CN208460801U - A kind of luminescent device - Google Patents
A kind of luminescent device Download PDFInfo
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- CN208460801U CN208460801U CN201821270817.0U CN201821270817U CN208460801U CN 208460801 U CN208460801 U CN 208460801U CN 201821270817 U CN201821270817 U CN 201821270817U CN 208460801 U CN208460801 U CN 208460801U
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- sidelight
- reflector
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Abstract
This application involves a kind of luminescent device, luminescent device includes: substrate；Multiple light emitting regions on the substrate are set；At least one LED chip on each light emitting region is set；It is arranged in correspondence with the light transmission plastic structure on LED chip；The multiple reflectors being disposed on the substrate；The sidelight truncation ring for being used to absorb sidelight on multiple reflectors is set, and the sidelight truncation ring includes multiple optical channels out, and multiple optical channels out are correspondingly arranged with multiple reflectors.The structure of the luminescent device of the utility model is simple, light, light extraction efficiency out small in size, can independently realizing small beam angle are high and uniform in light emission, prepares convenient and cost is relatively low.
Description
Technical field
The utility model relates to technical field of electronic products more particularly to a kind of luminescent devices.
Background technique
In the prior art, LED chip is packaged into LED encapsulation, to ensure being electrically connected between LED chip and substrate,
And protect LED chip from the damage of external attack (such as mechanical shock, heat or moisture).In addition, as lighting apparatus,
LED encapsulation needs to meet certain requirement, to improve luminous efficiency, realizes specific optical profile, and export visible light.
COB is a kind of LED encapsulation technology.In traditional COB LED encapsulation, multiple LED chips arrange to be formed it is round or
Square arrangement.LED chip is directly anchored on substrate, and substrate usually has good thermal conductivity, and each other by gold thread
Connection.Then, these LED chips are connected to power supply with cathode liner by the anode liner on substrate.In order to manufacture white COB
LED coats the sealant (for example, resin, epoxy resin) mixed with fluorophor and forms shining for LED to cover LED chip
Surface.White dam is pre-formed to limit the area of light-emitting area and prevent sealant from overflowing before curing.As can be seen that due to
LED chip is directly integrated on the substrate with high thermal conductivity, therefore COB LED encapsulation usually has good thermal diffusivity
Energy.Along with simple circuit design light extraction efficiency, COB LED encapsulation is becoming increasingly popular, especially in spotlight, floodlight
In the application of flash lamp.
However, the shortcomings that traditional COB LED is packaged with its own.Firstly, traditional COB LED encapsulation is without internal anti-
Penetrate structure (such as reflector).In this way, being propagated in all directions by the light of the LED chip excitation in sealant, light extraction
Efficiency is poor.In addition, some light are reflected in sealant and quilt due to the total reflection in sealant and the interface of air
LED chip absorbs, to further reduced the light extraction efficiency of COB LED encapsulation.
Secondly, in order to manufacture the lighting device based on COB LED, it is often necessary to additional optical component, for example, lens,
Reflecting mirror etc. focuses the beam angle of output light.Because COB LED encapsulation includes multiple LED chips, light-emitting area
It is larger, therefore, in order to effectively focus the light output from LED chip, reach required beam angle, for focusing output light
Optical component be typically larger than the volume that COB LED encapsulates itself, cause the volume of entire lighting device larger.
In the related technology, there are the various solutions for solving the above problems.For example, a solution is to increase
The density of LED chip on COB substrate, to reduce the size of light-emitting area.But this solution adds substrates
The current density in chip bonding region can generate amount of heat and be unable to rapid cooling, therefore, may cause the reliable of product
The reduction of property.
The patent that Chinese Patent Application No. is 201310714412.7 proposes another solution, and it discloses be used for
The silicon lens of COB LED encapsulation, silicone lenses disclosed in the patent have and multiple have from inboard to what outside was sequentially arranged
Machine silicon layer, wherein the refractive index for the silicone layer being located on outer layer is less than or equal to the refractive index of silicon.The structure of resin lens is multiple
Polygamy not only increases the complexity of manufacturing process, and increases final products cost.In addition, for the LED core of COB encapsulation
For chip arrays, silicone lenses are extracting light when ratio from centrally located LED from the LED chip for being located at array periphery region
The low efficiency of chip extraction light.Therefore, the ability for improving the light extraction efficiency of COB LED encapsulation is limited.
The patent that Chinese Patent Application No. is 103474564 proposes another solution, and which disclose one kind
It is laid with white oil layer on line layer, white oil layer is then covered using flexible reflective film, the method to form reflector is each reflective
Cup includes individual LED chip.But as disclosed in the patent, the depth of these reflectors is no more than 0.4mm.As general
When fluid sealant is assigned in reflector, due to capillarity, sealant will be overflowed from reflector, therefore be reduced yield and damaged
The photochromic uniformity in COB LED illumination device is done harm to.In addition, COB LED disclosed in the patent encapsulation light-emitting area with
The size of traditional COB LED encapsulation is identical, even more greatly.Therefore, it increases and sets COB LED encapsulation structure is incorporated to illumination
The additional difficulty and cost that the optical component of required beam angle is obtained for optically focused is provided when standby middle.
Therefore, currently, in the related art, for reaching the photograph of small beam angle (being, for example, less than 40 ° of beam angle)
Luminescent device (such as COB, lamp bead etc.) in bright device, all really can not independently issue the light beam of small beam angle, be both needed to
Auxiliary is carried out by additional optical component can be only achieved the demand of small beam angle, but for obtaining required beam angle
Optical component volume it is larger, cause the volume for the entire lighting device being made of luminescent device and optical component larger, at
This higher problem becomes technical problem urgently to be solved in the industry.
Utility model content
The utility model in view of the above technical problems, provides a kind of luminescent device, and structure is simple, can be realized small light
The light-out effect of beam angle degree, light extraction efficiency is high, small in size, and preparation process is simple, cheap.
The utility model is to provide a kind of luminescent device for solving the technical solution of the above technical problem, comprising: base
Plate；
Multiple light emitting regions on the substrate are set；
At least one LED chip on each light emitting region is set；
It is arranged in correspondence with the light transmission plastic structure on LED chip；
The multiple reflectors being disposed on the substrate；
It is arranged in for absorbing the sidelight truncation ring of sidelight on multiple reflectors, the sidelight truncation ring includes multiple
Optical channel out, multiple optical channels out are correspondingly arranged with multiple reflectors.
Optionally, multiple optical channels out are arranged in a one-to-one correspondence with multiple reflectors.
Optionally, each reflector includes the reflection cup body for reflecting cup holder and being connected with reflection cup holder；Wherein, described
Reflection cup holder is arranged on the substrate and is located between adjacent light transmission plastic structure, and the reflection cup body is connected to the reflection
Side of the cup holder far from the substrate.
Optionally, the electroplated layer for mirror-reflection is provided on the reflecting surface of the reflector.
Optionally, the sidelight truncation ring is mounted on the reflector far from the side of substrate, is truncated in the sidelight
Ring is provided with lens subassembly in the one side far from the reflector.
Optionally, it is truncated between ring and the reflector in the sidelight and is additionally provided with lens subassembly.
Optionally, the lens subassembly includes multiple lenticular bodies and the interconnecting piece between lenticular body, the interconnecting piece
It is connected between adjacent lenticular body, multiple lenticular bodies are correspondingly disposed in multiple reflectors, and interconnecting piece is arranged anti-
It penetrates at the rim of a cup of cup；The sidelight truncation ring is connected between the interconnecting piece, the lenticular body and corresponding reflector.
Optionally, the lens subassembly includes: multiple lenticular bodies and is arranged in lenticular body far from the reflector side
Load-bearing part, multiple lenticular bodies are correspondingly disposed in multiple reflectors；The load-bearing part is for being arranged sidelight truncation ring.
Optionally, the load-bearing part includes load-bearing part body, the first forming ring and the second forming ring；
The load-bearing part body includes several light holes, and the outer peripheral edge of the load-bearing part body is arranged in first forming ring
Direction extension upper and towards the load-bearing part body far from the lenticular body；Second forming ring is by several described light holes
Hole wall be directed away from the direction of the lenticular body and extend；When sidelight truncation ring is mounted on the first forming ring, light out
Channel is accordingly set on the second forming ring.
Optionally, the sidelight truncation ring is made of light absorbent, and the light absorbent is selected from one of following material
It is or a variety of: metal material, resin, plastics.
The utility model additionally provides a kind of preparation method of luminescent device, which comprises
S100, substrate is divided into multiple light emitting regions, at least one LED chip is set in each light emitting region；
S200, light-transparent glue is set on the bottom of each LED chip and/or mold, it will be each saturating using the mold
Optical cement water is shaped to light transmission plastic structure；
High reflection glue is filled in S300, the gap between substrate and mold, and is allowed to solidification to form multiple reflections
Cup；
S400, mold is removed, the sidelight for absorbing sidelight is set on multiple reflectors, ring is truncated；
Wherein, the sidelight truncation ring packet is multiple for limiting the optical channel that goes out of light-emitting angle, multiple optical channels out
It is correspondingly arranged with multiple reflectors.
Optionally, step S400 the following steps are included:
S401, side mounted lens component of the ring far from the reflector is truncated in the sidelight.
Optionally, step S400 is further comprising the steps of:
S402, the mounted lens component at the reflector；
S403, the sidelight truncation ring is installed far from the side of the reflector in the lens subassembly.
Optionally, step S400 the following steps are included:
S404, sidelight truncation ring is prepared material and is arranged on the rim of a cup of reflector；
S405, interconnecting piece is set between multiple lenticular bodies to form lens subassembly；
S406, multiple lenticular bodies are placed in the reflector, solidify the sidelight truncation ring and prepares material to be formed
Ring is truncated in sidelight, and prepares material by solidifying the sidelight truncation ring to connect the lens subassembly and the reflector.
Optionally, step S400 the following steps are included:
S407, lens subassembly is prepared；Wherein, lens subassembly includes the multiple lens of load-bearing part and setting on the load bearing member
Body, load-bearing part include: load-bearing part body, the first forming ring and the second forming ring, and light hole, the first forming ring are arranged on load-bearing part body
It is arranged on the outer peripheral edge of load-bearing part body and extends towards load-bearing part body far from the direction of the lenticular body, second forming ring
Extended by the direction that the hole wall of several light holes is directed away from lenticular body；
S408, load-bearing part body is arranged in side of the reflector far from substrate, so that each lenticular body is accordingly set
It sets in each reflector；
S409, injection sidelight truncation ring prepares material to form sidelight between first forming ring and the second forming ring
Ring is truncated.
Optionally, multiple optical channels out are arranged in a one-to-one correspondence with multiple reflectors.
The utility model provides a kind of luminescent device, has the advantage that firstly, the luminescent device is arranged on substrate
Different light emitting regions, is arranged reflector between light emitting region, and the effect of preliminary control beam angle has been reached by reflector
Fruit, and improve the light extraction efficiency of luminescent device；Secondly, being cut to meet smaller beam angle demand by the way that sidelight will be increased
Abscission ring further enhances the directionality of light, so that luminescent device independently issues the beam angle of light beam less than 40 °, simultaneously
Guarantee uniform in light emission；Finally, the luminescent device of the utility model can also place collector lens in reflector guarantees optically focused effect
Fruit, or place even optical lens in the side of reflector and increase light-emitting uniformity.In conclusion the luminescent device has reached volume
Small, to can be realized small beam angle light-out effect, light extraction efficiency be high and the technical effect of uniform in light emission, in addition, the photophore
The structure of part is simple, preparation method is convenient and cost is relatively low.
Detailed description of the invention
Below in conjunction with accompanying drawings and embodiments, the utility model is described in further detail, in attached drawing:
Fig. 1 is the structural schematic diagram for the luminescent device that the utility model embodiment one provides；
Fig. 2 is the structural schematic diagram of the light emitting region in the utility model embodiment one；
Fig. 3 is the structural schematic diagram of the light emitting region in the utility model embodiment two；
Fig. 4 is the structural schematic diagram of the light emitting region in the utility model embodiment three；
Fig. 5 is the structural schematic diagram of the lens subassembly of the utility model embodiment four；
Fig. 6 is the structural schematic diagram of the lens subassembly of the utility model embodiment five；
Fig. 7 is the structural schematic diagram of the lens subassembly of the utility model embodiment six；
Fig. 8 is the structural schematic diagram of the luminescent device of the utility model embodiment six；
Fig. 9 is the decomposition diagram of the luminescent device of the utility model embodiment seven；
Figure 10 is the structural schematic diagram of the luminescent device of the utility model embodiment seven；
Figure 11 is the flow chart of the preparation method of the luminescent device of the utility model embodiment four；
Figure 12 is die drawing when the utility model provides the molding of light transmission plastic structure；
Figure 13 is the structural schematic diagram of the utility model upper mold；
Figure 14 is die drawing when the utility model provides reflection cup formation；
Figure 15 is the flow chart of the preparation method of the luminescent device of the utility model embodiment four；
Figure 16 is the flow chart of step S400 in the preparation method of the luminescent device of the utility model embodiment five；
Figure 17 is the flow chart of step S400 in the preparation method of the luminescent device of the utility model embodiment six；
Figure 18 is the flow chart of step S400 in the preparation method of the luminescent device of the utility model embodiment seven.
Specific embodiment
In order to enable those skilled in the art that the utility model is more clearly understood, below in conjunction with attached drawing and specifically
Embodiment does further detailed description to the utility model.
Embodiment one
As shown in Figure 1, the utility model discloses a kind of luminescent devices, comprising: substrate 100；It is arranged in the substrate 100
On multiple light emitting regions 110 (being detailed in Fig. 2)；At least one LED chip 111 on each light emitting region 110 is set；It is corresponding
The light transmission plastic structure 120 on LED chip 111 is arranged in ground；Multiple reflectors 130 on the substrate 100 are set；It is arranged multiple
For absorbing the sidelight truncation ring 140 of sidelight on the reflector 130, the sidelight truncation ring 140 includes multiple optical channels out
141, multiple optical channels 141 out are correspondingly arranged with multiple reflectors 130.Different hairs is arranged in the luminescent device on the substrate 100
Reflector 130 is arranged in light region 110 between light emitting region 110, has reached preliminary control light beam by controlling reflector 130
The effect of angle, and improve the light extraction efficiency of luminescent device；Meanwhile in order to meet smaller beam angle demand, pass through increase
Ring 140 is truncated in sidelight, further enhances the directionality of light, allows luminescent device independently to issue beam angle and be less than
40 ° of light beam, while guaranteeing uniform in light emission.Therefore, by applying this embodiment, other optics can be veritably obtained without need for
Component auxiliary can independently issue the luminescent device of the light beam of small beam angle, and the luminescent device has small in size, optically focused
Effect is good, light extraction efficiency is high and the technical effect of uniform in light emission.
Optionally, LED chip 111 can be positive cartridge chip or flip-chip.It is to be appreciated that it can also be other hairs
Optical element, such as LED lamp bead, as long as it can shine, it is not limited here.In the present embodiment, reflector 130 is high anti-
Injection water forms on the substrate 100, side and light transmission plastic structure 120 and/or LED chip of the reflector 130 close to substrate 100
111 side is connected.Wherein, light transmission plastic structure 120 can only include the original fluorescence plastic structure of LED chip 111 and/or
Transparent plastic structure can also include the single-layer or multi-layer fluorescence plastic structure being set up directly on LED chip 111 through this embodiment
And/or transparent plastic structure and the present embodiment are arranged on the original fluorescence plastic structure of LED chip 111 and/or transparent plastic structure
Single-layer or multi-layer fluorescence plastic structure and/or transparent plastic structure.Preferably, multiple optical channel 141 and multiple reflectors 130 1 out
One is correspondingly arranged, and makes to show that light is more uniform.Substrate 100 can be MCPCB substrate 100 (by aluminium, mirror aluminium or copper at), ceramics
Substrate 100, glass substrate 100, FR4 substrate 100 or BT substrate 100.
Optionally, each light transmission plastic structure 120 is covered on the top surface and side surface of corresponding LED chip 111 and makes to obtain
Light is more uniform.Light transmission plastic structure 120 does not do design in shape, so that processing technology is simple and convenient, as long as it is covered on LED
May be the shapes such as bowl-shape, trapezoidal, arc-shaped certainly on chip 111, with reach practically necessary brightness and
Range of exposures.Understand ground, light transmission plastic structure 120 can be transparent adhesive tape structure, or translucent plastic structure, as long as it can be with
Light transmission, it is not limited here, can by fluorescent glue or other be that the mixture of fluorescent material and resin is made to cover
Lid LED chip 111.This fluorescent glue can be visible fluorescence glue or IR fluorescence glue, from the LED chip of coating fluorescent glue
The wave-length coverage of 111 light issued is also from 350nm to 2000nm.
Sidelight truncation ring 140 is mounted on the side of the reflector 130 far from substrate 100, and sidelight truncation ring 140 has
Light absorbing function can be that the colors such as black, grey or white it is not limited here can be by following any material
Or their mixture is made: metal, plastics, the materials such as resin, can be in a manner of further using metal surface blackening processing
Reach better extinction effect.By the way that in such a way that sidelight is truncated and optical channel 141 is provided on ring 140, truncation reflector 130 goes out
The sidelight of light, obtains the emerging beam of the luminescent device of low-angle, and uniform in light emission, light beam it is clear-cut.
As shown in Fig. 2, the size of each light emitting region 110 can be select and set according to actual needs, in this reality
Apply in example, different light emitting regions 110 it is in the same size so that processing it is simpler.Multiple adjacent light emitting regions 110 are via leading
150 serial or parallel connection of line is to form luminescent line 160.In the present embodiment, luminescent line 160 is curve, may be straight
Line, it is not limited here.It is supplied by the electric energy of circuit control luminescent line 160, it can realize that adjustment luminescent device goes out light
The effect of brightness.Each light emitting region 110 includes at least one LED chip 111 to complete the light-emitting function of light emitting region 110.
In the present embodiment, a LED chip 111 (being detailed in Fig. 1) is provided in light emitting region 110.Due in adjacent light emitting region
Reflector 130 (being detailed in Fig. 1) is provided between 110, therefore, conducting wire 150 is simultaneously by by adjacent light transmission plastic structure 120 and reflection
Cup 130 is covered.
Different light emitting regions 110 is arranged in the luminescent device on the substrate 100, and reflection is arranged between light emitting region 110
Cup 130, preliminary beam angle can by control light emitting region 110 external diameter of a circle and 130 rim of a cup of reflector it is straight
The ratio between diameter controls, to achieve the effect that preliminary control beam angle by reflector 130, and improve luminescent device out
Light efficiency.Further, ring 140 is truncated by increasing sidelight, further enhances light by going out the selection of diameter of optical channel 141
The directionality of line meets smaller beam angle demand, at the same make uniform in light emission, light beam it is clear-cut.Wherein, luminous zone
The external diameter of a circle in domain 110 and the diameter ratio of 130 rim of a cup of reflector and the out diameter of optical channel 141 according to actual needs into
Row is selected and adjustment.Therefore, which, which does not need additional optical device i.e., can provide low-angle light beam (for example, light beam
Angle is the low-angles light beams such as 10 °, 20 °).On the one hand, it can be used directly as built-in luminescent device；On the other hand,
It can also be used directly as lighting devices such as illuminators, obtain small light without other additional optical device auxiliary
The emerging beam of beam angle degree.Therefore, by applying this embodiment, other optical components auxiliary can be veritably obtained without need for just
The luminescent device of the light beam of small beam angle can be independently issued, and the luminescent device is with small in size, spotlight effect is good, goes out light
High-efficient and uniform in light emission technical effect.
Embodiment two
As shown in figure 3, the difference of the embodiment of the present invention two and embodiment one is the structure and luminous road of reflector 130
The structure of line 160 (being detailed in Fig. 2).In the present embodiment, LED chip 111 is flip-chip, at this point it is possible to not need embodiment
Conducting wire 150 (being detailed in Fig. 2) in one is attached between flip-chip, and therefore, reflector 130 is close to the side of substrate 100
It can have gap with the side of light transmission plastic structure 120 and/or LED chip 111, meanwhile, which can also be anti-to avoid installation
Light transmission plastic structure 120 or LED chip 111 are damaged when penetrating cup 130.Differently with embodiment one, reflector 130 is not into
The structure of type on the substrate 100, before the installation on the substrate 100 of reflector 130, reflector 130 mutually divides with substrate 100
From then by being bonded or pressing etc. on the substrate 100 that reflector 130 is mounted between LED chip 111 by modes.
Preferably, the electroplated layer for mirror-reflection is provided on the reflecting surface 130a of reflector 130.In embodiment one
In, the reflecting surface of the reflector 130 of straight forming on the substrate 100 is non-specular surface structure, only to light progress diffusing reflection, and
In the present embodiment, before reflector 130 is mounted on substrate 100, reflector 130 is separated with 100 phase of substrate, rather than is directly existed
Therefore in the present embodiment, electricity can be arranged in figured reflective cup 130 on basic 100 on the reflecting surface 130a of reflector 130
Coating, electroplated layer carries out mirror-reflection to light, so that light extraction efficiency is higher.
Using the advantage of this embodiment is that, light emitting region 110 (being detailed in Fig. 2) and reflector 130 are set on the substrate 100
Preparation can carry out simultaneously, then the two is installed together, it is easy to assembly, save the preparation time of product, mention
High production efficiency；On the other hand, due to being provided with the plating for mirror-reflection on the reflecting surface 130a of reflector 130
Layer, therefore, light extraction efficiency is higher.
Embodiment three
As shown in figure 4, the difference of the embodiment of the present invention three and embodiment one is the structure of reflector 130.LED chip
111 can be positive cartridge chip, or flip-chip.Each reflector 130 includes reflection cup holder 131 and and reflector
The connected reflection cup body 132 of seat 131；Wherein, the reflection cup holder 131 is arranged on the substrate 100 and is located in adjacent LED
Between chip 111 and/or light transmission plastic structure 120, for protect conducting wire 150 (being detailed in Fig. 2) and/or LED chip 111 and/or thoroughly
Optical cement structure 120, reflection cup body 132 are connected to reflection side of the cup holder 131 far from the substrate 100.Cup body 132 will reflected
It is mounted on before reflection cup holder 131, reflection cup body 132 is separated with reflection 131 phase of cup holder, and reflection cup body 132 passes through pressing, fitting
Etc. modes be mounted on reflection cup holder 131 on.
Preferably, the electroplated layer for mirror-reflection is provided on the reflecting surface 132a of reflection cup body 132.In embodiment
In one, the reflecting surface of the reflector 130 of straight forming on the substrate 100 is non-specular surface structure, only carries out diffusing reflection to light, and
In the present embodiment, before reflection cup body 132 is mounted on substrate 100, reflection cup body 132 is separated with reflection 131 phase of cup holder, and
Be not straight forming on the substrate 100, therefore, the present embodiment can reflection cup body 132 reflecting surface 132a on be arranged plating
Layer, electroplated layer carries out mirror-reflection to light, so that light extraction efficiency is higher.
Using the advantage of this embodiment is that, by reflection cup holder 131 protect conducting wire 150 and/or LED chip 111 and/or
Light transmission plastic structure 120 avoids the damage that above structure is caused when cup body 132 are reflected in installation, meanwhile, on the substrate 100
The process and reflector of reflection cup holder 132 and light emitting region 110 (being detailed in Fig. 2) or luminescent line 160 (being detailed in Fig. 2) are set
The preparation flow of body 132 can carry out simultaneously, then be installed together the two, easy to assembly, save the system of product
The standby time, improve production efficiency；On the other hand, anti-for mirror surface due to being provided on the reflecting surface 132a of reflector 132
The electroplated layer penetrated, therefore, light extraction efficiency is higher.
Example IV
As shown in figure 5, the structure of example IV and embodiment one the difference is that, ring is truncated in sidelight in the present embodiment
It is provided with lens subassembly 200 in 140 one sides far from the reflector 130, in the present embodiment, light-transmitting component 200 includes even
Optical lens makes to show that light is more uniform.It in other embodiments, can also include collector lens, with to leaving reflector 130
Light carry out optically focused, it is not limited here.Implement the advantage of this embodiment is that, make to show that light is more uniform, and can have
Spotlight effect.
Embodiment five
As shown in fig. 6, in the present embodiment, the structure of embodiment five and example IV is the difference is that lens subassembly
200 position is additionally provided with lens subassembly 200 between sidelight truncation ring 140 and reflector 130 in the present embodiment.This implementation
Example is provided with lens subassembly 200, in the present embodiment, light-transmitting component in sidelight truncation ring 140 in the one side of reflector 130
200 include even optical lens, makes to show that light is more uniform.It in other embodiments, can also be collector lens or can be with
Including collector lens, it is not limited here.It may include multiple collector lenses when light-transmitting component 200 includes collector lens
(not shown), collector lens are arranged in correspondence in reflector 130, carry out optically focused with the light that goes out to each reflector 130, relatively
In the technical solution of example IV, collector lens is set in reflector 130 and further saves space, so that luminescent device
Volume is smaller.
Embodiment six
As shown in fig. 7, in the present embodiment, the structure of embodiment six and embodiment five is the difference is that lens subassembly
200 structure, lens subassembly 200 include multiple lenticular bodies 210 and the interconnecting piece 220 between lenticular body 210, interconnecting piece
220 are connected between adjacent lenticular body 210.
In conjunction with Fig. 7 referring to Fig. 8, multiple lenticular bodies 210 are correspondingly disposed in multiple reflectors 130, and interconnecting piece 220 is arranged
At the rim of a cup of reflector 130, sidelight truncation ring 140 be connected to interconnecting piece 220, lenticular body 210 and corresponding reflector 130 it
Between.Preferably, the shape and size of lenticular body 210 are identical as the shape and size of reflector 130.It is to be appreciated that lenticular body
210 and interconnecting piece 220 can be made of one piece by same material so that the preparation process of luminescent device it is simpler and
Assembling process is more convenient.
Implement the advantage of this embodiment is that, the luminescent device of the present embodiment has spotlight effect, and by cutting sidelight
Abscission ring 140 is clamped in the peace for making luminescent device between interconnecting piece 220, lenticular body 210 and reflector 130 corresponding with them
It is more compact to fill more convenient and volume.
Embodiment seven
As shown in figure 9, in the present embodiment, the structure of embodiment seven and embodiment five is the difference is that lens subassembly
200 structure, lens subassembly 200 include: multiple lenticular bodies 210 and lenticular body 210 are arranged in far from 130 side of reflector
Load-bearing part 230, multiple lenticular bodies 210 are correspondingly disposed in multiple reflectors 130.
As shown in Figure 10, the load-bearing part 230 is for being arranged sidelight truncation ring 140.Load-bearing part 230 includes load-bearing part body
231, the first forming ring 232 and the second forming ring 233；Load-bearing part body 231 includes several light holes 234, the first forming ring 232
It is arranged on the outer peripheral edge of the load-bearing part body 231 and extends towards load-bearing part body 231 far from the direction of lenticular body 210；Second
Forming ring 233 is extended by the direction that the hole wall of light hole 234 is directed away from lenticular body 210；When sidelight truncation ring 140 is installed
When on the first forming ring 232, optical channel 141 (being detailed in Fig. 1) is accordingly set on the second forming ring 233 out.It is understood that
Ground has gap between the second adjacent forming ring 233, for being set in second for the optical channel 141 that goes out of sidelight truncation ring 140
Outside forming ring 233.
Preferably, in the present embodiment, load-bearing part 230 and sidelight truncation ring 140 can using same material one at
Type forms, so that the preparation process of luminescent device is simpler and assembling process is more convenient.
Implement advantage of this embodiment is that, sidelight be truncated ring 140 install convenient, and by the second forming ring 233 protect
Shape and the edge for demonstrate,proving out the conduit wall of optical channel 141 are more smooth, so that each and every one going out the uniform in light emission of optical channel 141.
Embodiment six
The utility model additionally provides a kind of preparation method for preparing the luminescent device in above-described embodiment one, referring to Figure 11
It is shown, comprising the following steps:
S100, substrate is divided into multiple light emitting regions, at least one chip is set in each light emitting region；
S200, light-transparent glue is set on each LED chip, it is cementing that each light-transparent glue is shaped to light transmission using mold
Structure；
High reflection glue is filled in S300, the gap between substrate and mold, and is allowed to solidification to form multiple reflections
Cup；
S400, mold is removed, the sidelight for absorbing sidelight is set on multiple reflectors, ring is truncated；
Wherein, the sidelight truncation ring includes multiple for limiting the optical channel that goes out of light-emitting angle, and multiple light out are logical
Road is correspondingly arranged with multiple reflectors.
Wherein, as shown in figure 12, mold 700 includes upper mold 710 and lower mold 720, and lower mold 720 is for fixing base
Plate is provided on substrate and is formed by luminescent line by multiple light emitting regions of conducting wire connection.
In conjunction with Figure 12, referring to Figure 13, upper mold 710 has multiple submodules tool 711, and each submodule tool 711 has cupuliform master
Body 711a and bottom 711b.When being formed using mold 700 to light transmission plastic structure, light-transparent glue can be arranged
On the 711b of bottom, light-transparent glue can also be arranged in the top of light emitting region, it is not limited here.By on lower mold 720
Positioning column 721 pass through the location hole 712 of upper mold 710 upper mold 710 be located in 720 top of lower mold.When by upper mold
710 when being located in lower 720 top of mold, and each submodule tool 711 is placed exactly in above corresponding LED chip, so that working as upper mold
When 710 pressure, the bottom 711b of each submodule tool 711 will be shaped to light transmission glue with the corresponding light-transparent glue on LED chip
Structure.So that each light transmission plastic structure 120 is covered on the top surface of LED chip and conducting wire is partly encapsulated.It should pay attention to
, during light transmission plastic structure 120 is molding, the bottom 711b of submodule tool 711 should only contact glue without contacting LED
Chip or conducting wire avoid causing to damage to LED chip or conducting wire.
As shown in figure 14, in step 300, by after step 200, light transmission plastic structure has been molded over LED chip
On top surface.At this point, injection high reflection glue is to fill the gap between substrate 100 and upper mold 710.High reflection glue is infused
Enter into the gap between upper mold 710 and substrate 100, encapsulates the rest part of conducting wire.Because of the top table of each LED chip
The light transmission plastic structure 120 that face is formed is covered, and since submodule has the presence of 711 (being detailed in Figure 13), the high reflection of injection
Glue cannot reach above the top surface of LED chip, and therefore, reflector after molding will not stop the light output of LED chip.It is high
The wavelength of light that the wavelength of reflection glue emits according to LED chip is selected.Preferably, high reflection glue is that reflectivity is greater than
70% high reflectivity silica.
As shown in figure 15, when preparing above-described embodiment four, step S400 the following steps are included:
S401, side mounted lens component of the ring far from the reflector is truncated in the sidelight.
As shown in figure 16, when preparing above-described embodiment five, step S400 the following steps are included:
S402, the mounted lens component at the reflector；
S403, the sidelight truncation ring is installed far from the side of the reflector in the lens subassembly.
As shown in figure 17, when preparing above-described embodiment six, step S400 the following steps are included:
S404, sidelight truncation ring is prepared material and is arranged on the rim of a cup of reflector；
S405, interconnecting piece is set between multiple lenticular bodies to form lens subassembly；
S406, multiple lenticular bodies are placed in the reflector, solidify the sidelight truncation ring and prepares material to be formed
Ring is truncated in sidelight, and prepares material by solidifying the sidelight truncation ring to connect the lens subassembly and the reflector.
As shown in figure 18, when preparing above-described embodiment seven, in step S400 the following steps are included:
S407, lens subassembly is prepared；Wherein, lens subassembly includes the multiple lens of load-bearing part and setting on the load bearing member
Body, load-bearing part include: load-bearing part body, the first forming ring and the second forming ring, and light hole, the first forming ring are arranged on load-bearing part body
It is arranged on the outer peripheral edge of load-bearing part body and extends towards load-bearing part body far from the direction of the lenticular body, second forming ring
Extended by the direction that the hole wall of several light holes is directed away from lenticular body；
Preferably, in the present embodiment, load-bearing part and multiple lenticular bodies are integrally formed by mold using same material
It forms.
S408, load-bearing part body is arranged in side of the reflector far from substrate, so that each lenticular body is accordingly set
It sets in each reflector；
S409, injection sidelight truncation ring prepares material to form sidelight between first forming ring and the second forming ring
Ring is truncated.
It is to be appreciated that having gap between the second adjacent forming ring, pass through for preparing material for sidelight truncation ring
Capillarity flows between the second adjacent forming ring to form sidelight truncation ring.
In conclusion the preparation method is convenient and cost is relatively low, the structure of the prepared luminescent device come out is simple, volume
Small, to can be realized small beam angle light out, light extraction efficiency height and uniform in light emission.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations all should belong to the protection scope of the appended claims for the utility model.
Claims (10)
1. a kind of luminescent device characterized by comprising
Substrate (100)；
The multiple light emitting regions (110) being arranged on the substrate (100)；
At least one LED chip (111) being arranged on each light emitting region (110)；
It is arranged in correspondence with the light transmission plastic structure (120) on LED chip (111)；
The multiple reflectors (130) being arranged on substrate (100)；
Sidelight truncation ring (140) for absorbing sidelight is set on multiple reflectors (130), and ring is truncated in the sidelight
(140) include it is multiple go out optical channel (141), it is multiple it is described go out optical channel (141) are corresponding with multiple reflector (130) sets
It sets.
2. luminescent device according to claim 1, which is characterized in that it is multiple it is described go out optical channel (141) with it is multiple described
Reflector (130) is arranged in a one-to-one correspondence.
3. luminescent device according to claim 1, which is characterized in that each reflector (130) includes reflection cup holder
(131) and with reflection cup holder (131) the reflection cup body (132) being connected；Wherein, the substrate is arranged in the reflection cup holder (131)
(100) on and it is located between adjacent light transmission plastic structure (120), the reflection cup body (132) is connected to the reflection cup holder
(131) far from the side of the substrate (100).
4. luminescent device according to claim 1, which is characterized in that on the reflecting surface (130a) of the reflector (130)
It is provided with the electroplated layer for mirror-reflection.
5. luminescent device according to claim 1, which is characterized in that sidelight truncation ring (140) is mounted on described anti-
Cup (130) are penetrated far from the one side on the side of substrate (100), in sidelight truncation ring (140) separate the reflector (130)
On be provided with light-transmitting component (200).
6. luminescent device according to claim 1, which is characterized in that in sidelight truncation ring (140) and the reflection
Light-transmitting component (200) are additionally provided between cup (130).
7. luminescent device according to claim 6, which is characterized in that the light-transmitting component (200) includes multiple lenticular bodies
(210) interconnecting piece (220) and between lenticular body (210), the interconnecting piece (220) are connected to adjacent lenticular body
(210) between, multiple lenticular bodies (210) are correspondingly disposed in multiple reflectors (130), and interconnecting piece (220) setting exists
At the rim of a cup of reflector (130)；Sidelight truncation ring (140) is connected to the interconnecting piece (220), the lenticular body (210)
Between corresponding reflector (130).
8. luminescent device according to claim 6, which is characterized in that the light-transmitting component (200) includes: multiple lenticular bodies
(210) and it is arranged in lenticular body (210) far from the load-bearing part (230) on the reflector (130) side, multiple lenticular bodies
(210) it is correspondingly disposed in multiple reflectors (130)；The load-bearing part (230) is for being arranged sidelight truncation ring
(140)。
9. luminescent device according to claim 8, which is characterized in that the load-bearing part (230) includes load-bearing part body
(231), the first forming ring (232) and the second forming ring (233)；
The load-bearing part body (231) includes several light holes (234), and first forming ring (232) is arranged in the carrying
Extend on the outer peripheral edge of part body (231) and towards the load-bearing part body (231) far from the direction of the lenticular body (210)；It is described
Second forming ring (233) is extended by the direction that the hole wall of several light holes (234) is directed away from the lenticular body (210)
It forms；When sidelight truncation ring (140) is mounted on the first forming ring (232), optical channel (141) is accordingly set in second out
On forming ring (233).
10. luminescent device according to claim 1, which is characterized in that sidelight truncation ring (140) is by light absorbent system
At the light absorbent is selected from one of following material or a variety of: metal material, resin, plastics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821270817.0U CN208460801U (en) | 2018-08-08 | 2018-08-08 | A kind of luminescent device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821270817.0U CN208460801U (en) | 2018-08-08 | 2018-08-08 | A kind of luminescent device |
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| Publication Number | Publication Date |
|---|---|
| CN208460801U true CN208460801U (en) | 2019-02-01 |
Family
ID=65180497
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110703497A (en) * | 2019-10-09 | 2020-01-17 | 深圳市隆利科技股份有限公司 | Backlight device of surface light source and display apparatus |
| CN110828642A (en) * | 2018-08-08 | 2020-02-21 | 瑞识科技（深圳）有限公司 | Light-emitting device and preparation method thereof |
-
2018
- 2018-08-08 CN CN201821270817.0U patent/CN208460801U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828642A (en) * | 2018-08-08 | 2020-02-21 | 瑞识科技（深圳）有限公司 | Light-emitting device and preparation method thereof |
| CN110828642B (en) * | 2018-08-08 | 2024-03-29 | 深圳循光科技有限公司 | Light-emitting device and preparation method thereof |
| CN110703497A (en) * | 2019-10-09 | 2020-01-17 | 深圳市隆利科技股份有限公司 | Backlight device of surface light source and display apparatus |
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Address after: 518000 Building 203, Floor 2, Building B, Bangkai Science and Technology Industrial Park (Phase I), South of Sightseeing Road and West of Bangkai Road, Tangjia Community, Fenghuang Street, Guangming District, Shenzhen, Guangdong Province Patentee after: Shenzhen Sunlight Technology Co.,Ltd. Address before: 518000 Room 201, building 1, Bangkai science and Technology Industrial Park, No.9, Bangkai Road, high tech Industrial Park, Fenghuang street, Guangming New District, Shenzhen City, Guangdong Province Patentee before: RAYSEES TECHNOLOGY (SHENZHEN) Co.,Ltd. |
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