CN112536494A - Solder paste, welding method of LED and bonding pad, LED display unit and manufacturing method thereof - Google Patents
Solder paste, welding method of LED and bonding pad, LED display unit and manufacturing method thereof Download PDFInfo
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- CN112536494A CN112536494A CN202011334174.3A CN202011334174A CN112536494A CN 112536494 A CN112536494 A CN 112536494A CN 202011334174 A CN202011334174 A CN 202011334174A CN 112536494 A CN112536494 A CN 112536494A
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- powder
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- pcb
- solder
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000003466 welding Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 56
- 238000003756 stirring Methods 0.000 claims abstract description 8
- 238000005476 soldering Methods 0.000 claims description 24
- 238000004043 dyeing Methods 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 230000003213 activating effect Effects 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 239000013008 thixotropic agent Substances 0.000 claims description 6
- 239000011324 bead Substances 0.000 claims description 5
- 238000004040 coloring Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 10
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 5
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 5
- 239000003738 black carbon Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a solder paste, a welding method of an LED and a bonding pad, an LED display unit and a manufacturing method thereof, belonging to the technical field of LEDs and comprising the following steps: adding dark color dye powder with the mass fraction of 1-10% and the powder diameter less than 100 nanometers into the solder paste, and uniformly stirring; the solder paste is spot-welded to a pad of the PCB and the LED is soldered. The method is simple, low in cost and convenient for large-scale application, and the high contrast of the LED module is realized.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a solder paste, a welding method of an LED and a bonding pad, an LED display unit and a manufacturing method thereof.
Background
With the continuous development of the LED display technology, the display effect of the LED display screen is rapidly improved, and the pixel pitch and the display effect are greatly improved. With the coming of the 5G era, the popularization of the Internet of things and artificial intelligence is taken as an interactive important information display window, and the LED display screen is further widely applied due to the technical advantages of seamless splicing and large-screen display. In the field of indoor small-distance, the LED display is developing towards higher definition and more perfect image quality. At present, the small pitch display in the LED room starts the original product with the pitch of more than P1.0 and is developed to be less than P1.0. The display definition is qualitatively leap. And the distance below P1.0 is mainly based on Mini-LED display technology. The reduction of the pixel pitch also enables people to watch the display screen at a closer distance, so that the attention and the requirements of people on the display screen not only are the display effect, but also extend to the appearance effect of the screen. The method gradually enters a professional and personalized multi-application stage from the original single large-scale application. But the current LED display screen has the problem of poor display effect.
Disclosure of Invention
In view of the above, the technical problem to be solved by the present invention is to provide a solder paste, a soldering method of an LED and a bonding pad, an LED display unit and a manufacturing method thereof, so as to solve the problem of poor display effect of an LED display screen.
The invention solves the technical problem, and on one hand, provides a method for welding an LED and a bonding pad, which comprises the following steps:
adding dark color dye powder with the mass fraction of 1-10% and the powder diameter less than 100 nanometers into the solder paste, and uniformly stirring;
the solder paste is spot-welded to a pad of the PCB and the LED is soldered.
Another aspect provides a solder paste for soldering an LED, including flux and solder powder; the soldering flux comprises an activating agent, a thixotropic agent, resin and a solvent; the resin comprises 1-10% of dark dyeing powder with the powder diameter less than 100 nanometers by mass.
In another aspect, a method for manufacturing an LED display unit is provided, including:
adding dark color dye powder with the mass fraction of 1-10% and the powder diameter less than 100 nanometers into the solder paste, and uniformly stirring;
the solder paste is spot-welded on a preset welding position of the PCB;
welding the LED with the solder paste on the PCB, wherein in the process, solder powder is converted into liquid from solid particles and is accumulated together, and dyeing powder in the solder paste is uniformly wrapped outside at least the solder balls;
and after the temperature is reduced and the welding is finished, the whole LED display unit is in the color of the dyeing powder.
In another aspect, an LED display unit is further provided, which includes a PCB board, the PCB board includes a pad, and an LED is welded on the pad; the method is characterized in that: the solder paste on the bonding pad comprises soldering flux and solder powder; the soldering flux comprises an activating agent, a thixotropic agent, resin and a solvent; the resin comprises 1-10% of dark dyeing powder with the powder diameter less than 100 nanometers by mass; in the process of welding the LED and the bonding pad on the PCB board by the solder paste, the solder powder is converted into liquid from solid particles and is accumulated together, and the coloring powder in the solder paste is uniformly wrapped outside the tin bead at least, so that the LED display unit is integrally colored by the coloring powder after the temperature is reduced and the welding is finished.
According to the soldering tin paste, the LED and the soldering pad welding method, the LED display unit and the manufacturing method thereof, the dark color toner is added into the soldering tin paste, so that after the LED lamp beads are soldered by the soldering tin paste, the dark color substance covers the soldering pad and the tin surface, the module contrast is improved, the LED display effect is improved, and the soldering tin paste has the advantages of being simple in method, low in cost and capable of achieving large-scale production.
Drawings
FIG. 1 is a state before a PCB board is to be soldered in at least one embodiment of the present invention;
FIG. 2 is yet another state of the PCB before it is to be soldered in at least one embodiment of the present invention;
fig. 3 is a state after a PCB board is to be soldered in at least one embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
With the continuous development of the LED display technology, in the indoor small-space field, the LED display is developing towards smaller pixel point space, mainly based on the Mini-LED display technology. Due to the intensive increase of the pixel points, the density of the PCB pads is increased, and the relative area of the whole PCB occupied by the PCB welding area is increased. Make the module accomplish the LED lamp welding back, the exposed relative area of pad department tin is more, again because pad and tin have metallic luster for the whole looks partially bright, contrast is lower when the black screen of LED lamp plate. The following embodiments of the present invention can better solve the problem.
The LED in the following examples is a light emitting diode (abbreviated). It is a diode made of a compound of gallium (Ga) and arsenic (As), phosphorus (P), nitrogen (N), indium (In) by controlling the display mode of a semiconductor light emitting diode, and can radiate visible light when electrons and holes are recombined, and thus can be used to manufacture a light emitting diode. In circuits and instruments as indicator lights or to form text or numerical displays. The gaas diode emits red light, the gan diode emits green light, the sic diode emits yellow light, and the ingan diode emits blue light.
Example one
A first embodiment of the present invention provides a method for bonding an LED to a pad, including:
adding dark color dye powder with the mass fraction of 1-10% and the powder diameter less than 100 nanometers into the solder paste, and uniformly stirring; the solder paste is spot-welded to a pad of the PCB and the LED is soldered. Preferably, the dark colored powder has conductive properties. More preferably, the dark-colored toner is black carbon powder. Referring to fig. 1 and 2, a PCB to be soldered is provided with a plurality of pads 2 on a PCB 4, the pads are pin holes and copper foils around the pin holes, components are soldered and fixed on the PCB through the pin holes, and the pads are connected by printed wires to realize electrical connection of the components in a circuit. In this embodiment, the bonding pad is used to electrically connect the LED and the PCB. The solder paste 3 used for welding the LED on the bonding pad 2 is added with carbon powder with the mass fraction of 1-10% and the powder diameter of less than 100 nanometers, after being uniformly stirred, the solder paste 3 is spot-welded on the bonding pad 2 of the PCB 4 to form a state shown in figure 2, and after the solder powder in the solder paste 3 is changed into liquid state from solid particles and is accumulated together, the carbon powder in the solder paste is uniformly wrapped outside the solder balls to form a black appearance. After the LED is welded on the basis, the LED with black ground color can be formed, the contrast of the LED module is improved, and the display effect is improved.
Example two
A second embodiment of the present invention provides a solder paste for soldering an LED, the solder paste including flux and solder powder; the soldering flux comprises an activating agent, a thixotropic agent, resin and a solvent; the resin comprises 1-10% of dark dyeing powder with the powder diameter less than 100 nanometers by mass. The mass fraction is preferably 4%, 5%, 6%.
The dark color toner is black carbon powder with conductive property. In other embodiments, the dark colorant powder may be a colorant having no conductivity, such as a dark blue, dark gray, or the like.
EXAMPLE III
A third embodiment of the present invention provides a method for manufacturing an LED display unit, including:
adding dark color dye powder with the mass fraction of 1-10% and the powder diameter less than 100 nanometers into the solder paste, and uniformly stirring;
the solder paste is spot-welded on a preset welding position of the PCB;
welding the LED with the solder paste on the PCB, wherein in the process, solder powder is converted into liquid from solid particles and is accumulated together, and dyeing powder in the solder paste is uniformly wrapped outside at least the solder balls;
and after the temperature is reduced and the welding is finished, the whole LED display unit is in the color of the dyeing powder.
Preferably, the dark color toner is black carbon powder.
With the structure shown in fig. 1, 2 and 3, a plurality of bonding pads 2 are arranged on the PCB 4 to be soldered shown in fig. 1, the bonding pads are lead holes and copper foil around the lead holes, the component is soldered and fixed on the PCB by solder paste through the lead holes on the PCB, and the bonding pads are connected by printed wires to realize the electrical connection of the component in the circuit. In this embodiment, the bonding pad is used to electrically connect the LED and the PCB. The method comprises the steps of adding 1-10 mass percent of carbon powder with the powder diameter smaller than 100 nanometers into solder paste 3 for soldering an LED on a bonding pad 2, uniformly stirring, spot-welding the solder paste 3 on the bonding pad 2 of a PCB 4 to form a state shown in figure 2, wherein after the solder powder in the solder paste 3 is converted from solid particles into liquid and is accumulated together, dyeing powder in the solder paste is uniformly wrapped outside a solder ball to form a black appearance, then arranging the LED 1 on the solder paste 3 shown in figure 2 to be soldered with the bonding pad 2 before the solder paste 3 shown in figure 2 is not solidified, and forming the state shown in figure 3 after the solder paste is cooled. And a driving IC 5 is welded on the back surface of the PCB 4. The LED display screen is carried out on the basis, the LEDs with black ground colors can be formed, the contrast of the LED module is improved, and the display effect is improved. In the automatic surface mounting or integrated packaging module welding process, the process can also be simply set as follows: firstly, printing black tin paste on a PCB lamp surface bonding pad; then, LED lamp beads or chips are pasted on the surface of the PCB lamp; then, the PCB passes through a reflow soldering furnace, and the LED lamp beads or the chips are welded with the PCB; and finally, welding the back drive IC.
Example four
The fourth embodiment of the invention provides an LED display unit, which comprises a PCB, wherein the PCB comprises a bonding pad, and an LED is welded on the bonding pad; the solder paste on the bonding pad comprises soldering flux and solder powder; the soldering flux comprises an activating agent, a thixotropic agent, resin and a solvent; the resin comprises 1-10% of dark dyeing powder with the powder diameter less than 100 nanometers by mass; preferably, the dark-colored toner is black carbon powder, and is manufactured by the manufacturing method of the third embodiment, which is not described herein again.
The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, and are not to be construed as limiting the scope of the invention. Those skilled in the art can implement the invention in various modifications, such as features from one embodiment can be used in another embodiment to yield yet a further embodiment, without departing from the scope and spirit of the invention. Any modification, equivalent replacement and improvement made within the technical idea of using the present invention should be within the scope of the right of the present invention.
Claims (10)
1. A method for welding an LED and a bonding pad is characterized by comprising the following steps:
adding dark color dye powder with the mass fraction of 1-10% and the powder diameter less than 100 nanometers into the solder paste, and uniformly stirring;
the solder paste is spot-welded to a pad of the PCB and the LED is soldered.
2. The LED and pad bonding method according to claim 1, wherein: the dark colored toner has conductive properties.
3. The LED and pad bonding method according to claim 1 or 2, wherein: the dark color dyeing powder is carbon powder.
4. A solder paste for soldering an LED, characterized in that: the solder paste comprises soldering flux and solder powder; the soldering flux comprises an activating agent, a thixotropic agent, resin and a solvent; the resin comprises 1-10% of dark dyeing powder with the powder diameter less than 100 nanometers by mass.
5. The solder paste for soldering an LED according to claim 4, wherein: the dark colored toner has conductive properties.
6. The solder paste for soldering an LED according to claim 4 or 5, wherein: the dark color dyeing powder is carbon powder.
7. A manufacturing method of an LED display unit is characterized by comprising the following steps:
adding dark color dye powder with the mass fraction of 1-10% and the powder diameter less than 100 nanometers into the solder paste, and uniformly stirring;
the solder paste is spot-welded on a preset welding position of the PCB;
welding the LED with the solder paste on the PCB, wherein in the process, solder powder is converted into liquid from solid particles and is accumulated together, and dyeing powder in the solder paste is uniformly wrapped outside at least the solder balls;
and after the temperature is reduced and the welding is finished, the whole LED display unit is in the color of the dyeing powder.
8. The method of claim 7, wherein the dark-colored toner is carbon powder.
9. An LED display unit comprises a PCB, wherein the PCB comprises a bonding pad, and a plurality of LEDs are welded on the bonding pad; the method is characterized in that: the solder paste on the bonding pad comprises soldering flux and solder powder; the soldering flux comprises an activating agent, a thixotropic agent, resin and a solvent; the resin comprises 1-10% of dark dyeing powder with the powder diameter less than 100 nanometers by mass; in the process of welding the LED and the bonding pad on the PCB board by the solder paste, the solder powder is converted into liquid from solid particles and is accumulated together, and the coloring powder in the solder paste is uniformly wrapped outside the tin bead at least, so that the LED display unit is integrally colored by the coloring powder after the temperature is reduced and the welding is finished.
10. The LED display unit of claim 9, wherein the dark colored toner is carbon powder.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011334174.3A CN112536494A (en) | 2020-11-25 | 2020-11-25 | Solder paste, welding method of LED and bonding pad, LED display unit and manufacturing method thereof |
| PCT/CN2021/105236 WO2022110818A1 (en) | 2020-11-25 | 2021-07-08 | Solder paste, welding method for led and bonding pad, and led display unit and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011334174.3A CN112536494A (en) | 2020-11-25 | 2020-11-25 | Solder paste, welding method of LED and bonding pad, LED display unit and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112536494A true CN112536494A (en) | 2021-03-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011334174.3A Pending CN112536494A (en) | 2020-11-25 | 2020-11-25 | Solder paste, welding method of LED and bonding pad, LED display unit and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112536494A (en) |
| WO (1) | WO2022110818A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022110818A1 (en) * | 2020-11-25 | 2022-06-02 | 深圳市洲明科技股份有限公司 | Solder paste, welding method for led and bonding pad, and led display unit and manufacturing method therefor |
| CN115188282A (en) * | 2021-04-07 | 2022-10-14 | 西安青松光电技术有限公司 | Display module manufacturing method and display module |
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| EP0829324A1 (en) * | 1993-10-25 | 1998-03-18 | Fujitsu Limited | Solder paste |
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| CN109873073A (en) * | 2019-04-09 | 2019-06-11 | 深圳市华科莱特电子有限公司 | Upside-down mounting is transparent to roll up mantle LED display and its production technology |
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| CN112536494A (en) * | 2020-11-25 | 2021-03-23 | 深圳市洲明科技股份有限公司 | Solder paste, welding method of LED and bonding pad, LED display unit and manufacturing method thereof |
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2020
- 2020-11-25 CN CN202011334174.3A patent/CN112536494A/en active Pending
-
2021
- 2021-07-08 WO PCT/CN2021/105236 patent/WO2022110818A1/en active Application Filing
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| JPH07323391A (en) * | 1994-06-03 | 1995-12-12 | Eastern:Kk | Colored soldering material and method for forming colored film on soldered part |
| CN110098306A (en) * | 2018-09-03 | 2019-08-06 | 深圳市洲明科技股份有限公司 | A kind of integration packaging display module |
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| CN111682019A (en) * | 2020-05-11 | 2020-09-18 | 安徽芯瑞达科技股份有限公司 | Manufacturing process of Mini RGB LED module |
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| WO2022110818A1 (en) * | 2020-11-25 | 2022-06-02 | 深圳市洲明科技股份有限公司 | Solder paste, welding method for led and bonding pad, and led display unit and manufacturing method therefor |
| CN115188282A (en) * | 2021-04-07 | 2022-10-14 | 西安青松光电技术有限公司 | Display module manufacturing method and display module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022110818A1 (en) | 2022-06-02 |
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