive film on the blue film, sucking the adhesive film of the single PCS through a suction nozzle, placing adhesive glue on a chip at the moment, immediately placing the adhesive film of the single PCS on the chip, and enabling the adhesive film and the chip to be fixed through the adhesive glue;
s6, primary baking: placing the chip with the adhesive film fixed through dispensing into an oven for baking to enable the adhesive film to be fully contacted with the chip;
s7, cofferdam: taking out the chips after primary baking, and filling the edges of the chips and the adhesive film with white adhesive;
s8, baking again: placing the glue film and the chip filled with the white glue into the oven again for baking so that the white glue is in full contact with the glue film and the chip;
s9, finished product: and taking out the chips which are baked again, cutting and classifying, and after the cutting and the classifying are finished, placing the chips into a braider according to grades for braiding and packaging to obtain a finished product.
Preferably, the glue film powder of steps S1 and S2 is prepared by mixing nitride-based red powder with one or more of GaAG-based green powder and YAG-based yellow powder.
Preferably, the glue film glue involved in the steps S1 and S2 is formed by mixing one or two of dow corning 7103A/B glue and Xinyue 2461A/B glue.
Preferably, the stirring time and the rotation speed in step S2 are, in order:
a: the stirring time is 28-32S, and the stirring speed is 195-205 r/S;
b: the stirring time is 58-62S, and the stirring speed is 510-530 r/S;
c: the stirring time is 18-22S, and the stirring speed is 1950 and 2050 r/S;
d: the stirring time is 88-92S, and the stirring speed is 890-910 r/S;
e: the stirring time is 28-32S, and the stirring speed is 1180-1200 r/S;
and continuously stirring twice according to the stirring time and the rotating speed sequence.
Preferably, the thickness of the molded semi-finished film should be controlled between 0.14-0.16 in step S3.
Preferably, the baking temperature of the primary baking related to the step S6 should be controlled at 180 ℃ and the baking time should be 190min and 170-.
Preferably, the bank in step S7 is left only right above the edge when the edge is filled, so that one-sided light emission is realized.
Preferably, the re-baking temperature involved in the step S8 should be controlled at 180 ℃ and 170 min-.
Preferably, the classification in step S8 is to split the color of the diced chips.
Compared with the prior art, the invention has the beneficial effects that: the invention provides an adhesive film packaging process which is mainly characterized in that the preparation process is simple, adhesive film powder and adhesive film adhesive are molded and then cut into an adhesive film with single pcs, the cut adhesive film is placed on a die bonder to be absorbed and placed above a chip for adhering the adhesive film, and then baking is carried out, the adopted adhesive has no limitation, the raw material cost is low, the adhesive film can be mixed and stirred with the adhesive film powder, hard adhesive and soft adhesive can be selected according to product power parameters, the surface of a packaging end product is flat, the light emitting is uniform, the concentration degree is high, and the packaging end product can be stored at the temperature of minus 40-100 ℃.
In conclusion, the packaging process is simple to operate, low in cost, small in limitation, convenient to store and use, flat in surface of a product at a packaging end, uniform in light emitting and high in concentration.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1:
the adhesive film packaging process is characterized by comprising the following steps:
s1, preparing materials: selecting the adhesive film powder and the adhesive film glue which need to be used according to the adhesive film packaging requirement, weighing the adhesive film powder and the adhesive film glue in proportion, and weighing corresponding parts for later use;
s2, stirring: putting the weighed glue film powder and glue film glue into a vacuum stirrer, and carrying out vacuum stirring on the glue film powder and the glue film glue to ensure that the glue film powder and the glue film glue are fully fused to form semi-finished glue;
s3, compression molding: guiding the semi-finished glue prepared by vacuum stirring into a laminator, carrying out hot pressing by the laminator at the hot pressing temperature of 150 ℃, and carrying out die pressing on the guided semi-finished glue to prepare a semi-finished glue film;
s4, cutting: putting the semi-finished rubber membrane prepared by die pressing into cutting machine equipment, cutting the semi-finished rubber membrane into required specification and size according to the use requirement of a rubber membrane to prepare a single PCS rubber membrane, and laying the single PCS rubber membrane on a blue membrane for later use;
s5, die bonding: placing the blue film paved with the single PCS adhesive film on a die bonder, enabling the die bonder to work to jack up the adhesive film on the blue film, sucking the adhesive film of the single PCS through a suction nozzle, placing adhesive glue on a chip at the moment, immediately placing the adhesive film of the single PCS on the chip, and enabling the adhesive film and the chip to be fixed through the adhesive glue;
s6, primary baking: placing the chip with the adhesive film fixed through dispensing into an oven for baking to enable the adhesive film to be fully contacted with the chip;
s7, cofferdam: taking out the chips after primary baking, and filling the edges of the chips and the adhesive film with white adhesive;
s8, baking again: placing the glue film and the chip filled with the white glue into the oven again for baking so that the white glue is in full contact with the glue film and the chip;
s9, finished product: and taking out the chips which are baked again, cutting and classifying, and after the cutting and the classifying are finished, placing the chips into a braider according to grades for braiding and packaging to obtain a finished product.
Specifically, the glue film powder in steps S1 and S2 is made by mixing red powder of nitride and yellow powder of YAG.
Specifically, the glue film glue involved in the steps S1 and S2 is formed by mixing Dow Corning 7103A/B glue and Xinyue 2461A/B glue.
Specifically, the stirring time and the rotation speed related to step S2 are sequentially:
a: the stirring time is 30S, and the stirring speed is 200 r/S;
b: the stirring time is 60S, and the stirring speed is 520 r/S;
c: the stirring time is 20S, and the stirring speed is 2000 r/S;
d: the stirring time is 90S, and the stirring speed is 900 r/S;
e: the stirring time is 30S, and the stirring speed is 1200 r/S;
and continuously stirring twice according to the stirring time and the rotating speed sequence.
Specifically, the thickness of the molded semi-finished film should be controlled to 0.15 in step S3.
Specifically, the baking temperature of the primary baking related to the step S6 should be controlled at 160 ℃, and the baking time is 180 min.
Specifically, the bank related to the step S7 should be left only right above the edge when the edge is filled, so as to realize single-sided light emission.
Specifically, the baking temperature of the re-baking in step S8 should be controlled at 150 ℃, and the baking time is 180 min.
Specifically, the classification in step S8 is to perform light splitting and color separation on the diced chips.
Example 2:
the adhesive film packaging process is characterized by comprising the following steps:
s1, preparing materials: selecting the adhesive film powder and the adhesive film glue which need to be used according to the adhesive film packaging requirement, weighing the adhesive film powder and the adhesive film glue in proportion, and weighing corresponding parts for later use;
s2, stirring: putting the weighed glue film powder and glue film glue into a vacuum stirrer, and carrying out vacuum stirring on the glue film powder and the glue film glue to ensure that the glue film powder and the glue film glue are fully fused to form semi-finished glue;
s3, compression molding: guiding the semi-finished glue prepared by vacuum stirring into a laminator, carrying out hot pressing by the laminator at the hot pressing temperature of 150 ℃, and carrying out die pressing on the guided semi-finished glue to prepare a semi-finished glue film;
s4, cutting: putting the semi-finished rubber membrane prepared by die pressing into cutting machine equipment, cutting the semi-finished rubber membrane into required specification and size according to the use requirement of a rubber membrane to prepare a single PCS rubber membrane, and laying the single PCS rubber membrane on a blue membrane for later use;
s5, die bonding: placing the blue film paved with the single PCS adhesive film on a die bonder, enabling the die bonder to work to jack up the adhesive film on the blue film, sucking the adhesive film of the single PCS through a suction nozzle, placing adhesive glue on a chip at the moment, immediately placing the adhesive film of the single PCS on the chip, and enabling the adhesive film and the chip to be fixed through the adhesive glue;
s6, primary baking: placing the chip with the adhesive film fixed through dispensing into an oven for baking to enable the adhesive film to be fully contacted with the chip;
s7, cofferdam: taking out the chips after primary baking, and filling the edges of the chips and the adhesive film with white adhesive;
s8, baking again: placing the glue film and the chip filled with the white glue into the oven again for baking so that the white glue is in full contact with the glue film and the chip;
s9, finished product: and taking out the chips which are baked again, cutting and classifying, and after the cutting and the classifying are finished, placing the chips into a braider according to grades for braiding and packaging to obtain a finished product.
Specifically, the glue film powder according to steps S1 and S2 is prepared by mixing nitride red powder, GaAG green powder, and YAG yellow powder.
Specifically, the glue film glue involved in the steps S1 and S2 is formed by mixing Dow Corning 7103A/B glue and Xinyue 2461A/B glue.
Specifically, the stirring time and the rotation speed related to step S2 are sequentially:
a: the stirring time is 32S, and the stirring speed is 195 r/S;
b: the stirring time is 62S, and the stirring speed is 510 r/S;
c: the stirring time is 22S, and the stirring speed is 1950 r/S;
d: the stirring time is 92S, and the stirring speed is 890 r/S;
e: the stirring time is 32S, and the stirring speed is 1180 r/S;
and continuously stirring twice according to the stirring time and the rotating speed sequence.
Specifically, the thickness of the molded semi-finished film should be controlled to 0.16 in step S3.
Specifically, the baking temperature of the primary baking related to the step S6 should be controlled at 180 ℃, and the baking time is 190 min.
Specifically, the bank related to the step S7 should be left only right above the edge when the edge is filled, so as to realize single-sided light emission.
Specifically, the baking temperature of the re-baking in step S8 should be controlled at 180 ℃, and the baking time is 190 min.
Specifically, the classification in step S8 is to perform light splitting and color separation on the diced chips.
Based on the above examples 1 and 2, the blending ratio of the glue film powder and the glue film glue in the steps S1 and S2 is shown in the following table 1:
TABLE 1 proportioning table of adhesive film powder and adhesive film glue
Note: the above table relates to the error range of the glue film powder ratio value is + -0.005, and the error range of the glue film glue ratio value is + -0.2.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. The adhesive film packaging process is characterized by comprising the following steps:
s1, preparing materials: selecting the adhesive film powder and the adhesive film glue which need to be used according to the adhesive film packaging requirement, weighing the adhesive film powder and the adhesive film glue in proportion, and weighing corresponding parts for later use;
s2, stirring: putting the weighed glue film powder and glue film glue into a vacuum stirrer, and carrying out vacuum stirring on the glue film powder and the glue film glue to ensure that the glue film powder and the glue film glue are fully fused to form semi-finished glue;
s3, compression molding: guiding the semi-finished glue prepared by vacuum stirring into a laminator, carrying out hot pressing by the laminator at the hot pressing temperature of 150 ℃, and carrying out die pressing on the guided semi-finished glue to prepare a semi-finished glue film;
s4, cutting: putting the semi-finished rubber membrane prepared by die pressing into cutting machine equipment, cutting the semi-finished rubber membrane into required specification and size according to the use requirement of a rubber membrane to prepare a single PCS rubber membrane, and laying the single PCS rubber membrane on a blue membrane for later use;
s5, die bonding: placing the blue film paved with the single PCS adhesive film on a die bonder, enabling the die bonder to work to jack up the adhesive film on the blue film, sucking the adhesive film of the single PCS through a suction nozzle, placing adhesive glue on a chip at the moment, immediately placing the adhesive film of the single PCS on the chip, and enabling the adhesive film and the chip to be fixed through the adhesive glue;
s6, primary baking: placing the chip with the adhesive film fixed through dispensing into an oven for baking to enable the adhesive film to be fully contacted with the chip;
s7, cofferdam: taking out the chips after primary baking, and filling the edges of the chips and the adhesive film with white adhesive;
s8, baking again: placing the adhesive film and the chip filled with the white glue into the oven again for baking, so that the white glue is fully contacted with the adhesive film and the chip, the baking temperature is controlled to be 180 ℃ and the baking time is 190 min;
s9, finished product: and taking out the chips which are baked again, cutting and classifying, and after the cutting and the classifying are finished, placing the chips into a braider according to grades for braiding and packaging to obtain a finished product.
2. The adhesive film packaging process of claim 1, wherein the adhesive film powder involved in steps S1 and S2 is prepared by mixing nitride-based red powder with one or more of GaAG-based green powder and YAG-based yellow powder.
3. The adhesive film packaging process of claim 1, wherein the adhesive film glue of steps S1 and S2 is formed by mixing one or two of dow corning 7103A/B glue and shin yue 2461A/B glue.
4. The adhesive film packaging process according to claim 1, wherein the stirring time and the rotation speed involved in step S2 are sequentially:
a: the stirring time is 28-32S, and the stirring speed is 195-205 r/S;
b: the stirring time is 58-62S, and the stirring speed is 510-530 r/S;
c: the stirring time is 18-22S, and the stirring speed is 1950 and 2050 r/S;
d: the stirring time is 88-92S, and the stirring speed is 890-910 r/S;
e: the stirring time is 28-32S, and the stirring speed is 1180-1200 r/S;
and continuously stirring twice according to the stirring time and the rotating speed sequence.
5. The adhesive film packaging process of claim 1, wherein the thickness of the molded semi-finished adhesive film sheet involved in step S3 is controlled to be in the range of 0.14-0.16.
6. The adhesive film packaging process of claim 1, wherein the baking temperature of the primary baking in step S6 is controlled at 180 ℃ and the baking time is 190min and 170-.
7. The adhesive film packaging process of claim 1, wherein the cofferdam related to step S7 should only remain right above the edge for filling, so as to realize single-sided illumination.
8. The adhesive film packaging process of claim 1, wherein the re-baking temperature in step S8 is controlled at 180 ℃ and 170 min-.
9. The adhesive film packaging process of claim 1, wherein the classification of step S8 is to split the color of the cut chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110089219.3A CN112909152A (en) | 2021-01-22 | 2021-01-22 | Adhesive film packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110089219.3A CN112909152A (en) | 2021-01-22 | 2021-01-22 | Adhesive film packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112909152A true CN112909152A (en) | 2021-06-04 |
Family
ID=76118457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110089219.3A Pending CN112909152A (en) | 2021-01-22 | 2021-01-22 | Adhesive film packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112909152A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102506315A (en) * | 2011-10-22 | 2012-06-20 | 华南师范大学 | High-color-rendering-property light-emitting diode (LED) device |
| CN103236485A (en) * | 2013-04-16 | 2013-08-07 | 哈尔滨奥瑞德光电技术股份有限公司 | Method for manufacturing illuminant on transparent sapphire heat conductive plate |
| CN103296184A (en) * | 2013-05-31 | 2013-09-11 | 左洪波 | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support |
| CN103311417A (en) * | 2013-06-04 | 2013-09-18 | 左洪波 | Phosphor coating method for high-power LEDs |
| CN105720182A (en) * | 2015-09-27 | 2016-06-29 | 重庆品鉴光电工程有限公司 | Novel LED sapphire support |
| CN110112129A (en) * | 2019-06-05 | 2019-08-09 | 福建天电光电有限公司 | A kind of emitting semiconductor manufacture craft of glass flourescent sheet |
| CN110767791A (en) * | 2019-09-10 | 2020-02-07 | 江西省晶能半导体有限公司 | LED lamp bead preparation method |
| CN111063783A (en) * | 2019-12-30 | 2020-04-24 | 江西省晶能半导体有限公司 | Preparation method of fluorescent diaphragm and preparation method of LED lamp bead |
-
2021
- 2021-01-22 CN CN202110089219.3A patent/CN112909152A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102506315A (en) * | 2011-10-22 | 2012-06-20 | 华南师范大学 | High-color-rendering-property light-emitting diode (LED) device |
| CN103236485A (en) * | 2013-04-16 | 2013-08-07 | 哈尔滨奥瑞德光电技术股份有限公司 | Method for manufacturing illuminant on transparent sapphire heat conductive plate |
| CN103296184A (en) * | 2013-05-31 | 2013-09-11 | 左洪波 | Manufacturing method for light-emitting diode (LED) lamp strip using sapphire as chip support |
| CN103311417A (en) * | 2013-06-04 | 2013-09-18 | 左洪波 | Phosphor coating method for high-power LEDs |
| CN105720182A (en) * | 2015-09-27 | 2016-06-29 | 重庆品鉴光电工程有限公司 | Novel LED sapphire support |
| CN110112129A (en) * | 2019-06-05 | 2019-08-09 | 福建天电光电有限公司 | A kind of emitting semiconductor manufacture craft of glass flourescent sheet |
| CN110767791A (en) * | 2019-09-10 | 2020-02-07 | 江西省晶能半导体有限公司 | LED lamp bead preparation method |
| CN111063783A (en) * | 2019-12-30 | 2020-04-24 | 江西省晶能半导体有限公司 | Preparation method of fluorescent diaphragm and preparation method of LED lamp bead |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101699638A (en) | Phosphor powder film making method and obtained phosphor powder film encapsulating method | |
| CN100389504C (en) | YAG chip-type white-light light-emitting-diode and its packing method | |
| CN102723424B (en) | Method for preparing fluorescent wafer for LED (light-emitting diode) | |
| CN106876534A (en) | A kind of method for packing of flip-chip level LED light source | |
| CN112563391B (en) | LED packaging process | |
| CN107331678A (en) | The integrated LED display module chip shuffling method for packing of colourity difference can be eliminated | |
| CN112909152A (en) | Adhesive film packaging process | |
| CN104993032B (en) | A kind of white light LED part and preparation method thereof | |
| CN112993123A (en) | Packaging process for pasted glass sheet | |
| CN108400222A (en) | A kind of high aobvious production method for referring to LED light | |
| US6299806B1 (en) | Method for manufacturing EVA outsoles | |
| CN109742217B (en) | Four LED fluorescent powder proportioning and dispensing methods based on least square method | |
| CN113043361A (en) | Fluorescent sheet, LED packaging part and manufacturing method thereof | |
| CN110391322B (en) | LED lamp bead and preparation method thereof | |
| CN106684231A (en) | Chip scale package (CSP) piece and package method | |
| WO2020168028A3 (en) | System and method for continuous manufacture of joint compound | |
| CN108908826A (en) | Vacuum self-sucking coating film forming machine and fluorescence membrane preparation method | |
| CN108666307B (en) | CSP light source and preparation method thereof | |
| US20210005792A1 (en) | Optoelectronic device and manufacturing method thereof | |
| CN108148249A (en) | A kind of high-strength quick-solidifying polymer creamy material and preparation method for 3D printing | |
| CN108927859A (en) | A kind of veneer patch processing method of composite plywood | |
| CN105845810B (en) | A kind of production method of the high colour gamut white light LEDs lamp bead based on green light quantum point | |
| CN103390719A (en) | Fluorescent membrane for white-light LED module chip | |
| CN105826449A (en) | Moulding and preparation method and system for white-light chip | |
| CN112820815A (en) | Fluorescent diaphragm and LED lamp bead |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210604 |