CN113043361A - Fluorescent sheet, LED packaging part and manufacturing method thereof - Google Patents

Fluorescent sheet, LED packaging part and manufacturing method thereof Download PDF

Info

Publication number
CN113043361A
CN113043361A CN202010230909.1A CN202010230909A CN113043361A CN 113043361 A CN113043361 A CN 113043361A CN 202010230909 A CN202010230909 A CN 202010230909A CN 113043361 A CN113043361 A CN 113043361A
Authority
CN
China
Prior art keywords
fluorescent
target
cutting
sheet
strips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010230909.1A
Other languages
Chinese (zh)
Inventor
何刚
张志超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Jufei Optoelectronics Co Ltd
Original Assignee
Shenzhen Jufei Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Jufei Optoelectronics Co Ltd filed Critical Shenzhen Jufei Optoelectronics Co Ltd
Priority to CN202010230909.1A priority Critical patent/CN113043361A/en
Publication of CN113043361A publication Critical patent/CN113043361A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/02Bevelling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • B26D7/02Means for holding or positioning work with clamping means
    • B26D7/025Means for holding or positioning work with clamping means acting upon planar surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides a fluorescent sheet, an LED packaging piece and a manufacturing method thereof, wherein the manufacturing method of the fluorescent sheet comprises the following steps: fixing a fluorescent plate to be cut; cutting the fluorescent plate by a cutting tool at a first preset angle in an inclined manner along two symmetrical directions respectively to obtain a target fluorescent strip; rearranging and fixing the target fluorescent strips, arranging the rearranged target fluorescent strips to be cut in the same batch in parallel, and arranging the target fluorescent strips in the up-down direction in a consistent manner; and cutting the target fluorescent strips which are arranged in the rearranged mode in batches by the cutting tool at a second preset angle and respectively along two symmetrical directions in an inclined mode, wherein the cutting direction is along the width direction of the target fluorescent strips, and the target fluorescent sheets are obtained. Therefore, the fluorescent sheet is prepared in a cutting mode, the prepared fluorescent sheet is not provided with chamfers, the cutting surface is naturally rough, and the bonding strength between the fluorescent sheet and the reflective white glue can be enhanced when the LED packaging piece is prepared, so that the luminous effect of the packaged LED packaging piece is further improved.

Description

Fluorescent sheet, LED packaging part and manufacturing method thereof
Technical Field
The invention relates to the field of light emitting diodes, in particular to a fluorescent sheet, an LED packaging piece and a manufacturing method thereof.
Background
Along with the progress and the development of society, the technology of display equipment is also constantly innovated, in order to promote LED luminescent device display effect, often can adopt big-end-up's trapezoidal fluorescence piece structure, sets up the fluorescence piece in the LED chip outside, adjusts LED chip luminous effect for the light-emitting is even. However, in the related prior art, the manufacturing process of the fluorescent sheet is usually manufactured by a mold pressing method, that is, the preparation materials of the fluorescent sheet are mixed according to a certain ratio, the mixture is poured into a mold after high-temperature slurry burning, and the trapezoidal fluorescent sheet is obtained after cooling and molding, and the fluorescent sheet manufactured by the method has a chamfer, so that white glue on the surface of the fluorescent sheet is prone to influence the brightness of the LED during packaging; and the side wall of the fluorescent sheet which is molded by compression is smooth, so that the bonding degree between the fluorescent sheet and the encapsulated reflective white glue is poor, the fluorescent sheet is easy to degum, and the LED luminous effect is further influenced.
Disclosure of Invention
Aiming at solving the technical problem that the fluorescent sheet obtained by the existing fluorescent sheet manufacturing process has a chamfer and is too smooth, so that the LED light-emitting effect is poor, the invention provides a fluorescent sheet manufacturing method, which comprises the following steps:
fixing a fluorescent plate to be cut;
cutting the fluorescent plate by a cutting tool in a first preset angle in an inclined manner along two symmetrical directions respectively to obtain a target fluorescent strip;
rearranging and fixing the target fluorescent strips, arranging the target fluorescent strips to be cut in the same batch in parallel after rearrangement, and arranging the target fluorescent strips in the up-down direction consistently;
and cutting the rearranged target fluorescent strips in batches by a cutting tool at a second preset angle in an inclined manner along two symmetrical directions respectively, wherein the cutting direction is along the width direction of the target fluorescent strips, so as to obtain the target fluorescent sheets.
Optionally, the cutting the fluorescent plate by the cutting tool at a first preset angle and respectively cutting the fluorescent plate along two symmetrical directions in an inclined manner, and obtaining the target fluorescent strip includes:
obliquely cutting the fluorescent plate along a first direction at a first preset angle to obtain a plurality of middle fluorescent strips;
continuously carrying out reverse oblique cutting on each middle fluorescent strip along a second direction at the first preset angle, and dividing each middle fluorescent strip into two same target fluorescent strips; the second direction is symmetrical to the first direction.
Optionally, the cutting tool is used for performing batch cutting on the rearranged target phosphor stripes respectively along two symmetrical directions at a second preset angle, and the cutting direction is along the width direction of the target phosphor stripes, so as to obtain the target phosphor piece, including:
obliquely cutting the target fluorescent strip along a third direction at a second preset angle to obtain a plurality of middle fluorescent sheets;
continuously carrying out reverse oblique cutting on each middle fluorescent sheet along a fourth direction at the second preset angle, and dividing each middle fluorescent sheet into two same target fluorescent sheets; the fourth direction is symmetrical to the third direction, and the symmetrical planes of the fourth direction and the third direction are perpendicular to the symmetrical planes of the first direction and the second direction.
Optionally, the rearranging and fixing the target fluorescent stripes, and the target fluorescent stripes to be cut in the same batch after rearranging and having the same orientation include:
and placing and fixing the target fluorescent strips to be cut in the same batch in parallel according to the directions of the sizes from top to bottom.
Optionally, after obtaining the target fluorescence slice, the method further includes:
the target fluorescent sheets are rearranged in the direction of the upper and lower sizes of the respective sizes and are fixedly placed.
Optionally, the angle range of the first preset angle and the second preset angle is between 30 and 85 degrees, or between 95 and 150 degrees.
The fluorescent sheet is prepared by the fluorescent sheet manufacturing method.
An LED package manufacturing method is characterized by comprising the following steps:
carrying out die bonding on the LED chip on the substrate;
the fluorescent sheet of claim 7, fixedly disposed on an upper surface of the LED chip; the size of the lower surface of the fluorescent sheet is matched with that of the LED chip, and the size of the upper surface of the fluorescent sheet is larger than that of the lower surface;
and filling reflective glue and fixing above the substrate and around the LED chip and the fluorescent sheet to obtain the LED packaging piece.
Optionally, the step of fixedly arranging the fluorescent sheet on the upper surface of the LED chip includes:
and adhering the fluorescent sheet to the upper surface of the LED chip, and curing by baking.
Optionally, after the light reflecting white glue is filled and fixed to obtain the LED package, the method further includes:
and cutting the packaging piece by taking the LED chip as a unit to obtain a single LED luminous piece.
The invention also provides an LED packaging piece, which is manufactured by the LED packaging piece manufacturing method.
Advantageous effects
The invention provides a fluorescent sheet, an LED packaging piece and a manufacturing method thereof, wherein the manufacturing method of the fluorescent sheet comprises the following steps: fixing a fluorescent plate to be cut; cutting the fluorescent plate by a cutting tool at a first preset angle in an inclined manner along two symmetrical directions respectively to obtain a target fluorescent strip; rearranging and fixing the target fluorescent strips, arranging the rearranged target fluorescent strips to be cut in the same batch in parallel, and arranging the target fluorescent strips in the up-down direction in a consistent manner; and cutting the target fluorescent strips which are arranged in the rearranged mode in batches by the cutting tool at a second preset angle and respectively along two symmetrical directions in an inclined mode, wherein the cutting direction is along the width direction of the target fluorescent strips, and the target fluorescent sheets are obtained. Therefore, the fluorescent sheet is prepared in a cutting mode, the prepared fluorescent sheet is not provided with chamfers, the cutting surface is naturally rough, and the bonding strength between the fluorescent sheet and the reflective white glue can be enhanced when the LED packaging piece is prepared, so that the luminous effect of the packaged LED packaging piece is further improved.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a flow chart of a method for manufacturing a phosphor plate according to a first embodiment of the present invention;
FIG. 2 is a schematic view of a phosphor plate according to various embodiments of the present invention;
FIG. 3 is a flow chart of a method for manufacturing a phosphor plate according to a second embodiment of the present invention;
FIG. 4 is a schematic side view of a cut-out for manufacturing a fluorescent sheet according to a second embodiment of the present invention;
FIG. 5 is a schematic top view of a phosphor sheet manufacturing cut in a second embodiment of the present invention;
FIG. 6 is a schematic side view of a cut-out for manufacturing a phosphor sheet according to a second embodiment of the present invention;
FIG. 7 is a schematic top view of a phosphor sheet cut in a second embodiment of the present invention;
FIG. 8 is a schematic side view of a cut-out for manufacturing a phosphor sheet according to a second embodiment of the present invention;
FIG. 9 is a schematic top view of a phosphor sheet cut in a second embodiment of the present invention;
FIG. 10 is a schematic side view of a cut-out for manufacturing a phosphor sheet according to a second embodiment of the present invention;
FIG. 11 is a schematic top view of a phosphor sheet cut in a second embodiment of the present invention;
fig. 12 is a schematic view illustrating a method for manufacturing an LED package according to a third embodiment of the present invention;
fig. 13 is a schematic view of an LED package structure according to a third embodiment of the invention.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
First embodiment
The present embodiment provides a method for manufacturing a fluorescent sheet, please refer to fig. 1, the method includes:
s101, fixing a fluorescent plate to be cut;
s102, cutting the fluorescent plate by the cutting tool in a first preset angle in an inclined mode along two symmetrical directions respectively to obtain a target fluorescent strip;
s103, rearranging and fixing the target fluorescent strips, arranging the rearranged target fluorescent strips to be cut in the same batch in parallel, and arranging all the target fluorescent strips in the up-down direction consistently;
and S104, cutting the rearranged target fluorescent strips in batch by the cutting tool in a second preset angle and respectively obliquely along two symmetrical directions, wherein the cutting direction is along the width direction of the target fluorescent strips, and thus the target fluorescent sheets are obtained.
In this embodiment, the fluorescent sheet is prepared by cutting; in this embodiment, the cutting is performed by providing a whole block of the fluorescent plate to be cut, and then correspondingly cutting the fluorescent plate according to the desired fluorescent sheet, so as to obtain the fluorescent sheet, i.e. the target fluorescent sheet in this embodiment. Wherein, for cutting, the thickness of the fluorescent plate provided initially is the thickness of the target fluorescent plate. Of course, the originally provided phosphor plate may also be obtained by cutting a thicker phosphor plate, or the phosphor plate itself may be formed by molding, injection molding, or the like.
In this embodiment, the size of the phosphor plate can be arbitrary, wherein arbitrary means that the phosphor plate can exist in any length and width as long as it is satisfied that at least one phosphor sheet can be cut out, in the case that the size of the underlying phosphor sheet is satisfied.
In S101, the phosphor plate to be cut is fixed, and the purpose of the fixing is to perform a subsequent cutting operation on the phosphor plate, so as to avoid cutting errors caused by unexpected movement of the phosphor plate during the cutting process. Wherein the fixed mode of fluorescent screen can be through the mode bonding on other devices that bond, if can smooth paste the fluorescent screen on blue membrane, be fixed in cutting platform with the fluorescent screen of pasting blue membrane again on, fixed mode can be fixed with anchor clamps, or after the marginal position of fluorescent screen punches, fix through the hole with the fastener to restriction fluorescent screen's degree of freedom.
In S102, the cutting tool is used for cutting the fluorescent plate in an inclined manner along two symmetrical directions at a first preset angle, so that the target fluorescent strip is obtained. Cutting the fluorescent plate to obtain the fluorescent strip is an intermediate step of preparing the fluorescent sheet, wherein the process of preparing the fluorescent strip is unidirectional for the fluorescent sheet, the size of the fluorescent strip in the width direction is consistent with that of the target fluorescent sheet, but the size of the fluorescent strip in the length direction is optional, and the fluorescent strip needs to be cut again to obtain the target fluorescent sheet.
The first preset angle is directly related to the target fluorescent sheet, and because the upper surface of the target fluorescent sheet is larger than the lower surface of the target fluorescent sheet, the side surface of the cut fluorescent sheet is inclined, namely the included angle formed by the side surface and the upper and lower surfaces is not a right angle, but a certain angle; the fluorescent sheet has four side faces, wherein the included angles between two opposite side faces and the upper and lower surfaces are the same, and the included angles between adjacent side faces and the upper and lower surfaces may be the same or different. For the opposite surfaces, the included angle is the first predetermined angle in the embodiment, and the second predetermined angle is the same. The cutting of the fluorescent plate is carried out according to the size of a required target fluorescent sheet by a first preset angle, namely, the cutting of the fluorescent plate is carried out in an inclined mode, the included angle of the side edge of the fluorescent strip obtained by cutting is the first preset angle, and the angle of the two opposite side faces is consistent, namely, the cutting direction is symmetrical.
And S103, rearranging and fixing the target fluorescent bars, arranging the rearranged target fluorescent bars to be cut in the same batch in parallel, and arranging the target fluorescent bars in the vertical direction consistently. After the target phosphor stripes are obtained by cutting, since the target phosphor stripes are overlapped with each other, in order to avoid wasting raw materials, it is not suitable to directly cut the target phosphor stripes, and the target phosphor stripes should be rearranged first. The rearrangement refers to that the target fluorescent strips obtained by cutting the fluorescent plate are arranged by taking the target fluorescent strips to be cut in the same batch as a unit, for the target fluorescent strips to be cut in the same batch, the target fluorescent strips are placed in parallel for improving the cutting efficiency and accuracy, and when the target fluorescent strips are placed in parallel, the target fluorescent strips are placed in the same vertical direction, namely, when the target fluorescent strips are placed in parallel, the target fluorescent strips are in the same size, or are in the same size, so that the target fluorescent strips can be cut in batches after the rearrangement.
And S104, performing batch cutting on the rearranged target fluorescent strips by the cutting tool in a second preset angle in two symmetrical directions in an inclined manner, wherein the cutting direction is along the width direction of the target fluorescent strips, so as to obtain the target fluorescent sheets. Similar to the first preset angle cutting, when the cutting is performed at the second preset angle, the cut object becomes the target phosphor stripe, and the result of the cutting is the target phosphor sheet.
In some embodiments, cutting the fluorescent plate by the cutting tool at the first preset angle and respectively inclining in two symmetrical directions to obtain the target fluorescent strip may specifically include:
obliquely cutting the fluorescent plate along a first direction at a first preset angle to obtain a plurality of middle fluorescent strips;
continuously carrying out reverse oblique cutting on each middle fluorescent strip along a second direction at a first preset angle, and dividing each middle fluorescent strip into two same target fluorescent strips; the second direction is symmetrical to the first direction. The target fluorescent sheet is of a symmetrical structure, and the intermediate product target fluorescent strip is also of a symmetrical structure; the symmetrical oblique cutting of the fluorescent plate can be divided into two flows, namely, the cutting in the first direction is firstly carried out, the middle fluorescent strip is obtained through the cutting, then the cutting in the second direction is carried out, wherein the first direction and the second direction are symmetrical, and therefore the target fluorescent strip is obtained.
For the cutting of the fluorescent plate, cutting the obtained middle fluorescent strip according to a first preset angle for the first time, wherein the size of the middle fluorescent strip is twice that of the target fluorescent strip; and cutting the target fluorescent strips, wherein after the target fluorescent strips are cut, the middle fluorescent strip is just divided into two target fluorescent strips, the two target fluorescent strips are distributed in a centrosymmetric manner, and the symmetric center is positioned at the center of the contact surface of the two target fluorescent strips.
In some embodiments, the cutting tool is configured to perform batch cutting on the rearranged target phosphor stripes respectively inclined in two symmetrical directions at a second preset angle, and the cutting direction is along the width direction of the target phosphor stripes, and obtaining the target phosphor sheet may include:
obliquely cutting the target fluorescent strip along a third direction at a second preset angle to obtain a plurality of middle fluorescent sheets;
continuously carrying out reverse oblique cutting on each middle fluorescent sheet along a fourth direction at a second preset angle, and dividing each middle fluorescent sheet into two same target fluorescent sheets; the fourth direction is symmetrical to the third direction, and the symmetrical planes of the fourth direction and the third direction are perpendicular to the symmetrical planes of the first direction and the second direction. Similarly, because the target phosphor plate has a symmetrical structure, a single cutting of the target phosphor strip along the third direction can only obtain a unidirectional middle phosphor plate, and the middle phosphor plate needs to be obliquely cut along the fourth direction again according to the second preset angle, so that the target phosphor plate is obtained. The difference between the process of obtaining the target fluorescent strip by cutting and the process of obtaining the target fluorescent strip by cutting is that leftover materials are arranged between the target fluorescent strips when the target fluorescent strips are obtained, because the size direction of the target fluorescent strip obtained by cutting is already limited in the structure of the target fluorescent strip.
In some embodiments, rearranging and fixing the target phosphor stripes, wherein the arranging that the target phosphor stripes to be cut in the same batch have the same orientation may include:
and placing and fixing the target fluorescent strips to be cut in the same batch in parallel according to the directions of the sizes from top to bottom. Because after cutting the fluorescent screen and obtaining the target phosphor strip, the distribution between the target phosphor strip is a positive reverse staggered distribution, consequently, can arrange the back according to same direction to the target phosphor strip, it is fixed again, then cut to can promote the efficiency of cutting. The arrangement direction of the fluorescent sheets is preferably the direction of the upper part and the lower part, so that when the target fluorescent sheets are obtained by continuously cutting, the target fluorescent sheets are also in the direction of the upper part and the lower part, and the subsequent LED packaging can be facilitated.
In some embodiments, after obtaining the target fluorescent sheet, the method may further include:
the target phosphor plates are rearranged in the vertical direction of the respective sizes and fixed. The target fluorescent sheet in this embodiment is used for an LED package, and specifically, the target fluorescent sheet is fixedly disposed above the LED chip in a large-to-small manner, that is, the smaller side of the target fluorescent sheet is close to the LED chip, and the larger side of the target fluorescent sheet is far away from the LED chip, so that light emitted by the LED chip can reach a good diffusion effect after being refracted by the target fluorescent sheet; therefore, in order to improve the efficiency of the subsequent packaging process of the LED packaging piece, the obtained target fluorescent piece is rearranged, the leftover materials generated in the cutting process between the adjacent target fluorescent pieces can be removed, the target fluorescent piece is placed according to the direction of the size from top to bottom, the placing direction is consistent with that of the LED packaging piece, the target fluorescent piece is installed above the LED chip in the same direction, the subsequent LED packaging process can be conveniently adopted, in the packaging process of the LED packaging piece, the target fluorescent piece only needs to be taken through modes such as vacuum adsorption or a clamp, the target fluorescent piece does not need to be overturned, the target fluorescent piece can be directly arranged above the LED chip, and the packaging efficiency of the LED packaging piece is greatly improved.
In some embodiments, the first predetermined angle and the second predetermined angle range between 30-85 °, or 95-150 °. The first preset angle and the second preset angle can be the same or different, and the inclination directions of the first preset angle and the second preset angle are always consistent regardless of the same or different.
The embodiment provides a method for manufacturing a fluorescent sheet, which comprises the following steps: fixing a fluorescent plate to be cut; cutting the fluorescent plate by a cutting tool at a first preset angle in an inclined manner along two symmetrical directions respectively to obtain a target fluorescent strip; rearranging and fixing the target fluorescent strips, arranging the rearranged target fluorescent strips to be cut in the same batch in parallel, and arranging the target fluorescent strips in the up-down direction in a consistent manner; and cutting the target fluorescent strips which are arranged in the rearranged mode in batches by the cutting tool at a second preset angle and respectively along two symmetrical directions in an inclined mode, wherein the cutting direction is along the width direction of the target fluorescent strips, and the target fluorescent sheets are obtained. . Therefore, the fluorescent sheet is prepared in a cutting mode, the cutting surface of the fluorescent sheet naturally has certain roughness in the cutting process, the bonding strength between the fluorescent sheet and the reflective white glue during packaging can be improved, the fluorescent sheet obtained through cutting is not provided with a chamfer, the problem that the white glue is prone on the surface of the fluorescent sheet during glue injection can be avoided, and the light emitting effect of the LED light-emitting piece is ensured; by adopting the cutting process, the surface of the fluorescent sheet is rough, so that a reflecting surface caused by smoothness is avoided, and the light-emitting efficiency can be improved.
The embodiment also provides a fluorescent sheet, which is manufactured by the method for manufacturing a fluorescent sheet in the embodiment, please refer to fig. 2.
Second embodiment
Referring to fig. 3, the present embodiment provides a method for manufacturing a fluorescent sheet, including:
s301, flatly pasting the fluorescent plate on a blue film, fixing the blue film-pasted fluorescent sheet on a cutting platform, adjusting a cutting knife to form an inclined angle of 30-85 degrees or 95-150 degrees with the platform, adjusting appropriate parameters to cut the surface A to obtain a middle fluorescent strip, wherein as shown in FIGS. 4 and 5, the arrow direction in the figure is a cutting direction, the direction from the solid line to the adjacent dotted line in the figure correspondingly represents the cutting direction, and the direction from the thick solid line to the adjacent thick dotted line represents the cutting direction in the current step, and the same is carried out below;
s302, after the cutting of the surface A is finished, the cutting platform rotates 180 degrees to cut the surface B to obtain a target fluorescent strip, as shown in FIGS. 6 and 7;
s303, after the surface B is cut, uniformly arranging the cut target fluorescent strips on the blue film by using a piece arranging machine, and fixing the target fluorescent strips adhered with the blue film on a cutting platform; wherein the size direction of the target fluorescent strip is up-large-down-small;
s304, fixing the target fluorescent strip to finish adjusting parameters, and cutting the C surface of the target fluorescent strip to obtain a middle fluorescent sheet, as shown in the figures 8 and 9;
and S305, after the C surface is cut, rotating the cutting platform by 180 degrees to cut the D surface to obtain the target fluorescent sheet, as shown in figures 10 and 11.
Thus, a desired target fluorescent sheet can be obtained.
Third embodiment
Referring to fig. 12, the present embodiment provides a method for manufacturing an LED package, including:
s121, carrying out die bonding on the LED chip on the substrate; the substrate may be a ceramic substrate, a plastic substrate, a metal substrate, or the like, and the substrate is not limited in this embodiment; the die bonding of the LED chip can be realized by gluing, welding, eutectic crystal and the like.
S122, fixedly arranging the fluorescent sheet in each embodiment on the upper surface of the LED chip; the area of the upper surface of the fluorescent sheet is larger than that of the lower surface of the fluorescent sheet, the lower surface of the fluorescent sheet is close to the LED chip, and the upper surface of the fluorescent sheet is far away from the LED chip; the size of the lower surface of the fluorescent sheet is matched with that of the LED chip;
and S123, filling reflective white glue above the substrate and around the LED chip and the fluorescent sheet, and fixing to obtain the LED packaging piece. The light-reflecting white glue is uniformly filled around the chip and the fluorescent sheet, and only the front surface of the fluorescent sheet is exposed; after the filling is finished, the mixture can be placed into an oven at 120-170 ℃ for baking and curing.
In some embodiments, fixedly disposing the fluorescent sheet on the upper surface of the LED chip may include:
and adhering the fluorescent sheet to the upper surface of the LED chip, and curing by baking. The fluorescent sheet can be adhered to the upper surface of the LED chip through silica gel; silica gel can be transparent, has an open porous structure, and is strong in adsorbability, i.e., has strong adhesiveness. The main component of silica gel is silica, which is chemically stable and non-combustible. Wherein, the baking and curing can be realized by baking in an oven at 120-170 ℃.
In some embodiments, after filling and fixing the reflective white glue to obtain the LED package, the method may further include:
and cutting the packaging piece by taking the LED chip as a unit to obtain a single LED light-emitting piece.
The present embodiment further provides an LED package, which is manufactured by the LED package manufacturing method in the present embodiment, please refer to fig. 13.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A method for manufacturing a fluorescent sheet is characterized by comprising the following steps:
fixing a fluorescent plate to be cut;
cutting the fluorescent plate by a cutting tool in a first preset angle in an inclined manner along two symmetrical directions respectively to obtain a target fluorescent strip;
rearranging and fixing the target fluorescent strips, arranging the target fluorescent strips to be cut in the same batch in parallel after rearrangement, and arranging the target fluorescent strips in the up-down direction consistently;
and cutting the rearranged target fluorescent strips in batches by a cutting tool at a second preset angle in an inclined manner along two symmetrical directions respectively, wherein the cutting direction is along the width direction of the target fluorescent strips, so as to obtain the target fluorescent sheets.
2. The method for manufacturing a fluorescent sheet as claimed in claim 1, wherein said cutting the fluorescent plate with the cutting tool inclined in two symmetrical directions at a first predetermined angle to obtain the target fluorescent strip comprises:
obliquely cutting the fluorescent plate along a first direction at a first preset angle to obtain a plurality of middle fluorescent strips;
continuously carrying out reverse oblique cutting on each middle fluorescent strip along a second direction at the first preset angle, and dividing each middle fluorescent strip into two same target fluorescent strips; the second direction is symmetrical to the first direction.
3. The method for manufacturing a fluorescent sheet as claimed in claim 2, wherein the step of cutting the rearranged target fluorescent stripes in batch by tilting the cutting tool in two symmetrical directions at a second preset angle, wherein the cutting direction is along the width direction of the target fluorescent stripes to obtain the target fluorescent sheet includes:
obliquely cutting the target fluorescent strip along a third direction at a second preset angle to obtain a plurality of middle fluorescent sheets;
continuously carrying out reverse oblique cutting on each middle fluorescent sheet along a fourth direction at the second preset angle, and dividing each middle fluorescent sheet into two same target fluorescent sheets; the fourth direction is symmetrical to the third direction, and the symmetrical planes of the fourth direction and the third direction are perpendicular to the symmetrical planes of the first direction and the second direction.
4. The method for manufacturing a fluorescent sheet as claimed in any one of claims 1 to 3, wherein the rearranging and fixing the target fluorescent stripes, and the rearranged target fluorescent stripes to be cut in the same batch have the same orientation comprises:
and placing and fixing the target fluorescent strips to be cut in the same batch in parallel according to the directions of the sizes from top to bottom.
5. The method of manufacturing a phosphor sheet according to any of claims 1 to 3, further comprising, after said obtaining the target phosphor sheet:
the target fluorescent sheets are rearranged in the direction of the upper and lower sizes of the respective sizes and are fixedly placed.
6. The method of any of claims 1-3, wherein the first predetermined angle and the second predetermined angle are in a range of 30-85 °, or 95-150 °.
7. A fluorescent sheet, characterized in that it is produced by the method for producing a fluorescent sheet according to any one of claims 1 to 6.
8. An LED package manufacturing method is characterized by comprising the following steps:
carrying out die bonding on the LED chip on the substrate;
the fluorescent sheet of claim 7, fixedly disposed on an upper surface of the LED chip; the size of the lower surface of the fluorescent sheet is matched with that of the LED chip, and the size of the upper surface of the fluorescent sheet is larger than that of the lower surface;
and filling reflective glue and fixing above the substrate and around the LED chip and the fluorescent sheet to obtain the LED packaging piece.
9. The LED package manufacturing method of claim 8, wherein fixedly disposing a fluorescent sheet on an upper surface of the LED chip comprises:
and adhering the fluorescent sheet to the upper surface of the LED chip, and curing by baking.
10. An LED package, characterized in that the LED package is manufactured by the LED package manufacturing method according to claim 8 or 9.
CN202010230909.1A 2020-03-27 2020-03-27 Fluorescent sheet, LED packaging part and manufacturing method thereof Pending CN113043361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010230909.1A CN113043361A (en) 2020-03-27 2020-03-27 Fluorescent sheet, LED packaging part and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010230909.1A CN113043361A (en) 2020-03-27 2020-03-27 Fluorescent sheet, LED packaging part and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN113043361A true CN113043361A (en) 2021-06-29

Family

ID=76507581

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010230909.1A Pending CN113043361A (en) 2020-03-27 2020-03-27 Fluorescent sheet, LED packaging part and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN113043361A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114335306A (en) * 2021-12-13 2022-04-12 深圳市穗晶光电股份有限公司 Novel white light LED chip
CN114709319A (en) * 2022-04-11 2022-07-05 东莞市中麒光电技术有限公司 Color conversion structure manufacturing method, color conversion structure, crystal grain manufacturing method and crystal grain

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811642A (en) * 2012-11-12 2014-05-21 厦门兴恒隆照明科技有限公司 Novel remote light-emitting diode (LED) high-light-efficiency fluorescent powder light-emitting film
CN104851959A (en) * 2014-02-14 2015-08-19 Lg伊诺特有限公司 Light conversion substrate, light emitting package, and automobile lamp including the same
CN105453282A (en) * 2013-08-20 2016-03-30 皇家飞利浦有限公司 Shaped phosphor to reduce repeated reflections
CN208521965U (en) * 2018-07-27 2019-02-19 宁波升谱光电股份有限公司 A kind of LED component that CSP is encapsulated and a kind of lighting apparatus
CN109638003A (en) * 2017-10-09 2019-04-16 晶能光电(江西)有限公司 The preparation method of LED headlamp based on CSP white chip
US20190305201A1 (en) * 2018-03-29 2019-10-03 Lumens Co., Ltd. Side view led package and side view led module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811642A (en) * 2012-11-12 2014-05-21 厦门兴恒隆照明科技有限公司 Novel remote light-emitting diode (LED) high-light-efficiency fluorescent powder light-emitting film
CN105453282A (en) * 2013-08-20 2016-03-30 皇家飞利浦有限公司 Shaped phosphor to reduce repeated reflections
CN104851959A (en) * 2014-02-14 2015-08-19 Lg伊诺特有限公司 Light conversion substrate, light emitting package, and automobile lamp including the same
CN109638003A (en) * 2017-10-09 2019-04-16 晶能光电(江西)有限公司 The preparation method of LED headlamp based on CSP white chip
US20190305201A1 (en) * 2018-03-29 2019-10-03 Lumens Co., Ltd. Side view led package and side view led module
CN208521965U (en) * 2018-07-27 2019-02-19 宁波升谱光电股份有限公司 A kind of LED component that CSP is encapsulated and a kind of lighting apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114335306A (en) * 2021-12-13 2022-04-12 深圳市穗晶光电股份有限公司 Novel white light LED chip
CN114709319A (en) * 2022-04-11 2022-07-05 东莞市中麒光电技术有限公司 Color conversion structure manufacturing method, color conversion structure, crystal grain manufacturing method and crystal grain

Similar Documents

Publication Publication Date Title
CN113043361A (en) Fluorescent sheet, LED packaging part and manufacturing method thereof
KR102071463B1 (en) Led with high thermal conductivity particles in phosphor conversion layer and the method of fabricating the same
TWI443853B (en) Semiconductor light emitting device with pre-fabricated wavelength converting element
CN100411198C (en) Light emitting apparatus
KR101443870B1 (en) Light emitting device package, backlight unit, lighting device and its manufacturing method
US20100109025A1 (en) Over the mold phosphor lens for an led
CN105938869A (en) Double-layer chip scale package (CSP) light source and manufacturing method thereof
CN101636851A (en) Have phosphor sheet and the LED that crosses the mold pressing phosphor in the lens
CN108682729A (en) The packaging method of CSP LED and the encapsulating structure of CSP LED
US20160035945A1 (en) White led chip and method of manufacture
US20130244354A1 (en) Methods for producing and placing wavelength converting structures
CN111063784A (en) LED lamp bead preparation method
JP2002151743A (en) Light emitting device and its manufacturing method
US9299878B2 (en) Luminescence conversion element, method for the manufacture thereof and optoelectronic component having a luminescence conversion element
KR101102237B1 (en) LED package, method of manufacturing LED package, back light unit and lighting device
JP5681532B2 (en) Light emitting device and manufacturing method thereof
JP2011091101A (en) Light emitting device and method of manufacturing light emitting device
CN109920903A (en) A kind of LED component and backlight module
CN100369278C (en) Semiconductor light emitting device
CN111063783A (en) Preparation method of fluorescent diaphragm and preparation method of LED lamp bead
CN109801902A (en) A kind of package substrate, semiconductor devices and preparation method thereof
KR101645329B1 (en) Method for fabricating light-emitting diode device and base mold used therefor
CN115425124B (en) Preparation method of flip white light LED packaging structure
CN208315595U (en) The encapsulating structure of CSP LED
CN108666307B (en) CSP light source and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20210629

RJ01 Rejection of invention patent application after publication