TWM588208U - A light source structure of lighting equipment - Google Patents

Abstract

A light source structure of a lighting device. The light source structure includes a circuit board and a plurality of light-emitting chips covered with optical coatings on the top of the front surface; the plurality of light-emitting chips covered with optical coatings on the top of the front surface are fixed on the circuit board, thereby constituting The light source structure.

Description

Light source structure of lighting equipment

The invention relates to a light source structure of a lighting device. In particular, the structure includes a light-emitting wafer covered with an optical coating on the front side.

At present, the light source module of a lighting device usually includes an optical lens or a diaphragm and a diffusion plate, and its function is to use the optical lens or the diaphragm and a diffusion plate to reduce the light emitting point of the light source and make it emit light uniformly. However, the optical lens, the diffuser and the light source need to be spaced a certain distance apart to exert fogging effect, reduce the bright spots and make the luminous brightness or surface illuminance uniform, resulting in that the thickness or volume of the final lighting equipment cannot be effectively reduced or reduced. Therefore, the light source structure provided by the current technology cannot be applied to lighting products with thin or light design.

In summary, in the current lighting industry, it is an important issue to be developed and urgently needed to develop a light source structure that reduces the use of optical lenses or diffusers.

In view of the above-mentioned new background, in order to meet the requirements of the industry, this new model provides an innovative lighting device that does not use optical lenses as constituent elements. Light source structure to solve the technical bottlenecks encountered by the industry and achieve the purpose required by the industry.

The object of the present invention is to provide a light source structure of a lighting device. The structure includes a circuit board and a plurality of light-emitting chips with optical coatings on the top surface and the front surface. The light-emitting chips with optical coatings on the top surface are fixed on the circuit board. As a result, the light source structure of the lighting device is formed.

Specifically, the manufacturing mode of the light-emitting wafer includes a light-emitting wafer in a wafer-level packaging process, a luminescent glue, a glue, a luminescent film body, or a combination thereof.

The novel technology is characterized in that the plurality of light-emitting wafers covered with optical coatings on the front and top sides emit light on five sides. Because the optical coating has the function of regulating the brightness of light and preventing the occurrence of bright spots, and the remaining ones that do not cover the optical coating The light output brightness of the four light emitting surfaces can uniform the light output brightness of the entire light emitting chip. Therefore, the plurality of light-emitting chips covered with an optical coating on the front side are the core elements of the light source structure of the lighting device described in the novel. According to this, the advantages and unpredictable effects of the light source structure of the lighting device according to the present invention include: (1) the present invention directly uses an optical coating to cover the top of the front side of the light emitting chip to achieve the effect of self-atomization of the light source; (2) ) No optical lens is used to achieve the purpose of lightening or thinning the design of the lighting equipment; (3) Does not cause visual defects in the lighting equipment to produce bright spots; and (4) The light source maintains five sides of the light and has a uniform Luminance or surface illumination.

In summary, the light source structure of the lighting equipment provided by the new model uses an innovative light emitting chip with an optical coating on the front light emitting surface. The light source structure of the lighting device described above does not use optical lenses, and has the advantages and functions of five-sided light emission, self-fogging of the top light emission, reduced light emission points and uniform luminosity or surface illuminance, so it is particularly suitable for thinning or lightening. The designed lighting equipment fully overcomes the current technical bottleneck and achieves the purpose of industrial demand.

100‧‧‧light source structure of lighting equipment

110‧‧‧Optical coating 1

120‧‧‧light emitting chip

130‧‧‧Circuit board 1

Light source structure of 200‧‧‧wafer package-level lighting equipment

210‧‧‧Circuit Board 2

220‧‧‧Chip

230‧‧‧luminescent powder layer

240‧‧‧ Optical Coating 2

FIG. 1 is a schematic diagram of a light source structure of a lighting device according to the present invention; and FIG. 2 is a schematic diagram of a light source structure of a lighting device in a wafer-level packaging process according to the present invention.

The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. In order to thoroughly understand the new model, detailed steps and their composition will be proposed in the following description. Obviously, the implementation of the new model is not limited to the specific details familiar to those skilled in the art. On the other hand, well-known components or steps have not been described in detail to avoid unnecessary limitations of the present invention. The preferred embodiments of the present invention will be described in detail as follows. However, in addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and the scope of the present invention is not limited. The later patent scope shall prevail. .

According to a first embodiment of the present invention, the present invention provides a lighting device The light source structure 100 is prepared, wherein the components are arranged as shown in FIG. 1. The light source structure of the lighting device includes: a plurality of light-emitting wafers 120 with an optical coating 110 on the top of the front; and a plurality of optical coatings 110 fixed on the top of the front. The light emitting chip 120 is on the circuit board 130, thereby constituting the light source structure 100 of the lighting device.

Specifically, the manufacturing mode of the plurality of light-emitting wafers includes a light-emitting wafer in a wafer-level packaging process, a fusion light-emitting glue, a glue, a light-emitting film, or a combination thereof.

Specifically, the composition of the optical coating includes a polymer glue, a silicon glue, an epoxy resin, an atomized material, or a combination thereof. In a preferred embodiment, the optical coating includes a glue and a material for atomizing the optical coating.

In one embodiment, the light source structure of the lighting device according to the present invention is applied to the design of a thin or lightweight lighting device.

The following is an embodiment of a light source structure of a lighting device using a light-emitting wafer of a wafer-level packaging process.

In an embodiment, the technical feature of the wafer-level packaging process is to cover a light-emitting powder layer on the surface of a wafer, thereby forming a light-emitting wafer in the wafer-level packaging process.

In one embodiment, the luminescent powder layer includes polymer glue, silicon glue, epoxy resin, or a combination thereof.

In one embodiment, the luminescent powder layer is made of a luminescent powder or a luminescent film. Body formation.

In one embodiment, the luminescent powder includes a fluorescent powder, a phosphor powder, or any light-guiding powder.

In one embodiment, the light-emitting film body includes polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silicone, wax, or paraffin hydrocarbon.

In a specific example, the configuration of each element used in the light source structure 200 of the novel lighting device is shown in FIG. 2. It includes a circuit board 210, which includes a copper foil circuit substrate or a flexible substrate; a fixed wafer 220 is on the surface of the circuit board 210; and a luminescent powder layer 230 is covered and fixed on the surface of the wafer 220. This step may use ultraviolet rays. Irradiation, hot-melt pressing, or heating methods can cause the surface of the luminescent powder layer 230 and the wafer 220 to solidify so that they do not peel off from the surface of the wafer 220; The front top of the wafer thus constitutes a light source structure 200 including a light emitting wafer covered with an optical coating on the top of the front, wherein the optical coating is covered by a spraying or dispensing process.

In one embodiment, the composition of the optical coating includes a polymer glue, a silicon glue, an epoxy resin, an atomized material, or a combination thereof. In a preferred embodiment, the optical coating includes a glue and a material for atomizing the optical coating. Specifically, the function of the material to be atomized is to make the optical coating exert a light atomizing effect, and prevent bright spots on the light emitting surface on the front top of the light emitting chip.

In one embodiment, the optical coating has a transmittance of 10 to 90%. Compare Preferably, the optical coating has a light transmittance of 20-50%.

In summary, the main technical feature of the light source structure of the lighting device provided by the present invention is that the light source structure includes a light-emitting chip covered with an optical coating on the front top, and the light-emitting chip covered with the optical coating on the front top is five On the front side, the front top is covered with an optical coating that can regulate the light output and prevent bright spots. The other four light output surfaces do not cover the optical coating at all, so its light output can be uniform throughout the light emitting chip. According to this, the advantages and unexpected effects of the light source structure of the new type of lighting equipment include: (1) the new type directly covers the top of the front side of the light emitting chip with an optical coating to achieve the effect of self-atomization of the light source; (2) not Optical lenses and diffusers are required to achieve the purpose of lightweight or thin design of lighting equipment; (3) visual defects that do not cause bright spots in lighting equipment; and the light source structure described in (4) keeps light on five sides, At the same time, it has uniform luminosity or surface illumination.

Although the above describes the new model with a specific example, it does not limit the scope of the new model, as long as it does not depart from the gist of the new model, those skilled in the art understand that various modifications or changes can be made without departing from the intention and scope of the new model. In addition, the abstract section and title are only used to assist the search of patent documents and are not intended to limit the scope of rights of the new model.

Claims (10)

A light source structure of a lighting device. The structure includes a circuit board and a plurality of light-emitting chips with optical coatings on the top surface of the front surface; The light source structure of the lighting device described above. According to the light source structure of the lighting device described in the first item of the scope of the patent application, the embodiment of the light-emitting chip includes a combination of a light-emitting wafer, a luminescent glue, a glue, a light-emitting film, or a combination thereof in a wafer-level packaging process. According to the light source structure of the lighting device described in the second item of the patent application scope, the light-emitting wafer of the wafer-level packaging process is formed by covering a light-emitting powder layer on the surface of a wafer. According to the light source structure of the lighting device described in item 3 of the patent application scope, the luminescent powder layer includes polymer glue, silicon glue, epoxy resin, or a combination thereof. According to the light source structure of the lighting device described in the third item of the patent application scope, the luminescent powder layer is formed of a luminescent powder body or a luminescent film body. According to the light source structure of the lighting device described in the fifth item of the patent application scope, the luminescent powder includes a fluorescent powder, a phosphor powder, or any light-guiding powder. According to the light source structure of the lighting device described in item 5 of the patent application scope, the light-emitting film body includes polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silicone, wax, or paraffin hydrocarbon. According to the light source structure of the lighting device described in item 1 of the scope of the patent application, the optical coating includes polymer glue, silicon glue, epoxy resin, a material for making it atomized, or a combination thereof. According to the light source structure of the lighting device described in item 1 of the patent application scope, the optical coating has a light transmittance of 10 to 90%. According to the light source structure of the lighting device described in item 9 of the patent application scope, the optical coating has a light transmittance of 20-50%.