CN211670205U

CN211670205U - LED lamp strip

Info

Publication number: CN211670205U
Application number: CN201922375851.5U
Authority: CN
Inventors: 郭向茹
Original assignee: Skyworth LCD Shenzhen Co Ltd
Current assignee: Skyworth LCD Shenzhen Co Ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-10-13
Anticipated expiration: 2029-12-26

Abstract

The embodiment of the utility model discloses LED lamp strip. This LED lamp strip includes: a PCB board; the LED chip is arranged on the PCB; a lens covering the LED chip; and the fluorescent glue is detachably covered on the outer layer of the lens. The embodiment of the utility model provides a LED lamp strip structure is simpler, and manufacturing process and processing procedure are retrencied, peel off current fluorescent glue again, cover the colour coordinate that new fluorescent glue can realize adjusting LED lamp strip, and need not to prepare LED lamp strip again, have avoided the time of devices such as rewelding LED chip, lens, owing to only having changed fluorescent glue simultaneously, other original materials also can reuse, are favorable to reduce cost, shorten the change time.

Description

LED lamp strip

Technical Field

The utility model belongs to the LED shows the field, especially relates to a LED lamp strip.

Background

The light bar used in the present traditional direct type backlight is composed of a lens, an LED lamp and a PCB board. The LED lamp is characterized in that a normally-installed blue LED chip is welded on a support through silver adhesive, the positive and negative electrodes of the chip are connected with the positive and negative electrodes of the support through gold wire welding, then fluorescent glue is added to be heated and cured to form an LED single lamp, then the LED single lamp is welded on a PCB through tin paste, and a lens is fixed above the LED single lamp through epoxy resin to form a direct type LED lamp strip. When voltage is applied to the light bar, the LED chip on the support emits blue light, fluorescent powder in the fluorescent glue is excited to generate red and green light, and the excited red and green light is combined with the blue light emitted by the LED chip to form white light.

The white light color coordinate of the light bar obtained by the method mainly depends on the proportion of fluorescent powder and the using amount of fluorescent glue mixed with the fluorescent powder, the white light color coordinate of the prepared light bar is fixed, if the color coordinate needs to be changed, an LED single lamp needs to be replaced again, and the LED light bar needs to be prepared again, so that the process is complex, the using time is long, and the cost is increased.

Disclosure of Invention

In view of this, the utility model provides a LED lamp strip to.

In order to solve the technical problem, the utility model discloses a following technical scheme:

the utility model provides a LED lamp strip, include:

a PCB board;

the LED chip is arranged on the PCB;

a lens covering the LED chip;

and the fluorescent glue is detachably covered on the outer layer of the lens.

Preferably, when the LED chip is a normally-installed LED chip, the normally-installed LED chip is welded with a bonding pad on the PCB through a gold wire;

when the LED chip is the inverted LED chip, the inverted LED chip is directly welded with the welding pad on the PCB through solder paste.

Preferably, the LED chip is an LED chip emitting blue light, the phosphor powder in the phosphor gel is excited by the blue light emitted from the LED chip to generate red and green light, and the red and green light and the blue light emitted from the LED chip are combined to form white light.

Preferably, the lens is a transparent hemisphere, and the LED chip is disposed at a center of a bottom surface of the lens.

Preferably, the fluorescent glue is a peelable UV glue.

Preferably, the fluorescent glue comprises: acrylic resin, a photoinitiator and fluorescent powder.

Preferably, the thickness of the fluorescent glue is 2-4 microns.

Preferably, a heat conducting glue is further arranged between the LED chip and the PCB.

Preferably, the edge of the lens attached to the fluorescent glue is provided with an inner groove.

The utility model provides a pair of in LED lamp strip, the structure is simpler, manufacturing process and processing procedure are retrencied, and when the color coordinate of LED lamp strip needs to be changed, only need adjust the phosphor powder in the fluorescent glue according to the color coordinate demand, peel off current fluorescent glue again, cover the color coordinate that new fluorescent glue can realize adjusting LED lamp strip, and need not to prepare LED lamp strip again, the time of welding LED chip again has been avoided, devices such as lens, simultaneously because only changed the fluorescent glue, other original materials also can reuse, be favorable to reduce cost, shorten the change time.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only part of the embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is an angle view of an LED light bar according to a first embodiment of the present invention;

fig. 2 is an angle view of a LED light bar provided by the present invention.

Detailed Description

The technical solution in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of some, and not restrictive, of the current application. It should be further noted that, based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without any creative effort belong to the protection scope of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, the terms "first," "second," and the like may be used herein to describe various orientations, actions, steps, elements, or the like, but the orientations, actions, steps, or elements are not limited by these terms. These terms are only used to distinguish one direction, action, step or element from another direction, action, step or element. For example, a first region may be referred to as a second region, and similarly, a second region may be referred to as a first region, without departing from the scope of the present invention. The first region and the second region are both regions, but they are not the same region. The terms "first", "second", etc. are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. It should be noted that when one portion is referred to as being "secured to" another portion, it may be directly on the other portion or there may be an intervening portion. When a portion is said to be "connected" to another portion, it may be directly connected to the other portion or intervening portions may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Before discussing exemplary embodiments in more detail, it should be noted that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart may describe the steps as a sequential process, many of the steps can be performed in parallel, concurrently or simultaneously. In addition, the order of the steps may be rearranged. A process may be terminated when its operations are completed, but may have additional steps not included in the figure. A process may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc.

Example one

The embodiment provides an LED light bar, which can be applied to a direct type liquid crystal display LED backlight source, and relates to products which can exemplarily comprise large-size liquid crystal displays such as televisions, commercial displays and billboard illumination or simple backlight products.

Referring to fig. 1, for the embodiment of the present invention provides a LED light bar with an angle view, in this embodiment, the LED light bar includes: a PCB board 10; an LED chip 20 disposed on the PCB board 10; a lens 30 covering the LED chip 20; and the fluorescent glue 40 is detachably covered on the outer layer of the lens 30.

Compared with the traditional direct type LED light bar, the LED light bar provided by the embodiment omits an LED bracket, so that a structure similar to that of a single LED lamp in the traditional direct type LED light bar does not exist, the LED chip 20 is directly welded on the PCB 10, correspondingly, the LED chip comprises an inverted pile LED chip and a forward-installed LED chip (not shown), and when the LED chip 20 is the forward-installed LED chip, the forward-installed LED chip is welded with a bonding pad (not shown) on the PCB 10 through gold wires; when the LED chip 20 is a flip LED chip, the flip LED chip is directly soldered to the pad on the PCB board 10 by solder paste.

The lens 30 is used to increase the light-emitting angle, and may be made of a transparent material, and it should be understood that the term "transparent" refers to the light emitted from the LED chip 20, i.e. the light emitted from the LED chip 20 has substantially no color coordinate change after passing through the lens 30. Thus, depending on the wavelength of light emitted by the LED chip 20, the lens 30 may comprise different materials, including but not limited to: glass, epoxy, plastic, thermoset or thermoplastic resins or other light transmissive materials commonly used in the art for LED packaging.

The LED chip 20 and the phosphor in the phosphor paste 40 are cooperatively arranged to emit light with a designated color coordinate, specifically: the LED chip 20 emits light of a fixed color after being powered on, the phosphor in the phosphor glue 40 is excited by the light emitted from the LED chip 20 to generate light of another color, and the light of the two colors can emit light of a designated color coordinate after being combined.

For example, in some embodiments, the LED chip 20 is a blue light emitting LED chip, and the phosphor powder in the phosphor glue 40 is excited by the blue light emitted from the LED chip 20 to generate red and green light, which is combined with the blue light emitted from the LED chip 20 to form white light. It is understood that when the LED chip 20 is not changed and the phosphor paste 40 mixed with the phosphor is changed, when the phosphor in the phosphor paste 40 is different, the color coordinates of the finally generated light are also different. The fluorescent glue 40 is arranged on the outermost layer of the LED light bar based on the principle, and the fluorescent glue 40 is covered on the outer layer of the lens 30 in a separable covering manner, so that the design purpose is as follows: can need not to replace LED single lamp again when the light of the different color coordinates of user demand, also need not to prepare LED lamp strip again, only need peel off the outer fluorescent glue 40 that covers of current lens 30, cover again new fluorescent glue 40 can, as long as the light that the light of the color coordinates that new fluorescent glue 40 cooperation LED chip 20 can produce the demand can satisfy the user demand.

Compared with the traditional direct type LED lamp strip which is not provided with an LED bracket and an LED single lamp dispensing process, the LED lamp strip provided by the embodiment has a novel lamp strip structure, is simpler in structure, simplified in manufacturing process and manufacturing procedure, can realize the adjustment of the color coordinate of the LED lamp strip only by adjusting fluorescent powder in fluorescent glue according to the color coordinate requirement and stripping the current fluorescent glue and covering the new fluorescent glue when the color coordinate of the LED lamp strip needs to be changed, does not need to prepare the LED lamp strip again, avoids the time for re-welding devices such as an LED chip, a lens and the like, can recycle other original materials due to the replacement of the fluorescent glue, is beneficial to reducing the cost and shortening the replacement time, and can be known according to the prior art that the fluorescent glue is influenced by temperature to a certain extent, the LED chip can generate heat during working, the traditional LED lamp strip covers the fluorescent glue on the LED chip, and the LED chip directly contacts with the heat generated by the LED chip during working, and lens is separated from between LED chip and the fluorescent glue in this application, therefore the fluorescent glue can not receive the heat influence that the LED chip sent.

Preferably, in some embodiments, the lens 30 is a transparent hemisphere, and the LED chip 0 is disposed at a center of a bottom surface of the lens 30. The lens 30 adopting the hemisphere is beneficial to enlarging the light emitting angle, the LED chip 20 is arranged at the center of the bottom surface of the hemisphere to ensure uniform light emitting, specifically, the specific shape of the lens 30 can be changed according to actual conditions and requirements, for example, the top of the lens 30 (the side far away from the LED chip 20) is flat.

In order to achieve the functions of separating the fluorescent glue 40 and generating a specific light when the LED chip 20 is excited, the fluorescent glue 40 in the present embodiment should include: acrylic resin, photoinitiator and phosphor powder, acrylic resin is the coating common material, and the phosphor powder is used for producing corresponding light in response to LED chip 20 excitation, and photoinitiator is used for realizing evenly fixing fluorescent glue 40 in lens 30 skin, in order to realize the light-emitting effect of preferred, generally the thickness of fluorescent glue 40 is 2 ~ 4 microns.

Preferably, in some embodiments, the fluorescent glue 40 is a peelable UV glue, the peelable UV glue has a low shrinkage rate, is good in flexibility, is easy to peel off, does not break, is good in water resistance and weather resistance, does not corrode a substrate, and is a severe working environment of the LED light bar in some application scenes, and considering that light with a specified color coordinate cannot be emitted after peeling the fluorescent glue 40, the fluorescent glue 40 needs to be ensured to have good adaptability without being directly acted by an external force, and the peelable UV glue in the prior art can meet the requirement to a certain extent and does not have adverse effects on the lens 30. The peelable UV glue is mixed with a photoinitiator and fluorescent powder, and after the PCB 10, the LED chip 20 and the lens 30 are fixed, the peelable UV glue can be brushed to the outer surface of the lens 30 and then irradiated by an ultraviolet lamp with a specified wavelength (such as 365nm), so that the peelable UV glue is fixed on the outer layer of the lens 30.

Preferably, in some embodiments, in consideration of the heat generation problem of the LED chip 20, a heat conductive adhesive (not shown) is further disposed between the LED chip 20 and the PCB board 10 for dissipating heat generated by the LED chip 20 during operation through a larger heat dissipation area.

Preferably, in some embodiments, considering that the fluorescent glue 40 is peelable, it is required to satisfy the requirement that it is easy to peel off and ensure that it is not easy to automatically separate itself when not being subjected to external force, an inner groove is provided at the edge of the lens 30 where it is attached to the fluorescent glue 40, such as the LED light bar shown in fig. 2, fig. 2 shows only the condition that an inner groove is provided at a position on the lens 30, actually, a plurality of inner grooves can be set according to different requirements or the inner groove is formed around the two attachment positions for one circle, the fluorescent glue 40 is covered to just contact the inner groove wall, so the fluorescent glue 40 can be fixed and then the lens 30 can be buckled by the shape of itself, and when the user peels, the fluorescent glue can be directly buckled by the inner groove to easily peel off the edge.

In preferred embodiment, the LED lamp strip that provides has further given the more specific constitution of some devices, and the LED lamp strip that this embodiment provided is known and implemented to the technical staff of the field of being more convenient for, and it is simpler to provide a processing procedure, and material reuse rate is high, and the replacement cost is low, and the heat dissipation is good, and adaptability is good to through setting up the inner groovy with fluorescent glue laminating edge on lens and further avoided the automation of fluorescent glue to drop, also made things convenient for the manual fluorescent glue that peels off of user.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. An LED light bar, comprising:

a PCB board;

the LED chip is arranged on the PCB;

a lens covering the LED chip;

and the fluorescent glue is detachably covered on the outer layer of the lens.

2. The LED light bar of claim 1, wherein:

when the LED chip is a normally-installed LED chip, the normally-installed LED chip is welded with a bonding pad on the PCB through a gold thread;

3. The LED light bar of claim 1, wherein the LED chip is a blue light emitting LED chip, the fluorescent glue is excited by the blue light emitted by the LED chip to generate red and green light, and the red and green light and the blue light emitted by the LED chip are combined to form white light.

4. The LED lamp strip of claim 1, wherein the lens is a transparent hemisphere, and the LED chip is disposed at a center of a bottom surface of the lens.

5. The LED light bar of claim 1, wherein the fluorescent glue is a peelable UV glue.

6. The LED light bar of claim 1, wherein the thickness of the fluorescent glue is 2-4 microns.

7. The LED light bar of claim 1, wherein a heat conducting adhesive is further disposed between the LED chip and the PCB.

8. The LED light bar of claim 1, wherein the lens is provided with an inner groove at the edge where the lens is attached to the fluorescent glue.