CN102544245A - LED packaging method and structure - Google Patents
LED packaging method and structure Download PDFInfo
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- CN102544245A CN102544245A CN2010105895255A CN201010589525A CN102544245A CN 102544245 A CN102544245 A CN 102544245A CN 2010105895255 A CN2010105895255 A CN 2010105895255A CN 201010589525 A CN201010589525 A CN 201010589525A CN 102544245 A CN102544245 A CN 102544245A
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Abstract
An LED packaging method comprises the following steps of (1) fixing a reflecting bowl/fixing bracket on a circuit board, presetting a plurality of vent holes for a glue filling process, wherein a hollow part at which an LED chip is in direct contact with the circuit board is formed at the bottom of the reflecting bowl/fixing bracket; (2) directly loading and covering the LED chip on the hollow part of the reflecting bowl/fixing bracket, on the circuit board; (3) welding the anode and the cathode of the LED chip on the circuit board by an inner lead wire; and (4) coating a fluorescent powder layer on the surface of the LED chip, filling glue on the LED chip so as to completely cover the LED chip, the inner lead wire and the reflecting bowl/fixing bracket, or filling a mixture of fluorescent powder and glue on the LED chip so as to completely cover the LED chip, the inner lead wire and the reflecting bowl/fixing bracket. According to the method, the advantages of good thermal radiation property, simple structure and good reflecting effect can be achieved.
Description
Technical field
The present invention relates to a kind of manufacture craft of light fixture, relate in particular to a kind of manufacture craft and LED encapsulating structure of LED encapsulating structure.
Background technology
The LED encapsulation is that outer lead is connected on the electrode of led chip, so that be connected with other devices.It not only is connected the electrode on the chip on the package casing with lead accomplishes being connected of chip and external circuit, and chip is fixed and sealed, and forms electric property to safeguard chip circuit not receive the corrosion of materials such as water, air and reduces.In addition, can also the improve light extraction efficiency of led chip of encapsulation, and facilitate for the application apparatus of downstream industry and transportation.Thereby encapsulation technology plays an important role to performance and the fixing of LED.
Be 200710029336.0 in the patent No., application number is 2007-07-20, denomination of invention is in " manufacturing approach of a kind of LED ", discloses the manufacturing approach of large scale LED, it may further comprise the steps:
1) led chip is fixed on the cup bowl;
2) routing is electrically connected to two electrode pins respectively with the led chip both positive and negative polarity;
3) fully mix, go bubble and oven dry to be made into the fluorescent glue cake with packing colloid fluorescent material;
4) with 3) the fluorescent glue cake of step made melts encapsulation in batches by 2) mounted led chip of step and cup;
5) with 4) packaged LED oven dry of step.
Manufacture craft of the present invention divides two roads to walk earlier,
The one, prefabricated fluorescent glue cake; The manufacturing approach of fluorescent glue cake has two kinds: the one, earlier packing colloid is ground into powder; Become piece with the abundant extrusion of fluorescent material again, the 2nd, earlier with the packing colloid hot melt, fully mix, go to steep the back oven dry again with fluorescent material and be made into the fluorescent glue cake;
Another is fixed tightly in led chip on the cup bowl, is solid crystalline substance on the industry again, with lead the both positive and negative polarity of chip is electrically connected to two pins respectively then;
At last prefabricated fluorescent glue cake is melted and inject mould, encapsulate mounted chip and pin, dry with electric furnace again.
Above-mentioned patent is melted the injection mould through the fluorescent glue cake, substitutes existing some glue step, improves LED production efficiency thus.
Fluorescent material is one of key technology in the semiconductor lighting technology, directly the resolved performances such as brightness, color rendering index, colour temperature and luminous efficiency of fluorescent material conversion LED of its characteristic.That is to say that the kind of fluorescent material is many, make different LED kinds, the kind (such as color) of the fluorescent material that needs or combination are different, then need make different fluorescent glue cakes, have improved the complexity of manufacture craft.
In addition, led chip is fixed on the cup bowl, and fixing in the circuit board through the cup bowl again, the heat of led chip is passed to wiring board through the cup bowl, dispels the heat through wiring board again, has shortcomings such as heat dispersion is not good enough, parts complicacy.
Summary of the invention
The object of the present invention is to provide a kind of LED method for packing, to solve the technical problem of packaging technology complicacy, poor radiation in the prior art.
Another object of the present invention is to provide a kind of LED encapsulating structure, to solve the technical problem of poor radiation in the prior art LED encapsulating structure.
First kind of LED method for packing of the present invention may further comprise the steps:
(1) reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology, the hollow out place that led chip and wiring board directly contact is left in the bottom of said reverberation bowl;
(2) direct the carrying of led chip overlays on the wiring board in the hollow out place of reverberation bowl, and the angular range of reverberation bowl is 90 degree-150 degree, is of a size of 3-5 times of chip;
(3) the led chip both positive and negative polarity is received on the wiring board through lead;
(4) on the led chip surface, be coated with and be covered with phosphor powder layer; Above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps; Above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead and reverberation bowl.
Preferably, fluorescent material is coated in the led chip surface; Or fill out in the cavity of reverberation bowl and wiring board formation, and make it to cover led chip.
Preferably, do not have the solder mask of being coated with in the circuit board and the Copper Foil part is reserved with the reverberation bowl installation site earlier, those steam vents evenly are arranged on wiring board and reverberation bowl junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and reverberation bowl junction.
Preferably, use glue to be connected with wiring board, the glue curing requisite space also need be left in the bottom, and said space is flute profile or bevel.
Preferably; Said reverberation bowl is connected through mechanical closing component structure with wiring board: some shell fragments are set on wiring board/reverberation bowl; Correspondence position at reverberation bowl/wiring board is provided with corresponding groove, and reverberation bowl and wiring board come mechanical connection through said clip clamping in corresponding groove.
Preferably, said reverberation bowl through glue bonding or the welding in the circuit board, high-power LED chip reverberation bowl is used metal material, low power led chip reverberation bowl is used plastic material.
Preferably, also comprise:
On led chip, mould is set with reserving the lead part, after be coated with above that and be covered with phosphor powder layer, remove mould, lead and led chip directly weld.
The present invention provides second kind of LED method for packing, may further comprise the steps:
(1) is that the fixed support of inclination angle 90 ~ 150 degree is fixing in the circuit board with medial surface, and leaves the plurality of rows pore that is used for filler technology that the hollow out place that led chip and wiring board directly contact is left in said support bracket fastened bottom;
(2) direct the carrying of led chip overlays on the wiring board in support bracket fastened hollow out place;
(3) the led chip both positive and negative polarity is welded on the wiring board through lead;
(4) on the led chip surface, be coated with and be covered with phosphor powder layer, above led chip, fill colloid, make it to cover fully led chip, lead, perhaps, above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead.
Preferably, fixed support leans on led chip one side inner surface to apply the reflector of high reflectance.
Preferably, fluorescent material is coated in the led chip surface; Fill out or the cavity that forms of fixed support and wiring board, make it to cover led chip.
Preferably; There is not the solder mask of being coated with in the circuit board and the Copper Foil part is reserved with the fixed support installation site earlier; Those steam vents evenly are arranged on wiring board and fixed support junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and fixed support junction.
Preferably, use glue to be connected with wiring board, the glue curing requisite space also need be left in the bottom, and said space is flute profile or bevel
Preferably; Said fixed support is connected through mechanical closing component structure with said wiring board: some shell fragments are set on fixed support/wiring board; At wiring board/support bracket fastened correspondence position corresponding groove is set, fixed support and wiring board come mechanical connection through said clip clamping in corresponding groove.
Preferably; Said fixed support is made through following steps and is fixed in the circuit board: wiring board is placed in the plastic mold cavity; Moulding on the plate of support direct-on-line road, the face temperature should not be higher than the heat-resisting scope of wiring board, so-called support and wiring board matched coefficients of thermal expansion.
Preferably, on led chip, mould is set with reserving the lead part, after be coated with above that and be covered with phosphor powder layer, remove mould, lead welds with led chip.
The present invention also discloses the third LED method for packing, may further comprise the steps:
(1) reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology;
(2) led chip directly carries and overlays on the reverberation bowl, and the angular range of reverberation bowl is 90 degree-150 degree, is of a size of 3-5 times of chip;
(3) the led chip both positive and negative polarity is received on the wiring board through the outer rim that lead strides across reverberation bowl;
(4) on the led chip surface, be coated with and be covered with phosphor powder layer; Above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps; Above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead and reverberation bowl.
The invention discloses a kind of LED encapsulating structure, comprise reverberation bowl, wiring board, led chip, filling colloid, reverberation bowl is fixing in the circuit board; And leave the plurality of rows pore that is used for filler technology; The hollow out place that led chip and wiring board directly contact is left in the bottom of said reverberation bowl, and led chip directly carries and overlays on the wiring board in the hollow out place of reverberation bowl, and the led chip both positive and negative polarity is welded on the wiring board through lead; On the led chip surface, phosphor powder layer is set; Above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps; Fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
Preferably, those steam vents evenly are arranged on wiring board and reverberation bowl junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and reverberation bowl junction.
Preferably, add a cover the lens module up, add radiator in the bottom.
Preferably, add a cover the lens module up, add radiator in the bottom.
The present invention also discloses second kind of LED encapsulating structure; Comprise fixed support, wiring board, led chip, filling colloid; Fixed support is fixing in the circuit board, and leaves the plurality of rows pore that is used for filler technology, and the hollow out place that led chip and wiring board directly contact is left in said support bracket fastened bottom; Led chip directly carries and overlays on the wiring board in support bracket fastened hollow out place; The led chip both positive and negative polarity is welded on the wiring board through lead; On the led chip surface, be coated with and be covered with phosphor powder layer, above led chip, fill colloid, make it to cover fully led chip, lead, perhaps, above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead.
Preferably, those steam vents evenly are arranged on wiring board and fixed support junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and fixed support junction.
Preferably, add a cover the lens module up, add radiator in the bottom.
A kind of LED encapsulating structure comprises reverberation bowl, wiring board, led chip, filling colloid, and reverberation bowl is fixing in the circuit board; And leaving the plurality of rows pore that is used for filler technology, led chip directly carries and overlays on the wiring board, and the led chip both positive and negative polarity is received on the wiring board through the outer rim that lead strides across reverberation bowl; On the led chip surface, phosphor powder layer is set; Above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps; Fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
Existing LED encapsulation; Often led chip is fixed on support heat sink, is packaged into the LED particle, the LED particle is welded on wiring board; Be installed on the radiator again; Form product, become industry technology prejudice, and the frame mode of this LED fluorescent lamp exists shortcomings such as heat dispersion is not good enough, parts complicacy.The applicant is in LED throw light on proprietary field and application scenario; Overcome existing technological prejudice; Proposed a kind of new LED encapsulating structure, led chip is directly carried overlayed on the wiring board, and solved led chip and carry and overlay on the heat dissipation problem in the encapsulation process on the wiring board.And in addition, the present invention is coated with on the led chip surface and is covered with phosphor powder layer, above led chip, fills colloid, makes it to cover fully led chip.
In addition, the present invention will be coated with phosphor powder layer on the led chip surface, promptly can be coated with fluorescent material in the place of led chip except that the bottom surface, by the way, can make the light of LED reach more preferably reflecting effect.Show that through experiment the reflecting effect of filling fluorescent material and colloid admixture compared with the led chip top is better.
And, in the circuit board, and leaving the plurality of rows pore that is used for filler technology, this mode has promoted the thermal diffusivity in the encapsulation process.
Also have, those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and reverberation bowl junction.Be arranged so that the thermal diffusivity that reaches fabulous like this, and simple in structure.
Have again; Said reverberation bowl is connected through mechanical closing component structure with wiring board: some shell fragments are set on wiring board/reverberation bowl; Correspondence position at reverberation bowl/wiring board is provided with corresponding groove, and reverberation bowl and wiring board come mechanical connection through said clip clamping in corresponding groove.This structural design, reverberation bowl and wiring board can reach reasonable disassembling function, make things convenient for the maintenance in later stage, have also promoted the utilance of later stage led chip simultaneously.
Figure of description
Fig. 1 is the topology example figure of a kind of LED encapsulating structure of the present invention;
Fig. 2 is a LED encapsulation gumming position view;
Fig. 3 is that led chip is connected sketch map with wiring board through mechanical structure;
Fig. 4 is the topology example figure of another kind of LED encapsulating structure of the present invention.
Embodiment
Below in conjunction with accompanying drawing, specify the present invention.
See also Fig. 1, it is a kind of structure of LED encapsulation, comprising: led chip 401, lead 402 is filled colloid 403, wiring board 404, reverberation bowl 405.
For reasonable radiating effect, wiring board 404 can adopt the material of high thermal conductivity, like metal material or pottery etc.Wiring board 404 mounts the position with led chip 401 can also be plane, square groove, rectangular recess, circular groove etc.And for fixed L ED chip, wiring board 404 can have elargol, golden tin through point, perhaps insulating heat-conductive glue, perhaps welding material connection led chip 401.And, can install reverberation bowl additional in the position of wiring board 404 fixed L ED chips 401, improve light extraction efficiency.In order to guarantee that the shape of filling colloid 403 also can adopt molding technology.Can behind fixed chip, inject fluorescent material simultaneously
(Be coated in the led chip surface; Or fill out at support (or reverberation bowl) and the cavity that wiring board forms, make it to cover led chip
), also can in primer, sneak into fluorescent material.The angular range of reverberation bowl is 90 degree-150 degree; The 3-5 that is of a size of chip doubly; The light that this design is sent led chip can be directional light or has the light of certain diffusion angle, forms the optimal effectiveness of emergent light, satisfies the encapsulation requirement of LED; Reach light emission rate preferably, the light flux values after the encapsulation is better.
From the above, led chip can directly encapsulate in the circuit board, and the heat of led chip is directly transferred to wiring board and radiator, does not pass through the LED packaging heat sink, and LED is heat sink and the air dielectric of wiring board, has promoted radiating effect greatly.
Adopt reverberation bowl, the process implementing of making for example down.
A kind of manufacture craft of LED encapsulating structure, form by following steps:
1. can be that plastics are processed with the fixing reverberation bowl in the circuit board of reverberation bowl, also can be that frosting applies the high-reflectivity metal layer again, also can process by metal, and the light that makes it can reflection led chip as much as possible to send gets final product.Concrete mode can have 1.1 and 1.2 two kind, carries out one of them and gets final product.The hollow out place that led chip and wiring board directly contact is left in the bottom of reverberation bowl.That is to say that the bottom of reverberation bowl can be empty, also can be that part is sky, and this vacancy is the hollow out place.General high-power LED adopts metal bowl,, low power LED adopts plastic bowl.
1.1 glue bonding reverberation bowl.The reverberation bowl structure of the method is: the one side that combines with wiring board is the plane, is beneficial to better bonding; And leave the steam vent of follow-up filler technology; And owing to use glue to be connected with wiring board, the glue curing requisite space also need be left in the bottom, can be groove 407, also can be certain oblique angle 408.Like Fig. 2.Need on the wiring board to consider the reliability of bonding leaving the reverberation bowl installation site in the design in advance, best mode is not have the solder mask of covering and Copper Foil here.The fixation reflex bowl is accomplished by manual work or automatic equipment, with reference to the predefined benchmark that is labeled as on the wiring board when wiring board.(this mark pattern is not limit, and can be a simple MARK point, can be boring yet, can also be typographic(al) mark on the wiring board).Used glue need guarantee that (220 degrees centigrade is that technology removes to accomplish the fixing of chip because follow-up wiring board needs hypereutectic weldering etc. for stability under 220.This needs the original performance of glue to guarantee) so that follow-up technological process, and can guarantee bonding reliability for a long time.The curing mode of glue can be air dry, also can be the oven dry of heating, and can also add drying up the pathogenic dryness body.
1.2 mechanical sealed fixation reflex bowl.The method needs to leave fixed hole position in the circuit board in advance, can be a reverberation bowl one hole, also can be a reverberation bowl porous.
The structure of reverberation bowl need have closing component structure in the bottom that combines with wiring board, and this structure is to grow shell fragment 11 in the reverberation bowl bottom, and guarantees can form sealed power with the groove 12 on the wiring board after the installation; And leave the steam vent of follow-up filler technology.That is, some shell fragments 11 are set on wiring board/reverberation bowl, at the correspondence position of reverberation bowl/wiring board corresponding groove 12 (or being referred to as boring) are set, reverberation bowl and wiring board come machinery to removably connect through said clip clamping in corresponding groove.Like Fig. 3.The fixation reflex bowl is accomplished by manual work or automatic equipment, with reference to the predefined benchmark that is labeled as on the wiring board when wiring board.
1.3 special, when the wiring board material is metal material, can on 1.1 or 1.2 basis, use welding procedure to fix reverberation bowl.
2. led chip is carried and overlay on the wiring board, be positioned at the cavity of reverberation bowl, and baking is fixing; Step 2 is characterised in that chip directly fixing in the circuit board, rather than other heat sink supports.This step can adopt elargol technology, eutectic technology, cover brilliant technology or other technology, only needs and can led chip 402 be fixed on the technology on the substrate.
2.1 that eutectic technology is meant is gold-plated on led chip, tin, gold-tin alloy; Gold-plated or silver-colored on the substrate weld layer, heated substrates makes the gold, silver element be penetrated in the gold-tin alloy to eutectic temperature; The formation alloy-layer solidifies, thereby led chip is welded on the substrate.
2.2 cover brilliant technology and be the led chip upside-down mounting on substrate, use ultrasonic wave that led chip is fixed on the substrate.
3. the led chip both positive and negative polarity is welded on the wiring board through lead.Said lead is generally gold thread, and single electrode can weld one, and is perhaps two, perhaps more.For the chip of vertical stratification, electrode can be directly and the anodal or negative pole circuit welding conducting on the wiring board, and an other utmost point is derived by lead.
4. apply fluorescent material at chip surface, make it evenly cover each surface except that the bottom surface of led chip.Make the optical excitation fluorescent material that led chip sends, be mixed into the light of required colour temperature and color.On led chip, mould is set with reserving the lead part, after be coated with above that and be covered with phosphor powder layer, remove mould, lead welds with led chip, this processing mode has better welding effect.
5. the filling colloid is put above led chip, covers led chip and lead-in wire thereof fully, and reverberation bowl, and it is under the sealing state.When filling, can slowly insert from the led chip top, so that between reverberation bowl and led chip, do not leave air.Special, filling together after also can fluorescent material and glue being mixed, as this mode of employing, but skips steps 4 then.The shape on filler surface can have 5.1 and 5.2 dual modes, carries out one of them and gets final product.
5.1 the colloid shape of filler technology is formed by the surface tension of colloid self, is left intact its free forming under action of gravity of leaving after that is to say a glue.
5.2 adopt the molding moulding.
More than disclosedly be merely a kind of realization example, in fact, led chip directly carries and overlays on reverberation bowl and also be fine.
A kind of LED method for packing may further comprise the steps:
(1) reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology;
(2) led chip directly carries and overlays on the reverberation bowl, and the angular range of reverberation bowl is 90 degree-150 degree, is of a size of 3-5 times of chip;
(3) the led chip both positive and negative polarity is received on the wiring board through lead, lead is connected on the wiring board through the outer rim of reverberation bowl;
(4) on the led chip surface, be coated with and be covered with phosphor powder layer; Above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps; Above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead and reverberation bowl.
See also its structure for another kind of LED encapsulation of Fig. 4, comprising: led chip 401, lead 402 is filled colloid 403, wiring board 404, fixed support 406.The medial surface of fixed support 406 can be inclination angle 90 ~ 150 degree, and the design of this angle makes reflecting effect than preferable.
The step that adopts fixed support to encapsulate is following:
1. can be that plastics and metal are processed with the fixing fixed support in the circuit board of fixed support; Lean on the led chip one side inner surface can extra again coating high-reflectivity metal layer; Also can be coated with. cover other materials reflector system, purpose is that the light that can reflection led chip as much as possible sends gets final product.Concrete mode can have 1.1,1.2 and 1.3 3 kind, carries out one of them and gets final product.
1.1 glue bonding fixed support.The fixing rack structure of the method is: the one side that combines with wiring board is the plane, is beneficial to better bonding; And leave the steam vent of follow-up filler technology; And owing to use glue to be connected with wiring board, the glue curing requisite space also need be left in the bottom, can be groove, also can be certain oblique angle.Need on the wiring board to consider the reliability of bonding leaving the fixed support installation site in the design in advance, best mode is not have the solder mask of covering and Copper Foil here.Mounting and fixing bracket is accomplished by manual work or automatic equipment, with reference to the predefined benchmark that is labeled as on the wiring board when wiring board.Used glue need guarantee the stability under 220 degrees centigrade, so that follow-up technological process, and can guarantee bonding reliability for a long time.The curing mode of glue can be air dry, also can be the oven dry of heating, and can also add drying up the pathogenic dryness body.
1.2 mechanical sealed mounting and fixing bracket.The method needs to leave fixed hole position in the circuit board in advance, and support is fixed on the position, hole.Support bracket fastened structure need have closing component structure in the bottom that combines with wiring board, and this structure is to grow shell fragment or other locking mechanisms in the fixed support bottom, and guarantees after installation, can form sealed power with wiring board; And leave the steam vent 14 of follow-up filler technology.Mounting and fixing bracket is accomplished by manual work or automatic equipment, with reference to the predefined benchmark that is labeled as on the wiring board when wiring board.
The support material is plastics 1.3 many injection mouldings are installed, and then 1.2 methods also are applicable to injection molding way repeatedly fixed support is installed on the wiring board.Within the tolerance range of the melt temperature online road plate when in the selection of timbering material, need considering injection moulding, and take into account the matching of support and wiring board thermal coefficient of expansion.That is to say wiring board is placed in the plastic mold cavity moulding on the plate of support direct-on-line road.The face temperature should not be higher than the heat-resisting scope of wiring board, the situation of concrete numerical value sight path plate and deciding.So-called support and wiring board matched coefficients of thermal expansion are appreciated that to be that two parameters numerically are on the one magnitude.
2. led chip is carried and overlay on the wiring board, be positioned at special support bracket fastened cavity, and baking is fixing; Step 2 is characterised in that chip directly fixing in the circuit board, rather than other heat sink supports.This step can adopt elargol technology, eutectic technology, cover brilliant technology or other technology, only needs and can led chip 402 be fixed on the technology on the substrate.
2.1 eutectic technology is meant gold-plated or tin or gold-tin alloy on led chip; Gold-plated or silver-colored on the substrate weld layer, heated substrates makes gold or silver element be penetrated in the gold-tin alloy to eutectic temperature; The formation alloy-layer solidifies, thereby led chip is welded on the substrate.
2.2 cover brilliant technology and be the led chip upside-down mounting on substrate, use ultrasonic wave that led chip is fixed on the substrate.
3. the led chip both positive and negative polarity is welded on the wiring board through lead.Said lead is generally gold thread, and single electrode can weld one, and is perhaps two, perhaps more.For the chip of vertical stratification, electrode can be directly and the anodal or negative pole circuit welding conducting on the wiring board, and an other utmost point is derived by lead.
4. apply fluorescent material at chip surface, make it evenly cover each surface except that ground of led chip.Make the optical excitation fluorescent material that led chip sends, be mixed into the light of required colour temperature and color.On led chip, mould is set with reserving the lead part, after be coated with above that and be covered with phosphor powder layer, remove mould, lead welds with led chip.
5. the filling colloid is put above led chip, fills the space that full fixed support and wiring board surround, and covers led chip and lead-in wire thereof fully, and it is under the sealing state.Should slowly fill in order to avoid in fixed support and led chip, leave air during filler.Special, filling together after also can fluorescent material and glue being mixed, as this mode of employing, but skips steps 4 then.
The colloid shape of filler technology is formed by the surface tension of colloid self, or adopts the molding moulding.
A kind of LED encapsulating structure is provided here again, comprises reverberation bowl, wiring board, led chip, filling colloid, reverberation bowl is fixing in the circuit board; And leaving the plurality of rows pore that is used for filler technology, led chip directly carries and overlays on the wiring board, and the led chip both positive and negative polarity is received on the wiring board through the outer rim that lead strides across reverberation bowl; On the led chip surface, phosphor powder layer is set; Above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps; Fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
More than the disclosed several specific embodiments that are merely the application, but the application is not limited thereto, any those skilled in the art can think variation, all should drop in the application's the protection range.
Claims (24)
1. a LED method for packing is characterized in that, may further comprise the steps:
(1) reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology, the hollow out place that led chip and wiring board directly contact is left in the bottom of said reverberation bowl;
(2) direct the carrying of led chip overlays on the wiring board in the hollow out place of reverberation bowl, and the angular range of reverberation bowl is 90 degree-150 degree, is of a size of 3-5 times of chip;
(3) the led chip both positive and negative polarity is received on the wiring board through lead;
(4) on the led chip surface, be coated with and be covered with phosphor powder layer; Above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps; Above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead and reverberation bowl.
2. LED method for packing as claimed in claim 1 is characterized in that fluorescent material is coated in the led chip surface; Or fill out in the cavity of reverberation bowl and wiring board formation, and make it to cover led chip.
3. LED method for packing as claimed in claim 1; It is characterized in that; There is not the solder mask of being coated with in the circuit board and the Copper Foil part is reserved with the reverberation bowl installation site earlier; Those steam vents evenly are arranged on wiring board and reverberation bowl junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and reverberation bowl junction.
4. LED method for packing as claimed in claim 1 is characterized in that, uses glue to be connected with wiring board, and the glue curing requisite space also need be left in the bottom, and said space is flute profile or bevel.
5. LED method for packing as claimed in claim 1; It is characterized in that; Said reverberation bowl is connected through mechanical closing component structure with wiring board: some shell fragments are set on wiring board/reverberation bowl; Correspondence position at reverberation bowl/wiring board is provided with corresponding groove, and reverberation bowl and wiring board come mechanical connection through said clip clamping in corresponding groove.
6. LED method for packing as claimed in claim 1 is characterized in that, said reverberation bowl through glue bonding or the welding in the circuit board, high-power LED chip reverberation bowl is used metal material, low power led chip reverberation bowl is used plastic material.
7. LED method for packing as claimed in claim 1 is characterized in that, also comprises:
On led chip, mould is set with reserving the lead part, after be coated with above that and be covered with phosphor powder layer, remove mould, lead and led chip directly weld.
8. a LED method for packing is characterized in that, may further comprise the steps:
(1) is that the fixed support of inclination angle 90 ~ 150 degree is fixing in the circuit board with medial surface, and leaves the plurality of rows pore that is used for filler technology that the hollow out place that led chip and wiring board directly contact is left in said support bracket fastened bottom;
(2) direct the carrying of led chip overlays on the wiring board in support bracket fastened hollow out place;
(3) the led chip both positive and negative polarity is welded on the wiring board through lead;
(4) on the led chip surface, be coated with and be covered with phosphor powder layer, above led chip, fill colloid, make it to cover fully led chip, lead, perhaps, above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead.
9. method as claimed in claim 8 is characterized in that, fixed support leans on led chip one side inner surface to apply the reflector of high reflectance.
10. method as claimed in claim 8 is characterized in that fluorescent material is coated in the led chip surface; Fill out or the cavity that forms of fixed support and wiring board, make it to cover led chip.
11. method as claimed in claim 8; It is characterized in that; There is not the solder mask of being coated with in the circuit board and the Copper Foil part is reserved with the fixed support installation site earlier; Those steam vents evenly are arranged on wiring board and fixed support junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and fixed support junction.
12. LED method for packing as claimed in claim 8 is characterized in that, uses glue to be connected with wiring board, the glue curing requisite space also need be left in the bottom, and said space is flute profile or bevel.
13. LED method for packing as claimed in claim 8; It is characterized in that; Said fixed support is connected through mechanical closing component structure with said wiring board: some shell fragments are set on fixed support/wiring board; At wiring board/support bracket fastened correspondence position corresponding groove is set, fixed support and wiring board come mechanical connection through said clip clamping in corresponding groove.
14. LED method for packing as claimed in claim 8 is characterized in that, said fixed support is made through following steps and is fixed in the circuit board:
Wiring board is placed in the plastic mold cavity, moulding on the plate of support direct-on-line road, the face temperature should not be higher than the heat-resisting scope of wiring board, so-called support and wiring board matched coefficients of thermal expansion.
15. method as claimed in claim 8 is characterized in that, on led chip, with reserving the lead part mould is set, after be coated with above that and be covered with phosphor powder layer, remove mould, lead welds with led chip.
16. a LED method for packing is characterized in that, may further comprise the steps:
(1) reverberation bowl is fixing in the circuit board, and leave the plurality of rows pore that is used for filler technology;
(2) led chip directly carries and overlays on the reverberation bowl, and the angular range of reverberation bowl is 90 degree-150 degree, is of a size of 3-5 times of chip;
(3) the led chip both positive and negative polarity is received on the wiring board through the outer rim that lead strides across reverberation bowl;
(4) on the led chip surface, be coated with and be covered with phosphor powder layer; Above led chip, fill colloid, make it to cover fully led chip, lead and reverberation bowl, perhaps; Above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead and reverberation bowl.
17. a LED encapsulating structure is characterized in that, comprises reverberation bowl, wiring board, led chip, filling colloid; Reverberation bowl is fixing in the circuit board, and leaves the plurality of rows pore that is used for filler technology, and the hollow out place that led chip and wiring board directly contact is left in the bottom of said reverberation bowl; Led chip directly carries and overlays on the wiring board in the hollow out place of reverberation bowl; The led chip both positive and negative polarity is welded on the wiring board through lead, on the led chip surface, phosphor powder layer is set, and above led chip, fills colloid; Make it to cover fully led chip, lead and reverberation bowl; Perhaps, fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
18. LED encapsulating structure as claimed in claim 17 is characterized in that, those steam vents evenly are arranged on wiring board and reverberation bowl junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and reverberation bowl junction.
19. LED encapsulating structure as claimed in claim 17 is characterized in that, adds a cover the lens module up, adds radiator in the bottom.
20. LED encapsulating structure as claimed in claim 17 is characterized in that, adds a cover the lens module up, adds radiator in the bottom.
21. LED encapsulating structure; Comprise fixed support, wiring board, led chip, filling colloid; Fixed support is fixing in the circuit board, and leaves the plurality of rows pore that is used for filler technology, and the hollow out place that led chip and wiring board directly contact is left in said support bracket fastened bottom; Led chip directly carries and overlays on the wiring board in support bracket fastened hollow out place; The led chip both positive and negative polarity is welded on the wiring board through lead; On the led chip surface, be coated with and be covered with phosphor powder layer, above led chip, fill colloid, make it to cover fully led chip, lead, perhaps, above led chip, fill fluorescent material and colloid admixture, make it to cover fully led chip, lead.
22. LED encapsulating structure as claimed in claim 21 is characterized in that, those steam vents evenly are arranged on wiring board and fixed support junction, and those steam vents are glue groove or the glue inclined-plane that is arranged on wiring board and fixed support junction.
23. LED encapsulating structure as claimed in claim 21 is characterized in that, adds a cover the lens module up, adds radiator in the bottom.
24. a LED encapsulating structure is characterized in that, comprises reverberation bowl, wiring board, led chip, filling colloid; Reverberation bowl is fixing in the circuit board, and leaves the plurality of rows pore that is used for filler technology, and led chip directly carries and overlays on the wiring board; The led chip both positive and negative polarity is received on the wiring board through the outer rim that lead strides across reverberation bowl, on the led chip surface, phosphor powder layer is set, above led chip, fill colloid; Make it to cover fully led chip, lead and reverberation bowl; Perhaps, fluorescent material and colloid admixture are set above led chip, make it to cover fully led chip, lead and reverberation bowl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105895255A CN102544245A (en) | 2010-12-15 | 2010-12-15 | LED packaging method and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105895255A CN102544245A (en) | 2010-12-15 | 2010-12-15 | LED packaging method and structure |
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| Publication Number | Publication Date |
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| CN102544245A true CN102544245A (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105895255A Pending CN102544245A (en) | 2010-12-15 | 2010-12-15 | LED packaging method and structure |
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| CN (1) | CN102544245A (en) |
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| CN104566254A (en) * | 2015-01-29 | 2015-04-29 | 佛山市三目照明电器有限公司 | Production method for installing light-transmitting cover on LED lamp |
| CN108023000A (en) * | 2016-11-04 | 2018-05-11 | 普因特工程有限公司 | Optical device substrate, optical device substrate manufacture method and optics |
| CN108023007A (en) * | 2017-11-09 | 2018-05-11 | 江苏稳润光电科技有限公司 | A kind of Lamp white lights and its packaged type |
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Application publication date: 20120704 |