CN110400864A - A kind of LED light and its encapsulation chip - Google Patents
A kind of LED light and its encapsulation chip Download PDFInfo
- Publication number
- CN110400864A CN110400864A CN201910823528.1A CN201910823528A CN110400864A CN 110400864 A CN110400864 A CN 110400864A CN 201910823528 A CN201910823528 A CN 201910823528A CN 110400864 A CN110400864 A CN 110400864A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- support plate
- led light
- chip
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 36
- 239000000919 ceramic Substances 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 74
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 239000012790 adhesive layer Substances 0.000 claims abstract description 24
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 230000008569 process Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
The invention discloses a kind of LED light and its encapsulation chips, including ceramic substrate, the lower surface of ceramic substrate is equipped with copper circuit board, the upper surface of ceramic substrate is equipped with flip-chip, the top of flip-chip is equipped with flourescent sheet, the circumferential edge of ceramic substrate is filled with adhesive layer in the support cavity that the support plate being equipped with for reinforcing, ceramic substrate and support plate are formed.Using the encapsulation chip of LED light provided by the invention; the upper surface of ceramic substrate is provided with flip-chip and flourescent sheet; it is surround in the circumferential edge of ceramic substrate and is equipped with support plate; adhesive layer is provided in the support cavity that ceramic substrate and support plate are formed; the circumferential hardness that ceramic substrate is improved by support plate, can bear biggish external impacts, thus the internal structure of effective protection encapsulation chip; by adhesive layer ceramic substrate is fixed simultaneously with support plate, improves stable degree.
Description
Technical field
The present invention relates to illuminating device technical fields to further relate to more specifically to a kind of encapsulation chip of LED light
A kind of LED light including above-mentioned encapsulation chip.
Background technique
With the maturation that LED illumination is applied, high power density, automobile-used LED demand rapid growth.Such LED component has
High reliability requirement.Assembling for LED chip, generally by no cup upside-down mounting eutectic chip, which uses
Cartridge chip saves and beats gold thread link, reduces once by external force in production and application process, gold thread is possible to impaired or disconnected
The risk split.But this structure top surface surrounding is the white wall of silica gel, and quality is soft, cracky, causes appearance of device bad, exposing metal line
Road floor.White wall glue and substrate binding force are poor, easily separated under harsh environment (high temperature and humidity, temperature shock), through breaking point
Or separating layer, air and metal layer contact, metal oxide is formed, device reliability is influenced.The white wall glue of the structure filling is
The filling of one whole face, behind process need to cut full wafer ceramic substrate, need hi-precision cutting machine, and expend working hour.
Summary of the invention
In view of this, the first purpose of this invention is to provide a kind of encapsulation chip of LED light, to solve existing encapsulation
The problems such as chip is easily separated damaged, device reliability is poor.It include above-mentioned encapsulation core a second object of the present invention is to provide one kind
The LED light of piece.
In order to reach above-mentioned first purpose, the invention provides the following technical scheme:
A kind of encapsulation chip of LED light, comprising:
Ceramic substrate, the lower surface of the ceramic substrate are equipped with copper circuit board, and the upper surface of the ceramic substrate is equipped with
Cartridge chip, the top of the flip-chip are equipped with flourescent sheet, and the circumferential edge of the ceramic substrate is around equipped with for reinforcing
Adhesive layer is filled in the support cavity that support plate, the ceramic substrate and the support plate are formed.
Preferably, the support plate is arranged in the circumferential edge continued circling of the ceramic substrate.
Preferably, the number of the support plate is multiple, circumferential edge of multiple support plates along the ceramic substrate
Interval setting.
Preferably, the support plate is specially copper sheet, and the copper sheet is fixed with the ceramic substrate through direct copper plating technique
Connection.
Preferably, the outer wall plating of the copper sheet is coated with nickel/palladium/gold.
Preferably, the adhesive layer is specially white wall glue-line.
Preferably, the inner surface of the support plate is equipped with the roughened layer for increasing contact area with the adhesive layer.
Preferably, the ceramic substrate and the support plate integral type are arranged, and are coated with layers of copper on the outer wall of the support plate.
Preferably, the flip-chip is adhesively fixed with the flourescent sheet.
The lower surface of the encapsulation chip of LED light provided by the invention, including ceramic substrate, ceramic substrate is equipped with copper wire
Plate, the upper surface of ceramic substrate are equipped with flip-chip, and the top of flip-chip is equipped with flourescent sheet, the circumferential edge ring of ceramic substrate
It is arranged with the support plate for reinforcing, is filled with adhesive layer in the support cavity that ceramic substrate and support plate are formed.
Using the encapsulation chip of LED light provided by the invention, the upper surface of ceramic substrate is provided with flip-chip and fluorescence
Piece is arranged in the support cavity that ceramic substrate is formed with support plate in the circumferential edge of ceramic substrate around support plate is equipped with
There is adhesive layer, the circumferential hardness of ceramic substrate is improved by support plate, biggish external impacts can be born, thus effective protection
The internal structure of chip is encapsulated, while by adhesive layer ceramic substrate is fixed with support plate, improves stable degree.
In order to reach second purpose, the present invention also provides a kind of LED light, which includes any of the above-described kind of encapsulation
Chip, since above-mentioned encapsulation chip has above-mentioned technique effect, the LED light with the encapsulation chip should also have corresponding skill
Art effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of the encapsulation chip of LED light provided in an embodiment of the present invention；
Fig. 2 is the side structure schematic view of Fig. 1.
It is marked in attached drawing as follows:
Support plate 1, flourescent sheet 2, adhesive layer 3, flip-chip 4, ceramic substrate 5, copper circuit board 6.
Specific embodiment
The embodiment of the invention discloses a kind of encapsulation chips of LED light, to solve the easily separated damaged, device of existing encapsulation chip
The problems such as part poor reliability.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-Fig. 2 is please referred to, Fig. 1 is a kind of structural schematic diagram of the encapsulation chip of LED light provided in an embodiment of the present invention；
Fig. 2 is the side structure schematic view of Fig. 1.
In a kind of specific embodiment, the encapsulation chip of LED light provided by the invention, including ceramic substrate 5, ceramics
The lower surface of substrate 5 is equipped with copper circuit board 6, and the upper surface of ceramic substrate 5 is equipped with flip-chip 4, and the top of flip-chip 4 is equipped with
Flourescent sheet 2, what the circumferential edge of ceramic substrate 5 was formed around the support plate 1 being equipped with for reinforcing, ceramic substrate 5 and support plate 1
It supports and is filled with adhesive layer 3 in cavity.
The circumferential edge of ceramic substrate 5 is provided with support plate 1, and support plate 1 surround setting along its circumferential edge, such as in one kind
In embodiment, ceramic substrate 5 is rectangular slab, then support plate 1 is respectively in four side rings of rectangular slab around setting.Wherein, support plate 1 with
Ceramic substrate 5 can realize fixation by welding or other modes, meanwhile, secondary fixation is realized by adhesive layer 3, to improve jail
Gu degree, in other embodiments, ceramic substrate 5 and support plate 1 can also be realized only by adhesive layer 3 and be fixed, at this
In the protection scope of invention.
Support plate 1 is preferably metal plate, such as copper sheet or other plates, ceramic wafer etc., and thus to increase device heat dissipation area,
LED junction temperature is effectively reduced, reduces light decay, extends device service life.It can be configured as needed.Support plate 1 also, it is preferred that
For rectangular slab, in order to produce and process.
It is understood that removing flourescent sheet 2 and flip-chip in the support cavity that ceramic substrate 5 and support plate 1 are formed
Other cavity spaces other than 4 are provided with adhesive layer 3, to realize fixing and supporting to flip-chip 4.Adhesive layer 3 has
Body is white wall glue-line, and the concrete form of binder can be set as needed in other embodiments.
Using the encapsulation chip of LED light provided by the invention, the upper surface of ceramic substrate 5 is provided with flip-chip 4 and glimmering
Mating plate 2, in the circumferential edge of ceramic substrate 5 around support plate 1 is equipped with, in the support cavity that ceramic substrate 5 and support plate 1 are formed
It is inside provided with adhesive layer 3, the circumferential hardness of ceramic substrate 5 is improved by support plate 1, biggish external impacts can be born, from
And the internal structure of effective protection encapsulation chip, while making ceramic substrate 5 and support plate 1 fixed by adhesive layer 3, it improves
Stable degree.
In one embodiment, support plate 1 is arranged in the circumferential edge continued circling of ceramic substrate 5.Thus be arranged, with into
One step improves the support strength of the circumferential side wall of ceramic substrate 5, by taking ceramic substrate 5 is rectangular slab as an example, in the surrounding of rectangular slab
Support plate 1 is arranged in continued circling, and support plate 1 and ceramic substrate 5 form the rectangular cavities of upper opening, be filled in rectangular cavities
Adhesive layer 3.
Specifically, the number of support plate 1 be it is multiple, multiple support plates 1 along ceramic substrate 5 circumferential edge interval be arranged.
In such embodiment, support plate 1 forms barrier formula in the circumferential edge of ceramic substrate 5 and surround, and is for rectangular slab with ceramic substrate 5
Example, is preferably respectively set 3-5 support plate 1 at each edge of ceramic substrate 5, the number of support plate 1 can be set as needed.
Further, support plate 1 is specially copper sheet, and copper sheet is fixedly connected with ceramic substrate 5 through direct copper plating technique.Copper sheet
It can be arranged on ceramic substrate 5 by direct copper plating technique, by being repeatedly electroplated and etching, form certain thickness, and in copper sheet
The metals such as electroplating nickel on surface, palladium, gold, compared to traditional white glue enclosure wall, side hardness is higher.
On the basis of the various embodiments described above, the inner surface of support plate 1 is equipped with for increasing contact area with adhesive layer 3
Roughened layer.Wherein, roughened layer may be configured as arcwall face, or uniform protrusion and/or groove are arranged on roughened layer, thus
To increase the contact area with adhesive layer 3.
In one embodiment, ceramic substrate 5 and the setting of 1 integral type of support plate, can be realized by sintering process to ceramics
The integrated molding of substrate 5 and support plate 1, processing easy to produce, and it is coated with layers of copper on the outer wall of support plate 1, to increase heat dissipation
Area, it is to be understood that in metals such as outer wall electrodepositable cladding nickel/palladium/gold of layers of copper, improve the lateral hard of ceramic substrate 5
Degree, guarantees the reliability of device.
Further, flip-chip 4 is adhesively fixed with flourescent sheet 2.
The fixed form of ceramic substrate 5 and copper circuit board 6 can refer to the prior art, be arranged in the upper surface of ceramic substrate 5
Thus flip-chip 4 beats gold thread environment to save, reduce the damaged risk during production application, in production, in ceramic base
The size that scaling powder, coated area and thickness and flip-chip 4 are coated on plate 5 is adapted, and flip-chip 4 is solid by high-precision
Brilliant machine is fixed on specified region, and the good semi-finished product of die bond are soldered into welding by high temperature reflux.And by scavenger specially and
Sprinkling equipment removes residual flux；The fixation of flourescent sheet 2 is completed using high-precision bonder, and complete by glue dispenser with high precision
At the filling of white wall glue-line, monolithic ceramic substrate 5 is divided by required monolithic by sliver fixture, is not necessarily to hi-precision cutting machine,
Save equipment cost and working hour.
Above-mentioned apparatus is in the circumferential setting support plate 1 of ceramic substrate 5 to reinforce the protection to LED chip, while copper sheet tool
There are higher mechanical strength and hardness, is able to bear biggish external impacts, thus the internal structure of effective protection LED chip,
Copper sheet is fixed using electroplating technology and ceramic substrate 5, and whole binding force is strong, and the interior side-wall surface roughening of copper sheet, increase with
The contact area of adhesive layer 3.
The encapsulation chip of the LED light provided in based on the above embodiment, the present invention also provides a kind of LED light, the LED light
Including any one encapsulation chip in above-described embodiment, since the LED light uses the encapsulation chip in above-described embodiment, so
The beneficial effect of the LED light please refers to above-described embodiment.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (10)
1. a kind of encapsulation chip of LED light characterized by comprising
Ceramic substrate, the lower surface of the ceramic substrate are equipped with copper circuit board, and the upper surface of the ceramic substrate is equipped with upside-down mounting core
Piece, the top of the flip-chip are equipped with flourescent sheet, and the circumferential edge of the ceramic substrate is around the support being equipped with for reinforcing
Adhesive layer is filled in the support cavity that plate, the ceramic substrate and the support plate are formed.
2. the encapsulation chip of LED light according to claim 1, which is characterized in that the support plate is in the ceramic substrate
Circumferential edge continued circling setting.
3. the encapsulation chip of LED light according to claim 1, which is characterized in that the number of the support plate be it is multiple, it is more
A support plate is arranged along the circumferential edge interval of the ceramic substrate.
4. the encapsulation chip of LED light according to claim 2, which is characterized in that the support plate is specially copper sheet, described
Copper sheet is fixedly connected with the ceramic substrate through direct copper plating technique.
5. the encapsulation chip of LED light according to claim 4, which is characterized in that the outer wall plating of the copper sheet is coated with
Nickel/palladium/gold.
6. the encapsulation chip of LED light according to claim 5, which is characterized in that the adhesive layer is specially white wall glue
Layer.
7. the encapsulation chip of LED light according to claim 1-6, which is characterized in that the interior table of the support plate
Face is equipped with the roughened layer for increasing contact area with the adhesive layer.
8. the encapsulation chip of LED light according to claim 1, which is characterized in that the ceramic substrate and the support plate
Integral type is arranged, and is coated with layers of copper on the outer wall of the support plate.
9. the encapsulation chip of LED light according to claim 1, which is characterized in that the flip-chip and the flourescent sheet
It is adhesively fixed.
10. a kind of LED light, which is characterized in that including the described in any item encapsulation chips of such as claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910823528.1A CN110400864A (en) | 2019-09-02 | 2019-09-02 | A kind of LED light and its encapsulation chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910823528.1A CN110400864A (en) | 2019-09-02 | 2019-09-02 | A kind of LED light and its encapsulation chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110400864A true CN110400864A (en) | 2019-11-01 |
Family
ID=68329796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910823528.1A Pending CN110400864A (en) | 2019-09-02 | 2019-09-02 | A kind of LED light and its encapsulation chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110400864A (en) |
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-
2019
- 2019-09-02 CN CN201910823528.1A patent/CN110400864A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101506969A (en) * | 2006-08-22 | 2009-08-12 | 三菱化学株式会社 | Semiconductor device member, liquid for forming semiconductor device member, method for manufacturing semiconductor device member, and liquid for forming semiconductor device member using the method, |
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