TWM588208U - A light source structure of lighting equipment - Google Patents

A light source structure of lighting equipment Download PDF

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TWM588208U
TWM588208U TW108207985U TW108207985U TWM588208U TW M588208 U TWM588208 U TW M588208U TW 108207985 U TW108207985 U TW 108207985U TW 108207985 U TW108207985 U TW 108207985U TW M588208 U TWM588208 U TW M588208U
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light
light source
source structure
lighting device
device described
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TW108207985U
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Chinese (zh)
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李宛儒
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李宛儒
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Abstract

一種照明設備之光源結構,該光源結構包含一電路板和複數個正面頂部覆蓋光學塗層的發光晶片;上述之複數個正面頂部覆蓋光學塗層的發光晶片固定在該電路板上,藉此構成所述之光源結構。 A light source structure of a lighting device. The light source structure includes a circuit board and a plurality of light-emitting chips covered with optical coatings on the top of the front surface; the plurality of light-emitting chips covered with optical coatings on the top of the front surface are fixed on the circuit board, thereby constituting The light source structure.

Description

一種照明設備的光源結構 Light source structure of lighting equipment

本新型係關於一種照明設備之光源結構。特別地,該結構包含一正面頂部覆蓋光學塗層之發光晶片。 The invention relates to a light source structure of a lighting device. In particular, the structure includes a light-emitting wafer covered with an optical coating on the front side.

目前照明設備的光源模組通常包含光學透鏡或膜片和擴散板,其功能是使用光學透鏡或膜片和擴散板減少光源的出光亮點,使其發光均勻。但是光學透鏡、擴散板和光源需要間隔一定的距離才能發揮霧化作用,減少亮點並使其發光亮度或面照度均勻,導致最終照明設備的厚度或體積無法有效地減少或縮小。因此,目前技術所提供之光源結構無法應用在薄型化或輕型化設計的照明產品。 At present, the light source module of a lighting device usually includes an optical lens or a diaphragm and a diffusion plate, and its function is to use the optical lens or the diaphragm and a diffusion plate to reduce the light emitting point of the light source and make it emit light uniformly. However, the optical lens, the diffuser and the light source need to be spaced a certain distance apart to exert fogging effect, reduce the bright spots and make the luminous brightness or surface illuminance uniform, resulting in that the thickness or volume of the final lighting equipment cannot be effectively reduced or reduced. Therefore, the light source structure provided by the current technology cannot be applied to lighting products with thin or light design.

綜上所述,在現今照明產業,對於開發一減少使用光學透鏡或擴散板的光源結構實為一亟待解決和研發的重要課題。 In summary, in the current lighting industry, it is an important issue to be developed and urgently needed to develop a light source structure that reduces the use of optical lenses or diffusers.

鑒於上述之新型背景,為了符合產業上的要求,本新型提供一種創新、無使用光學透鏡作為組成元件的照明設備之 光源結構,以解決目前產業所遇到之技術瓶頸,並達成產業所需之目的。 In view of the above-mentioned new background, in order to meet the requirements of the industry, this new model provides an innovative lighting device that does not use optical lenses as constituent elements. Light source structure to solve the technical bottlenecks encountered by the industry and achieve the purpose required by the industry.

本新型之目的在於提供一種照明設備之光源結構,該結構包含一電路板和複數個正面頂部覆蓋光學塗層的發光晶片;上述之複數個正面頂部覆蓋光學塗層的發光晶片固定在該電路板上,藉此構成所述的照明設備之光源結構。 The object of the present invention is to provide a light source structure of a lighting device. The structure includes a circuit board and a plurality of light-emitting chips with optical coatings on the top surface and the front surface. The light-emitting chips with optical coatings on the top surface are fixed on the circuit board. As a result, the light source structure of the lighting device is formed.

具體地,該發光晶片的製作實施樣態包括晶片級封裝製程的發光晶片、融發光膠、點膠、發光膜體的貼合或其組合。 Specifically, the manufacturing mode of the light-emitting wafer includes a light-emitting wafer in a wafer-level packaging process, a luminescent glue, a glue, a luminescent film body, or a combination thereof.

本新型的技術特徵在於所述之複數個正面頂部覆蓋光學塗層的發光晶片是五面出光,由於該光學塗層具有調控出光亮度和防止亮點產生的功能,且其餘沒有覆蓋該光學塗層的四個出光面的出光亮度可以均勻整個發光晶片的出光亮度。因此,上述之複數個正面頂部覆蓋光學塗層的發光晶片係為本新型所述之照明設備之光源結構的核心元件。據此,本新型所述之照明設備之光源結構的優點和無法預期的功效包括:(1)本新型直接使用光學塗層覆蓋在發光晶片的正面頂部以達到光源自我霧化的效果;(2)沒有使用光學透鏡,藉此達到照明設備輕型化或薄型化設計之目的;(3)不會造成照明設備產生亮點的視覺瑕疵;和(4)所述光源保持五面出光,同時具有均勻的發光度或面照度。 The novel technology is characterized in that the plurality of light-emitting wafers covered with optical coatings on the front and top sides emit light on five sides. Because the optical coating has the function of regulating the brightness of light and preventing the occurrence of bright spots, and the remaining ones that do not cover the optical coating The light output brightness of the four light emitting surfaces can uniform the light output brightness of the entire light emitting chip. Therefore, the plurality of light-emitting chips covered with an optical coating on the front side are the core elements of the light source structure of the lighting device described in the novel. According to this, the advantages and unpredictable effects of the light source structure of the lighting device according to the present invention include: (1) the present invention directly uses an optical coating to cover the top of the front side of the light emitting chip to achieve the effect of self-atomization of the light source; (2) ) No optical lens is used to achieve the purpose of lightening or thinning the design of the lighting equipment; (3) Does not cause visual defects in the lighting equipment to produce bright spots; and (4) The light source maintains five sides of the light and has a uniform Luminance or surface illumination.

綜上所述,本新型所提供的照明設備之光源結構使用了創新的正面出光面覆蓋有光學塗層之發光晶片,故本新型所 述的照明設備之光源結構沒有使用光學透鏡,且具有五面發光、頂部出光自我霧化、減少出光亮點和均勻的發光度或面照度的優點和功能,因此特別適合應用在薄型化或輕型化設計的照明設備,充分克服了目前的技術瓶頸,達到產業需求之目的。 In summary, the light source structure of the lighting equipment provided by the new model uses an innovative light emitting chip with an optical coating on the front light emitting surface. The light source structure of the lighting device described above does not use optical lenses, and has the advantages and functions of five-sided light emission, self-fogging of the top light emission, reduced light emission points and uniform luminosity or surface illuminance, so it is particularly suitable for thinning or lightening. The designed lighting equipment fully overcomes the current technical bottleneck and achieves the purpose of industrial demand.

100‧‧‧照明設備之光源結構 100‧‧‧light source structure of lighting equipment

110‧‧‧光學塗層1 110‧‧‧Optical coating 1

120‧‧‧發光晶片 120‧‧‧light emitting chip

130‧‧‧電路板1 130‧‧‧Circuit board 1

200‧‧‧晶片封裝級照明設備之光源結構 Light source structure of 200‧‧‧wafer package-level lighting equipment

210‧‧‧電路板2 210‧‧‧Circuit Board 2

220‧‧‧晶片 220‧‧‧Chip

230‧‧‧發光粉層 230‧‧‧luminescent powder layer

240‧‧‧光學塗層2 240‧‧‧ Optical Coating 2

第1圖是本新型所述之照明設備之光源結構的示意圖;和第2圖是本新型所述之晶片級封裝製程的照明設備之光源結構的示意圖。 FIG. 1 is a schematic diagram of a light source structure of a lighting device according to the present invention; and FIG. 2 is a schematic diagram of a light source structure of a lighting device in a wafer-level packaging process according to the present invention.

有關本新型之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。為了能徹底地瞭解本新型,將在下列的描述中提出詳盡的步驟及其組成。顯然地,本新型的施行並未限定於該領域之技藝者所熟習的特殊細節。另一方面,眾所周知的組成或步驟並未描述於細節中,以避免造成本新型不必要之限制。本新型的較佳實施例會詳細描述如下,然而除了這些詳細描述之外,本新型還可以廣泛地施行在其他的實施例中,且本新型的範圍不受限定,其以之後的專利範圍為準。 The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. In order to thoroughly understand the new model, detailed steps and their composition will be proposed in the following description. Obviously, the implementation of the new model is not limited to the specific details familiar to those skilled in the art. On the other hand, well-known components or steps have not been described in detail to avoid unnecessary limitations of the present invention. The preferred embodiments of the present invention will be described in detail as follows. However, in addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and the scope of the present invention is not limited. The later patent scope shall prevail. .

根據本新型的第一實施例,本新型提供一種照明設 備之光源結構100,其中各元件配置如第1圖所示,該照明設備之光源結構包含:複數個正面頂部具有光學塗層110的發光晶片120;固定該複數個正面頂部具有光學塗層110的發光晶片120在電路板130上,藉此構成所述的照明設備之光源結構100。 According to a first embodiment of the present invention, the present invention provides a lighting device The light source structure 100 is prepared, wherein the components are arranged as shown in FIG. 1. The light source structure of the lighting device includes: a plurality of light-emitting wafers 120 with an optical coating 110 on the top of the front; and a plurality of optical coatings 110 fixed on the top of the front. The light emitting chip 120 is on the circuit board 130, thereby constituting the light source structure 100 of the lighting device.

具體地,該複數個發光晶片的製作實施樣態包含晶片級封裝製程的發光晶片、融合發光膠、點膠、發光膜體的貼合或其組合。 Specifically, the manufacturing mode of the plurality of light-emitting wafers includes a light-emitting wafer in a wafer-level packaging process, a fusion light-emitting glue, a glue, a light-emitting film, or a combination thereof.

具體地,該光學塗層的組成包含高分子膠水、矽膠、環氧樹脂、使其霧化的材質或其組合。於一較佳實施例,該光學塗層包含膠水和所述之使其霧化的材質。 Specifically, the composition of the optical coating includes a polymer glue, a silicon glue, an epoxy resin, an atomized material, or a combination thereof. In a preferred embodiment, the optical coating includes a glue and a material for atomizing the optical coating.

於一實施例,本新型所述之照明設備之光源結構的係應用在薄型化或輕型化的照明設備設計。 In one embodiment, the light source structure of the lighting device according to the present invention is applied to the design of a thin or lightweight lighting device.

以下所述是使用晶片級封裝製程之發光晶片的照明設備之光源結構的實施例。 The following is an embodiment of a light source structure of a lighting device using a light-emitting wafer of a wafer-level packaging process.

於一實施例,該晶片級封裝製程的技術特徵是包覆一發光粉層在一晶片的表面,藉此構成晶片級封裝製程的發光晶片。 In an embodiment, the technical feature of the wafer-level packaging process is to cover a light-emitting powder layer on the surface of a wafer, thereby forming a light-emitting wafer in the wafer-level packaging process.

於一實施例,該發光粉層包含高分子膠水、矽膠、環氧樹脂或其組合。 In one embodiment, the luminescent powder layer includes polymer glue, silicon glue, epoxy resin, or a combination thereof.

於一實施例,該發光粉層是由一發光粉體或發光膜 體所形成。 In one embodiment, the luminescent powder layer is made of a luminescent powder or a luminescent film. Body formation.

於一實施例,該發光粉體包含螢光粉、磷光粉或任一可導光之粉體。 In one embodiment, the luminescent powder includes a fluorescent powder, a phosphor powder, or any light-guiding powder.

於一實施例,該發光膜體包含高分子膠水、陶瓷粉、石墨烯粉、玻璃粉、環氧樹脂、矽膠、臘或石蠟烴。 In one embodiment, the light-emitting film body includes polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silicone, wax, or paraffin hydrocarbon.

於一具體範例,本新型之照明設備之光源結構200所使用的各元件配置如第2圖所示。其包含一電路板210,電路板210包括銅箔電路基板或可撓式基板;固定晶片220在電路板210的表面上;包覆固定發光粉層230在晶片220的表面,此步驟可使用紫外線照射、熱熔壓或加熱方式,使發光粉層230和晶片220的表面產生固化作用,使其不會從晶片220的表面剝落;覆蓋一光學塗層240在上述之包覆固定發光粉層的晶片的正面頂部藉此構成包含正面頂部覆蓋有光學塗層之發光晶片的光源結構200,其中上述之光學塗層的覆蓋方式包括噴塗或點膠程序。 In a specific example, the configuration of each element used in the light source structure 200 of the novel lighting device is shown in FIG. 2. It includes a circuit board 210, which includes a copper foil circuit substrate or a flexible substrate; a fixed wafer 220 is on the surface of the circuit board 210; and a luminescent powder layer 230 is covered and fixed on the surface of the wafer 220. This step may use ultraviolet rays. Irradiation, hot-melt pressing, or heating methods can cause the surface of the luminescent powder layer 230 and the wafer 220 to solidify so that they do not peel off from the surface of the wafer 220; The front top of the wafer thus constitutes a light source structure 200 including a light emitting wafer covered with an optical coating on the top of the front, wherein the optical coating is covered by a spraying or dispensing process.

於一實施例,該光學塗層的組成包含高分子膠水、矽膠、環氧樹脂、使其霧化的材質或其組合。於一較佳實施例,該光學塗層包含膠水和所述之使其霧化的材質。具體地,該使其霧化的材質的功能是使光學塗層發揮光線霧化作用,防止發光晶片正面頂部出光面產生亮點。 In one embodiment, the composition of the optical coating includes a polymer glue, a silicon glue, an epoxy resin, an atomized material, or a combination thereof. In a preferred embodiment, the optical coating includes a glue and a material for atomizing the optical coating. Specifically, the function of the material to be atomized is to make the optical coating exert a light atomizing effect, and prevent bright spots on the light emitting surface on the front top of the light emitting chip.

於一實施例,該光學塗層具有10~90%的透光率。較 佳地,該光學塗層具有20~50%的透光率。 In one embodiment, the optical coating has a transmittance of 10 to 90%. Compare Preferably, the optical coating has a light transmittance of 20-50%.

綜上所述,本新型所提供的照明設備之光源結構的之主要技術特徵在於其光源構造包含一正面頂部覆蓋有光學塗層之發光晶片,該正面頂部覆蓋有光學塗層之發光晶片是五面出光,其正面頂部覆蓋可調控出光亮度並防止亮點產生的光學塗層,其他四個出光面則完全沒有覆蓋所述之光學塗層,所以其出光亮度可以均勻整個發光晶片的出光亮度。據此,本新型的照明設備之光源結構的優點和無法預期的功效包括:(1)本新型直接使用光學塗層覆蓋在發光晶片的正面頂部以達到光源自我霧化的效果;(2)不需使用光學透鏡和擴散板,藉此達到照明設備輕型化或薄型化設計之目的;(3)不會造成照明設備產生亮點的視覺瑕疵;和(4)所述之光源結構保持五面出光,同時其具有均勻的發光度或面照度。 In summary, the main technical feature of the light source structure of the lighting device provided by the present invention is that the light source structure includes a light-emitting chip covered with an optical coating on the front top, and the light-emitting chip covered with the optical coating on the front top is five On the front side, the front top is covered with an optical coating that can regulate the light output and prevent bright spots. The other four light output surfaces do not cover the optical coating at all, so its light output can be uniform throughout the light emitting chip. According to this, the advantages and unexpected effects of the light source structure of the new type of lighting equipment include: (1) the new type directly covers the top of the front side of the light emitting chip with an optical coating to achieve the effect of self-atomization of the light source; (2) not Optical lenses and diffusers are required to achieve the purpose of lightweight or thin design of lighting equipment; (3) visual defects that do not cause bright spots in lighting equipment; and the light source structure described in (4) keeps light on five sides, At the same time, it has uniform luminosity or surface illumination.

以上雖以特定範例說明本新型,但並不因此限定本新型之範圍,只要不脫離本新型之要旨,熟悉本技藝者瞭解在不脫離本新型的意圖及範圍下可進行各種變形或變更。此外,摘要部分和標題僅是用來輔助專利文件搜尋之用,並非用來限制本新型之權利範圍。 Although the above describes the new model with a specific example, it does not limit the scope of the new model, as long as it does not depart from the gist of the new model, those skilled in the art understand that various modifications or changes can be made without departing from the intention and scope of the new model. In addition, the abstract section and title are only used to assist the search of patent documents and are not intended to limit the scope of rights of the new model.

Claims (10)

一種照明設備之光源結構,該結構包含一電路板和複數個正面頂部覆蓋光學塗層的發光晶片;上述之複數個正面頂部覆蓋光學塗層的發光晶片固定在該電路板上,藉此構成所述的照明設備之光源結構。A light source structure of a lighting device. The structure includes a circuit board and a plurality of light-emitting chips with optical coatings on the top surface of the front surface; The light source structure of the lighting device described above. 如申請專利範圍第1項所述之照明設備之光源結構,該發光晶片的實施樣態包含晶片級封裝製程之發光晶片、融發光膠、點膠、發光膜體的貼合或其組合。According to the light source structure of the lighting device described in the first item of the scope of the patent application, the embodiment of the light-emitting chip includes a combination of a light-emitting wafer, a luminescent glue, a glue, a light-emitting film, or a combination thereof in a wafer-level packaging process. 如申請專利範圍第2項所述之照明設備之光源結構,該晶片級封裝製程之發光晶片是包覆一發光粉層在一晶片的表面所構成。According to the light source structure of the lighting device described in the second item of the patent application scope, the light-emitting wafer of the wafer-level packaging process is formed by covering a light-emitting powder layer on the surface of a wafer. 如申請專利範圍第3項所述之照明設備之光源結構,該發光粉層包含高分子膠水、矽膠、環氧樹脂或其組合。According to the light source structure of the lighting device described in item 3 of the patent application scope, the luminescent powder layer includes polymer glue, silicon glue, epoxy resin, or a combination thereof. 如申請專利範圍第3項所述之照明設備之光源結構,該發光粉層是由一發光粉體或發光膜體所形成。According to the light source structure of the lighting device described in the third item of the patent application scope, the luminescent powder layer is formed of a luminescent powder body or a luminescent film body. 如申請專利範圍第5項所述之照明設備之光源結構,該發光粉體包含螢光粉、磷光粉或任一可導光之粉體。According to the light source structure of the lighting device described in the fifth item of the patent application scope, the luminescent powder includes a fluorescent powder, a phosphor powder, or any light-guiding powder. 如申請專利範圍第5項所述之照明設備之光源結構,該發光膜體包含高分子膠水、陶瓷粉、石墨烯粉、玻璃粉、環氧樹脂、矽膠、臘或石蠟烴。According to the light source structure of the lighting device described in item 5 of the patent application scope, the light-emitting film body includes polymer glue, ceramic powder, graphene powder, glass powder, epoxy resin, silicone, wax, or paraffin hydrocarbon. 如申請專利範圍第1項所述之照明設備之光源結構,該光學塗層包含高分子膠水、矽膠、環氧樹脂、使其霧化的材質或其組合。According to the light source structure of the lighting device described in item 1 of the scope of the patent application, the optical coating includes polymer glue, silicon glue, epoxy resin, a material for making it atomized, or a combination thereof. 如申請專利範圍第1項所述之照明設備之光源結構,該光學塗層具有10~90%的透光率。According to the light source structure of the lighting device described in item 1 of the patent application scope, the optical coating has a light transmittance of 10 to 90%. 如申請專利範圍第9項所述之照明設備之光源結構,該光學塗層具有20~50%的透光率。According to the light source structure of the lighting device described in item 9 of the patent application scope, the optical coating has a light transmittance of 20-50%.
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