CN214369376U

CN214369376U - Twin lamp panel capable of being connected in series

Info

Publication number: CN214369376U
Application number: CN202120201399.5U
Authority: CN
Inventors: 李广会
Original assignee: Liaoning Dikangyuan Health Technology Co ltd
Current assignee: Liaoning Dikangyuan Health Technology Co ltd
Priority date: 2021-01-25
Filing date: 2021-01-25
Publication date: 2021-10-08
Anticipated expiration: 2031-01-25

Abstract

The application discloses twinkle can establish ties lamp plate includes: bimorph chip, gold thread, support, lamp cup, colloid, PCB board, negative pole pin, anodal pin, lamp pearl and diode. Gold wires are used for connecting the two chips to the positive electrode pins; the double-crystal chip is arranged in the center of the lamp cup arranged at the sunken part of the bracket; the colloid encapsulates the part of the double-crystal chip, the gold wire, the lamp cup, the positive electrode pin and the negative electrode pin; the lamp beads are formed by a part encapsulated by the colloid, a positive electrode pin and a negative electrode pin and are arranged on the upper surface of the PCB through an SMT (surface mounting technology) process; the diode is arranged on the lower surface of the PCB, and the anode and the cathode of the diode are correspondingly communicated with the cathode pin and the anode pin; the encapsulation size of the colloid is 5mm, and the shape of the PCB is octagonal. The design can connect 1-68 lamp panels according to the requirement, the modeling is easy, and when the finished product is manufactured, the heat dissipation of a single small lamp panel is good, and the plasticity is strong. The design factor of safety of two chips is high, and luminance is high, and the lamp pearl spotlight that the size is 5mm is outstanding, and stability is good.

Description

Twin lamp panel capable of being connected in series

Technical Field

The application relates to the technical field of LEDs, in particular to a bicrystal series-connectable lamp panel.

Background

With the development of LED technology and the wide application of various scenes in various fields, LED structures satisfying various demands are produced. In various LED structures, the lamp panel is used as the main light emitting component in a complete product, and LED lamp panels of various sizes, structures and materials have also been derived in order to meet various requirements. However, most lamp plates at present are the shape according to the product or special requirement customization lamps and lanterns carrier, inlay LED lamp pearl on the circuit board, and this mode is unfavorable for batch production, and the plasticity is poor, and with high costs.

In addition, when a plurality of LED chips connected in series or in parallel or in a mixed series-parallel manner are required to be disposed in one LED support, the current method can only be to dispose a plurality of LED chips on a substrate of the support, and then to implement connection between the LED chips through gold wires additionally.

Disclosure of Invention

A bimorph lamp panel that can establish ties includes: bimorph chip, gold thread, support, lamp cup, colloid, PCB board, negative pole pin, anodal pin, lamp pearl and diode. The gold wire is used for connecting the two chips to the positive electrode pin; the double-crystal chip is arranged in the center of the lamp cup arranged at the concave part of the bracket; the colloid encapsulates the parts of the double-crystal chip, the gold wires, the lamp cup, the positive electrode pins and the negative electrode pins; the lamp beads are composed of a part encapsulated by colloid, a positive electrode pin and a negative electrode pin and are arranged on the upper surface of the PCB through an SMT process; the diode is arranged on the lower surface of the PCB, and the anode and the cathode of the diode correspond to the cathode pin and the anode pin to form conduction;

further, the colloid material is epoxy resin, and is encapsulated by transparent epoxy resin.

Further, the double-crystal chip is arranged at the center of the lamp cup installed on the concave part of the bracket.

Furthermore, two chips of the double-crystal chip are connected with the positive electrode pin through gold wires.

Furthermore, the wavelength range of the light emitted by the double-crystal chip is 650nm-980 nm.

Furthermore, the positive electrode pin and the negative electrode pin extend from the inside of the colloid to penetrate through the PCB, and the negative electrode pin is longer than the positive electrode pin.

Furthermore, the whole lamp bead is arranged on the upper surface of the PCB through an SMT process.

Furthermore, the diode is arranged below the PCB, and the anode and the cathode of the diode correspond to the cathode pin and the anode pin, so that the circuit is conveniently conducted integrally, and meanwhile, the diode plays a role of protecting the lamp beads.

Further, the PCB board is octagonal.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic overall structure diagram of an embodiment of the present application;

FIG. 2 is a schematic top view of an embodiment of the present application;

in the figure: 1. the LED lamp comprises a double-crystal chip, 2, gold wires, 3, a lamp cup, 4, colloid, 5, a support, 6, a PCB (printed circuit board), 7, a diode, 8, a negative electrode pin, 9 and an anode pin.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.

Referring to fig. 1, a dual-crystal series lamp panel includes: bimorph chip, gold thread, support, lamp cup, colloid, PCB board, negative pole pin, anodal pin, lamp pearl and diode. The gold wire is used for connecting the two chips to the positive electrode pin; the double-crystal chip is arranged in the center of the lamp cup arranged at the concave part of the bracket; the colloid encapsulates the parts of the double-crystal chip, the gold wires, the lamp cup, the positive electrode pins and the negative electrode pins; the lamp beads are composed of a part encapsulated by colloid, a positive electrode pin and a negative electrode pin and are arranged on the upper surface of the PCB through an SMT process; the diode is arranged on the lower surface, and the anode and the cathode of the diode correspond to the cathode pin and the anode pin to form conduction.

When the product is manufactured, the whole LED wafer film is uniformly expanded by adopting an expander, so that LED crystal grains which are attached to the surface of the film and are closely arranged are pulled apart, and crystal pricking is facilitated; placing the crystal expansion ring with the expanded crystal on the surface of the back gluing machine with the scraped silver paste layer, and coating silver paste on the back; a glue dispenser is adopted to dispense a proper amount of silver paste on the bracket; placing the prepared crystal expansion ring with the silver paste into a crystal pricking frame, and pricking the LED chip on the support by using a crystal pricking pen; and placing the lamp beads with the thoroughened crystals into a thermal cycle oven to be kept stand for a period of time at a constant temperature to fix the crystals, bridging the wafer and the bonding pad aluminum wire of the support by using an aluminum wire bonding machine, and repairing the unqualified circuit board again by using a special detection tool. And placing the connected part of the baked bracket and the crystal into a plastic mould for glue dripping, baking and shaping, and separating the plastic mould to obtain the finished product of the lamp bead. And distinguishing the brightness of the lamps with different brightness by using a light splitting machine according to requirements, respectively packaging, and finally warehousing. And packaging the required lamp beads on the octagonal PCB through an SMT process, mounting diodes at the corresponding positions on the back of the PCB, and testing to obtain the finished product.

The application has the advantages that:

1. a single small-size lamp plate can be connected 1-68 according to the product demand, and when a single small-size lamp plate is making finished product, the single small-size lamp plate is easy to model, and structural plasticity is strong, and when making finished product, when a plurality of lamp plates are required to be connected, good heat dissipation performance is achieved

2. The size of the lamp bead is 5mm, the light-gathering property is good, the double-chip design in the lamp bead is realized, only one LED light-emitting chip is designed in the traditional lamp bead, and when the LED light-emitting chip is short-circuited or damaged, the whole LED lamp bead can be damaged; the double chips have higher brightness and strong stability under a certain current; the light ray excited by the double-crystal chip is 650nm-980 nm.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A bimorph lamp panel that can establish ties includes: bimorph chip, gold thread, support, lamp cup, colloid, PCB board, negative pole pin, anodal pin, lamp pearl and diode, its characterized in that: the LED lamp comprises a lamp bead, a colloid, a double-crystal chip, a gold wire, a lamp cup, a support, an anode pin and a cathode pin, wherein the colloid encapsulates one end of the double-crystal chip, the gold wire, the lamp cup, the support, the anode pin and the cathode pin, the lamp bead is composed of a part encapsulated by the colloid, the anode pin and the cathode pin, and the encapsulation size of the colloid is 5 mm.

2. The twinkle lamp panel of claim 1, wherein: the colloid material is epoxy resin.

3. The twinkle lamp panel of claim 1, wherein: the double-crystal chip is arranged at the center of the lamp cup installed on the concave part of the bracket.

4. The twinkle lamp panel of claim 1, wherein: two chips of the double-crystal chip are connected with the positive electrode pin through gold wires.

5. The twinkle lamp panel of claim 1, wherein: the wavelength range of the light emitted by the double-crystal chip is 650nm-980 nm.

6. The twinkle lamp panel of claim 1, wherein: the positive electrode pin and the negative electrode pin extend from the inside of the colloid to penetrate through the PCB, and the negative electrode pin is longer than the positive electrode pin.

7. The twinkle lamp panel of claim 1, wherein: the lamp beads are arranged on the upper surface of the PCB through an SMT process.

8. The twinkle lamp panel of claim 1, wherein: the diode is arranged below the PCB, and the anode and the cathode of the diode correspond to the cathode pin and the anode pin.

9. The twinkle lamp panel of claim 1, wherein: the PCB is octagonal.