TW202045965A - A method for fabricating a lens-less backlight source device and its application thereof - Google Patents

Abstract

The invention provides a method for fabricating a lens-less backlight source device and its application thereof. The method comprises: provide a circuit board, place light emitting chips on the circuit board, cover a diffusion layer on the top surface of the light emitting chips to form surface modifying light emitting chips, and place a backlight module on the space above the surface modifying light emitting chips to form the lens-less backlight source device.

Description

Preparation method and application of lensless backlight device

The invention relates to a method for preparing a lensless backlight device. In particular, the backlight is a light-emitting chip with a modified surface.

The backlight of the conventional panel or lighting device uses a lens and a diffuser to reduce the bright spot of the light source, so that it emits uniformly. However, the lens, the diffuser and the backlight need to be separated by a certain distance to play the fogging effect, reduce the bright spots and make the brightness or surface illumination uniform. Therefore, the light-emitting element provided by the prior art cannot be used in the manufacture of thinner or lighter panels or lighting devices.

To sum up, in the current panel or lighting industry, the development of a manufacturing technology for a backlight device that reduces the use of lens elements is an important issue to be solved and developed.

In view of the above-mentioned background of the invention, in order to meet the requirements of the industry, the present invention provides a method for manufacturing a lensless backlight device to solve the above-mentioned insurmountable problems and achieve the goals required by the industry.

The object of the present invention is to provide a method for manufacturing a lensless backlight device, which includes: providing a circuit board; placing a plurality of light-emitting chips on the circuit board; and covering the top of the front surface of the plurality of light-emitting chips with a diffuser The adhesive layer is used to form a surface-modified light-emitting chip on the circuit board; and a backlight module is placed in the space above the surface-modified light-emitting chip, thereby forming the lensless backlight device .

Specifically, the manufacturing implementation of the light-emitting chip includes wafer-level packaging, luminescent glue, dispensing, bonding of light-emitting film bodies, or a combination thereof.

The technical feature of the present invention is that the surface-modified light-emitting chip emits light from five sides, and the top of the front surface is covered with a diffuser layer that can regulate the brightness of the light and prevent the generation of bright spots. The other four light-emitting surfaces are not covered with the diffuser layer at all. The light output brightness can even out the light output brightness of the light-emitting chip modified on the entire surface. Therefore, the surface-modified light-emitting chip is the core unit of the lensless backlight device of the present invention.

The light-emitting chip used in the surface modification of the lensless backlight device of the present invention only covers the top of the front surface with a diffusing glue layer that can adjust the light transmittance, and uses the light output from the remaining four sides to uniform the light output of the entire surface-modified light-emitting chip. Accordingly, the advantages and unpredictable effects of the surface-modified light-emitting chip of the present invention include: (1) using a diffuser layer to cover the top of the front of the light source to achieve the effect of self-atomization; (2) directly reducing the bright spots on the light-emitting surface The visual defect, and (3) maintain five-sided luminescence to have uniform luminosity or surface illumination.

In summary, the manufacturing method of the lens-free backlight device provided by the present invention uses an innovative surface-modified light-emitting chip manufacturing technology, because the surface-modified light-emitting chip has five-sided light emission and self-atomizing light from the top. , The advantages and functions of reducing the top light spot and uniform luminosity or surface illuminance, so it is particularly suitable for the production of lensless backlight devices used in thin or light panels or lighting equipment, which fully overcomes the current technical bottleneck. To achieve the purpose of industry demand.

100‧‧‧Lensless backlight device

110‧‧‧Circuit board 1

120‧‧‧Light-emitting chip

130‧‧‧Diffusion adhesive layer 1

140‧‧‧Backlight Module 1

200‧‧‧Chip package level lensless backlight device

210‧‧‧Circuit board 2

220‧‧‧Chip

230‧‧‧Luminescent powder layer

240‧‧‧Diffusion adhesive layer 2

250‧‧‧Backlight Module 2

Figure 1 is a schematic diagram of the lensless backlight device of the present invention; and FIG. 2 is a schematic diagram of the lensless backlight device of the wafer level package according to the present invention.

The foregoing and other technical content, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. In order to thoroughly understand the present invention, detailed steps and their composition will be proposed in the following description. Obviously, the implementation of the present invention is not limited to the specific details familiar to those skilled in the field. On the other hand, well-known components or steps are not described in details to avoid unnecessary limitation of the present invention. The preferred embodiments of the present invention will be described in detail as follows. However, in addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and the scope of the present invention is not limited, and the subsequent patent scope shall prevail. .

According to the first embodiment of the present invention, the present invention provides a method for manufacturing a lensless backlight device 100, wherein each component is configured as shown in FIG. 1. The manufacturing method includes: providing a circuit board 110; A plurality of light-emitting chips 120 are placed on top of the plurality of light-emitting chips 120; a diffusion adhesive layer 130 is covered on the top of the front surface of the plurality of light-emitting chips 120, thereby forming a surface-modified light-emitting chip on the circuit board; and A backlight module 140 is placed in the space above the light-emitting chip, thereby forming the lensless backlight device 100.

Specifically, the manufacturing implementation aspects of the plurality of light-emitting chips include wafer-level packaging, fusion of light-emitting glue, dispensing, bonding of light-emitting film bodies, or a combination thereof.

The above-mentioned surface-modified light-emitting chip emits light from five sides, only the top of the front surface is covered with a diffusing glue layer that can adjust the light transmittance, and the light from the remaining four sides is used to evenly emit light from the entire surface-modified light-emitting chip.

Specifically, the diffusion adhesive layer includes polymer glue, silicon glue, epoxy resin, atomized material, or a combination thereof. In a preferred embodiment, the diffusion adhesive layer includes glue and the material for making it atomized.

In one embodiment, the method for manufacturing the lensless backlight device of the present invention is applied to the backlight device of a panel display or lighting equipment.

The following is an embodiment of a method for manufacturing a lensless backlight device using a light-emitting chip in a wafer-level packaging process.

In one embodiment, the manufacturing implementation of the plurality of light-emitting chips is The technical feature of wafer-level packaging is to cover the surface of a chip with a layer of luminescent powder.

In one embodiment, the luminescent powder layer includes polymer glue, silicon glue, epoxy resin or a combination thereof.

In one embodiment, the luminescent powder layer is formed of a luminescent powder or a luminescent film.

In one embodiment, the luminescent powder includes phosphor, phosphor, or any powder that can guide light.

In one embodiment, the light-emitting film body comprises polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silicone rubber, wax or paraffin hydrocarbon.

In one embodiment, the diffusion adhesive layer includes polymer glue, silicon glue, epoxy resin, atomized material, or a combination thereof. In a preferred embodiment, the diffusion adhesive layer includes glue and the material for making it atomized. Specifically, the function of the atomized material is to make the diffuser layer play an atomizing effect to prevent bright spots from being generated on the top of the front surface.

In one embodiment, the diffusion adhesive layer has a light transmittance of 10 to 90%. Preferably, the diffusion adhesive layer has a light transmittance of 20-50%.

In a specific example, the configuration of the components used in the manufacturing method of the lensless backlight device 200 of the present invention is shown in FIG. 2. The specific steps of the preparation method are as follows: provide a circuit board 210, the circuit board 210 includes a copper foil circuit substrate or a flexible substrate; place the chip 220 on the surface of the circuit board 210; Fix the luminescent powder layer 230 on the surface of the chip 220. In this step, ultraviolet radiation, hot melt pressing or heating can be used to cure the luminescent powder layer 230 and the surface of the chip 220 so as not to peel off from the surface of the chip 220; Covering a diffuser 240 on the top of the front surface of the chip covered and fixed with the luminescent powder layer to form a surface-modified light-emitting chip, the covering method includes spraying or dispensing steps; and the surface of the modified light-emitting chip A backlight module 250 is placed in the upper space, thereby making the lensless backlight device 200 of the present invention.

In summary, the main technical feature of the method for preparing a lensless backlight device provided by the present invention is to prepare a surface-modified light-emitting chip. The surface-modified light-emitting chip emits light from five sides, and the top of the front surface is covered with Adjust the brightness of the light and prevent the diffusion adhesive layer generated by the bright spots. The other four light-emitting surfaces are not covered by the diffusion adhesive layer at all, and the light-emitting brightness can uniform the light-emitting brightness of the entire surface-modified light-emitting chip. Therefore, the surface-modified light-emitting chip is used as the core unit in the manufacturing method of the lensless backlight device of the present invention. Accordingly, the advantages and unpredictable effects of the preparation method of the lensless backlight device of the present invention include: (1) using a diffuser layer to cover the top of the front of the light source to achieve the effect of self-atomization; (2) directly reducing the light-emitting surface Visual defects that produce bright spots; (3) No need to use lenses and (4) to maintain five-sided luminescence to have uniform luminosity or surface illumination. Therefore, it is particularly suitable for the production of backlight sources for thin or light panel devices or flat lighting equipment, which fully overcomes the current technical bottleneck and achieves the purpose of industrial demand.

Although specific examples are used to describe the present invention above, it does not limit the scope of the present invention. As long as it does not depart from the gist of the present invention, those skilled in the art understand that various modifications or changes can be made without departing from the intent and scope of the present invention. In addition, the summary The part and title are only used to assist the searching of patent documents, not to limit the scope of rights of the present invention.

100‧‧‧Lensless backlight device

110‧‧‧Circuit board 1

120‧‧‧Light-emitting chip

130‧‧‧Diffusion adhesive layer

140‧‧‧Backlight Module 1

Claims (12)

A method for manufacturing a lensless backlight device, the manufacturing method comprising: providing a circuit board; placing a plurality of light-emitting chips on the circuit board; covering the top surface of the plurality of light-emitting chips with a diffusion glue layer, thereby A surface-modified light-emitting chip is formed on the circuit board; and a backlight module is placed in the space above the surface-modified light-emitting chip, thereby forming the lensless backlight device. According to the manufacturing method of the lensless backlight device described in the first item of the scope of patent application, the manufacturing implementation of the light-emitting chip includes wafer-level packaging, luminescent glue, dispensing, bonding of light-emitting film bodies, or a combination thereof. According to the manufacturing method of the lensless backlight device described in the second item of the scope of patent application, the wafer-level package is coated with a luminescent powder layer on the surface of a chip. According to the method for preparing a lensless backlight device described in item 3 of the scope of patent application, the luminescent powder layer includes polymer glue, silicon glue, epoxy resin or a combination thereof. According to the method for manufacturing a lensless backlight device described in item 3 of the scope of patent application, the luminescent powder layer is formed by a luminescent powder or a luminescent film. According to the method for preparing a lensless backlight device as described in item 5 of the scope of patent application, the luminescent powder includes phosphor, phosphor or any powder that can guide light. According to the method for preparing a lensless backlight device described in item 5 of the scope of patent application, the light-emitting film body includes polymer glue, ceramic powder, graphene powder, glass powder, ring Oxygen resin, silicone rubber, wax or paraffin hydrocarbon. According to the method for manufacturing a lensless backlight device described in the first item of the scope of patent application, the diffusion adhesive layer includes polymer glue, silicon glue, epoxy resin, atomized materials, or a combination thereof. According to the method for manufacturing a lensless backlight device described in the first item of the scope of the patent application, the diffuser layer has a light transmittance of 10 to 90%. According to the method for manufacturing a lensless backlight device described in item 7 of the scope of patent application, the diffuser layer has a light transmittance of 20-50%. According to the method for manufacturing a lensless backlight device described in the first item of the scope of patent application, the surface-modified light-emitting chip emits light from five sides. The method for manufacturing a lensless backlight device as described in the first item of the scope of patent application is applied to the manufacturing of backlight devices for panel displays or lighting equipment.

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