CN109860164A - A kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece - Google Patents
A kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece Download PDFInfo
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- CN109860164A CN109860164A CN201910139947.3A CN201910139947A CN109860164A CN 109860164 A CN109860164 A CN 109860164A CN 201910139947 A CN201910139947 A CN 201910139947A CN 109860164 A CN109860164 A CN 109860164A
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- light source
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- flip led
- aluminium nitride
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Abstract
The present invention relates to automobile lighting technical fields, and disclose a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece, aluminium nitride ceramics layout bracket including being internally provided with fixed plate, the inside that aluminium nitride ceramics layout bracket is located at fixed plate two sides is respectively arranged with positive pin and negative pin, and the top of aluminium nitride ceramics layout bracket is welded with three flip LED chips being equally spaced by the scaling powder coated.The automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece, by the way that inorganic ceramic fluorescent piece is uniformly accurately mounted on three concatenated flip LED wafer surfaces, and curing molding, and the spacing between each chip is controlled at 120 microns or less by Reflow Soldering eutectic technology, the very good solution ghost image and cast shadow problem of multi-wafer light source module group, so that there is volume production feasibility using the high reliability automobile-used LED light source of ceramic fluorescent piece encapsulation, the high reliability request in market can satisfy.
Description
Technical field
The present invention relates to automobile lighting technical field, specially a kind of automobile-used LED light source based on the encapsulation of ceramic fluorescent piece
And its packaging technology.
Background technique
LED light source is widely used in all kinds of automobile lightings mainly as illumination electron-like element, such as motorcycle lighting, family
Outer flashlight lamp illumination, automobile-used lighting area of repacking of cross-country SUV automotive lighting and other middle and high ends etc..
Conventional high-power automobile-used LED light source, is all the fluorescence diaphragm in the surface mount silica gel material of LED wafer, yellow
The fluorescence diaphragm of color generates white light under the excitation of LED blue light, since automobile-used LED light source is to optical radiation flux and radiant illumination
There is high requirement, that is to say, that the luminous flux requirement in unit light emitting angle is extremely harsh, shines to meet this high radiation
The LED light source of degree goes out light requirement, and automobile-used light source is all the flip LED chip using high power large driven current density, and LED light source is big
Electric current driving is lower to generate a large amount of thermal energy, and this heat can directly act on the phosphor powder layer on LED wafer surface, cause silica gel material
The fluorescence membrane layer of matter constantly cracks in the continuous decaying of the effect of high temperature high fever and aging, layer of silica gel, ultimately causes LED light source
Brightness reduce and to failing, followed by packaging technology is complicated, and manufacturing cost is high, and the above various reasons cause such automobile-used
LED light source is difficult to meet extensive automobile-used market to the high reliability request of power type LED light source.
Traditional high-power automobile-used light source, the light-emitting angle and radiant illumination and radiation light intensity requirement to light source are extremely severe
It carves, common high-power automobile-used light source generallys use flip LED in order to reach the automobile-used light source effect of this high radiant illumination
Chip, in the fluorescence diaphragm of the silica gel material of LED wafer surface mount mixed fluorescent powder, LED blue light excites fluorescence diaphragm to generate
White light, a disadvantage of this packaging technology are exactly that automobile-used light source is all to use large driven current density, are generated in ignition
Heat directly acts on the fluorescent film on piece of silica gel material, and fluorescent powder is easy to decay under the action of high temperature, secondly silica gel material
Fluorescence diaphragm under the conditions of high temperature high fever for a long time using can gradually crack and be carbonized because these reasons lead to automobile-used LED
The light decay especially severe of the service life of light source.
Summary of the invention
The present invention provides a kind of automobile-used LED light sources and its packaging technology based on the encapsulation of ceramic fluorescent piece, have light decay
The advantages that subtracting high reliability request that is weaker, meeting market, solves the problems, such as background technique proposition.
The invention provides the following technical scheme: a kind of automobile-used LED light source and its encapsulation work based on the encapsulation of ceramic fluorescent piece
Skill, the aluminium nitride ceramics layout bracket including being internally provided with fixed plate, the aluminium nitride ceramics layout bracket are located at fixed plate
The inside of two sides is respectively arranged with positive pin and negative pin, and the top of the aluminium nitride ceramics layout bracket passes through coating
Scaling powder is welded with three flip LED chips being equally spaced, and to pass through coating transparent at the top of three flip LED chips
Bonded adhesives is bonded with ceramic fluorescent piece jointly, and the top of the aluminium nitride ceramics layout bracket, which is filled with, to be located at outside ceramic fluorescent piece
The enclosure wall silica gel of side.
Preferably, the medial surface that the positive pin is contacted with scaling powder is provided with triangular hill.
Preferably, it is connected between three flip LED chips by scaling powder, and between flip LED chip
Spacing is in micron hereinafter, three flip LED chips form a mould group.
Preferably, the positive pin and negative pin pass through scaling powder and are electrically connected with concatenated flip LED chip
It connects.
A kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece, includes following process flow:
S1, point scaling powder, on the aluminium nitride ceramics layout bracket that a monolith is made of multiple light sources module group unit, according to
Light source module group single wafer distributing position point prefluxing, each light source module group are made of three flip LED wafer tandems, and every
Spacing is lower than 120 microns between flip LED chip；
The turn in one's mind flip LED chip at bottom of gold-tin alloy is bundled in aluminium nitride and made pottery by S2, die bond using bonder and die bond technique
On porcelain layout bracket die bond region；
S3, Reflow Soldering and X-ray voidage inspection pass through setting reflow oven temperatures parameter (260 degree) and essence of regulating the speed
Really control reflow soldering process makes flip LED chip be connected and realize with the firm electrical-mechanical of aluminium nitride ceramics layout bracket realization
Chip spacing is less than 120 microns, passes through the X-RAY process cavity Nian Jie with aluminium nitride ceramics layout bracket to flip LED chip
Rate inspection, voidage are lower than 20%；
S4, spot printing bonded adhesives, after Reflow Soldering binding flip LED chip and aluminium nitride ceramics layout bracket, using die bond
Machine dispensing method, in flip LED wafer surface spot printing clear adhesive glue, the accurate glue amount for controlling bonded adhesives；
S5, solid piece adjust suitable die bond equipment and its technological parameter using bonder, by a monolithic ceramic flourescent sheet
Disposable to be mounted on three flip LED wafer surfaces simultaneously, ceramic fluorescent piece is covered on simultaneously on three flip LED chips；
The enclosure wall silica gel of S6, filling white, on the aluminium nitride ceramics layout bracket of bonded ceramics flourescent sheet, each
Interval between light source module group unit uses glue dispenser with high precision and its gluing process, and dispensing road laterally or longitudinally is arranged
Diameter, by the enclosure wall silica gel of cell module interval filling white；
S7, baking enclosure wall silica gel, carry out high-temperature baking for the aluminium nitride ceramics layout bracket of coated good enclosure wall silica gel
Curing molding；
S8, aluminium nitride ceramics layout bracket is cut by each mould group for a unit, cutting position is along each
The enclosure wall silica gel center line cutting filled between mould group, the light source module group after cutting is by enclosure wall silica gel, three flip LED chip strings
The mould group of connection and the ceramic fluorescent piece being overlapped with flip LED chip area and aluminium nitride ceramics layout bracket composition；
S9, the sorting that photochromic electrical parameter is carried out to the light source module group after cutting, according to the application requirement of client, to finished product
Colour temperature, voltage, the class wrapping of radiation flux.
Preferably, in the process flow S5, the ceramic fluorescent piece on three flip LED chips is covered in vertical direction
On projected area be overlapped with the projection gross area of three flip LED chips.
Preferably, in the process flow S6, the enclosure wall silica gel height of filling must not be higher than the height of ceramic fluorescent piece.
The present invention have it is following the utility model has the advantages that
It 1, should be based on the automobile-used LED light source and its packaging technology that ceramic fluorescent piece encapsulates, by pacifying on flip LED chip
Dress ceramic fluorescent piece can to automobile-used LED light source using when the high temperature that generates be isolated, ceramic fluorescent piece is in high temperature high fever item
Cracking and carbonization will not be generated for a long time under part, so that the optical attenuation of automobile-used LED light source is weaker.
2, the automobile-used LED light source and its packaging technology that should be encapsulated based on ceramic fluorescent piece, by by inorganic ceramic fluorescent
Piece is uniformly accurately mounted on three concatenated flip LED wafer surfaces, and curing molding, and passing through Reflow Soldering eutectic technology will
Spacing between each chip is controlled at 120 microns hereinafter, the very good solution ghost image and cast shadow of multi-wafer light source module group
Problem can satisfy market so that having volume production feasibility using the high reliability automobile-used LED light source of ceramic fluorescent piece encapsulation
High reliability request.
Detailed description of the invention
Fig. 1 is the cross-sectional view of structure of the invention；
Fig. 2 is the top view of structure of the invention；
Fig. 3 is the bottom schematic view of structure of the invention；
Fig. 4 is the process flow chart of structure of the invention.
In figure: 1, aluminium nitride ceramics layout bracket；2, positive pin；3, negative pin；4, scaling powder；5, flip LED is brilliant
Piece；6, ceramic fluorescent piece；7, enclosure wall silica gel.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Attached drawing in the embodiment of the present invention: different types of hatching is labeled not in accordance with national standard in figure, also not
The material of element is required, is distinguished to the cross-sectional view of element in figure.
As depicted in figs. 1 and 2, a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece, including it is interior
Portion is provided with the aluminium nitride ceramics layout bracket 1 of fixed plate, and aluminium nitride ceramics layout bracket 1 is located at the inner part of fixed plate two sides
It is not provided with positive pin 2 and negative pin 3, the top of aluminium nitride ceramics layout bracket 1 is welded with by the scaling powder 4 of coating
Three flip LED chips 5 being equally spaced, and the top of three flip LED chips 5 passes through that coat transparent bonded adhesives common
It is bonded with ceramic fluorescent piece 6, the top of aluminium nitride ceramics layout bracket 1 is filled with the enclosure wall silicon for being located at 6 outside of ceramic fluorescent piece
Glue 7.
As shown in Figure 3, wherein the medial surface that positive pin 2 is contacted with scaling powder 4 is provided with triangular hill, utilizes three
Angular protrusion can distinguish the polarity of positive pin 2 and negative pin 3, facilitate the installation of automobile-used LED circuit of light sources；
As shown in Figure 1, wherein connected between three flip LED chips 5 by scaling powder 4, and flip LED chip 5
Between spacing at 120 microns hereinafter, three flip LED chips 5 form a mould groups；
Positive pin 2 and negative pin 3 are electrically connected by scaling powder 4 with concatenated flip LED chip 5；
As shown in Figure 4, wherein it is a kind of based on ceramic fluorescent piece encapsulation automobile-used LED light source and its packaging technology, comprising with
Lower process flow:
S1, point scaling powder 4, on the aluminium nitride ceramics layout bracket 1 that a monolith is made of multiple light sources module group unit, root
According to light source module group single wafer distributing position point prefluxing 4, each light source module group is composed in series by three flip LED chips 5,
Spacing is lower than 120 microns between every flip LED chip 5；
The turn in one's mind flip LED chip 5 at bottom of gold-tin alloy is bundled in aluminium nitride using bonder and die bond technique by S2, die bond
On ceramic 1 die bond region of layout bracket；
S3, Reflow Soldering and X-ray voidage inspection pass through setting reflow oven temperatures parameter (260 degree) and essence of regulating the speed
Really control reflow soldering process makes flip LED chip 5 and aluminium nitride ceramics layout bracket 1 realize that firm electrical-mechanical is connected and in fact
Existing chip spacing is Nian Jie with aluminium nitride ceramics layout bracket 1 to flip LED chip 5 by X-RAY process less than 120 microns
Voidage inspection, voidage are lower than 20%；
S4, spot printing bonded adhesives, after Reflow Soldering binding flip LED chip 5 and aluminium nitride ceramics layout bracket 1, using solid
Brilliant machine dispensing method, in 5 surface spot printing clear adhesive glue of flip LED chip, the accurate glue amount for controlling bonded adhesives；
S5, solid piece adjust suitable die bond equipment and its technological parameter using bonder, by a monolithic ceramic flourescent sheet 6
Disposable to be mounted on three 5 surfaces of flip LED chip simultaneously, ceramic fluorescent piece 6 is covered on three flip LED chips 5 simultaneously
On, and the projected area of ceramic fluorescent piece 6 in vertical direction is overlapped with the projection gross area of three flip LED chips 5；
The enclosure wall silica gel 7 of S6, filling white, on the aluminium nitride ceramics layout bracket 1 of bonded ceramics flourescent sheet 6,
Interval between each light source module group unit uses glue dispenser with high precision and its gluing process, and dispensing laterally or longitudinally is arranged
Path, by the enclosure wall silica gel 7 of cell module interval filling white, and the height of enclosure wall silica gel 7 must not be higher than ceramic fluorescent piece 6
Highly；
S7, baking enclosure wall silica gel 7, carry out high temperature baking for the aluminium nitride ceramics layout bracket 1 of coated good enclosure wall silica gel 7
Roasting curing molding, can make transparent bonding adhesive curing by toasting to aluminium nitride ceramics layout bracket 1, realize that ceramics are glimmering
Mating plate 6 is combined closely with flip LED chip 5；
S8, aluminium nitride ceramics layout bracket 1 is cut by each mould group for a unit, cutting position is along each
The 7 center line cutting of enclosure wall silica gel filled between mould group, the light source module group after cutting is by 7, three flip LED chips of enclosure wall silica gel
5 concatenated mould groups and 1 group of ceramic fluorescent piece 6 and aluminium nitride ceramics layout bracket being overlapped with 5 area of flip LED chip
At each module group unit is separated from aluminium nitride ceramics layout bracket 1 by Water Cutting technique, ultimately forms a height
Radiate high illumination, the automobile-used LED light source of high reliability；
S9, the sorting that photochromic electrical parameter is carried out to the light source module group after cutting, according to the application requirement of client, to finished product
Colour temperature, voltage, the class wrapping of radiation flux.
Automobile-used LED light source is in use, be external to application end driving circuit, aluminium nitride ceramics layout branch for automobile-used LED light source
Positive pin 2 and negative pin 3 in frame 1 are powered, and flip LED chip 5, which shines, excites ceramic fluorescent piece 6, issue white light, due to
It is encapsulated using flip LED chip 5 and inorganic ceramic fluorescent piece 6, the optical attenuation of LED light source substantially improves, so that based on ceramics
The highly reliable high power automobile-used LED light source that flourescent sheet 6 encapsulates has volume production feasibility.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.Simultaneously in the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length
Degree ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner",
The orientation or positional relationship of the instructions such as "outside", " clockwise ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, only
It is that for the convenience of describing the present invention and simplifying the description, rather than the equipment of indication or suggestion meaning or element must have specifically
Orientation is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (7)
1. a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece, including being internally provided with fixed plate
Aluminium nitride ceramics layout bracket (1), it is characterised in that: the aluminium nitride ceramics layout bracket (1) is located at the interior of fixed plate two sides
Portion is respectively arranged with positive pin (2) and negative pin (3), passes through coating at the top of the aluminium nitride ceramics layout bracket (1)
Scaling powder (4) be welded with three flip LED chips (5) being equally spaced, and the top of three flip LED chips (5) is logical
It crosses and coats transparent bonded adhesives and be bonded with jointly ceramic fluorescent piece (6), the top filling of the aluminium nitride ceramics layout bracket (1)
There is the enclosure wall silica gel (7) being located on the outside of ceramic fluorescent piece (6).
2. a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece according to claim 1, special
Sign is: the medial surface that the anode pin (2) contacts with scaling powder (4) is provided with triangular hill.
3. a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece according to claim 1, special
Sign is: being connected between three flip LED chips (5) by scaling powder (4), and between flip LED chip (5)
Spacing is at 120 microns hereinafter, three flip LED chips (5) form a mould group.
4. a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece according to claim 1, special
Sign is: the anode pin (2) and negative pin (3) are carried out by scaling powder (4) and concatenated flip LED chip (5)
Electrical connection.
5. a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece according to claim 1, special
Sign is, includes following process flow:
S1, point scaling powder (4), on the aluminium nitride ceramics layout bracket (1) that a monolith is made of multiple light sources module group unit, root
According to light source module group single wafer distributing position point prefluxing (4), each light source module group is connected by three flip LED chips (5)
It forms, spacing is lower than 120 microns between every flip LED chip (5)；
The turn in one's mind flip LED chip (5) at bottom of gold-tin alloy is bundled in aluminium nitride and made pottery by S2, die bond using bonder and die bond technique
On porcelain layout bracket (1) die bond region；
S3, Reflow Soldering and X-ray voidage inspection pass through setting reflow oven temperatures parameter (260 degree) and accurate control of regulating the speed
Reflow soldering process processed makes flip LED chip (5) and aluminium nitride ceramics layout bracket (1) realize that firm electrical-mechanical is connected and in fact
Existing chip spacing is less than 120 microns, viscous to flip LED chip (5) and aluminium nitride ceramics layout bracket (1) by X-RAY process
The voidage inspection connect, voidage are lower than 20%；
S4, spot printing bonded adhesives, after Reflow Soldering binding flip LED chip (5) and aluminium nitride ceramics layout bracket (1), using solid
Brilliant machine dispensing method, in flip LED chip (5) surface spot printing clear adhesive glue, the accurate glue amount for controlling bonded adhesives；
S5, solid piece adjust suitable die bond equipment and its technological parameter using bonder, by a monolithic ceramic flourescent sheet (6) one
Three flip LED chip (5) surfaces are mounted on while secondary property, ceramic fluorescent piece (6) is covered on three flip LED chips simultaneously
(5) on；
The enclosure wall silica gel (7) of S6, filling white, in the aluminium nitride ceramics layout bracket (1) of bonded ceramics flourescent sheet (6)
On, the interval between each light source module group unit uses glue dispenser with high precision and its gluing process, is arranged laterally or longitudinally
Dispensing path, by the enclosure wall silica gel (7) of cell module interval filling white；
The aluminium nitride ceramics layout bracket (1) of coated good enclosure wall silica gel (7) is carried out high temperature by S7, baking enclosure wall silica gel (7)
Baking-curing molding；
S8, aluminium nitride ceramics layout bracket (1) is cut by each mould group for a unit, cutting position is along each mould
Enclosure wall silica gel (7) the center line cutting filled between group, the light source module group after cutting is by enclosure wall silica gel (7), three flip LED crystalline substances
The concatenated mould group of piece (5) and the ceramic fluorescent piece (6) being overlapped with flip LED chip (5) area and aluminium nitride ceramics layout
Bracket (1) composition；
S9, the sorting that photochromic electrical parameter is carried out to the light source module group after cutting, according to the application requirement of client, to finished product color
Temperature, voltage, the class wrapping of radiation flux.
6. a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece according to claim 5, special
Sign is: in the process flow S5, being covered on ceramic fluorescent piece (6) on three flip LED chips (5) in vertical direction
Projected area be overlapped with the projection gross area of three flip LED chips (5).
7. a kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece according to claim 5, special
Sign is: in the process flow S6, the enclosure wall silica gel (7) of filling must not highly be higher than the height of ceramic fluorescent piece (6).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910139947.3A CN109860164A (en) | 2019-02-26 | 2019-02-26 | A kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece |
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| CN201910139947.3A CN109860164A (en) | 2019-02-26 | 2019-02-26 | A kind of automobile-used LED light source and its packaging technology based on the encapsulation of ceramic fluorescent piece |
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| CN110400864A (en) * | 2019-09-02 | 2019-11-01 | 宁波升谱光电股份有限公司 | A kind of LED light and its encapsulation chip |
| CN110473866A (en) * | 2019-08-27 | 2019-11-19 | 谷麦光电科技股份有限公司 | Double-colored temperature auto lamp illuminating source packaging structure of one kind and preparation method thereof |
| CN110600460A (en) * | 2019-08-21 | 2019-12-20 | 芜湖安瑞光电有限公司 | High-power LED light source of automobile lamp and production process thereof |
| JP7448833B2 (en) | 2022-03-17 | 2024-03-13 | 日亜化学工業株式会社 | Manufacturing method and inspection method for light emitting device |
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Application publication date: 20190607 |