CN105374924B - The preparation method of the preparation facilities of glued membrane, preparation method and flip LED chips - Google Patents
The preparation method of the preparation facilities of glued membrane, preparation method and flip LED chips Download PDFInfo
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- CN105374924B CN105374924B CN201510689575.3A CN201510689575A CN105374924B CN 105374924 B CN105374924 B CN 105374924B CN 201510689575 A CN201510689575 A CN 201510689575A CN 105374924 B CN105374924 B CN 105374924B
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- light
- transparent substrates
- absorbing member
- light absorbing
- glued membrane
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- 238000002360 preparation method Methods 0.000 title claims abstract description 54
- 239000012528 membrane Substances 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 86
- 239000003292 glue Substances 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000008569 process Effects 0.000 claims abstract description 18
- 238000000465 moulding Methods 0.000 claims abstract description 13
- 238000007711 solidification Methods 0.000 claims description 29
- 230000008023 solidification Effects 0.000 claims description 29
- 239000006071 cream Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 8
- 238000004528 spin coating Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000007787 solid Substances 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000004568 cement Substances 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000007639 printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of preparation facilities of the glued membrane for flip LED chips, including：The preparation facilities includes transparent substrates and the light-emitting device below transparent substrates, the upper surface of the transparent substrates is provided with light absorbing member, the light-transmissive transparent substrates of the light-emitting device are exposed on light absorbing member, and the shape of the light absorbing member is consistent with the molding pattern of glued membrane.The invention also discloses a kind of preparation method of glued membrane for flip LED chips and a kind of preparation method of flip LED chips.The present invention, fluorescence adhesive curing is realized by the way of " photo-thermal is solid ", flexibility is strong, meanwhile, in the curing process, LED chip is not required to together into baking box be solidified with fluorescent glue, it is easier to realizes automation.
Description
Technical field
The present invention relates to the preparation dress in LED encapsulation technologies field, more particularly to a kind of glued membrane for flip LED chips
Put, the preparation method of glued membrane and the preparation method of flip LED chips for flip LED chips.
Background technology
With developing rapidly for semiconductor industry, the application of encapsulation technology is increasingly extensive, and packing forms are more various
Change.Wherein, Flip Chip（Flip-Chip）, " crystalline substance that falls encapsulates " or " brilliant package method " are also referred to as, it is both a kind of chip interconnection
Technology, it is a kind of preferably die bonding technology again.The LED light source that Flip Chip is supported has compared with conventional package light source
The characteristics of thermal resistance is low, and voltage is low, and high current density light efficiency is high, comprehensive study show that flip LED light source above has it unique in application
Potentiality and advantage.
Flip Chip includes die bond technique and gluing process, wherein, gluing process will be mixed evenly by point gum machine
Glue and fluorescent material drop are put into baking box in the upper surface of LED chip, and by the LED chip after glue has been put, with about 50 DEG C of bakings
Bake and vacuumize under state at least 20 minutes, the air for making to remain in glue is discharged, then sample is toasted 1 hour with 150 DEG C, is made
Glue is fully cured.Therefore, existing gluing process is the solidification that glue is directly realized by by heat（For example, by baking box
Heat make glue realize solidification）, limitation is big；Meanwhile in the curing process, LED chip need to together enter baking box with glue
Solidified, be unfavorable for automating the making of LED chip.
The content of the invention
The technical problems to be solved by the invention are, there is provided a kind of preparation facilities of glued membrane for flip LED chips,
It is simple in construction, easy to operate, flexibility is strong, can be achieved fluorescent glue local solidification.
The technical problems to be solved by the invention also reside in, there is provided a kind of preparation side of glued membrane for flip LED chips
Method, it is easy to operate.
The technical problems to be solved by the invention also reside in, there is provided a kind of preparation method of flip LED chips, it is ensured that
The performance of LED chip.
In order to solve the above-mentioned technical problem, the invention provides a kind of preparation facilities of the glued membrane for flip LED chips,
Including：Transparent substrates and the light-emitting device below transparent substrates, the upper surface of the transparent substrates are provided with light absorbing member, institute
The light-transmissive transparent substrates for stating light-emitting device are exposed on light absorbing member, the shape of the light absorbing member and the shaping of glued membrane
Pattern is consistent.
As the improvement of such scheme, the transparent substrates are glass substrate.
As the improvement of such scheme, the thickness of the light absorbing member is 0.1 ~ 10 micron.
As the improvement of such scheme, the light absorbing member is metallic film, graphite film or composite material film.
As the improvement of such scheme, the region on the transparent substrates beyond light absorbing member is provided with reflecting part.
Correspondingly, present invention also offers a kind of preparation method of the glued membrane for flip LED chips, including：
Glue pre-processes：Uniform mixture glue and fluorescent material in proportion, form fluorescent glue；
Spin coating：By the upper surface of fluorescent glue drop transparent substrates in preparation facilities, the preparation facilities includes printing opacity base
Plate and the light-emitting device below transparent substrates, the upper surface of the transparent substrates are provided with light absorbing member, the light-emitting device
Light-transmissive transparent substrates expose on light absorbing member, the shape of the light absorbing member is consistent with the molding pattern of glued membrane；
Solidification：Light-emitting device launches light to transparent substrates, and light is exposed on light absorbing member through transparent substrates, extinction
Part absorbs light and converts light energy into heat energy, and fluorescent glue realizes local solidification using the heat energy of light absorbing member, forms glued membrane.
Correspondingly, present invention also offers a kind of preparation method of flip LED chips, including：
Point tin cream：Tin cream is applied on the pad of substrate；
Put crystalline substance：By LED chip upside-down mounting on pad；
Welding：The tin cream on pad is melted, and is electrical connected with LED chip；
Glue pre-processes：Uniform mixture glue and fluorescent material in proportion, form fluorescent glue；
Spin coating：By the upper surface of fluorescent glue drop transparent substrates in preparation facilities, the preparation facilities includes printing opacity base
Plate and the light-emitting device below transparent substrates, the upper surface of the transparent substrates are provided with light absorbing member, the light-emitting device
Light-transmissive transparent substrates expose on light absorbing member, the shape of the light absorbing member is consistent with the molding pattern of glued membrane；
Solidification：Light-emitting device launches light to transparent substrates, and light is exposed on light absorbing member through transparent substrates, extinction
Part absorbs light and converts light energy into heat energy, and fluorescent glue realizes local solidification using the heat energy of light absorbing member, forms glued membrane；
It is fixed：Cured glued membrane is taken out from preparation facilities, and glued membrane is fixed in the light-emitting area of LED chip.
Implement the present invention, have the advantages that：
The present invention builds the preparation facilities of the glued membrane for flip LED chips, utilize " Gu optical and thermal-" mode realize it is glimmering
Optical cement solidifies, and specifically, launches light by light-emitting device, light is exposed on light absorbing member through transparent substrates, light absorption unit
Part absorbs light and light is converted into heat energy, then fluorescent glue is solidified by heat energy, and flexibility is strong.
Meanwhile the shape of light absorbing member can be configured according to the molding pattern of glued membrane in preparation facilities, fluorescent glue is solid
During change, the fluorescent glue only above light absorbing member could receive light absorbing member and provide heat, so as to realize fluorescence
The local solidification of glue, so as to produce more accurate glued membrane, to match different shape, the LED chip of performance.
In addition, the glued membrane after solidification is directly fixed on the upper surface of LED chip by the present invention, you can substitutes in the prior art
Gluing process so that in the curing process, LED chip is not required to together into baking box be solidified with fluorescent glue fluorescent glue, section
Save space, it is easier to realize automation.
Brief description of the drawings
Fig. 1 is the first embodiment structural representation of the preparation facilities for the glued membrane that the present invention is used for flip LED chips；
Fig. 2 is the second embodiment structural representation of the preparation facilities for the glued membrane that the present invention is used for flip LED chips；
Fig. 3 is the embodiment flow chart of the preparation method for the glued membrane that the present invention is used for flip LED chips；
Fig. 4 is the embodiment flow chart of the preparation method of flip LED chips of the present invention.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with accompanying drawing
It is described in detail on step ground.Only this is stated, appearance in the text of the invention or the side such as the up, down, left, right, before and after that will appear from, inside and outside
Position word, only on the basis of the accompanying drawing of the present invention, it is not the specific restriction to the present invention.
Referring to Fig. 1, Fig. 1 shows that the present invention is used for the first of the preparation facilities 100 of the glued membrane of flip LED chips and implemented
Example, the preparation facilities 100 include transparent substrates 1 and the light-emitting device 2 located at the lower section of transparent substrates 1, the transparent substrates 1
Upper surface is provided with light absorbing member 3, and the shape of the light absorbing member 3 is consistent with the molding pattern of glued membrane.The light of the light-emitting device 2
Line can pass through transparent substrates 1 and expose on light absorbing member 3.The transparent substrates 1 are preferably glass substrate, have good printing opacity
Property.
During work, light-emitting device 2 launches light to transparent substrates 1, and light exposes to light absorbing member 3 through transparent substrates 1
On, light absorbing member 3 absorbs light and converts light energy into heat energy, so as to realize luminous energy and hot transformation of energy.Wherein, light-emitting device
2 light launched can be incandescence, ultraviolet light or blue light, but be not limited system.
Meanwhile the shape of light absorbing member 3 can be configured according to the molding pattern of glued membrane, make the shape of light absorbing member 3 with
The molding pattern of glued membrane is consistent.In the curing process, the fluorescent glue only above light absorbing member 3 could receive suction to fluorescent glue
Light part 3 provides heat, and so as to realize the local solidification of fluorescent glue, flexibility is strong, therefore, in process of production, can basis
Actual demand sets the shape of light absorbing member 3, to produce more accurate glued membrane, preferably to match different shape, performance
LED chip.
Further, the thickness of the light absorbing member is 0.1 ~ 10 micron.Ensure that fluorescent glue can preferably receive light absorbing member 3
There is provided heat, while also can guarantee that the molding effect of fluorescent glue.The light absorbing member 3 is by colored inorganic exotic material system
Into preferably metallic film, graphite film or composite material film, but be not limited system.More preferably, the metallic film is
Aluminium, copper, the compound film of iron, there is good heat conductivility, it is ensured that the transmission of heat.
In use, by the drop of fluorescent glue 4 being mixed evenly in the upper surface of transparent substrates 1, light-emitting device 2 is to transparent substrates
1 transmitting light, light are exposed on light absorbing member 3 through transparent substrates 1, and light absorbing member 3 absorbs light and converted light energy into
Heat energy, make fluorescent glue is heated to realize solidification.Compared with prior art, the present invention realizes fluorescent glue by the way of " Gu optical and thermal-"
Local solidification, flexibility is strong；Meanwhile fluorescent glue is in the curing process, LED chip is not required to together enter baking box progress with glue
Solidification, save space, it is easier to realize automation.
The upper surface of the transparent substrates 1 can also be provided with box dam, can effectively prevent fluorescent glue from overflowing printing opacity by box dam
Substrate 1, ensure that fluorescent glue is in the upper surface of transparent substrates 1 all the time, ensure solidification effect.
Referring to Fig. 2, Fig. 2 shows that the present invention is used for the second of the preparation facilities 100 of the glued membrane of flip LED chips and implemented
Example, unlike the first embodiment shown in Fig. 1, the region on transparent substrates 1 described in the present embodiment beyond light absorbing member 3
Provided with reflecting part 5, the light absorbing member 3 and the non-overlapping copies of reflecting part 5.Extinction can effectively be prevented by reflecting part 5
Region beyond part 3 absorbs the light that light-emitting device 2 is launched, and the region corresponding to reflecting part 5 is kept lower temperature,
Prevent the solidification of the fluorescent glue of the top of reflecting part 5；Meanwhile reflecting part 5 can be reflected light, light is set to launch to suction
Light part 3, it is further ensured that light absorbing member 3 can receive more luminous energy, realizes local solidification.
Fig. 3 is the embodiment flow chart of the preparation method for the glued membrane that the present invention is used for flip LED chips, including：
S101, glue pretreatment：Uniform mixture glue and fluorescent material in proportion, form fluorescent glue.
Wherein, mixture glue and the mixed proportion of fluorescent material are allocated by actual demand, and glimmering after being mixed evenly
Optical cement is put into baking box, is toasted and is evacuated under vacuum state at least 20 minutes with about 50 DEG C, and the air for making to remain in fluorescent glue is arranged
Go out.
S102, spin coating：By the upper surface of fluorescent glue drop transparent substrates in preparation facilities.
It is using automatic dispensing machine that the upper surface of fluorescent glue drop transparent substrates in preparation facilities, guarantee is glimmering during dispensing
Optical cement amount is consistent with profile.
Referring to Fig. 1 and Fig. 2, the preparation facilities includes transparent substrates 1 and the light-emitting device 2 located at the lower section of transparent substrates 1,
The upper surface of the transparent substrates 1 is provided with light absorbing member 3, and the shape of the light absorbing member 3 is consistent with the molding pattern of glued membrane.Institute
It is preferably glass substrate to state transparent substrates 1, has good translucency.Wherein, the light that light-emitting device 2 is launched can be white
Vehement light, ultraviolet light or blue light.The thickness of the light absorbing member is 0.1 ~ 10 micron, is made up of colored inorganic exotic material, excellent
Elect metallic film, graphite film or composite material film as, but be not limited system, more preferably, the metallic film be aluminium,
The compound film of copper, iron, there is good heat conductivility, it is ensured that the transmission of heat.
S103, solidification：Light-emitting device launches light to transparent substrates, and light exposes to light absorbing member through transparent substrates
On, light absorbing member absorbs light and converts light energy into heat energy, and fluorescent glue realizes local solidification, shape using the heat energy of light absorbing member
Into glued membrane.
In solidification process, light-emitting device 2 launches light to transparent substrates 1, and light exposes to light absorption unit through transparent substrates 1
On part 3, light absorbing member 3 absorbs light and converts light energy into heat energy, makes fluorescent glue is heated to realize solidification, is formed " Gu optical and thermal-"
Curing mode, flexibility is strong.
Fig. 4 is the embodiment flow chart of the preparation method of flip LED chips of the present invention, including：
S201, point tin cream：Tin cream is applied on the pad of substrate.
The thickness of tin cream is 0.4-0.6mm, and tin bulb diameter is about slightly less than the pad area of LED chip.
S202, put crystalline substance：By LED chip upside-down mounting on pad.
S203, welding：The tin cream on pad is melted, and is electrical connected with LED chip.
Solder reflow techniques can be used when melting the tin cream on pad or use heating plate welding.Wherein, melted using heating plate
When connecing, at least need to use two sections of temperature weldings, two groups of high/low temperature heating plates can be used, being first warming up to 200 DEG C or so makes scaling powder
Melt, being warming up to 250 DEG C or so again after about 10 seconds melts tin, and cooling is removed after about 10 seconds, during which must keep uniformly adding
Heat, fusion temp highest must not exceed 280 DEG C, and weld time within the 10-20 seconds, on the contrary can for a long time by excessive temperature or mistake
Cause tin cream welding bad；During using reflow oven welding, optimal welding effect is obtained using reflow oven multi-temperature zone characteristic.
S204, glue pretreatment：Uniform mixture glue and fluorescent material in proportion, form fluorescent glue.
Wherein, mixture glue and the mixed proportion of fluorescent material are allocated by actual demand, and glimmering after being mixed evenly
Optical cement is put into baking box, is toasted and is evacuated under vacuum state at least 20 minutes with about 50 DEG C, and the air for making to remain in fluorescent glue is arranged
Go out.
S205, spin coating：By the upper surface of fluorescent glue drop transparent substrates in preparation facilities.
It is using automatic dispensing machine that the upper surface of fluorescent glue drop transparent substrates in preparation facilities, guarantee is glimmering during dispensing
Optical cement amount is consistent with profile.
Referring to Fig. 1 and Fig. 2, the preparation facilities includes transparent substrates 1 and the light-emitting device 2 located at the lower section of transparent substrates 1,
The upper surface of the transparent substrates 1 is provided with light absorbing member 3, and the shape of the light absorbing member 3 is consistent with the molding pattern of glued membrane.Institute
It is preferably glass substrate to state transparent substrates 1, has good translucency.Wherein, the light that light-emitting device 2 is launched can be white
Vehement light, ultraviolet light or blue light.The thickness of the light absorbing member is 0.1 ~ 10 micron, is made up of colored inorganic exotic material, excellent
Elect metallic film, graphite film or composite material film as, but be not limited system, more preferably, the metallic film be aluminium,
The compound film of copper, iron, there is good heat conductivility, it is ensured that the transmission of heat.
S206, solidification：Light-emitting device launches light to transparent substrates, and light exposes to light absorbing member through transparent substrates
On, light absorbing member absorbs light and converts light energy into heat energy, and fluorescent glue realizes local solidification, shape using the heat energy of light absorbing member
Into glued membrane.
In solidification process, light-emitting device 2 launches light to transparent substrates 1, and light exposes to light absorption unit through transparent substrates 1
On part 3, light absorbing member 3 absorbs light and converts light energy into heat energy, makes fluorescent glue is heated to realize solidification, is formed " Gu optical and thermal-"
Curing mode, flexibility is strong.
S207, fixation：Cured glued membrane is taken out from preparation facilities, and glued membrane is fixed on to the light-emitting area of LED chip
On.
From the foregoing, it will be observed that the present invention launches light by light-emitting device, light is exposed on light absorbing member through transparent substrates,
Light absorbing member absorbs light and light is converted into heat energy, then fluorescent glue is solidified by heat energy, i.e., the present invention uses
Gu the mode of " optical and thermal-" realizes fluorescence adhesive curing, flexibility is strong.In addition, the glued membrane after solidification is directly fixed on LED chip
Upper surface, you can substitute gluing process of the prior art so that in the curing process, LED chip is not required to glimmering fluorescent glue
Optical cement is together solidified into baking box, saves space, it is easier to realizes automation.
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (6)
1. the preparation facilities of a kind of glued membrane for flip LED chips, it is characterised in that the preparation facilities includes transparent substrates
And the light-emitting device below transparent substrates, the upper surface of the transparent substrates are provided with light absorbing member, the light-emitting device
Light-transmissive transparent substrates are exposed on light absorbing member, and the shape of the light absorbing member is consistent with the molding pattern of glued membrane；Institute
State the region on transparent substrates beyond light absorbing member and be provided with reflecting part.
2. preparation facilities as claimed in claim 1, it is characterised in that the transparent substrates are glass substrate.
3. preparation facilities as claimed in claim 1, it is characterised in that the thickness of the light absorbing member is 0.1 ~ 10 micron.
4. preparation facilities as claimed in claim 1, it is characterised in that the light absorbing member be metallic film, graphite film or
Composite material film.
A kind of 5. preparation method of glued membrane for flip LED chips, it is characterised in that including：
Glue pre-processes：Uniform mixture glue and fluorescent material in proportion, form fluorescent glue；
Spin coating：By the upper surface of fluorescent glue drop transparent substrates in preparation facilities, the preparation facilities include transparent substrates and
Light-emitting device below transparent substrates, the upper surface of the transparent substrates are provided with light absorbing member, the light of the light-emitting device
Line can pass through transparent substrates and expose on light absorbing member, and the shape of the light absorbing member is consistent with the molding pattern of glued membrane；
Solidification：Light-emitting device launches light to transparent substrates, and light is exposed on light absorbing member through transparent substrates, light absorbing member
Absorb light and convert light energy into heat energy, fluorescent glue realizes local solidification using the heat energy of light absorbing member, forms glued membrane.
A kind of 6. preparation method of flip LED chips, it is characterised in that including：
Point tin cream：Tin cream is applied on the pad of substrate；
Put crystalline substance：By LED chip upside-down mounting on pad；
Welding：The tin cream on pad is melted, and is electrical connected with LED chip；
Glue pre-processes：Uniform mixture glue and fluorescent material in proportion, form fluorescent glue；
Spin coating：By the upper surface of fluorescent glue drop transparent substrates in preparation facilities, the preparation facilities include transparent substrates and
Light-emitting device below transparent substrates, the upper surface of the transparent substrates are provided with light absorbing member, the light of the light-emitting device
Line can pass through transparent substrates and expose on light absorbing member, and the shape of the light absorbing member is consistent with the molding pattern of glued membrane；
Solidification：Light-emitting device launches light to transparent substrates, and light is exposed on light absorbing member through transparent substrates, light absorbing member
Absorb light and convert light energy into heat energy, fluorescent glue realizes local solidification using the heat energy of light absorbing member, forms glued membrane；
It is fixed：Cured glued membrane is taken out from preparation facilities, and glued membrane is fixed in the light-emitting area of LED chip.
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| CN201510689575.3A CN105374924B (en) | 2015-10-23 | 2015-10-23 | The preparation method of the preparation facilities of glued membrane, preparation method and flip LED chips |
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| CN201510689575.3A CN105374924B (en) | 2015-10-23 | 2015-10-23 | The preparation method of the preparation facilities of glued membrane, preparation method and flip LED chips |
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| CN105374924A CN105374924A (en) | 2016-03-02 |
| CN105374924B true CN105374924B (en) | 2018-03-06 |
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| CN112536494A (en) * | 2020-11-25 | 2021-03-23 | 深圳市洲明科技股份有限公司 | Solder paste, welding method of LED and bonding pad, LED display unit and manufacturing method thereof |
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| JP5189379B2 (en) * | 2008-02-20 | 2013-04-24 | リンテック株式会社 | Resin composition, film using the same, and method for producing film |
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| CN101209201A (en) * | 1998-08-26 | 2008-07-02 | 医药及科学传感器公司 | Optical-based sensing devices |
| CN102482396A (en) * | 2009-08-14 | 2012-05-30 | 旭硝子株式会社 | Curable resin composition, transparent laminate, and method for producing same |
| CN104245277A (en) * | 2012-07-31 | 2014-12-24 | 昭和电工株式会社 | Processes for producing molded cured resin |
| CN205159360U (en) * | 2015-10-23 | 2016-04-13 | 佛山市中昊光电科技有限公司 | A preparation facilities for inverting glued membrane of LED chip |
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Denomination of invention: Preparation device and method of adhesive film, and preparation method of inverted LED chip Effective date of registration: 20231122 Granted publication date: 20180306 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: FOSHAN EVERCORE OPTOELECTRONIC TECHNOLOGY CO.,LTD. Registration number: Y2023980066635 |