CN201964172U - Light-emitting diode (LED) packaging structure - Google Patents
Light-emitting diode (LED) packaging structure Download PDFInfo
- Publication number
- CN201964172U CN201964172U CN2010206612102U CN201020661210U CN201964172U CN 201964172 U CN201964172 U CN 201964172U CN 2010206612102 U CN2010206612102 U CN 2010206612102U CN 201020661210 U CN201020661210 U CN 201020661210U CN 201964172 U CN201964172 U CN 201964172U
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- led chip
- wiring board
- led
- reverberation bowl
- colloid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model discloses a light-emitting diode (LED) packaging structure, which comprises a reflecting bowl, a circuit board, an LED chip and a filling colloid, wherein the reflecting bowl is fixed on the circuit board, and is provided with a plurality of vent holes for a colloid filling process; the bottom of the reflecting bowl is provided with a hollowed part where the LED chip is directly contacted with the circuit board; the LED chip on the hollowed part of the reflecting bowl is directly coated on the circuit board; the anode and the cathode of the LED chip are welded on the circuit board through inner leads; the surface of the LED chip is provided with a fluorescent powder layer; the colloid is filled above the LED chip, and is fully covered on the LED chip, the inner leads and the reflecting bowl; or the mixture of fluorescent powder and the colloid is arranged above the LED chip, and is fully covered on the LED chip, the inner leads and the reflecting bowl. The LED packaging structure has the advantages of high heat dispersion, simple structure and good reflecting effect.
Description
Technical field
The utility model relates to a kind of manufacture craft of light fixture, relates in particular to a kind of LED encapsulating structure.
Background technology
The LED encapsulation is that outer lead is connected on the electrode of led chip, so that be connected with other devices.It not only is connected the electrode on the chip with lead finishes being connected of chip and external circuit on the package casing, and chip is fixed and sealed, and forms electric property to safeguard chip circuit not to be subjected to the corrosion of materials such as water, air and reduces.In addition, can also the improve light extraction efficiency of led chip of encapsulation, and facilitate for the application apparatus of downstream industry and transportation.Thereby encapsulation technology plays an important role to performance and the fixing of LED.
Be 200710029336.0 in the patent No., application number is that 2007-07-20, utility model name are called in " manufacture method of a kind of LED ", discloses the manufacture method of large scale LED, it may further comprise the steps:
1) led chip is fixed on the cup bowl;
2) routing is electrically connected to two electrode pins respectively with the led chip both positive and negative polarity;
3) fluorescent material is fully mixed, go bubble and oven dry are made into the fluorescent glue cake with packing colloid;
4) with 3) go on foot the fluorescent glue cake thawing batch encapsulation of made by 2) mounted led chip of step and cup;
5) with 4) packaged LED oven dry of step.
Manufacture craft of the present utility model divides two roads to walk earlier,
The one, prefabricated fluorescent glue cake, the manufacture method of fluorescent glue cake has two kinds: the one, earlier packing colloid is ground into powder, fully mix being squeezed into piece again with fluorescent material, the 2nd, earlier with the packing colloid hot melt, fully mix, go to steep the back oven dry again with fluorescent material and be made into the fluorescent glue cake;
Another is fixed tightly in led chip on the cup bowl, is solid crystalline substance on the industry again, with lead the both positive and negative polarity of chip is electrically connected to two pins respectively then;
At last prefabricated fluorescent glue cake is melted and inject mould, encapsulate mounted chip and pin, dry with electric furnace again.
Above-mentioned patent is melted the injection mould by the fluorescent glue cake, substitutes existing some glue step, improves LED production efficiency thus.
Fluorescent material is one of key technology in the semiconductor lighting technology, directly the resolved performances such as brightness, colour rendering index, colour temperature and luminous efficiency of fluorescent material conversion LED of its characteristic.That is to say that the kind of fluorescent material is many, make different LED kinds, the kind (such as color) of the fluorescent material that needs or combination are different, then need to make different fluorescent glue cakes, have improved the complexity of manufacture craft.
In addition, led chip is fixed on the cup bowl, and fixing in the circuit board by the cup bowl again, the heat of led chip is passed to wiring board by the cup bowl, dispels the heat by wiring board again, has shortcomings such as heat dispersion is not good enough, parts complexity.
The utility model content
Another purpose of the present utility model is to provide a kind of LED encapsulating structure, to solve the technical problem of poor radiation in the prior art LED encapsulating structure.
The utility model discloses a kind of LED encapsulating structure, comprise reverberation bowl, wiring board, led chip, fill colloid, reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology, the hollow out place that led chip and wiring board directly contact is left in the bottom of described reverberation bowl, led chip directly carries and overlays on the wiring board in the hollow out place of reverberation bowl, the led chip both positive and negative polarity is welded on the wiring board by lead, on the led chip surface, phosphor powder layer is set, above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps, fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
Preferably, those steam vents evenly are arranged on wiring board and reverberation bowl junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and reverberation bowl junction.
Preferably, add a cover the lens module up, add radiator in the bottom.
Preferably, add a cover the lens module up, add radiator in the bottom.
The utility model also discloses second kind of LED encapsulating structure, comprise fixed support, wiring board, led chip, filling colloid, fixed support is fixing in the circuit board, and leaving the plurality of rows pore that is used for filler technology, the hollow out place that led chip and wiring board directly contact is left in described support bracket fastened bottom; Led chip directly carries and overlays on the wiring board in support bracket fastened hollow out place; The led chip both positive and negative polarity is welded on the wiring board by lead; On the led chip surface, be coated with and be covered with phosphor powder layer, above led chip, fill colloid, make it to cover fully led chip, lead, perhaps, above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead.
Preferably, those steam vents evenly are arranged on wiring board and fixed support junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and fixed support junction.
Preferably, add a cover the lens module up, add radiator in the bottom.
The utility model also provides a kind of LED encapsulating structure, comprise reverberation bowl, wiring board, led chip, fill colloid, reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology, led chip directly carries and overlays on the wiring board, the led chip both positive and negative polarity is received on the wiring board by the outer rim that lead strides across reverberation bowl, on the led chip surface, phosphor powder layer is set, above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps, fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
Existing LED encapsulation, often led chip is fixed on support heat sink, be packaged into the LED particle, the LED particle is welded on wiring board, be installed on the radiator again, form product, become industry technology prejudice, and the frame mode of this LED fluorescent lamp exists shortcomings such as heat dispersion is not good enough, parts complexity.The applicant is in LED throw light on proprietary field and application scenario, overcome existing technology prejudice, proposed a kind of new LED encapsulating structure, led chip is directly carried overlayed on the wiring board, and solved led chip and carry and overlay on the heat dissipation problem in the encapsulation process on the wiring board.And in addition, the utility model is coated with on the led chip surface and is covered with phosphor powder layer, fills colloid above led chip, makes it to cover fully led chip.
In addition, the utility model will be coated with phosphor powder layer on the led chip surface, promptly can be coated with fluorescent material in the place of led chip except that the bottom surface, by the way, can make the light of LED reach more preferably reflecting effect.Our experiments show that the reflecting effect of filling fluorescent material and colloid admixture compared with the led chip top is better.
And, in the circuit board, and leaving the plurality of rows pore that is used for filler technology, this mode has promoted the thermal diffusivity in the encapsulation process.
Also have, those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and reverberation bowl junction.Be arranged so that the thermal diffusivity that reaches fabulous like this, and simple in structure.
Have again, described reverberation bowl is connected by mechanical closing component structure with wiring board: some shell fragments are set on wiring board/reverberation bowl, correspondence position at reverberation bowl/wiring board is provided with corresponding groove, and reverberation bowl and wiring board come mechanical connection by described clip clamping in corresponding groove.This structural design, reverberation bowl and wiring board can reach reasonable disassembling function, make things convenient for the maintenance in later stage, have also promoted the utilization rate of later stage led chip simultaneously.
Description of drawings
Fig. 1 is the topology example figure of a kind of LED encapsulating structure of the present utility model;
Fig. 2 is a LED encapsulation gumming position view;
Fig. 3 is that led chip and wiring board pass through the frame for movement connection diagram;
Fig. 4 is the topology example figure of another kind of LED encapsulating structure of the present utility model.
The specific embodiment
Below in conjunction with accompanying drawing, specify the utility model.
See also Fig. 1, it is a kind of structure of LED encapsulation, comprising: led chip 401, lead 402 is filled colloid 403, wiring board 404, reverberation bowl 405.
For reasonable radiating effect, wiring board 404 can adopt the material of high thermal conductivity, as metal material or pottery etc.Wiring board 404 mounts the position with led chip 401 can also be plane, square groove, rectangular recess, circular groove etc.And for fixed L ED chip, wiring board 404 can have elargol, golden tin by point, perhaps insulating heat-conductive glue, perhaps welding material connection led chip 401.And, can install reverberation bowl additional in the position of wiring board 404 fixed L ED chips 401, improve light extraction efficiency.In order to guarantee that the shape of filling colloid 403 also can adopt molding technology.Can behind fixed chip, inject fluorescent material and (be coated in the led chip surface simultaneously; Or fill out at support (or reverberation bowl) and the cavity that wiring board forms, make it to cover led chip), also can in primer, sneak into fluorescent material.The angular range of reverberation bowl is 90 degree-150 degree, the 3-5 that is of a size of chip doubly, the light that this design is sent led chip can be directional light or has the light of certain diffusion angle, form the optimal effectiveness of emergent light, satisfy the encapsulation requirement of LED, reach light emission rate preferably, the light flux values after the encapsulation is better.
From the above, led chip can directly encapsulate in the circuit board, and the heat of led chip is directly transferred to wiring board and radiator, does not pass through the LED packaging heat sink, and LED is heat sink and the air dielectric of wiring board, has promoted radiating effect greatly.
Adopt reverberation bowl, the process implementing of making for example down.
A kind of manufacture craft of LED encapsulating structure, form by following steps:
Reverberation bowl is fixing in the circuit board 1.
Reverberation bowl can be that plastics are made, and also can be that frosting applies the high-reflectivity metal layer again, also can make by metal, and the light that makes it can reflection led chip as much as possible to send gets final product.Concrete mode can have 1.1 and 1.2 two kind, carries out one of them and gets final product.The hollow out place that led chip and wiring board directly contact is left in the bottom of reverberation bowl.That is to say that the bottom of reverberation bowl can be empty, also can be that part is sky, and this vacancy is the hollow out place.General high-power LED adopts metal bowl,, low power LED adopts plastic bowl.
1.1 glue bonding reverberation bowl.
The reverberation bowl structure of the method is: the one side that combines with wiring board is the plane, is beneficial to better bonding; And leave the steam vent of follow-up filler technology; And owing to use glue to be connected with wiring board, the glue curing requisite space also need be left in the bottom, can be groove 407, also can be certain oblique angle 408.As Fig. 2.
Need on the wiring board to consider the reliability of bonding leaving the reverberation bowl installation site in the design in advance, best mode is not have the solder mask of covering and Copper Foil herein.
The fixation reflex bowl is finished by artificial or automatic equipment when wiring board, with reference to the predefined benchmark that is labeled as on the wiring board.(this mark pattern is not limit, and can be a simple MARK point, can be boring yet, can also be typographic(al) mark on the wiring board).
Used glue need guarantee that (220 degrees centigrade is that technology removes to finish the fixing of chip because follow-up wiring board needs hypereutectic weldering etc. for stability under 220.This needs the original performance of glue to guarantee) so that follow-up technological process, and can guarantee bonding reliability for a long time.The curing mode of glue can be air dry, also can be the oven dry of heating, and can also add drying up the pathogenic dryness body.
1.2 mechanical sealed fixation reflex bowl.
The method needs to leave fixed hole position in the circuit board in advance, can be a reverberation bowl one hole, also can be a reverberation bowl porous.
The structure of reverberation bowl need have closing component structure in the bottom that combines with wiring board, and this structure is to grow shell fragment 11 in the reverberation bowl bottom, and guarantees can form sealed power with the groove 12 on the wiring board after the installation; And leave the steam vent of follow-up filler technology.That is, some shell fragments 11 are set on wiring board/reverberation bowl, at the correspondence position of reverberation bowl/wiring board corresponding groove 12 (or being referred to as boring) are set, reverberation bowl and wiring board come machinery to removably connect by described clip clamping in corresponding groove.As Fig. 3.
The fixation reflex bowl is finished by artificial or automatic equipment when wiring board, with reference to the predefined benchmark that is labeled as on the wiring board.
1.3 special, when the wiring board material is metal material, can on 1.1 or 1.2 basis, use welding procedure to fix reverberation bowl.
2. led chip is carried and overlay on the wiring board, be positioned at the cavity of reverberation bowl, and baking is fixing; Step 2 is characterised in that chip directly fixing in the circuit board, rather than other heat sink supports.This step can adopt elargol technology, eutectic technology, cover brilliant technology or other technology, only needs led chip 402 to be fixed on the technology on the substrate.
2.1 that eutectic technology is meant is gold-plated on led chip, tin, gold-tin alloy, gold-plated or silver-colored on the substrate weld layer, heated substrates makes the gold, silver element be penetrated in the gold-tin alloy to eutectic temperature, the formation alloy-layer solidifies, thereby led chip is welded on the substrate.
2.2 cover brilliant technology and be the led chip upside-down mounting on substrate, use ultrasonic wave that led chip is fixed on the substrate.
3. the led chip both positive and negative polarity is welded on the wiring board by lead.Described lead is generally gold thread, and single electrode can weld one, and is perhaps two, perhaps more.For the chip of vertical stratification, electrode can be directly and positive pole on the wiring board or negative pole circuit welding conducting, and an other utmost point is derived by lead.
4. apply fluorescent material at chip surface, make it evenly cover each surface except that the bottom surface of led chip.Make the optical excitation fluorescent material that led chip sends, be mixed into the light of required colour temperature and color.On led chip, mould is set with reserving the lead part, after be coated with thereon and be covered with phosphor powder layer, remove mould, lead welds with led chip, this processing mode has better welding effect.
5. the filling colloid is put above led chip, covers led chip and lead-in wire thereof fully, and reverberation bowl, and it is under the sealing state.When filling, can slowly insert from the led chip top, so that between reverberation bowl and led chip, do not leave air.
Especially, fill together after also fluorescent material and glue can being mixed, as adopting the manner, but skips steps 4 then.
The shape on filler surface can have 5.1 and 5.2 dual modes, carries out one of them and gets final product.
5.1 the colloid shape of filler technology is formed by the surface tension of colloid self, is left intact its free forming under the gravity effect of leaving after that is to say a glue.
5.2 adopt the molding moulding.
More than disclosed only be a kind of realization example, in fact, led chip directly carries and overlays on reverberation bowl and also be fine.
A kind of LED method for packing may further comprise the steps:
(1) reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology;
(2) led chip directly carries and overlays on the reverberation bowl, and the angular range of reverberation bowl is 90 degree-150 degree, is of a size of 3-5 times of chip;
(3) the led chip both positive and negative polarity is received on the wiring board by lead, lead is connected on the wiring board by the outer rim of reverberation bowl;
(4) on the led chip surface, be coated with and be covered with phosphor powder layer, above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps, above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead and reverberation bowl.
See also its structure for another kind of LED encapsulation of Fig. 4, comprising: led chip 401, lead 402 is filled colloid 403, wiring board 404, fixed support 406.The medial surface of fixed support 406 can be inclination angle 90～150 degree, and the design of this angle makes reflecting effect than preferable.
The step that adopts fixed support to encapsulate is as follows:
Fixed support is fixing in the circuit board 1.
Fixed support can be that plastics and metal are made, and can additionally apply the high-reflectivity metal layer again by led chip one side inner surface, also can apply other materials reflecting layer system, and purpose is that the light that can reflection led chip as much as possible sends gets final product.Concrete mode can have 1.1,1.2 and 1.3 3 kind, carries out one of them and gets final product.
1.1 glue bonding fixed support.
The fixing rack structure of the method is: the one side that combines with wiring board is the plane, is beneficial to better bonding; And leave the steam vent of follow-up filler technology; And owing to use glue to be connected with wiring board, the glue curing requisite space also need be left in the bottom, can be groove, also can be certain oblique angle.
Need on the wiring board to consider the reliability of bonding leaving the fixed support installation site in the design in advance, best mode is not have the solder mask of covering and Copper Foil herein.
Mounting and fixing bracket is finished by artificial or automatic equipment when wiring board, with reference to the predefined benchmark that is labeled as on the wiring board.
Used glue need guarantee the stability under 220 degrees centigrade, so that follow-up technological process, and can guarantee bonding reliability for a long time.The curing mode of glue can be air dry, also can be the oven dry of heating, and can also add drying up the pathogenic dryness body.
1.2 mechanical sealed mounting and fixing bracket.
The method needs to leave fixed hole position in the circuit board in advance, and support is fixed on the position, hole.Support bracket fastened structure need have closing component structure in the bottom that combines with wiring board, and this structure is to grow shell fragment or other locking mechanisms in the fixed support bottom, and guarantees can form sealed power with wiring board after installation; And leave the steam vent 14 of follow-up filler technology.Mounting and fixing bracket is finished by artificial or automatic equipment when wiring board, with reference to the predefined benchmark that is labeled as on the wiring board.
1.3 many injection mouldings are installed
If the support material is plastics, then 1.2 methods also are applicable to injection molding way repeatedly fixed support are installed on the wiring board.Within the tolerance range of the melt temperature online road plate when in the selection of timbering material, need considering injection moulding, and take into account the matching of support and wiring board thermal coefficient of expansion.
That is to say wiring board is placed in the plastic mold cavity moulding on the plate of support direct-on-line road.The face temperature should not be higher than the heat-resisting scope of wiring board, the situation of concrete numerical value sight path plate and deciding.So-called support and wiring board matched coefficients of thermal expansion can be understood as two parameters and numerically are on the order of magnitude.
2. led chip is carried and overlay on the wiring board, be positioned at special support bracket fastened cavity, and baking is fixing; Step 2 is characterised in that chip directly fixing in the circuit board, rather than other heat sink supports.This step can adopt elargol technology, eutectic technology, cover brilliant technology or other technology, only needs led chip 402 to be fixed on the technology on the substrate.
2.1 eutectic technology is meant gold-plated or tin or gold-tin alloy on led chip, gold-plated or silver-colored on the substrate weld layer, heated substrates makes gold or silver element be penetrated in the gold-tin alloy to eutectic temperature, the formation alloy-layer solidifies, thereby led chip is welded on the substrate.
2.2 cover brilliant technology and be the led chip upside-down mounting on substrate, use ultrasonic wave that led chip is fixed on the substrate.
3. the led chip both positive and negative polarity is welded on the wiring board by lead.Described lead is generally gold thread, and single electrode can weld one, and is perhaps two, perhaps more.For the chip of vertical stratification, electrode can be directly and positive pole on the wiring board or negative pole circuit welding conducting, and an other utmost point is derived by lead.
4. apply fluorescent material at chip surface, make it evenly cover each surface except that ground of led chip.Make the optical excitation fluorescent material that led chip sends, be mixed into the light of required colour temperature and color.On led chip, mould is set with reserving the lead part, after be coated with thereon and be covered with phosphor powder layer, remove mould, lead welds with led chip.
5. the filling colloid is put above led chip, fills the space that full fixed support and wiring board surround, and covers led chip and lead-in wire thereof fully, and it is under the sealing state.Should slowly fill in order to avoid in fixed support and led chip, leave air during filler.
Especially, fill together after also fluorescent material and glue can being mixed, as adopting the manner, but skips steps 4 then.
The colloid shape of filler technology is formed by the surface tension of colloid self, or adopts the molding moulding.
The utility model also provides a kind of LED encapsulating structure, comprise reverberation bowl, wiring board, led chip, fill colloid, reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology, led chip directly carries and overlays on the wiring board, the led chip both positive and negative polarity is received on the wiring board by the outer rim that lead strides across reverberation bowl, on the led chip surface, phosphor powder layer is set, above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps, fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
More than disclosed only be several specific embodiments of the application, but the application is not limited thereto, any those skilled in the art can think variation, all should drop in the application's the protection domain.
Claims (8)
1. LED encapsulating structure, it is characterized in that, comprise reverberation bowl, wiring board, led chip, fill colloid, reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology, the hollow out place that led chip and wiring board directly contact is left in the bottom of described reverberation bowl, led chip directly carries and overlays on the wiring board in the hollow out place of reverberation bowl, the led chip both positive and negative polarity is welded on the wiring board by lead, on the led chip surface, phosphor powder layer is set, above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps, fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
2. LED encapsulating structure as claimed in claim 1 is characterized in that, those steam vents evenly are arranged on wiring board and reverberation bowl junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and reverberation bowl junction.
3. LED encapsulating structure as claimed in claim 1 is characterized in that, adds a cover the lens module up, adds radiator in the bottom.
4. LED encapsulating structure as claimed in claim 1 is characterized in that, adds a cover the lens module up, adds radiator in the bottom.
5. LED encapsulating structure, it is characterized in that, comprise fixed support, wiring board, led chip, filling colloid, fixed support is fixing in the circuit board, and leaving the plurality of rows pore that is used for filler technology, the hollow out place that led chip and wiring board directly contact is left in described support bracket fastened bottom; Led chip directly carries and overlays on the wiring board in support bracket fastened hollow out place; The led chip both positive and negative polarity is welded on the wiring board by lead; On the led chip surface, be coated with and be covered with phosphor powder layer, above led chip, fill colloid, make it to cover fully led chip, lead, perhaps, above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead.
6. LED encapsulating structure as claimed in claim 5 is characterized in that, those steam vents evenly are arranged on wiring board and fixed support junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and fixed support junction.
7. LED encapsulating structure as claimed in claim 5 is characterized in that, adds a cover the lens module up, adds radiator in the bottom.
8. LED encapsulating structure, it is characterized in that, comprise reverberation bowl, wiring board, led chip, fill colloid, reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology, led chip directly carries and overlays on the wiring board, the led chip both positive and negative polarity is received on the wiring board by the outer rim that lead strides across reverberation bowl, on the led chip surface, phosphor powder layer is set, above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps, fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206612102U CN201964172U (en) | 2010-12-15 | 2010-12-15 | Light-emitting diode (LED) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206612102U CN201964172U (en) | 2010-12-15 | 2010-12-15 | Light-emitting diode (LED) packaging structure |
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| Publication Number | Publication Date |
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| CN201964172U true CN201964172U (en) | 2011-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010206612102U Expired - Lifetime CN201964172U (en) | 2010-12-15 | 2010-12-15 | Light-emitting diode (LED) packaging structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891245A (en) * | 2012-09-17 | 2013-01-23 | 温州大学 | High-power white light emitting diode (LED) packaging structure employing fluorescence wafer and packaging method thereof |
| CN103794698A (en) * | 2012-10-31 | 2014-05-14 | 展晶科技(深圳)有限公司 | Light-emitting diode |
| CN105874616A (en) * | 2014-01-02 | 2016-08-17 | 飞利浦照明控股有限公司 | Light emitting device comprising releasable wavelength converter |
| CN114420664A (en) * | 2022-01-18 | 2022-04-29 | 广东气派科技有限公司 | Packaging structure of multi-base-island high-power module QFN |
-
2010
- 2010-12-15 CN CN2010206612102U patent/CN201964172U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102891245A (en) * | 2012-09-17 | 2013-01-23 | 温州大学 | High-power white light emitting diode (LED) packaging structure employing fluorescence wafer and packaging method thereof |
| CN103794698A (en) * | 2012-10-31 | 2014-05-14 | 展晶科技(深圳)有限公司 | Light-emitting diode |
| CN103794698B (en) * | 2012-10-31 | 2016-12-21 | 展晶科技(深圳)有限公司 | Light emitting diode |
| CN105874616A (en) * | 2014-01-02 | 2016-08-17 | 飞利浦照明控股有限公司 | Light emitting device comprising releasable wavelength converter |
| CN105874616B (en) * | 2014-01-02 | 2019-05-10 | 飞利浦照明控股有限公司 | Luminaire including releasable wavelength shifter |
| CN114420664A (en) * | 2022-01-18 | 2022-04-29 | 广东气派科技有限公司 | Packaging structure of multi-base-island high-power module QFN |
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