CN114551418A - Preparation method of flexible light bar, flexible light bar and display device - Google Patents
Preparation method of flexible light bar, flexible light bar and display device Download PDFInfo
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- CN114551418A CN114551418A CN202210187586.1A CN202210187586A CN114551418A CN 114551418 A CN114551418 A CN 114551418A CN 202210187586 A CN202210187586 A CN 202210187586A CN 114551418 A CN114551418 A CN 114551418A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 238000005538 encapsulation Methods 0.000 claims abstract description 26
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 14
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims abstract description 11
- 239000004408 titanium dioxide Substances 0.000 claims abstract description 9
- -1 polyethylene terephthalate Polymers 0.000 claims abstract description 7
- 238000004806 packaging method and process Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 11
- 238000005507 spraying Methods 0.000 claims description 11
- 238000007650 screen-printing Methods 0.000 claims description 9
- 238000002310 reflectometry Methods 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 6
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 2
- 238000009766 low-temperature sintering Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000001795 light effect Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 235000010215 titanium dioxide Nutrition 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000004020 luminiscence type Methods 0.000 description 4
- 238000012536 packaging technology Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
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- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Planar Illumination Modules (AREA)
Abstract
The application discloses a preparation method of a flexible light bar, the flexible light bar and a display device; the preparation method of the flexible light bar comprises the following steps: providing a flexible reflector, wherein the material of the flexible reflector comprises polyethylene terephthalate and titanium dioxide; forming a circuit structure on the flexible reflector; fixing a plurality of light-emitting chips on the circuit structure, and electrically connecting the plurality of light-emitting chips with the circuit structure; and forming an encapsulation layer for encapsulating each light-emitting chip on the flexible reflecting sheet. This application embodiment is through directly setting up circuit structure on flexible reflector plate, when circuit structure circular telegram, luminous chip is luminous, flexible reflector plate can be with luminous chip transmission to the light reflection of self away, the circuit board of this application embodiment itself has the reflection of light effect promptly, compare in current LED lamp strip, need not to coat the reflective coating again on the circuit board, the process steps of coating reflective coating has been saved promptly, the production technology of flexible lamp strip has been simplified, the production efficiency of flexible lamp strip has been improved.
Description
Technical Field
The application belongs to the field of display devices, and particularly relates to a flexible light bar, a preparation method thereof and a display device.
Background
The liquid crystal display device is widely applied to electronic display equipment, and most of the display devices on the market at present are backlight liquid crystal displays which comprise a liquid crystal display panel and a backlight module. Since the lcd panel does not emit light, the backlight module is one of the key components of the lcd device because the backlight module needs to provide a light source to normally display images. The backlight module is divided into a side-in type backlight module and a direct type backlight module according to the difference of the incident positions of the backlight sources, and the direct type backlight module is widely used in the market at present.
In the related art, the current direct type backlight module comprises a back plate and an LED light bar arranged on one side of the back plate, and the current production process of the LED light bar is long in line and low in production efficiency.
Disclosure of Invention
The embodiment of the application provides a preparation method of a flexible light bar, the flexible light bar and a display device, so that the production process of the flexible light bar is simplified, and the production efficiency of the flexible light bar is improved.
In a first aspect, an embodiment of the present application provides a method for manufacturing a flexible light bar, including:
providing a flexible reflector, wherein the material of the flexible reflector comprises polyethylene terephthalate and titanium dioxide;
forming a circuit structure on the flexible reflector;
fixing a plurality of light-emitting chips on the circuit structure, and electrically connecting the plurality of light-emitting chips with the circuit structure;
and forming a packaging layer for coating each light-emitting chip on the flexible reflecting sheet.
Optionally, the forming a circuit structure on the flexible reflective sheet includes:
and printing the circuit structure on the flexible reflecting sheet by adopting a screen printing process or a nano-imprinting process.
Optionally, fixing a plurality of light emitting chips on the circuit structure, and implementing circuit connection between the plurality of light emitting chips and the circuit structure includes:
the light-emitting chip is a MiniLED chip, and the MiniLED chip is fixed on the circuit structure by adopting a MiniLED die bonder; and
and carrying out line sintering to realize the electrical connection of the MiniLED chip and the circuit structure.
Optionally, the forming a circuit structure on the flexible reflective sheet includes:
covering a copper foil on the flexible reflection sheet; and
and etching the circuit structure on the copper foil by adopting a photoetching process.
Optionally, the fixing a plurality of light emitting chips on the circuit structure, and implementing the circuit connection between the plurality of light emitting chips and the circuit structure includes:
printing an electric connecting piece on the circuit structure, wherein the electric connecting piece is made of a nano conductive material or low-temperature sintered solder paste; and
the light-emitting chip is a MiniLED chip, and the MiniLED chip is connected with the electric connecting piece through circuit sintering so as to realize the electrical connection of the MiniLED chip and the circuit structure.
Optionally, the forming of the encapsulation layer covering each light emitting chip on the flexible reflective sheet includes:
and spraying the packaging glue to each light-emitting chip by a spraying device to form the packaging layer.
In a second aspect, an embodiment of the present application further provides a flexible light bar, including:
the circuit board comprises a flexible reflection sheet and a circuit structure arranged on one side of the flexible reflection sheet;
the light-emitting chips are electrically connected with the circuit structure; and
the packaging layer is coated on each light-emitting chip;
the flexible reflection sheet comprises polyethylene glycol terephthalate and titanium dioxide, and can reflect light rays emitted by the light emitting chip.
Optionally, the reflectivity of the flexible reflective sheet is greater than 90%.
Optionally, the package layer includes a plurality of sub-package portions arranged at intervals, and each sub-package portion covers one of the light emitting chips.
In a third aspect, an embodiment of the present application further provides a display device, which includes a display module and a backlight module disposed on one side of the display module, where the backlight module includes the flexible light bar according to any of the above embodiments.
In the method for manufacturing the flexible light bar of the embodiment of the application, a flexible reflection sheet is provided, the material of the flexible reflection sheet comprises polyethylene terephthalate (PET) and titanium dioxide, a circuit structure is formed on the flexible reflection sheet, a plurality of light-emitting chips are fixed on the circuit structure, and the plurality of light-emitting chips are electrically connected with the circuit structure; when circuit structure circular telegram, light-emitting chip sends light towards the all sides, because the preparation of flexibility reflection piece through adopting polyethylene glycol terephthalate and titanium white powder forms, it has the reflection of light effect for light accessible flexibility reflection piece self reflection on the flexibility reflection piece is shone to light-emitting chip, and the flexible lamp strip of this application embodiment has contained the light that light-emitting chip sent and the light that the flexibility reflection piece reflects promptly, has strengthened luminance. This application embodiment is through directly setting up circuit structure on flexible reflector plate and forming the circuit board, because flexible reflector plate itself has reflection of light characteristic, consequently the circuit board of this application embodiment itself has reflection of light characteristic, compare in the LED lamp strip on the existing market, need not to coat reflection of light coating again on the circuit board, the process steps of coating reflection of light coating have promptly been saved, thereby the production technology of flexible lamp strip has been simplified, the production efficiency of flexible lamp strip has been improved, the material cost of coating reflection of light coating has been saved simultaneously.
Drawings
The technical solutions and advantages of the present application will become apparent from the following detailed description of specific embodiments of the present application when taken in conjunction with the accompanying drawings.
Fig. 1 is a flowchart of a manufacturing method of a flexible light bar provided in an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a flexible light bar manufacturing process according to an embodiment of the present application.
FIG. 3 is a flowchart illustrating an embodiment of step 30 in FIG. 1.
Fig. 4 is a schematic structural diagram of step 20 performed on the flexible light bar according to the embodiment of the present application.
FIG. 5 is a detailed flowchart of another embodiment of step 30 in FIG. 1.
Fig. 6 is a schematic structural view of an embodiment of a flexible light bar provided in the present application.
Fig. 7 is a schematic structural view of another embodiment of the flexible light bar provided in the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the related art, the display device includes a display panel and a backlight module, for example, a direct-type backlight module, the backlight module includes a back plate and an LED light bar disposed on one side of the back plate, and the luminance of the LED light bar determines the luminance of the backlight module, so as to determine the display effect of the display device. In the existing LED lamp strip production process, in order to improve the luminous brightness of the LED lamp strip, most lamp strip manufacturers manually coat a reflective coating on the surface of a circuit board at present so as to increase the luminous brightness of the LED lamp strip by reflecting light emitted by the LED lamp, namely, a process step is added in the original production process route of the LED lamp strip, so that the production process route of the lamp strip is prolonged, and the production efficiency of the lamp strip is influenced.
In order to solve the above problems, embodiments of the present application provide a method for manufacturing a flexible light bar, so as to ensure that the flexible light bar has sufficient luminance, simplify a production process of the flexible light bar, and improve production efficiency of the flexible light bar.
Referring to fig. 1 and fig. 2 in combination, fig. 1 is a flowchart of a manufacturing method of a flexible light bar 100 according to an embodiment of the present disclosure, and fig. 2 is a schematic structural diagram of a manufacturing process of the flexible light bar according to the embodiment of the present disclosure; in an embodiment of the present application, a manufacturing method of the flexible light bar 100 includes:
s10: providing a flexible reflecting sheet 11, as shown in a stage a in fig. 2, wherein the material of the flexible reflecting sheet 11 includes polyethylene terephthalate (PET) and titanium dioxide; the flexible reflection sheet 11 is made of polyethylene terephthalate (PET) and titanium dioxide, so that the flexible reflection sheet has a light reflection effect and can reflect light irradiated to the flexible reflection sheet by an external light emitting structure.
S20: forming a circuit structure 12 on the flexible reflection sheet 11, as shown in a stage b in fig. 2; by forming the circuit structure 12 on the flexible reflection sheet 11, so that the flexible reflection sheet 11 and the circuit structure 12 are integrally combined to form the circuit board 10, the flexible reflection sheet 11 plays a role of supporting and insulating the circuit structure 12.
S30: fixing a plurality of light emitting chips 20 on the circuit structure 12, and electrically connecting the plurality of light emitting chips 20 with the circuit structure 12, as shown in stage c in fig. 2;
s40: forming an encapsulation layer 30 covering each of the light emitting chips 20 on the flexible reflection sheet 11, as shown in a stage d in fig. 2; the encapsulation layer 30 is used to isolate the light emitting chip 20 from the outside, and the material of the encapsulation layer 30 is a transparent material so that the light emitted by the light emitting chip 20 when the light emitting chip is powered on can pass through the transparent material.
It can be understood, this application embodiment is through setting up circuit structure 12 on flexible reflector plate 11, and with luminescence chip 20 and circuit structure 12 electric connection, when circuit structure 12 circular telegram, luminescence chip 20 sends light towards all sides, because flexible reflector plate 11 has the reflection of light effect, light accessible flexible reflector plate 11 self reflection on luminescence chip 20 transmission to flexible reflector plate 11 goes out, consequently, the light that flexible lamp strip 100 of this application embodiment sent has contained light that luminescence chip 20 self sent and the light that flexible reflector plate 11 reflects, thereby luminous luminance has been strengthened. Moreover, this application is through adopting the flexible reflection piece 11 that polyethylene glycol terephthalate (PET) and titanium white powder prepared, and its reflectivity to the light is greater than 90%, is higher than the reflectivity of current reflective coating (white oil), has better reflection of light effect, consequently compares in the LED lamp strip through coating reflective coating on the circuit board on the existing market, and the flexible lamp strip 100 of this application embodiment can send out higher luminance.
In the above manufacturing method of the flexible light bar, the circuit board 10 is formed by directly arranging the circuit structure 12 on the flexible reflection sheet 11 in the embodiment of the present application, and since the flexible reflection sheet 11 itself has a light reflection characteristic, the circuit board 10 itself has a light reflection characteristic, and compared with the LED light bar in the current market, the circuit board 10 does not need to be coated with a light reflection coating, i.e., the process step of coating the light reflection coating is omitted, so that the production process of the flexible light bar 100 is simplified, the production efficiency of the flexible light bar 100 is improved, and the material cost of coating the light reflection coating is saved.
Specifically, there are various process technologies for forming the circuit structure 12 on the flexible reflective sheet 11, for example, in an embodiment of the present application, forming the circuit structure 12 on the flexible reflective sheet 11 includes: the circuit structure 12 is printed on the flexible reflection sheet 11 by using a screen printing process or a nanoimprint process.
Taking a screen printing process as an example, the specific steps of printing the circuit structure 12 on the flexible reflection sheet 11 are as follows:
providing a silk screen plate; wherein, the silk screen plate is printed with patterns corresponding to the circuit structure 12;
coating conductive paste on the screen printing screen plate, wherein the conductive paste is made of nano silver or nano copper materials;
extruding the conductive paste on the screen printing screen plate through a scraper plate to make the conductive paste leak-printed on the flexible reflection sheet 11 through meshes on the screen printing screen plate;
and baking the conductive paste to solidify the conductive paste, and forming the circuit structure 12 after the conductive paste is solidified.
Further, in order to further improve the luminance of the flexible light bar 100, in this embodiment of the application, the light emitting chip 20 adopts a MiniLED chip. Because miniLED chip granule is little, and the interval between the adjacent miniLED chip is little, can arrange more miniLED chips on the circuit board 10 of the same area, not only can strengthen the luminous luminance of flexible lamp strip 100, can also guarantee that the light that sends is even for the display device who adopts this flexible lamp strip 100's display effect is exquisite, shows luminance height.
Referring to fig. 3, after the flexible reflection sheet 11 is printed by a screen printing process or a nano-imprinting process, fixing a plurality of light emitting chips 20 on the circuit structure 12 and electrically connecting the plurality of light emitting chips 20 with the circuit structure 12 includes:
s31: the light emitting chip 20 is a MiniLED chip, and the MiniLED chip is fixed on the circuit structure 12 by using a MiniLED die bonder; and
s32: performing circuit sintering to electrically connect the MiniLED chip and the circuit structure 12; wherein the sintering temperature is less than 150 ℃.
Referring to fig. 4, in another embodiment of the present application, the forming of the circuit structure 12 on the flexible reflection sheet 11 may further include: the flexible reflection sheet 11 is covered with a copper foil 12a, and a circuit structure 12 is etched on the copper foil 12a by a photolithography process.
As shown in fig. 4, in this embodiment, the specific process steps of "coating a copper foil 12a on the flexible reflective sheet 11 and etching a circuit structure 12 on the copper foil 12a by using a photolithography process" are as follows:
adhering copper foil 12a on the whole surface of the flexible reflection material sheet, as shown in a stage a in FIG. 4;
coating photoresist on the copper foil 12a and forming a cured photoresist structure 13 by exposure and development, as shown in stage b in fig. 4;
removing the copper foil 12a which is not covered by the photoresist structure 13 by using an etching solvent to form a circuit structure 12, as shown in stage c in fig. 4;
the photoresist structure 13 on the circuit structure 12 is removed by dissolving with a photoresist solvent, as shown in stage d in fig. 4.
Referring to fig. 5, after the circuit structure 12 is etched on the flexible reflective sheet 11 by using the photolithography process, fixing the plurality of light emitting chips 20 on the circuit structure 12 and electrically connecting the plurality of light emitting chips 20 with the circuit structure 12 includes:
s33: printing an electric connecting piece on the circuit structure 12, wherein the electric connecting piece is made of a nano conductive material or low-temperature sintered solder paste; and
s34: the light emitting chip 20 is a MiniLED chip, and the MiniLED chip is connected with the electrical connector through circuit sintering so as to electrically connect the MiniLED chip with the circuit structure 12; wherein the sintering temperature is less than 150 ℃.
Further, in order to further improve the production efficiency of the flexible light bar 100, in the embodiment of the present application, the forming of the encapsulation layer 30 covering each light emitting chip 20 on the flexible reflective sheet 11 includes: the encapsulation paste is sprayed to each of the light emitting chips 20 by a spraying device to form the encapsulation layer 30.
The packaging adhesive may be only sprayed on the light emitting chips 20, so that the packaging adhesive only covers each light emitting chip 20; the encapsulation adhesive may also be sprayed on the entire surface of the circuit board 10, so that the encapsulation adhesive covers the entire surface of the circuit board to cover each of the light emitting chips 20.
Fig. 6 is a schematic view of a structure of a flexible light bar 100 provided in an embodiment of the present application, and fig. 6 is a schematic view of the flexible light bar 100 provided in the embodiment of the present application; in the embodiment of the present application, the flexible light bar 100 includes a circuit board 10, a light emitting chip 20, and an encapsulation layer 30.
As shown in fig. 6, the circuit board 10 includes a flexible reflection sheet 11 and a circuit structure 12 disposed on one side of the flexible reflection sheet 11. The circuit structure 12 may be printed on the flexible reflection sheet 11 through a screen printing process or a nanoimprint process, or may be printed on the flexible reflection sheet 11 through a photolithography process.
Specifically, the flexible reflection sheet 11 is made of a composite material of polyethylene terephthalate and titanium dioxide, so that the flexible reflection sheet 11 has a light reflection effect and can reflect light rays irradiated by the light-emitting structure.
The light emitting chips 20 are electrically connected to the circuit structure 12, and when the circuit structure 12 is powered on, the light emitting chips 20 are powered on to emit light. In the embodiment of the present application, in order to further improve the light emitting brightness of the flexible light bar 100, the light emitting chip 20 of the embodiment of the present application is a MiniLED chip.
It can be understood that, this application embodiment is through adopting miniLED chip, because miniLED chip granule is little, and the interval between the adjacent miniLED chip is little, can arrange more miniLED chips on the circuit board 10 of the same area, not only can strengthen flexible lamp strip 100's luminous luminance, can also guarantee that the light that sends is even for the display effect who adopts this flexible lamp strip 100 is exquisite, shows luminance height.
The encapsulation layer 30 covers each light emitting chip 20, and the encapsulation layer 30 is used for isolating the light emitting chips 20 from the external environment. The material of the package layer 30 is a light-transmitting material, so that the light emitted from the light-emitting chip 20 can be transmitted through the light-transmitting material. In the embodiment of the present application, the encapsulation layer 30 is formed by curing the encapsulation adhesive, and specifically, the encapsulation layer 30 is formed by spraying the encapsulation adhesive on each light emitting chip 20 by a spraying device.
It can be understood that, in this embodiment of the application, when the circuit structure 12 is powered on, the light emitting chip 20 is powered on and emits light toward all directions, wherein a portion of the light irradiates on the flexible reflection sheet 11, because the flexible reflection sheet 11 itself has a light reflection function, the light irradiating on the flexible reflection sheet 11 from the light emitting chip 20 can be reflected by the flexible reflection sheet 11 itself, that is, the light emitted from the flexible light bar 100 includes the light emitted from the light emitting chip 20 itself and the light reflected from the flexible reflection sheet 11, so as to enhance the light emitting brightness.
In the embodiment of the application, the circuit structure 12 is directly arranged on the flexible reflection sheet 11 to form the circuit board 10, and the flexible reflection sheet 11 has a light reflection effect, so that the circuit board 10 of the embodiment of the application has the light reflection effect, and compared with the existing LED lamp strip in the market, the circuit board 10 does not need to be coated with a light reflection coating, namely, the process step of coating the light reflection coating is omitted, so that the production process of the flexible lamp strip 100 is simplified, and the production efficiency of the flexible lamp strip 100 is improved; moreover, since the reflective coating is omitted, the material cost for coating the reflective coating is saved, and the production cost of the flexible light bar 100 is reduced.
It should be further noted that, in the production process of the existing LED light bar, the reflective coating is coated on the circuit board 10, and the encapsulation layer 30 is directly disposed on the reflective coating, that is, the encapsulation layer 30 is not directly contacted with the circuit board 10, and in the long-term working process, the encapsulation layer 30 is easily degummed, so that the LED light and the conductive circuit are exposed to affect the service life of the light bar; this application embodiment compares in current LED lamp strip through with direct spraying of encapsulated layer 30 on circuit board 10, and encapsulated layer 30 is direct to contact with circuit structure 12, because circuit structure 12 is unsmooth, can strengthen the compactness that encapsulated layer 30 is connected, avoids encapsulated layer 30 to come unstuck easily, guarantees the life of lamp strip.
Further, in the embodiment of the present application, the reflectivity of the flexible reflection sheet 11 is greater than 90%.
The reflectivity is a ratio of the reflected light intensity projected onto the object to the total light intensity projected onto the object, and the reflectivity of the flexible reflector plate 11 in the embodiment of the present application is greater than 90%, that is, the light absorbed by the flexible reflector plate is less, and the reflected light is more, compared with the existing reflective coating (the reflectivity of white oil is between 80% and 85%), the ability of reflecting light is strong, so that the light-emitting brightness of the flexible light bar 100 is significantly improved.
Referring to fig. 6, in the embodiment of the present application, the package layer 30 includes a plurality of sub-package portions 30a disposed at intervals, and each sub-package portion 30a covers one light emitting chip 20. Specifically, each light emitting chip 20 is dispensed with a glue by a spraying device to form the sub-packaging portion 30a, as shown in fig. 6, each sub-packaging portion 30a is shaped like a convex mirror structure, which has the function of dispersing light, and the light emitted by the light emitting chip 20 is dispersed to the periphery through the sub-packaging portion 30a, so that the light emitted by the flexible light bar 100 is uniform.
Of course, in other embodiments of the present application, please refer to fig. 7, the encapsulation layer 30 can also be formed by spraying the encapsulation glue on the whole circuit board 10 by a spraying device.
To further improve the production efficiency of flexible light bar 100, in the embodiment of the present application, light emitting chip 20 is packaged on circuit board 10 by chip-on-board packaging technology (i.e., COB packaging technology).
Chip-on-board packaging, i.e., COB packaging, specifically is a technology in which a bare chip is adhered to a circuit board by a conductive or non-conductive adhesive, then wire bonding is performed to achieve electrical connection, and the chip and a bonding wire are encapsulated by the adhesive. Compared with the traditional chip packaging technology, the chip-on-board packaging technology saves the process steps of reflow soldering and chip mounting, greatly improves the packaging efficiency, and further improves the whole production efficiency of the flexible light bar 100.
The embodiment of the application also provides a display device, which comprises a display module and a backlight module arranged on one side of the display module, wherein the backlight module comprises a flexible lamp strip based on the inventive concept. Specifically, the display device may be a product or an apparatus having a display function such as a television, a computer, or a display.
Because the display device comprises the flexible light bar based on the inventive concept, the circuit board of the flexible light bar comprises the flexible reflection sheet and the circuit structure arranged on one side of the flexible reflection sheet, the light emitting chip is electrically connected with the circuit structure, when the light emitting chip is electrified to emit light, the flexible reflection sheet can reflect the light emitted by the light emitting chip to the circuit board, namely, the circuit board has a light reflection function.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The preparation method of the flexible light bar, the flexible light bar and the display device provided by the embodiment of the application are described in detail above, a specific example is applied in the description to explain the principle and the implementation of the application, and the description of the above embodiment is only used to help understanding the method and the core concept of the application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A preparation method of a flexible light bar is characterized by comprising the following steps:
providing a flexible reflector, wherein the material of the flexible reflector comprises polyethylene terephthalate and titanium dioxide;
forming a circuit structure on the flexible reflector;
fixing a plurality of light-emitting chips on the circuit structure, and electrically connecting the plurality of light-emitting chips with the circuit structure;
and forming a packaging layer for coating each light-emitting chip on the flexible reflecting sheet.
2. The method of claim 1, wherein the forming a circuit structure on the flexible reflective sheet comprises:
and printing the circuit structure on the flexible reflecting sheet by adopting a screen printing process or a nano-imprinting process.
3. The method of claim 2, wherein the fixing a plurality of light emitting chips on the circuit structure and electrically connecting the plurality of light emitting chips to the circuit structure comprises:
the light-emitting chip is a MiniLED chip, and the MiniLED chip is fixed on the circuit structure by adopting a MiniLED die bonder; and
and carrying out line sintering to realize the electrical connection of the MiniLED chip and the circuit structure.
4. The method of claim 1, wherein the forming a circuit structure on the flexible reflective sheet comprises:
covering a copper foil on the flexible reflection sheet; and
and etching the circuit structure on the copper foil by adopting a photoetching process.
5. The method of claim 4, wherein the fixing of the plurality of light emitting chips to the circuit structure and the electrically connecting the plurality of light emitting chips to the circuit structure comprises:
printing an electric connecting piece on the circuit structure, wherein the electric connecting piece is made of a nano conductive material or low-temperature sintering solder paste; and
the chip is a MiniLED chip, and the MiniLED chip is connected with the electric connecting piece through circuit sintering so as to realize the electrical connection of the MiniLED chip and the circuit structure.
6. The method for manufacturing the flexible light bar of claim 1, wherein the forming of the encapsulation layer on the flexible reflective sheet to encapsulate each of the light emitting chips comprises:
and spraying the packaging glue to each light-emitting chip by a spraying device to form the packaging layer.
7. A flexible light bar, comprising:
the circuit board comprises a flexible reflection sheet and a circuit structure arranged on one side of the flexible reflection sheet;
the light-emitting chips are electrically connected with the circuit structure; and
the packaging layer is coated on each light-emitting chip;
the flexible reflection sheet comprises polyethylene glycol terephthalate and titanium dioxide, and can reflect light rays emitted by the light emitting chip.
8. The flexible light bar of claim 7, wherein the flexible reflective sheet has a reflectivity of greater than 90%.
9. The flexible light bar of claim 7, wherein the encapsulation layer comprises a plurality of sub-encapsulation portions arranged at intervals, and each sub-encapsulation portion encapsulates one light emitting chip.
10. A display device, comprising a display module and a backlight module disposed on one side of the display module, wherein the backlight module comprises the flexible light bar according to any one of claims 7 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210187586.1A CN114551418A (en) | 2022-02-28 | 2022-02-28 | Preparation method of flexible light bar, flexible light bar and display device |
| PCT/CN2022/134282 WO2023160057A1 (en) | 2022-02-28 | 2022-11-25 | Preparation method for flexible lamp strip, and flexible lamp strip and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210187586.1A CN114551418A (en) | 2022-02-28 | 2022-02-28 | Preparation method of flexible light bar, flexible light bar and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114551418A true CN114551418A (en) | 2022-05-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210187586.1A Pending CN114551418A (en) | 2022-02-28 | 2022-02-28 | Preparation method of flexible light bar, flexible light bar and display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114551418A (en) |
| WO (1) | WO2023160057A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023160057A1 (en) * | 2022-02-28 | 2023-08-31 | 深圳Tcl新技术有限公司 | Preparation method for flexible lamp strip, and flexible lamp strip and display device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120051855A (en) * | 2010-11-15 | 2012-05-23 | 엘지이노텍 주식회사 | Light emitting device package, and light source device and backlight unit having the same |
| CN109975903B (en) * | 2017-12-27 | 2021-10-01 | 宁波长阳科技股份有限公司 | Reflecting film and backlight source for liquid crystal display |
| CN110398857A (en) * | 2019-07-15 | 2019-11-01 | 青岛海信电器股份有限公司 | Micro-led lamp plate, its production method, backlight module and display device |
| KR20210047204A (en) * | 2019-10-21 | 2021-04-29 | 삼성전자주식회사 | Direct type back light device and display apparatus having the same |
| CN113270437A (en) * | 2020-02-17 | 2021-08-17 | 京东方科技集团股份有限公司 | Back plate, preparation method thereof and display device |
| CN111752045A (en) * | 2020-07-15 | 2020-10-09 | 武汉华星光电技术有限公司 | Backlight module and display device |
| CN114551418A (en) * | 2022-02-28 | 2022-05-27 | 深圳Tcl新技术有限公司 | Preparation method of flexible light bar, flexible light bar and display device |
-
2022
- 2022-02-28 CN CN202210187586.1A patent/CN114551418A/en active Pending
- 2022-11-25 WO PCT/CN2022/134282 patent/WO2023160057A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023160057A1 (en) * | 2022-02-28 | 2023-08-31 | 深圳Tcl新技术有限公司 | Preparation method for flexible lamp strip, and flexible lamp strip and display device |
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| WO2023160057A1 (en) | 2023-08-31 |
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