CN211475607U

CN211475607U - Backlight module structure of panel

Info

Publication number: CN211475607U
Application number: CN201920995095.3U
Authority: CN
Inventors: 李宛儒
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2020-09-11
Anticipated expiration: 2029-06-28

Abstract

The utility model discloses a backlight module structure of a panel, which consists of a panel and a backlight source, wherein the backlight source comprises a circuit board and a plurality of luminous wafers, the tops of the front sides of the luminous wafers are covered with a light diffusion layer; the light emitting chips with the light diffusion layers covered on the tops of the front surfaces are fixed on the circuit board to form the backlight source; the panel is arranged above the backlight source, thereby forming the backlight module structure of the panel. The utility model discloses a backlight unit structure can use in more slim or light-duty panel product of design, has solved the unable effectual less or problem of reducing of whole thickness or the volume of panel product in the present industry.

Description

Backlight module structure of panel

Technical Field

The utility model relates to an optical equipment technical field especially relates to a backlight unit structure of panel.

Background

The backlight module structure of the current panel usually comprises an optical lens or a film and a diffusion plate, and the function of the backlight module structure is to reduce the light-emitting bright spots of the light source by using the optical lens or the film and the diffusion plate so as to make the light emitted by the light source uniform. However, the optical lens, the diffuser plate and the light source need to be spaced at a certain distance to perform the atomization effect, so that the bright spots are reduced and the luminance or the surface illuminance of the bright spots are uniform, and the overall thickness or volume of the final panel product cannot be effectively reduced or reduced. Therefore, the backlight module structure provided by the prior art cannot be applied to a panel product with a thin or light design.

SUMMERY OF THE UTILITY MODEL

In view of the above technical problem, in order to meet the industrial requirements, the present invention provides a backlight module structure without using an optical lens as a panel constituting a component, which can be applied to a panel product designed to be thinner or lighter, and solves the problem that the overall thickness or volume of the panel product in the current industry cannot be effectively reduced or reduced.

The present invention provides a backlight module structure of a panel, which is composed of a panel and a backlight source, wherein the backlight source comprises a circuit board and a plurality of light emitting chips with light diffusion layers covering the tops of the front sides; the light emitting chips with the light diffusion layers covered on the tops of the front surfaces are fixed on the circuit board to form the backlight source; and the panel is arranged above the backlight source, thereby forming the backlight module structure of the panel.

Specifically, the structural mode of the light-emitting wafer includes a light-emitting wafer with a nano-thickness coating prepared by a wafer level packaging process, a light-melting adhesive structure, a dispensing structure, a bonding structure of a light-emitting film body, or a combination of at least two of the structures.

Specifically, the light-emitting wafer with the nano-thickness coating layer in the wafer level packaging process is formed by coating a light-emitting powder layer on the surface of the wafer.

Specifically, the molten luminous adhesive structure is a structure with an outer layer containing high-molecular glue and an inner layer containing luminous powder, and the appearance of the molten luminous adhesive structure comprises a film shape or a hemispherical water drop shape.

Specifically, the dispensing structure and the light-melting glue structure are the same, but the process flows are different.

Specifically, the structure of the light-emitting film body is a structure with a surface layer made of a thin film made of polymer glue and an internal light-emitting powder body.

Specifically, the light-emitting powder layer includes polymer glue, silica gel, epoxy resin or a combination thereof.

Specifically, the luminescent powder layer is formed by luminescent powder or a luminescent film body.

Specifically, the luminescent powder comprises fluorescent powder, phosphor powder or any powder capable of guiding light.

Specifically, the light-emitting film body comprises polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silica gel, wax or paraffin.

Specifically, the light diffusion layer comprises polymer glue, silica gel, epoxy resin, a material for atomizing the light diffusion layer, or a combination of at least two of the materials.

Preferably, the polymer glue contains polyvinyl alcohol or polyvinyl acetate.

Specifically, the light diffusion layer has light transmittance of 10-90%.

Specifically, the light diffusion layer has 20-50% of light transmittance.

The technical features of the utility model a plurality of positive tops cover the light emitting wafer on light diffusion layer be five light-emitting, because this light diffusion layer has the function of regulation and control light-emitting luminance and preventing the bright spot and produce, and all the other light-emitting luminance that do not cover four play plain noodles on this light diffusion layer can even whole light emitting wafer's light-emitting luminance. Therefore, when the light-emitting chips of the light diffusion layer are covered on the top of the front surfaces, the core component of the backlight module structure of the panel of the present invention is provided. Accordingly, the advantages and unexpected effects of the backlight module structure of the panel of the present invention include: (1) the utility model directly uses the light diffusion layer to cover the top of the front side of the light-emitting chip to achieve the effect of self-atomization of the light source; (2) no optical lens is used, thereby achieving the purpose of light-weight or thin design of the panel; (3) the visual flaw of bright points of the panel product can not be caused; and (4) the backlight source in the backlight structure keeps five-surface light emitting and has uniform luminosity or surface illumination.

To sum up, the backlight unit structure of panel that provides has used the positive play plain noodles of innovation to cover and has had the luminous wafer on light diffusion layer, so the backlight unit structure of panel do not use optical lens, and the backlight has five luminous, top light-emitting self-atomization, reduces light-emitting bright spot and even luminosity or the advantage and the function of face illuminance, consequently is particularly suitable for using at the panel product of slim or light-duty design, has fully overcome present technical bottleneck, reaches the purpose of industry demand.

Drawings

Fig. 1 is a schematic diagram of a backlight module structure of a panel according to an embodiment of the present invention; and

fig. 2 is a schematic diagram of a backlight module structure of a panel of a wafer level packaging process according to an embodiment of the invention.

[ description of main element symbols ]

100: backlight module structure of panel

110: panel 1

120: light diffusion layer 1

130: light emitting chip

140: circuit board 1

200: backlight module structure of wafer packaging level panel

210: circuit board 2

220: wafer with a plurality of chips

230: luminous powder layer

240: light diffusion layer 2

250: panel 2

Detailed Description

The foregoing and other features, aspects and utilities of the present invention will be apparent from the following more particular description of the preferred embodiments, as illustrated in the accompanying drawings. In order that the invention may be more fully understood, specific steps and components thereof will be set forth in the following description. It is apparent that the practice of the invention is not limited to the specific details known to those skilled in the art. In other instances, well-known components or steps have not been described in detail so as not to unnecessarily obscure the present invention. The present invention is described in detail in the following preferred embodiments, but the present invention can be widely applied to other embodiments in addition to the detailed description, and the scope of the present invention is not limited by the claims.

According to the first embodiment of the present invention, the present invention provides a backlight module structure 100 of a panel, wherein each component configuration is as shown in fig. 1, and the backlight module structure of the panel comprises: the backlight module structure 100 of the panel is formed by a panel 110 and a backlight source which is arranged in a space below the panel 110 and consists of a plurality of light emitting chips 130 with light diffusion layers 120 on the top of the front surfaces and a circuit board 140.

Specifically, the fabrication of the plurality of light emitting chips includes the fabrication of a light emitting chip by a wafer level packaging process, the fabrication of a fusion light emitting adhesive, the fabrication of a dispensing, the bonding of a light emitting film body, or a combination thereof.

Specifically, the light diffusion layer comprises polymer glue, silica gel, epoxy resin, atomized material or combination thereof. In a preferred embodiment, the light diffusion layer comprises glue and said material for atomizing it.

In one embodiment, the backlight module structure of the panel of the present invention is applied to the design of the panel product with thin or light weight.

Described below are embodiments of a backlight module structure of a panel of light emitting wafers using a wafer level packaging process.

In one embodiment, the technical feature of the wafer level packaging process is that a light-emitting powder layer is coated on the surface of a wafer, thereby forming a light-emitting wafer of the wafer level packaging process.

In one embodiment, the light-emitting powder layer includes polymer glue, silica gel, epoxy resin or a combination thereof.

In one embodiment, the light-emitting powder layer is formed by light-emitting powder or a light-emitting film body.

In one embodiment, the luminescent powder comprises phosphor powder, phosphor powder or any powder capable of guiding light.

In one embodiment, the light-emitting film body includes polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silica gel, wax or paraffin.

In one embodiment, the backlight module structure 200 of the present invention is illustrated in fig. 2. It comprises a circuit board 210, wherein the circuit board 210 comprises a copper foil circuit substrate or a flexible substrate; fixing a wafer 220 on the surface of the circuit board 210; coating and fixing the luminescent powder layer 230 on the surface of the wafer 220, wherein the luminescent powder layer 230 and the surface of the wafer 220 can be cured by ultraviolet irradiation, hot melt pressing or heating, so that the luminescent powder layer 230 and the surface of the wafer 220 are not peeled off from the surface of the wafer 220; covering the light diffusion layer 240 on the top of the front surface of the wafer for covering and fixing the light emitting powder layer to form the light emitting wafer with the light diffusion layer covered on the top of the front surface, wherein the covering mode comprises a spraying or dispensing procedure; the panel 250 is placed in the space above the light-emitting chip covered with the light diffusion layer on the top of the front surface, thereby forming the backlight module structure 200 of the panel.

In one embodiment, the light diffusion layer comprises a polymer glue, a silica gel, an epoxy resin, a material for atomizing the polymer glue, or a combination thereof. In a preferred embodiment, the light diffusion layer comprises glue and said material for atomizing it. Specifically, the function of the material for atomizing the light is to enable the light diffusion layer to perform the light atomization effect, so as to prevent the bright spots from being generated on the light-emitting surface on the top of the front surface of the light-emitting chip.

In one embodiment, the light diffusion layer has a light transmittance of 10 to 90%. Preferably, the light diffusion layer has a light transmittance of 20 to 50%.

To sum up, the utility model provides a its backlight structure of main technical characterized in that of backlight module structure of panel is that the front top covers has the luminous wafer of light diffusion layer, and this front top covers the luminous wafer that has the light diffusion layer is five light-emitting, and its front top covers can regulate and control light brightness and prevent the light diffusion layer that the bright spot produced, and other four play plain noodles then do not cover completely the light diffusion layer, so its light-emitting brightness can be even whole luminous wafer's light-emitting brightness. Accordingly, the advantages and unexpected effects of the backlight module structure of the panel of the present invention include: (1) the utility model directly uses the light diffusion layer to cover the top of the front side of the light-emitting chip to achieve the effect of self-atomization of the light source; (2) an optical lens and a diffusion plate are not used, so that the purpose of light-weight or thin design of the panel is achieved; (3) the visual flaw of bright points of the panel product can not be caused; and (4) the backlight source in the backlight module structure keeps five-surface light emitting, and has uniform luminosity or surface illumination.

Although the present invention has been described with reference to specific examples, the scope of the present invention is not limited thereto, and those skilled in the art will appreciate that various modifications and changes can be made without departing from the spirit and scope of the present invention. Furthermore, the method is simple.

Claims

1. A backlight module structure of a panel is characterized in that the structure is composed of the panel and a backlight source, wherein the backlight source comprises a circuit board and a plurality of light emitting chips with light diffusion layers covered on the tops of the front surfaces; the light emitting chips with the light diffusion layers covered on the tops of the front surfaces are fixed on the circuit board so as to form the backlight source; and the panel is arranged above the backlight source, thereby forming the backlight module structure of the panel.

2. The backlight module structure of claim 1, wherein the light emitting chip has a structure pattern of a light emitting chip with a nano-thickness coating, a glue melting structure, a dispensing structure, a bonding structure of a light emitting film body, or a combination of at least two of the above structures.

3. The backlight module structure of claim 2, wherein the light-emitting chip with the nano-thickness coating has a structure of coating a light-emitting powder layer on the surface of the chip.

4. The backlight module structure of claim 3, wherein the light-emitting powder layer comprises polymer glue, silica gel or epoxy resin.

5. The backlight module structure of claim 3, wherein the light-emitting powder layer is formed by light-emitting powder or a light-emitting film.

6. The backlight module structure of claim 5, wherein the light-emitting powder comprises phosphor or phosphor.

7. The backlight module structure of claim 5, wherein the light-emitting film comprises polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silica gel, wax or paraffin.

8. The backlight module structure of claim 1, wherein the light diffusion layer has a light transmittance of 10-90%.

9. The backlight module structure of claim 7, wherein the light diffusion layer has a light transmittance of 20-50%.