CN211475565U

CN211475565U - Light source structure of lighting equipment

Info

Publication number: CN211475565U
Application number: CN201920996281.9U
Authority: CN
Inventors: 李宛儒
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-06-28
Filing date: 2019-06-28
Publication date: 2020-09-11
Anticipated expiration: 2029-06-28

Abstract

The utility model discloses a light source structure of lighting equipment, which comprises a circuit board and a plurality of light-emitting wafers, wherein the top parts of the front surfaces of the light-emitting wafers are covered with optical coatings; the light emitting chips with the optical coatings covered on the tops of the front surfaces are fixed on the circuit board, so that the light source structure is formed. The utility model discloses a light source structure can use in the illumination product of slimming or light-duty design, has solved the unable problem less or dwindle effectively of lighting apparatus's in the present industry thickness and volume.

Description

Light source structure of lighting equipment

Technical Field

The utility model relates to an optical equipment technical field especially relates to a lighting apparatus's light source structure.

Background

The light source module of the present illumination device usually includes an optical lens or a film and a diffusion plate, and the function of the light source module is to reduce the light emitting illumination point of the light source by using the optical lens or the film and the diffusion plate, so that the light emitting illumination is uniform. However, the optical lens, the diffusion plate and the light source need to be spaced at a certain distance to perform the atomization effect, so that the bright spots are reduced and the luminance or the surface illuminance of the light source is uniform, and the thickness or the volume of the final lighting device cannot be effectively reduced or reduced. Therefore, the light source structure provided by the prior art cannot be applied to lighting products with thin or light design.

In view of the above, in the lighting industry, it is an important issue to develop a light source structure with less use of optical lens or diffusion plate.

SUMMERY OF THE UTILITY MODEL

In view of the above technical problem, in order to meet the industrial requirements, the present invention provides a light source structure of an illumination device that does not use an optical lens as a component, which can be applied to a thinned or lightened illumination product, and solves the problem that the thickness and volume of the illumination device in the industry at present cannot be effectively reduced or reduced.

An object of the present invention is to provide a light source structure of an illumination device, the structure includes a circuit board and a plurality of light emitting chips with optical coatings covering the tops of the front surfaces; the light emitting chips with the optical coatings covered on the tops of the front surfaces are fixed on the circuit board, so that the light source structure of the lighting device is formed.

Specifically, the structural mode of the light-emitting wafer includes a light-emitting wafer with a nano-thickness coating prepared by a wafer level packaging process, a light-melting adhesive structure, a dispensing structure, a bonding structure of a light-emitting film body, or a combination of at least two of the structures.

Specifically, the light-emitting wafer with the nano-thickness coating has a structure that a light-emitting powder layer is coated on the surface of the wafer.

Specifically, the molten luminous adhesive structure is a structure with an outer layer containing high-molecular glue and an inner layer containing luminous powder, and the appearance of the molten luminous adhesive structure comprises a film shape or a hemispherical water drop shape.

Specifically, the dispensing structure and the light-melting glue structure are the same, but the process flows are different.

Specifically, the structure of the light-emitting film body is a structure with a surface layer made of a thin film made of polymer glue and an internal light-emitting powder body.

Specifically, the light-emitting powder layer comprises polymer glue, silica gel or epoxy resin. Specifically, the luminescent powder layer is formed by luminescent powder or a luminescent film body.

Specifically, the luminescent powder comprises fluorescent powder, phosphor powder or any powder capable of guiding light.

Specifically, the light-emitting film body comprises polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silica gel, wax or paraffin.

Specifically, the optical coating includes polymer glue, silica gel, epoxy resin, a material for atomizing the optical layer, or a combination of at least two of the materials.

Preferably, the polymer glue contains polyvinyl alcohol or polyvinyl acetate.

Specifically, the optical coating has light transmittance of 10-90%.

Specifically, the chemical coating has 20-50% of light transmittance.

The technical features of the utility model be characterized in that a plurality of positive tops cover optical coating's luminous wafer be five light-emitting, because this optical coating has the function of regulation and control light-emitting luminance and preventing the bright spot and produce, and all the other light-emitting luminance that do not cover four play plain noodles of this optical coating can be even whole luminous wafer's light-emitting luminance. Therefore, the above-mentioned light emitting chips with the optical coating covered on the top of the front surface are the core components of the light source structure of the lighting device of the present invention.

Accordingly, the advantages and unexpected effects of the light source structure of the lighting device of the present invention include: (1) the utility model directly uses the optical coating to cover the top of the front surface of the luminous wafer to achieve the effect of self-atomization of the light source; (2) no optical lens is used, thereby achieving the purpose of light-weight or thin design of the lighting equipment; (3) visual defects of bright points of the lighting equipment can not be caused; and (4) the light source keeps the light from five surfaces and has uniform luminosity or surface illumination.

To sum up, lighting apparatus's light source structure has used the front of innovation to go out the plain noodles and has covered the luminous wafer that has optical coating, so lighting apparatus's light source structure do not use optical lens, and have five luminous, top light-emitting self-atomization, reduce light-emitting bright spot and even luminosity or the advantage and the function of face illuminance, consequently be particularly suitable for using at the lighting apparatus of slim or light-duty design, fully overcome present technical bottleneck, reach the purpose of industry demand.

Drawings

Fig. 1 is a schematic view of a light source structure of a lighting device according to an embodiment of the present invention; and

fig. 2 is a schematic diagram of a light source structure of an illumination apparatus of a wafer level packaging process according to an embodiment of the present invention.

[ description of main element symbols ]

100: light source structure of lighting equipment

110: optical coating 1

120: light emitting chip

130: circuit board 1

200: light source structure of chip packaging level lighting equipment

210: circuit board 2

220: wafer with a plurality of chips

230: luminous powder layer

240: optical coating 2

Detailed Description

The foregoing and other features, aspects and utilities of the present invention will be apparent from the following more particular description of the preferred embodiments, as illustrated in the accompanying drawings. In order that the invention may be more fully understood, specific steps and components thereof will be set forth in the following description. It is apparent that the practice of the invention is not limited to the specific details known to those skilled in the art. In other instances, well-known components or steps have not been described in detail so as not to unnecessarily obscure the present invention. The preferred embodiments of the present invention will be described in detail below, however, the present invention can be widely practiced in other embodiments other than those described in the detailed description, and the scope of the present invention is not limited by the claims.

According to the first embodiment of the present invention, the present invention provides a light source structure 100 of a lighting device, wherein each component configuration is as shown in fig. 1, and the light source structure of the lighting device includes: a circuit board 130 and a plurality of light emitting dies 120 having optical coatings 110 on top of their frontsides; the light emitting chips 120 with the optical coating 110 on the top of the front surface are fixed on the circuit board 130, thereby forming the light source structure 100 of the lighting device.

Specifically, the fabrication of the plurality of light emitting chips includes the fabrication of a light emitting chip by a wafer level packaging process, the fabrication of a fusion light emitting adhesive, the fabrication of a dispensing, the bonding of a light emitting film body, or a combination thereof.

Specifically, the optical coating comprises polymer glue, silica gel, epoxy resin, atomized material or combination thereof. In a preferred embodiment, the optical coating comprises glue and the material for atomizing.

In one embodiment, the light source structure of the lighting device of the present invention is applied to the design of the lighting device with a thin or light structure.

Described below are embodiments of a light source structure of a lighting apparatus using a light emitting wafer of a wafer level packaging process.

In one embodiment, the technical feature of the wafer level packaging process is that a light-emitting powder layer is coated on the surface of a wafer, thereby forming a light-emitting wafer of the wafer level packaging process.

In one embodiment, the light-emitting powder layer includes polymer glue, silica gel, epoxy resin or a combination thereof.

In one embodiment, the light-emitting powder layer is formed by light-emitting powder or a light-emitting film body.

In one embodiment, the luminescent powder comprises phosphor powder, phosphor powder or any powder capable of guiding light.

In one embodiment, the light-emitting film body includes polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silica gel, wax or paraffin.

In one embodiment, the light source structure 200 of the lighting device of the present invention is configured as shown in fig. 2. It comprises a circuit board 210, wherein the circuit board 210 comprises a copper foil circuit substrate or a flexible substrate; securing the wafer 220 on the surface of the circuit board 210; coating and fixing the luminescent powder layer 230 on the surface of the wafer 220, wherein the step can use an ultraviolet irradiation, a hot melt pressing or a heating mode to enable the luminescent powder layer 230 and the surface of the wafer 220 to generate a curing effect so as not to be peeled off from the surface of the wafer 220; covering the optical coating 240 on the top of the front surface of the wafer for covering and fixing the light-emitting powder layer forms the light source structure 200 including the light-emitting wafer with the optical coating on the top of the front surface, wherein the covering manner of the optical coating includes a spraying or dispensing procedure.

In one embodiment, the optical coating comprises a polymer glue, a silica gel, an epoxy resin, a material for atomizing the polymer glue, or a combination thereof. In a preferred embodiment, the optical coating comprises glue and said material for atomizing it. Specifically, the function of the material for atomizing the optical coating is to enable the optical coating to exert a light ray atomizing effect and prevent the bright spot from being generated on the light-emitting surface on the top of the front surface of the light-emitting chip.

In one embodiment, the optical coating has a light transmittance of 10 to 90%. Preferably, the optical coating has a light transmittance of 20 to 50%.

To sum up, the utility model provides a lighting apparatus's light source structure's its light source structure of main technical feature contains that the front top covers has optical coating's luminous wafer, and this front top covers the luminous wafer that has optical coating is five light-emitting, and its front top covers can regulate and control light brightness and prevent the optical coating that the bright spot produced, and other four play plain noodles then do not cover completely optical coating, so its light-emitting brightness can be even whole luminous wafer's light-emitting brightness. Accordingly, the advantages and unexpected effects of the light source structure of the lighting device of the present invention include: (1) the utility model directly uses the optical coating to cover the top of the front surface of the luminous wafer to achieve the effect of self-atomization of the light source; (2) an optical lens and a diffusion plate are not needed, so that the purpose of light-weight or thin design of the lighting equipment is achieved; (3) visual defects of bright points of the lighting equipment can not be caused; and (4) the light source structure keeps the light from five surfaces, and has uniform luminosity or surface illumination.

Although the present invention has been described with reference to specific examples, the scope of the present invention is not limited thereto, and those skilled in the art will appreciate that various modifications and changes can be made without departing from the spirit and scope of the present invention.

Claims

1. A light source structure of lighting equipment is characterized by comprising a circuit board and a plurality of light emitting chips, wherein the top of the front surface of each light emitting chip is covered with an optical coating; the light emitting chips with the top surfaces covered with the optical coatings are fixed on the circuit board, so that the light source structure of the lighting device is formed.

2. The light source structure of claim 1, wherein the structural aspect of the light emitting chip comprises a light emitting chip with a nano-thickness layer, a fused light emitting adhesive structure, a dispensing structure, a bonding structure of a light emitting film body, or a combination of at least two of the above structures.

3. The light source structure of claim 2, wherein the light emitting wafer with the nano-thickness layer has a structure with a light emitting powder layer coated on the surface of the wafer.

4. The light source structure of claim 3, wherein the light-emitting powder layer comprises polymer glue, silica gel or epoxy resin.

5. The light source structure of claim 3, wherein the luminescent powder layer is formed by luminescent powder or luminescent film.

6. The light source structure of claim 5, wherein the luminescent powder comprises phosphor or phosphor.

7. The light source structure of claim 5, wherein the light-emitting film body comprises polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silica gel, wax or paraffin.

8. The light source structure of claim 1, wherein the optical coating has a light transmittance of 10-90%.

9. The light source structure of the lighting apparatus as claimed in claim 7, wherein the optical coating has a light transmittance of 20-50%.