CN201699012U - Packaging structure of multi-layer array type light-emitting diode - Google Patents
Packaging structure of multi-layer array type light-emitting diode Download PDFInfo
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- CN201699012U CN201699012U CN2010201584040U CN201020158404U CN201699012U CN 201699012 U CN201699012 U CN 201699012U CN 2010201584040 U CN2010201584040 U CN 2010201584040U CN 201020158404 U CN201020158404 U CN 201020158404U CN 201699012 U CN201699012 U CN 201699012U
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- multiple field
- package structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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Abstract
The utility model discloses a packaging structure of a multi-layer array type light-emitting diode, which mainly comprise a base board, a packaging module, a lead bracket and a cover body, wherein the base board is arranged at the lowest layer of the packaging structure, the packaging module is used for integrating the base board with the lead bracket, the base board is provided with a plurality of light-emitting diode crystalline grains which are arranged in an array way, the base board is made from metal, the light-emitting diode is eclectically connected with the lead bracket, and the cover body is packaged with the packaging module. When the light-emitting diode is driven by a power supply, the generated heat energy can be directly absorbed and discharged by the base board, and the arrangement density of the array type light-emitting diodes can be flexibly adjusted according to different fields. The packaging structure is simple in structure, and is easy to manufacture, the manufacturing cost can be greatly reduced and the manufacturing time can be greatly shortened.
Description
Technical field
The utility model relates to a kind of encapsulating structure of multiple field array type light-emitting diode, relates in particular to that a kind of structure is simplified and easy to manufacture, can significantly reduce the encapsulating structure of manufacturing cost and manufacturing time.
Background technology
Press, the principle of luminosity of LED is to utilize the semiconductor inherent characteristic, the discharge of the incandescent lamp tube that it is different from the past, heating principle of luminosity, but just can emit beam when electric current forward flowed into semi-conductive PN and connect face, so LED is called as cold light source (cold light).Because LED has that high-durability, life-span are long, light and handy, power consumption is low and does not contain the advantage of harmful substance such as mercury etc., so can be widely used in the lighting apparatus industry, and it is applied in fields such as electronic bill-board, traffic sign usually with the led array packaged type.
Existing LED array of packages comprises a plurality of LED, and each LED structure has a chip and be installed on the lead frame, and by a packing colloid coating chip and lead frame partly, the metal pins of lead frame is exposed outside the adhesive body and as external contact; When being assembled into led array, on the metal that its metal pins with a plurality of LED is mounted to a printed circuit board (PCB) is online, electrically connect mutually to make described LED by this.But this kind LED array of packages is subject to the package dimension of this LED structure itself, causes the volume can't limit; And because of the heat radiation approach of each LED only can see through metal pins, radiating effect is limited.
In the prior art, other has a kind of LED array of packages is a plurality of led chips directly to be disposed on the printed circuit board (PCB) encapsulate.In detail, on printed circuit board (PCB), be provided with the metal online layer corresponding mutually, described led chip directly is installed on the printed circuit board (PCB), and form electric connection with the online layer of this metal with each led chip; Last each assembly that utilizes again on the packing colloid coating printed circuit board (PCB) can be finished a LED array of packages.
Yet the shortcoming of prior art goes up the elasticity deficiency for the printed circuit board (PCB) of using as the LED substrate uses, because of the line pattern on the circuit board is formalized, if according to the customized circuit board that is consistent of each application places, also make cost improve and take time and effort, and the printed circuit board radiating effect is limited, therefore must add heat abstractor and help heat radiation, the related cost that makes increases, also make structure more huge, therefore it is compact that industry needs a kind of structure, but easy to manufacture and go up flexible a kind of array type package structure for LED with using.
The utility model content
The purpose of this utility model is to provide a kind of multiple field array type package structure for LED.This another purpose is to provide a kind of multiple field type package structure for LED, this LED crystal particle is disposed on the substrate in mode, so can come the LED crystal particle closeness according to the incompatible adjustment of applied field, this LED crystal particle forms electric connection by lead and lead frame again, even so several LED crystal particle are damaged, also do not influence whole luminosity and efficient.
The concrete technological means of the utility model includes a substrate, this substrate has an output optical zone and two lead frame storage tanks at least, this output optical zone is the middle block of this substrate, this two lead frames storage tank is connected in lateral areas, the front and back piece of this output optical zone, root edge place, the outside along this two lead frames storage tank below plate body is formed with two grooves that are set in distance, and being provided with at least one first fixing hole and at least one perforation adjacent to the left and right side border area piece of this output optical zone, the internal face of this first fixing hole is formed with a flange; One package module, it is formed at around this substrate with an injection molding method, the part that this package module is higher than the surface of this output optical zone is defined as package module on, the both sides, front and back that should go up the package module bottom surface are formed with two flanges downwards, the allocation position of this two flange and shape correspond to this lead frame storage tank, the length of this two flange is at least greater than the extreme length of this lead frame storage tank, this two flange exceeds the part of this lead frame storage tank and has extended one first protuberance downwards, this first protuberance bottom is parallel two projections that extended inwardly, the allocation position of this two projection and shape correspond to this two groove, should go up package module bottom surface and all be formed with one second protuberance corresponding to this first fixing hole place, this second protuberance then is formed with a recessed edge corresponding to the position of this flange, should go up package module again and have an end face, one first internal face, one stationary plane, one reflective surface and a fluorescence wall, this end face is positioned on this on outermost top of package module, this first internal face is perpendicular to this end face and this stationary plane, the base level of this first internal face is connected in this stationary plane, this stationary plane also is provided with a cover body embeded slot, the lower end of this stationary plane is connected to the upper end of this reflective surface, wherein the horizontal plane on this output optical zone surface is defined as a datum plane, this reflective surface and this datum plane are formed with one first angle of cut, the lower end of this reflective surface then is connected with the upper end of this fluorescence wall, the lower end of this fluorescence wall falls within the surface of this output optical zone, and wherein this fluorescence wall and this datum plane form one second angle of cut; One lead frame, this lead frame is located in this flange by envelope, the part of the most close this output optical zone one side of this lead frame is bonding pad in, the part that this lead frame is away from this output optical zone one side most is an outer bonding pad, should reach and to be provided with at least one second slot and at least one second fixing hole between the outer bonding pad in interior bonding pad, this second slot and this second fixing hole all are embedded in this package module, the top of bonding pad reaches and should outer bonding pad integral body expose to this package module in being somebody's turn to do, should be provided with a plurality of connecting holes in outer bonding pad, this outer bonding pad must exceed the periphery of this substrate at least; One cover body, but this cover body cover cap on this package module, coat this luminescence unit with protection, the end periphery of this cover body has outwards extended an extending seat, the bottom surface of this extending seat is provided with a fitting portion, this fitting portion corresponds to this cover body embeded slot; One luminescence unit, this luminescence unit is arranged at the surface of this output optical zone, and this luminescence unit includes a plurality of LED crystal particle, and a plurality of leads of described LED crystal particle and this two lead frames mat constitute one and electrically connect; One protective layer, this protective layer coats described LED crystal particle; And at least one fluorescence coating, this fluorescence coating is positioned at this protective layer top.
Multiple field array type package structure for LED described in the utility model is a multilayer architecture, its structure is simplified and is easy to manufacture, therefore can significantly reduce manufacturing cost and manufacturing time, wherein the material of substrate is a metal material, therefore substrate has the heat conductivity of metal excellence, can effectively arrange the heat energy that distributes optical diode.
The multiple field array type package structure for LED that the utility model provides, this LED crystal particle is disposed on the substrate with array way, so can come the closeness of LED crystal particle according to the incompatible adjustment of applied field, this LED crystal particle forms electric connection by lead and lead frame again, even so several LED crystal particle are damaged, also do not influence whole luminosity and efficient.
Description of drawings
Fig. 1 is for showing the schematic appearance of multiple field array type package structure for LED described in the utility model.
Fig. 2 is the decomposing schematic representation of the part member of multiple field array type package structure for LED described in the utility model.
Fig. 3 is for showing the sectional schematic diagram of substrate described in the utility model, package module and cover body.
Fig. 4 is the sectional schematic diagram of Fig. 1.
Fig. 5 is for showing the overlooking surface schematic diagram of multiple field array type package structure for LED described in the utility model.
Fig. 6 another enforcement structure of lead frame for showing multiple field array type package structure for LED described in the utility model.
Fig. 7 is the schematic diagram of the metal reflective mirror of demonstration multiple field array type package structure for LED described in the utility model.
Fig. 8 is for being an embodiment schematic diagram that shows the lens embeded slot of package module described in the utility model.
The schematic diagram of the lens cap that Fig. 9 forms for the lens embeded slot that shows corresponding to Fig. 8.
Embodiment
Those skilled in the art below cooperate Figure of description that execution mode of the present utility model is done more detailed description, so that can implement after studying this specification carefully according to this.
Consult Fig. 1, schematic appearance for multiple field array type package structure for LED described in the utility model, consult Fig. 2, decomposing schematic representation for the part member of multiple field array type package structure for LED described in the utility model, consult Fig. 3, be the overlooking surface schematic diagram of multiple field array type package structure for LED described in the utility model.The utility model relates to a kind of multiple field array type package structure for LED, it includes a substrate 1, one package module 3, two lead frames 5 and a cover body 10, this substrate 1 has an output optical zone 11 and two lead frame storage tanks 13 at least, this output optical zone 11 is the middle block of this substrate 1, the ring periphery of this output optical zone 11 is provided with one first slot 19, this two lead frames storage tank 13 is connected in lateral areas, the front and back piece of this output optical zone 11, the place, outer rim bottom side of these two lead frames storage tank, 13 below plate bodys is formed with two grooves that are set in distance 131, this two groove 131 generally is a rectangle or other suitable shape, and adjacent to the left side of this output optical zone 11, the right edge block is provided with at least one first fixing hole 15 and at least one perforation 17, the internal face of this first fixing hole 15 is formed with a flange 151, perhaps also can be shown in present embodiment, on a left side, the block of right edge respectively is provided with one first fixing hole 15 and two perforation 17, two perforation 17 can be arranged at the both sides of first fixing hole 15 or the place, end angle of this substrate 1.Wherein the material of this substrate 1 can be a bronze medal, aluminium, copper alloy, aluminium alloy or other suitable metal material.A heat conduction reflector layer (drawing does not show) can be further electroplated on the surface of this substrate 1, and the material of this heat conduction reflector layer can be a nickel, a palladium, a platinum, a silver medal, a platinum alloy or other suitable material.
Consult Fig. 3, for the sectional schematic diagram of substrate described in the utility model, package module and cover body, consult Fig. 4, Fig. 4 is the sectional schematic diagram of Fig. 1.This package module 3 is formed at around this substrate 1 with an injection molding method, so that this package module 3 securely combines with this substrate 1, the material of this package module 5 is an epoxy resin (Epoxy) or other suitable material, the part that this package module 3 is higher than these output optical zone 11 upper surfaces is defined as package module 31 on, be noted that, should go up package module 31 just for convenience of description present embodiment define out, be not the member that is independent of this package module 3.
The both sides, front and back that should go up package module 31 bottom surfaces are formed with two flanges 311 downwards, the allocation position of this two flange 311 and shape correspond to this lead frame storage tank 13, the length of this two flange 311 is at least greater than the extreme length of this lead frame storage tank 13, this two flange 311 exceeds the part of this lead frame storage tank 13 and has extended one first protuberance 3111 downwards, these first protuberance, 3111 bottoms are the parallel two projection 3111a that extended inwardly, allocation position and the shape of this two projection 3111a correspond to this two groove 131, should go up package module 31 bottom surfaces and all be formed with one second protuberance 33b corresponding to these first fixing hole, 15 places, this second protuberance 33b then is formed with a recessed edge 331b in the position corresponding to this flange 151.
Please consult Fig. 4 again, be embedded with this lead frame 5 in this flange 311, the part of these lead frame 5 the most close these output optical zone 11 1 sides is bonding pad in, the part that this lead frame 5 is away from these output optical zone 11 1 sides most is an outer bonding pad, this outer bonding pad must exceed the periphery of this substrate 1 at least, be somebody's turn to do outer bonding pad and be provided with a plurality of connecting holes 53, should reach and to be provided with at least one second fixing hole 51 and at least one second slot 51a between the outer bonding pad in interior bonding pad, or can respectively be provided with this second slot 51a in these second fixing hole, 51 both sides as present embodiment, and be provided with three second fixing holes 51 and two connecting holes 53, therefore this second fixing hole 51 can be embedded in this package module 3 with this second slot 51a, and the top of bonding pad reaches and should outer bonding pad integral body not be embedded in this package module 3 in being somebody's turn to do, and the upper surface of this lead frame 5 is not less than or is parallel to the surface of this output optical zone 11 at least.Decide on actual demand the configuration quantity and the position that are noted that above-mentioned this second fixing hole 51 and two connecting holes 53, only is the example of explanation usefulness at this, is not in order to limit scope of the present utility model.Fig. 6 is another enforcement structure of lead frame.
Consult Fig. 3 and shown in Figure 4, this package module 3 is when ejection formation, will all fill up first slot 19 of substrate 1, groove 131, first fixing hole 15 and lead frame storage tank 13, therefore the projection 3111a of package module 3 can engage mutually with this recessed edge 331 with two grooves 131 and this flange 151, the encapsulating material 3 of this package module 3 has also filled up the second slot 51a of this lead frame 5 and the hollow parts of this second fixing hole 51 simultaneously, and mat makes this package module 3 and this substrate 1 and this lead frame 5 closely be combined into one.Wherein the section configuration of this first slot 19 and this second slot 51a can be V-type, matrix, U type or other suitable shape.
Should go up package module 31 and have an end face 33, one first internal face 331, one stationary plane 3311, one reflective surface 96 and a fluorescence wall 98, this end face 33 is positioned on this on package module 31 outermost tops, this first internal face 331 hangs down and is located between this end face 33 and this stationary plane 3311, the base level of this first internal face 331 is connected in this stationary plane 3311, this stationary plane 3311 also is provided with a cover body embeded slot 3311a, the section of this cover body embeded slot 3311a is V-shaped, matrix, U type or other suitable shape, the lower end of this stationary plane 3311 is connected to the upper end of this reflective surface 96, wherein the horizontal plane on these output optical zone 11 surfaces is defined as a datum plane, this reflective surface 96 is formed with one first angle of cut θ 1 with this datum plane, the angular range of this first angle of cut θ 1 is that 30 degree are between 60 degree, the lower end of this reflective surface 96 is connected with the upper end of this fluorescence wall 98, the lower end of this fluorescence wall 98 falls within this output optical zone 11 surfaces, wherein this fluorescence wall 98 is formed with one second angle of cut θ 2 with this datum plane, the angular range of this second angle of cut θ 2 is that 30 degree are between 60 degree, this reflective surface 96 and fluorescence wall 98 can be on same one sides, for better reflective effect will be arranged, this reflective surface 96 is provided with a reflecting unit 99 with this fluorescence wall 98, this reflecting unit 99 can be a light reflecting membrane layer or a metal reflective mirror, this light reflecting membrane layer mat sputtering way and forming, the material of this light reflecting membrane layer is one of them of nickel or a chromium, to strengthen reflective function.
Consult Fig. 5, be the overlooking surface schematic diagram of multiple field array type package structure for LED of the present utility model, and cooperate shown in Figure 3.The upper surface of this output optical zone 11 also is provided with a luminescence unit 7; this luminescence unit 7 is arranged at the surface of this output optical zone 11; this luminescence unit 7 includes a plurality of LED crystal particle 71; described LED crystal particle 71 constitutes one with a plurality of lead W of this two lead frames mat and electrically connects to form a circuit; wherein said LED crystal particle 71 is disposed on this output optical zone 11 with arrayed or other suitable arrangement mode; has an insulating protective layer 8 on the described LED crystal particle 71; this insulating protective layer 8 coats described LED crystal particle 71; the material of this insulating protective layer 8 is a silica gel or other suitable material; has at least one fluorescence coating 9 on this insulating protective layer 8; and this fluorescence coating 9 is coated with the part of this fluorescence wall 98, and the material of this fluorescence coating 9 is a phosphor or other suitable material.
This cover body 10 with the injection molding mode directly with these package module 3 driving fits with this luminescence unit 7 of protection containing; the end periphery of this cover body 10 has outwards extended an extending seat 101; the bottom surface of this extending seat 101 is provided with a fitting portion 1011; this fitting portion 1011 corresponds to the position that is provided with of this cover body embeded slot 3311a, and the length that this extending seat is 101 is not less than the length of 331 of this first internal faces of package module 31 on this at least.Wherein the material of this cover body 10 is a silica gel material and has light-permeable.
This fitting portion 1011 of this cover body 10 can be mutually combined after in alignment with this cover body embeded slot 3311a, and these extending seat 101 end faces simultaneously closely face close in this first internal face 331, make this cover body 10 firmly be fixed on this package module 3.
The connecting hole 53 of this two lead frame 5 can draw respectively and connects power lead (drawing does not show), when applying a bias voltage, 71 of described LED crystal particle are subjected to power drives luminous, described LED crystal particle 71 has the characteristics of luminescence of high brightness with the illumination mode of arrayed mode, produces the effect that mixed light is arranged when source light passes this fluorescence coating 9.
Consult Fig. 8 and Fig. 9, this cover body embeded slot 3311a can be the top perimeter place on the section of a U type and this reflective surface 96 that is disposed at package module 31 on this, and this cover body embeded slot 3311a disposes to the angle of inclination between the 80 degree scopes with 0 degree with respect to the upper surface of this output optical zone 11, and the end periphery of this cover body 10 has outwards extended an extending seat 101, the bottom surface of this extending seat 101 is provided with a fitting portion 1011, the position that is provided with of this fitting portion 1011 corresponds to this cover body embeded slot 3311a, so that this cover body 10 is fixed on this package module 3.
The above only is in order to explain preferred embodiment of the present utility model; be not that attempt is done any pro forma restriction to the utility model according to this; therefore; all have in that identical creation spirit is following do relevant any modification of the present utility model or change, all must be included in the category of the utility model intention protection.
Claims (19)
1. a multiple field array type package structure for LED is characterized in that, comprises:
One substrate, this substrate has an output optical zone and two lead frame storage tanks at least, this output optical zone is the middle block of this substrate, this two lead frames storage tank is connected in lateral areas, the front and back piece of this output optical zone, the place, outer rim bottom side of this two lead frames storage tank below plate body is formed with two grooves that are set in distance, and be provided with at least one first fixing hole and at least one perforation adjacent to the left and right side border area piece of this output optical zone, the internal face of this first fixing hole is formed with a flange, and it is a datum plane that this output optical zone surface flies horizontal plane;
One package module, it is formed at around this substrate with an injection molding method, the part that this package module is higher than the surface of this output optical zone is defined as package module on, the both sides, front and back that should go up the package module bottom surface are formed with two flanges downwards, the allocation position of this two flange and shape correspond to this lead frame storage tank, the length of this two flange is at least greater than the extreme length of this lead frame storage tank, this two flange exceeds the part of this lead frame storage tank and has extended one first protuberance downwards, this first protuberance bottom is parallel two projections that extended inwardly, the allocation position of this two projection and shape correspond to this two groove, should go up package module bottom surface and all be formed with one second protuberance corresponding to this first fixing hole place, this second protuberance then is formed with a recessed edge corresponding to the position of this flange, should go up package module again and have an end face, one first internal face, one stationary plane, one reflective surface and a fluorescence wall, this end face is positioned on this on outermost top of package module, this first internal face hangs down and is located between this end face and this stationary plane, the base level of this first internal face is connected in this stationary plane, this stationary plane is provided with a cover body embeded slot, the lower end of this stationary plane is connected to the upper end of this reflective surface, wherein this reflective surface and this datum plane are formed with one first angle of cut, the lower end of this reflective surface then is connected with the upper end of this fluorescence wall, the lower end of this fluorescence wall falls within this output optical zone surface, and wherein this fluorescence wall and this datum plane form one second angle of cut;
One lead frame, this lead frame is embedded in this flange, the part of the most close this output optical zone one side of this lead frame is bonding pad in, the part that this lead frame is away from this output optical zone one side most is an outer bonding pad, should reach and to be provided with at least one second slot and at least one second fixing hole between the outer bonding pad in interior bonding pad, this second slot and this second fixing hole all are embedded in this package module, the top of bonding pad reaches and should outer bonding pad integral body expose to this package module in being somebody's turn to do, and this outer bonding pad must exceed the periphery of this substrate at least;
One cover body, but this cover body cover cap on this package module, coat this luminescence unit with protection, the end periphery of this cover body has outwards extended an extending seat, the bottom surface of this extending seat is provided with a fitting portion, this fitting portion corresponds to the position that is provided with of this cover body embeded slot;
One luminescence unit, this luminescence unit is arranged at the surface of this output optical zone, and this luminescence unit includes a plurality of LED crystal particle, and a plurality of leads of described LED crystal particle and this two lead frames mat constitute one and electrically connect;
One insulating protective layer, this insulating protective layer coats described LED crystal particle; And
At least one fluorescence coating, this fluorescence coating are positioned at this insulating protective layer top, live this insulating protective layer with embedding.
2. multiple field array type package structure for LED as claimed in claim 1 is characterized in that this two groove is a rectangle.
3. multiple field array type package structure for LED as claimed in claim 1 is characterized in that the material of this substrate is copper, aluminium, copper alloy or aluminium alloy.
4. multiple field array type package structure for LED as claimed in claim 1 is characterized in that the periphery of this output optical zone is provided with one first slot.
5. multiple field array type package structure for LED as claimed in claim 4 is characterized in that, the section of this first slot is V-shaped, matrix or U type.
6. multiple field array type package structure for LED as claimed in claim 1 is characterized in that, the section of this second slot is V-shaped, matrix or U type.
7. multiple field array type package structure for LED as claimed in claim 1 is characterized in that the surface of this substrate further is provided with a heat conduction reflector layer, and the material of this heat conduction reflector layer is nickel, palladium, white gold, silver or platinum alloy.
8. multiple field array type package structure for LED as claimed in claim 1 is characterized in that this outer bonding pad is provided with a plurality of connecting holes.
9. multiple field array type package structure for LED as claimed in claim 1 is characterized in that, the section of this cover body embeded slot is V-shaped, matrix or U type.
10. multiple field array type package structure for LED as claimed in claim 1 is characterized in that, the length between this extending seat is not less than the length between this first internal face of package module on this at least.
11. multiple field array type package structure for LED as claimed in claim 1 is characterized in that described LED crystal particle is disposed at the surface of this output optical zone with arrayed.
12. multiple field array type package structure for LED as claimed in claim 1 is characterized in that the material of this insulating protective layer is a silica gel.
13. multiple field array type package structure for LED as claimed in claim 1 is characterized in that the material of this fluorescence coating is a phosphor, this fluorescence coating also is coated with the part of this fluorescence wall.
14. multiple field array type package structure for LED as claimed in claim 1 is characterized in that the material of this cover body is a silica gel.
15. multiple field array type package structure for LED as claimed in claim 1 is characterized in that this cover body has light-permeable.
16. multiple field array type package structure for LED as claimed in claim 1 is characterized in that the material of this package module is an epoxy resin.
17. multiple field array type package structure for LED as claimed in claim 1 is characterized in that, the angular range of this first angle of cut is between 30 degree are spent to 60, and the angular range of this second angle of cut is that 30 degree are between 60 degree.
18. multiple field array type package structure for LED as claimed in claim 1, it is characterized in that, this reflective surface and this fluorescence wall are provided with a reflecting unit, this reflecting unit is a light reflecting membrane layer or a metal reflective mirror, this light reflecting membrane layer mat sputtering way and forming, the material of this light reflecting membrane layer is one of them of nickel or a chromium.
19. multiple field array type package structure for LED as claimed in claim 1, it is characterized in that, this cover body embeded slot is the top perimeter place on the section of a U type and this reflective surface that is disposed at package module on this, and this cover body embeded slot disposes to the angle of inclination between the 80 degree scopes with 0 degree with respect to the upper surface of this output optical zone, and the end periphery of this cover body has outwards extended an extending seat, the bottom surface of this extending seat is provided with a fitting portion, the position that is provided with of this fitting portion corresponds to this cover body embeded slot, so that this cover body is fixed on this package module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201584040U CN201699012U (en) | 2010-04-14 | 2010-04-14 | Packaging structure of multi-layer array type light-emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201584040U CN201699012U (en) | 2010-04-14 | 2010-04-14 | Packaging structure of multi-layer array type light-emitting diode |
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| CN201699012U true CN201699012U (en) | 2011-01-05 |
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| CN2010201584040U Expired - Fee Related CN201699012U (en) | 2010-04-14 | 2010-04-14 | Packaging structure of multi-layer array type light-emitting diode |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623623A (en) * | 2012-03-26 | 2012-08-01 | 李海涛 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
| CN102956624A (en) * | 2011-08-17 | 2013-03-06 | 盈胜科技股份有限公司 | Multilayer arrayed LED light engine |
| CN103208488A (en) * | 2012-01-12 | 2013-07-17 | 盈胜科技股份有限公司 | Thin-type multilayer array type light-emitting diode optical engine |
-
2010
- 2010-04-14 CN CN2010201584040U patent/CN201699012U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102956624A (en) * | 2011-08-17 | 2013-03-06 | 盈胜科技股份有限公司 | Multilayer arrayed LED light engine |
| CN103208488A (en) * | 2012-01-12 | 2013-07-17 | 盈胜科技股份有限公司 | Thin-type multilayer array type light-emitting diode optical engine |
| CN102623623A (en) * | 2012-03-26 | 2012-08-01 | 李海涛 | Surface-mounted type LED (light-emitting diode) device with inner core protected by flexible rubber |
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