CN111128984A - Active luminous film, active luminous signboard and preparation method thereof - Google Patents
Active luminous film, active luminous signboard and preparation method thereof Download PDFInfo
- Publication number
- CN111128984A CN111128984A CN201911318569.1A CN201911318569A CN111128984A CN 111128984 A CN111128984 A CN 111128984A CN 201911318569 A CN201911318569 A CN 201911318569A CN 111128984 A CN111128984 A CN 111128984A
- Authority
- CN
- China
- Prior art keywords
- film
- active light
- led
- substrate
- led array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000003292 glue Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 41
- 238000005520 cutting process Methods 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 235000010215 titanium dioxide Nutrition 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000010408 film Substances 0.000 claims 20
- 210000002469 basement membrane Anatomy 0.000 claims 3
- 239000010409 thin film Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F13/00—Illuminated signs; Luminous advertising
- G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
- G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
- G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The invention discloses an active light-emitting film, an active light-emitting signboard and a preparation method thereof, and aims to solve the technical problems that the existing active light-emitting signboard is complex in structure, difficult to manufacture and incapable of reasonably utilizing resources. The active light-emitting film comprises a substrate, an LED array, a scattering layer, fluorescent powder glue and a retro-reflection layer, wherein the LED array is arranged on the substrate, the scattering layer is fixed above the LED array, the fluorescent powder glue is filled between the substrate and the scattering layer, and the retro-reflection layer is arranged on the side surface of the scattering layer, which is back to the LED array; the active luminous sign comprises a support, a sign panel, a bottom film and an active luminous film, wherein the sign panel is fixedly connected with the support, the bottom film is adhered to the front surface of the sign panel, and the active luminous film is adhered to the bottom film. The invention directly pastes the active luminous film on the existing signboard, thereby reducing the volume, being convenient to manufacture and having uniform brightness.
Description
Technical Field
The invention relates to the technical field of luminous sign boards, in particular to an active luminous film, an active luminous sign and a preparation method thereof.
Background
Most of the existing luminous signs are of box-type structures, patch-type LED light sources are used inside the luminous signs, and the luminous signs are projected to the back of a retro-reflective film in a back direct projection or side light guide mode to light up luminous characters or patterns. The patent document with the publication number of CN110306457A and the name of 'a light source splicing and combining type active luminous traffic sign' discloses an active luminous sign, which aims to solve the problem that a light source plate is difficult to maintain and replace.
However, the box type luminous sign has relatively large volume, complex assembly process and increased weight, and still has great difficulty in manufacturing; moreover, the existing luminous signs can not change the content of the local layout at low cost, so that when the road network number and the like change, the whole luminous signs can only be removed and replaced; in addition, when the traditional non-luminous traffic sign board which is installed and used is upgraded and reformed into a luminous traffic sign, the original sign board can only be dismantled, and most of the dismantled parts can not be reused, thereby causing serious waste of resources.
Disclosure of Invention
The invention provides an active light-emitting film, an active light-emitting signboard and a preparation method thereof, and aims to solve the technical problems that the existing active light-emitting signboard is complex in structure, difficult to manufacture, incapable of conveniently and locally replacing contents, and incapable of reasonably utilizing the existing resources.
In order to solve the technical problems, the invention adopts the following technical scheme:
the design is an active light-emitting film which comprises a substrate, an LED array, a scattering layer, a fluorescent powder adhesive layer and a retro-reflecting layer, wherein the LED array is arranged on the substrate, the scattering layer is fixed above the LED array, the fluorescent powder adhesive layer is filled between the substrate and the scattering layer, and the retro-reflecting layer is arranged on the side surface of the scattering layer, which faces away from the LED array.
Further, the LED array is one of COB LED, SMD LED, CSP LED, Mini LED, Micro LED, QLED and OLED.
Further, the distance between the LED arrays is not more than 10mm, and the thickness is not more than 3 mm.
Furthermore, the scattering layer can be made of acrylic glue with scattering effect, which is coated on the bottom surface of the retroreflective layer.
Further, the substrate is any one of glass fiber, aluminum base, copper base, ceramic base, polyester fiber, polyimide and indium tin oxide.
Further, the fluorescent powder rubber layer comprises silica gel mixed with yellow fluorescent powder.
Further, the scattering layer comprises PC doped with titanium white scattering particles.
The preparation method of the active luminescent film comprises the following steps:
and 5, cutting out a retro-reflective film with the same shape as the scattering film, and adhering the retro-reflective film on the scattering film to form the active light-emitting film.
The active luminous signboard comprises a support, a signboard panel, a bottom film and an active luminous film, wherein the signboard panel is fixedly connected with the support, the bottom film is adhered to the front surface of the signboard panel, and the active luminous film is adhered to the bottom film.
The preparation method of the active luminous signboard comprises the following steps:
s1: riveting the bracket and the signboard panel together;
s2: adhering the bottom film to the front surface of the signboard panel;
s3: sticking the active luminous film on the bottom film;
s4: the bottom film and the signboard panel are provided with wire passing holes, and the active light-emitting film passes through the wire passing holes through leads and is electrically connected with a power supply device arranged on the back of the signboard panel.
Compared with the prior art, the invention has the main beneficial technical effects that:
the film body is ultrathin, can be directly adhered to a common traffic sign board, and can be directly upgraded and reformed conveniently after being connected with a power supply and control device.
The active light-emitting film has small volume and high integration level, and the active light-emitting mark manufactured by using the active light-emitting film has the advantages of less process flow, lower packaging cost, high packaging integration level, good reliability, convenience in maintenance and uniform and fine display effect.
Drawings
FIG. 1 is a schematic cross-sectional view of an active light-emitting film according to the present invention.
Fig. 2 is a schematic view of an LED array structure of the active light emitting film of the present invention.
Fig. 3 is a schematic structural diagram of the active light-emitting sign of the present invention.
Fig. 4 is a rear view of the active illuminated sign of the present invention.
Fig. 5 is a circuit diagram of an active illuminated sign controller of the present invention.
In the above figures, 1 is a substrate, 2 is an LED light emitting chip, 3 is a phosphor paste, 4 is a scattering layer, 5 is a retroreflective layer, 100 is a signboard panel, 101 is a slide, 102 is a base film, and 103 is a rivet.
Detailed Description
The following examples are intended to illustrate the present invention in detail and should not be construed as limiting the scope of the present invention in any way.
Example 1: an active light-emitting film is shown in fig. 1, and the film is of a layered structure and sequentially comprises a substrate 1, an LED light-emitting chip 2, a phosphor glue 3, a scattering layer 4 and a retro-reflection layer 5 from left to right. The substrate 1 is a flexible PCB, and may be made of glass fiber, aluminum base, copper base, ceramic base, polyester fiber, polyimide or indium tin oxide, and in this embodiment, polyimide is used. An LED light emitting chip 2 is welded on the upper surface of the substrate 1, referring to fig. 2, the LED light emitting chip 2 is welded at equal intervals of 2mm × 2mm, the LED light emitting chip 2 is one of a COB LED, an SMD LED, a CSP LED, a Mini LED, a Micro LED, a QLED, and an OLED, and the Mini LED is used in this embodiment. When white light needs to be emitted, a white light LED or an RGB LED chip can be directly adopted, and a fluorescent powder layer or a quantum dot film layer can be coated on the blue light LED chip. The scattering layer 4 is arranged above the LED light-emitting chip 2, the material of the scattering layer 4 is PC mixed with titanium white scattering particles, or the scattering layer 4 can be made of pressure-sensitive cured acrylic glue coated on the bottom surface of the retro-reflecting layer 5, the scattering layer 4 contains optical microstructures or is printed and sprayed with scattering particles, the optical microstructures are in an equidistant or gradient dense arrangement of salient points or pits, and the scattering particles are titanium white.
The gap between the substrate 1 and the scattering layer 4 is filled with cured phosphor glue 3, and the phosphor glue 3 is silica gel mixed with yellow phosphor powder, and the thickness of the silica gel is 0.3 mm. The upper surface of the scattering layer 4 is pasted with a retro-reflection layer 5, and the retro-reflection layer 5 is also called a reflective membrane and is widely applied to the existing traffic sign. A coating or a reflective film capable of reflecting light is sprayed or adhered on the substrate 1 to enhance the luminous intensity. In addition, the scattering layer 4 has optical microstructures or is printed and sprayed with scattering particles to reduce the brightness of the front surface of the light source and further improve the uniformity of the scattering brightness.
The preparation method of the active luminescent film comprises the following steps:
step 1: reflow soldering N LED light-emitting chips 2 (with the thickness of 0.15 mm) on the upper surface of a flexible PCB substrate 1 (with the thickness of 0.25 mm) by using an automatic die bonder, and connecting the electrodes of the N LED light-emitting chips 102 together through the flexible PCB substrate 1 to form an electric path; the N LED light-emitting chips 102 are arranged in a 2mm multiplied by 2mm rectangular shape at equal intervals to form a character or pattern shape;
step 2: cutting the flexible PCB substrate 1 welded with the LED light-emitting chip 2 into characters or patterns with corresponding sizes by using an engraving machine;
and step 3: a layer of fluorescent powder glue 3 is packaged and cured on the upper surface of the flexible PCB substrate 1 in an automatic glue dispenser packaging mode, the upper surface of the fluorescent powder glue 3 is horizontal, all the LED light-emitting chips 2 are immersed in the fluorescent powder glue 3, and the thickness of the fluorescent powder glue is 0.3 mm;
and 4, step 4: cutting the scattering layer 4 with the thickness of 0.3mm into characters or patterns by a carving machine, and sticking the scattering layer on the upper surface of the fluorescent powder glue 3 by silica gel;
and 5: the light-transmitting retroreflective layer 5 (thickness: 0.4 mm) was cut into the same shape as the substrate 1 with a plotter and adhered to the scattering layer 4 with a pressure-sensitive adhesive.
The active light-emitting film is small in size, light and thin, convenient to use and uniform and fine in display effect. Before the manufacture, the flexible PCB substrate 1 needs to be cleaned and baked: the cleaning machine is used for cleaning the flexible PCB substrate 1, organic matters remained on the surface of the flexible PCB substrate 1 are removed, the reflow soldering bonding force of the LED light-emitting chip 2 is improved, then the oven is used for baking the flexible PCB substrate 1, and water vapor on the surface of the flexible PCB substrate 1 is removed.
Example 2: an active luminous signboard, as shown in fig. 3 and 4, comprises a rectangular support, a slideway 101 is arranged around the support, and a signboard panel 100 slides into the support from the lower part of the slideway 101 and is fixed by a rivet 103 on the back of the support. The sign panel 100 has a base film 102 attached to the front surface thereof, and an active light-emitting film attached to the base film to form a light-emitting portion. The power supply and control device is fixed to the back of the signboard panel 100 by screws. The panel 100 of the signboard is provided with a hidden wire passing hole through which the active light emitting film is connected with the power supply and control device.
The active luminous mark comprises the following manufacturing steps:
s1: manufacturing a bracket and a signboard panel by using an aluminum material, wherein the bracket is provided with a slideway, and the aluminum panel is arranged on the bracket through the slideway and fixed by using a rivet;
s2: attaching the base film 102 to the other plane of the aluminum signboard panel 100 through a pressure sensitive adhesive;
s3: the active light-emitting film in example 1 was attached to the base film 102 with a pressure-sensitive adhesive;
s4: the bottom film 102 and the signboard panel 100 are provided with hidden wire passing holes, the active light emitting film passes through the hidden wire passing holes through a conducting wire, and the back of the signboard panel 100 is connected with a power supply and control device to form an electric path.
The active luminous film is directly pasted on the common traffic sign board and is connected with the power supply and control device, so that the original non-luminous traffic sign board can be directly upgraded and reformed conveniently. The power supply device adopts a 12V storage battery, the control circuit comprises a voltage reduction circuit (MP 1584), a current control circuit (PL 2700) and a single-chip microcomputer MCU (STC 8A8K64S4A 12), referring to fig. 5, the voltage reduction circuit reduces the voltage of the storage battery to be close to the starting voltage of the LED chip, the current control circuit sets the output current of 1 pin to be the sum of the rated working currents of all the LED chips connected in parallel by adjusting the resistance value of a feedback resistor, the output end of the single-chip microcomputer is connected with an MOSFET to control the anode of an LED matrix, the output end of the single-chip microcomputer outputs 0-100% of settable PWM square waves with the frequency larger than 1kHz to achieve the rated working current when the LED is in a transient state, the average current can be conveniently set and reduced, and the brightness and the color temperature consistency of a. The negative pole of LED matrix passes through sampling resistor ground connection, and this control circuit can determine the luminous time of LED array through the singlechip settlement time, for example eight night to eight morning, utilizes the singlechip AD port to gather the voltage value of sampling resistor, current in the real-time supervision LED return circuit. The active light-emitting film is high in flatness, light, thin and soft, can be used for designing special-shaped marks, and is small in size, light in weight, convenient to manufacture and easy to keep balance.
While the invention has been described in detail with reference to the drawings and examples, it will be understood by those skilled in the art that various changes in the specific parameters of the embodiments described above may be made and equivalents may be substituted for elements thereof to form a plurality of specific embodiments without departing from the spirit of the invention, and therefore, all of the changes in the specific parameters and equivalents may be resorted to without departing from the scope of the invention.
Claims (10)
1. The active light-emitting film is characterized by comprising a substrate, an LED array, a scattering layer, a fluorescent powder adhesive layer and a retro-reflecting layer, wherein the LED array is arranged on the substrate, the scattering layer is fixed above the LED array, the fluorescent powder adhesive layer is arranged between the substrate and the scattering layer, and the retro-reflecting layer is arranged on the side surface of the LED array, which is back to the scattering layer.
2. The active light emitting film of claim 1, wherein the LED array is any one of a blue LED chip, an RGB LED chip, a COB LED, an SMD LED, a CSP LED, a Mini LED, a Micro LED, a QLED, and an OLED.
3. The active light emitting film of claim 1, wherein the LED array has a pitch of 10mm or less and a thickness of 3mm or less.
4. The active light emitting film of claim 1, wherein the scattering layer comprises acrylic glue applied to the retroreflective layer.
5. The active light emitting film of claim 1, wherein the substrate is any one of glass fiber, aluminum-based, copper-based, ceramic-based, polyester fiber, polyimide, and indium tin oxide.
6. The active light emitting film of claim 1, wherein the phosphor glue layer comprises silica gel mixed with yellow phosphor.
7. The active light emitting film of claim 1, wherein the scattering layer comprises PC doped with titanium white scattering particles.
8. A method for preparing the active light-emitting thin film according to claim 1, comprising:
step 1, carrying out die bonding reflow soldering on the upper surface of a substrate by an LED array, and connecting electrodes of the LED array together through the substrate to form an electric path;
step 2, cutting the substrate welded with the LED array into characters or patterns with corresponding sizes;
step 3, packaging and curing fluorescent powder glue on the upper surface of the substrate, so that the LED array is immersed in the fluorescent powder glue;
step 4, cutting out a scattering film with the same shape as the characters or patterns in the step 2 and pasting the scattering film on the upper surface of the fluorescent powder glue;
and 5, cutting a retro-reflective film with the same shape as the scattering film, and adhering the retro-reflective film on the scattering film to form the active light-emitting film.
9. The utility model provides an initiative luminous denoter, includes support, denoter panel, its characterized in that: still include basement membrane and claim 1 the luminous film of initiative, the denoter panel with support fixed connection, the basement membrane paste in the front surface of denoter panel, the luminous film of initiative paste in on the basement membrane.
10. A method of making an active luminescent sign according to claim 9, comprising the steps of:
s1: fixing the bracket and the signboard panel together;
s2: adhering the bottom film to the front surface of the signboard panel;
s3: attaching the active light emitting film of claim 1 to the base film;
s4: the active light-emitting film penetrates through the wire passing holes through wires and is electrically connected with a power supply device arranged on the back of the signboard panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911318569.1A CN111128984A (en) | 2019-12-19 | 2019-12-19 | Active luminous film, active luminous signboard and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911318569.1A CN111128984A (en) | 2019-12-19 | 2019-12-19 | Active luminous film, active luminous signboard and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111128984A true CN111128984A (en) | 2020-05-08 |
Family
ID=70500198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911318569.1A Pending CN111128984A (en) | 2019-12-19 | 2019-12-19 | Active luminous film, active luminous signboard and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111128984A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112234132A (en) * | 2020-10-23 | 2021-01-15 | 崇义县精亿灯饰制品有限公司 | Energy-saving LED lamp production process |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2744519A1 (en) * | 1996-02-07 | 1997-08-08 | Berque Emmanuel | Retroreflective and luminous panel for road signalling |
| CN2929882Y (en) * | 2006-01-26 | 2007-08-01 | 李思伟 | Portable LED mark |
| KR20070113341A (en) * | 2006-05-23 | 2007-11-29 | (주) 미도랜드 | Bright light emitting signboard |
| KR20100117741A (en) * | 2009-04-27 | 2010-11-04 | 최광철 | Method for repairing of the road sign board for dew proofing |
| US20120087105A1 (en) * | 2010-10-05 | 2012-04-12 | Intematix Corporation | Wavelength conversion component |
| CN202432318U (en) * | 2012-01-14 | 2012-09-12 | 优杰精密机械(苏州)有限公司 | LED (light-emitting diode) soft lamp panel |
| CN102683555A (en) * | 2011-03-07 | 2012-09-19 | 展晶科技(深圳)有限公司 | Packaging structure and packaging method for light-emitting diode |
| CN202482788U (en) * | 2012-01-11 | 2012-10-10 | 南京赛康交通实业有限公司 | Modularization solar active shining denoter |
| KR101280953B1 (en) * | 2012-11-15 | 2013-07-08 | 주식회사 카이넥스엠 | Led top view type internal illumination traffic sign |
| CN104966474A (en) * | 2015-06-25 | 2015-10-07 | 南京赛康交通安全科技股份有限公司 | Light guiding type reflective film plate and manufacturing method thereof |
| CN205504601U (en) * | 2016-04-15 | 2016-08-24 | 宁波欧朗光电科技有限公司 | Flexible LED lamps and lanterns |
| CN107731801A (en) * | 2017-11-17 | 2018-02-23 | 广州市香港科大霍英东研究院 | Flexible light-emitting diodes structure and preparation method thereof |
| CN211045431U (en) * | 2019-12-19 | 2020-07-17 | 河南车路智通信息技术有限公司 | Active luminous film and active luminous sign board |
-
2019
- 2019-12-19 CN CN201911318569.1A patent/CN111128984A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2744519A1 (en) * | 1996-02-07 | 1997-08-08 | Berque Emmanuel | Retroreflective and luminous panel for road signalling |
| CN2929882Y (en) * | 2006-01-26 | 2007-08-01 | 李思伟 | Portable LED mark |
| KR20070113341A (en) * | 2006-05-23 | 2007-11-29 | (주) 미도랜드 | Bright light emitting signboard |
| KR20100117741A (en) * | 2009-04-27 | 2010-11-04 | 최광철 | Method for repairing of the road sign board for dew proofing |
| US20120087105A1 (en) * | 2010-10-05 | 2012-04-12 | Intematix Corporation | Wavelength conversion component |
| CN102683555A (en) * | 2011-03-07 | 2012-09-19 | 展晶科技(深圳)有限公司 | Packaging structure and packaging method for light-emitting diode |
| CN202482788U (en) * | 2012-01-11 | 2012-10-10 | 南京赛康交通实业有限公司 | Modularization solar active shining denoter |
| CN202432318U (en) * | 2012-01-14 | 2012-09-12 | 优杰精密机械(苏州)有限公司 | LED (light-emitting diode) soft lamp panel |
| KR101280953B1 (en) * | 2012-11-15 | 2013-07-08 | 주식회사 카이넥스엠 | Led top view type internal illumination traffic sign |
| CN104966474A (en) * | 2015-06-25 | 2015-10-07 | 南京赛康交通安全科技股份有限公司 | Light guiding type reflective film plate and manufacturing method thereof |
| CN205504601U (en) * | 2016-04-15 | 2016-08-24 | 宁波欧朗光电科技有限公司 | Flexible LED lamps and lanterns |
| CN107731801A (en) * | 2017-11-17 | 2018-02-23 | 广州市香港科大霍英东研究院 | Flexible light-emitting diodes structure and preparation method thereof |
| CN211045431U (en) * | 2019-12-19 | 2020-07-17 | 河南车路智通信息技术有限公司 | Active luminous film and active luminous sign board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112234132A (en) * | 2020-10-23 | 2021-01-15 | 崇义县精亿灯饰制品有限公司 | Energy-saving LED lamp production process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207852672U (en) | A kind of tetrad RGB-LED encapsulation modules and its display screen | |
| EP3582262B1 (en) | Four-in-one mini-led module, display screen and manufacturing method | |
| CN109658828A (en) | Transparent flexible display screen and its transparent circuitry | |
| JP2008505509A (en) | Transparent light emitting device and manufacturing method thereof | |
| CN111226319B (en) | Transparent light-emitting device display | |
| JP2015523604A (en) | Transparent lightning plate and manufacturing method thereof | |
| CN101350160A (en) | LED display screen and encapsulation method thereof | |
| CN109638008A (en) | A kind of flexible filament and its packaging method of double-colored temperature | |
| CN103680340A (en) | Integrated LED display encapsulated module suitable for ultrahigh display density | |
| CN103594463B (en) | Integrated LED displaying packaging module with LED chips arranged in wafers in inverted mode | |
| CN211045431U (en) | Active luminous film and active luminous sign board | |
| CN111128984A (en) | Active luminous film, active luminous signboard and preparation method thereof | |
| CN201093225Y (en) | Light-permeable light emitting diode array display device | |
| JP3146901U (en) | Flexible thin circuit board for light emitting diode and light emitting diode light bar formed by applying the same | |
| CN211670205U (en) | LED lamp strip | |
| CN202796951U (en) | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source | |
| CN2509675Y (en) | Illuminating diode display device with double-side illuminating | |
| CN112201736B (en) | MiniLED matrix backlight board, manufacturing method thereof and notebook computer | |
| CN201732235U (en) | Direct ultra-thin light emitting diode (LED) | |
| CN213399134U (en) | Yellow fluorescent backlight module based on four-chip-string blue-light LED matching | |
| TW200945940A (en) | Flexible LED display | |
| KR20080029351A (en) | The apparatus of led blu and that of manufacture method | |
| CN209418496U (en) | A kind of integrated LED backlight encapsulating structure | |
| CN109980066B (en) | Fluorescent glue, white light chip and preparation method thereof | |
| CN202712177U (en) | Two-sided light emitting plane sheet type LED package structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |