CN109638008A - A kind of flexible filament and its packaging method of double-colored temperature - Google Patents
A kind of flexible filament and its packaging method of double-colored temperature Download PDFInfo
- Publication number
- CN109638008A CN109638008A CN201811620899.1A CN201811620899A CN109638008A CN 109638008 A CN109638008 A CN 109638008A CN 201811620899 A CN201811620899 A CN 201811620899A CN 109638008 A CN109638008 A CN 109638008A
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- Prior art keywords
- double
- flexible
- led chips
- filament
- silica gel
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- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000000741 silica gel Substances 0.000 claims abstract description 32
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000000203 mixture Substances 0.000 claims abstract description 29
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000012360 testing method Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 238000010422 painting Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000005516 engineering process Methods 0.000 abstract description 7
- 239000000843 powder Substances 0.000 abstract description 7
- 239000003086 colorant Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 description 4
- 230000035807 sensation Effects 0.000 description 3
- 241000254158 Lampyridae Species 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to the flexible filaments and its packaging method of a kind of double-colored temperature, including flexible base board；Two circuits being arranged in parallel of distribution on flexible substrates；The flip LED chips of two groups of parallelly distribute ons on flexible substrates, above-mentioned two groups of flip LED chips are connected with two circuits respectively；Low color temperature silica gel phosphor mixture, the front and back sides coated in any one group of flip LED chips；High color temperature silica gel phosphor mixture, front and back sides coated in another group of flip LED chips, the flexible filament and its packaging method of double-colored temperature of the invention, it is designed to two parts route, Gu after good chip, it is directly coated with the silica gel and fluorescent powder mixture of two kinds of different-colours respectively, achievees the effect that double-colored temperature；Two lines road is also designed to different voltages, can be required according to the driving power of client, is designed to two kinds of colour temperatures, and the filament of different voltages can simplify the production technology of double-colored tenderness LED filament, improves production efficiency and yield.
Description
Technical field
The present invention relates to and field of illumination lamp technology, more particularly to flexible filament and its encapsulation side of a kind of double-colored temperature
Method.
Background technique
As ordinary incandescent lamp gradually exits illumination market, LED type lighting source is capturing rapidly entire illumination city
?.LED type lighting source mostly uses greatly light emitting diode as light source, and light emitting diode is that one kind can convert electrical energy into can
Light-exposed solid state semiconductor devices, electric energy directly can be converted into visible light by it.The core of LED is a light emitting diode
Chip, one end is cathode, and the other end is the anode for connecting power supply.Flexible filament is used as illumination or ornament lamp, due to
Its moulding is similar to the incandescent lamp being widely present in the market, in the environment of reducing energy consumption is widelyd popularize in the whole world, in addition its appearance
Moulding meets aesthetic standards and caters to the love knot of missing old times or old friends of people, and is increasingly welcomed by the general public.
The flexible filament and its packaging method of double-colored temperature are also increasingly received an acclaim due to color-variable, and current is double-colored
The structure of tenderness filament is as shown in Fig. 3 comprising substrate 10, chip 11, low color temperature mixture 12, high color temperature mixture
13, silica gel 14 and connecting terminal 15；Its manufacturing method is as follows: on single flexible wiring board, using dispenser, silica gel and firefly
The mixture of light powder, first one, every one mode, is put a kind of good colour temperature, the same manner is then used, another colour temperature
Silica gel and fluorescent powder mixture point on.Finally in whole coating layer of transparent silica gel.But it is sent out in actual production and processing
Existing, the production technology of this mode is complicated, and process is cumbersome, low efficiency, while its granular sensation is it is obvious that brightness is low, unsightly.
Summary of the invention
Flexible filament and its encapsulation of the double-colored temperature of one kind are provided the invention aims to overcome the deficiencies in the prior art
Method simplifies the production technology of double-colored flexible LED filament, has the advantages that production efficiency and yield are high.
In order to achieve the above objectives, the technical solution adopted by the present invention is that: a kind of flexible filament of double-colored temperature, including
Flexible base board；
Two circuits being arranged in parallel of distribution on flexible substrates；
The flip LED chips of two groups of parallelly distribute ons on flexible substrates, above-mentioned two groups of flip LED chips respectively with two circuit phases
Connection；
Low color temperature silica gel phosphor mixture, the front and back sides coated in any one group of flip LED chips；
High color temperature silica gel phosphor mixture, the front and back sides coated in another group of flip LED chips.
Preferably, layer of transparent silica gel is also applied outside the flexible filament of the double-colored temperature and its packaging method.
Preferably, the flip LED chips are fixed on flexible substrates by using the mode of flip technique, flip technique
The mode printed using steel mesh.
Preferably, the circuit is metallic copper route, and circuit is directly formed on substrate.
Preferably, the flexible base board is flexible metal base plate.
The packaging method of the flexible filament of double-colored temperature, comprising the following steps:
Step 1: flexible base board is provided;
Step 2: two circuits are made on flexible substrates;
Step 3: it by flip LED chips on substrate, by way of equipment die bond, is fixed on electric bracket, forms two groups and fall
LED chip is filled, and communicates two groups of flip LED chips with circuit respectively;
Step 4: in the substrate front side for fixing two groups of flip LED chips, the silica gel phosphor mixture of two kinds of colour temperatures is carried out
Coating；
Step 5: in the substrate back side for fixing flip LED chips, continue the painting of two kinds of colour temperature silica gel phosphor mixtures
It covers；
Step 6: will coat the bracket of silica gel phosphor mixture, be put into 150 DEG C of -200 DEG C of baking 5-8h of high temperature；
Step 7: baked finished product carries out lighting test；
Step 8: the product for testing OK is punched out, and is punched into single filament packaging；
Step 9: double-colored tenderness filament encapsulation is completed.
Due to the application of the above technical scheme, compared with the prior art, the invention has the following advantages:
(1) simple production process, it is only necessary to increase a route on substrate originally, coat silica gel and the firefly of a kind of corresponding colour temperature
Light powder mixture uses light more evenly, and whole lamp is without granular sensation, and colour temperature adjusting range is bigger, and production efficiency is higher.
(2) double-colored temperature control system is not influenced by the colour temperature on other chips, while the production efficiency of entire product is faster, can
To reach 20K/ hours.
(3) the flexible filament and its packaging method of double-colored temperature of the invention, can be designed to after being designed to two parts route
Different voltages can be required according to the driving power of client, be designed to two kinds of colour temperatures, and the filament of different voltages can simplify double
The production technology of colour temperature flexible LED filament improves production efficiency and yield.
Detailed description of the invention
Technical scheme of the present invention is further explained with reference to the accompanying drawing:
Accompanying drawing 1 is the structural representation of the present invention；
Attached drawing 2 is the partial enlarged view in attached drawing 1；
Attached drawing 3 is the structural schematic diagram of the prior art；
Wherein: 1, flexible base board；2, flip LED chips；3, low color temperature silica gel phosphor mixture；4, high color temperature silica gel fluorescent powder
Mixture；5, transparent silica gel；6, terminal；10, substrate；11, chip；12, low color temperature mixture；13, high color temperature mixture；14,
Silica gel；15, connecting terminal.
Specific embodiment
Below in conjunction with the accompanying drawings and specific embodiment, the present invention is described in further details.
Refering to attached drawing 1-2, the flexible filament of the double-colored temperature of one kind of the present invention, including flexible base board 1；It is distributed in flexibility
Two on the substrate 1 circuit (not shown)s being arranged in parallel；The flip LED core of two groups of parallelly distribute ons on a flexible substrate 1
Piece 2, above-mentioned two groups of flip LED chips 2 are connected with two circuits respectively；Low color temperature silica gel phosphor mixture 3 coats in office
It anticipates the front and back sides of one group of flip LED chips 2；High color temperature silica gel phosphor mixture 4, coated in another group of flip LED chips 2
Front and back sides, wherein the mode coated using equipment is uniformly coated in flip LED chips 2 according to different colour temperatures.
It is played as further preferred embodiments wherein also applying layer of transparent silica gel 5 outside the flexible filament of double-colored temperature
Preferable protective action.
As further preferred embodiments, the flip LED chips 2 are fixed on soft by using the mode of flip technique
Property substrate 1 on, flip technique use steel mesh print mode, use steel mesh print technology, it is ensured that the tin of each PAD point
Cream is uniform, and guaranteed quality is stablized.
As further preferred embodiments, the circuit is metallic copper route, and circuit is directly formed on substrate.
As further preferred embodiments, the flexible base board is flexible metal base plate.
Wherein, a kind of packaging method of the flexible filament of double-colored temperature is additionally provided, comprising the following steps:
Step 1: flexible base board is provided;
Step 2: two circuits are made on flexible substrates;
Step 3: it by flip LED chips on substrate, by way of equipment die bond, is fixed on electric bracket, forms two groups and fall
LED chip is filled, and communicates two groups of flip LED chips with circuit respectively;
Step 4: in the substrate front side for fixing two groups of flip LED chips, the silica gel phosphor mixture of two kinds of colour temperatures is carried out
Coating；
Step 5: in the substrate back side for fixing flip LED chips, continue the painting of two kinds of colour temperature silica gel phosphor mixtures
It covers；
Step 6: will coat the bracket of silica gel phosphor mixture, be put into 150 DEG C of -200 DEG C of baking 5-8h of high temperature；
Step 7: baked finished product carries out lighting test；
Step 8: the product for testing OK is punched out, and is punched into single filament packaging；
Step 9: double-colored tenderness filament encapsulation is completed.
Wherein, two circuits are connected with terminal 6, for connecting power supply.
The simple production process of the flexible filament of double-colored temperature of the invention, it is only necessary to increase a line on substrate originally
Road coats the silica gel and fluorescent powder mixture of a kind of corresponding colour temperature, uses light more evenly, colour temperature adjusting range is bigger, is produced into
This is low, high-efficient.
Double-colored temperature control system of the invention, is not influenced by the colour temperature on other chips, while the production efficiency of entire product is more
Fastly, it can achieve 20K/ hours；For whole lamp without granular sensation, colour temperature adjustment is wider, more efficient.
The flexible filament and its packaging method of double-colored temperature of the invention, are designed to two parts route, Gu after good chip, respectively
It is directly coated with the silica gel and fluorescent powder mixture of two kinds of different-colours, achievees the effect that double-colored temperature.Two lines road can also be designed
At different voltages, it can be required according to the driving power of client, be designed to two kinds of colour temperatures, the filament of different voltages can simplify
The production technology of double-colored tenderness LED filament improves production efficiency and yield.
The above is only specific application examples of the invention, are not limited in any way to protection scope of the present invention.All uses
Equivalent transformation or equivalent replacement and the technical solution formed, all fall within rights protection scope of the present invention.
Claims (6)
1. a kind of flexible filament of double-colored temperature, it is characterised in that: including
Flexible base board；
Two circuits being arranged in parallel of distribution on flexible substrates；
The flip LED chips of two groups of parallelly distribute ons on flexible substrates, above-mentioned two groups of flip LED chips respectively with two circuit phases
Connection；
Low color temperature silica gel phosphor mixture, the front and back sides coated in any one group of flip LED chips；
High color temperature silica gel phosphor mixture, the front and back sides coated in another group of flip LED chips.
2. the flexible filament of double-colored temperature according to claim 1, it is characterised in that: the flexible filament of the double-colored temperature and its
Layer of transparent silica gel is also applied outside packaging method.
3. the flexible filament of double-colored temperature according to claim 1, it is characterised in that: the flip LED chips by using
The mode of flip technique is fixed on flexible substrates, the mode that flip technique uses steel mesh to print.
4. the flexible filament of double-colored temperature according to claim 1, it is characterised in that: the circuit is metallic copper route, electricity
Road is directly formed on substrate.
5. the flexible filament of double-colored temperature according to claim 1, it is characterised in that: the flexible base board is flexible metal base
Plate.
6. the packaging method of the flexible filament of double-colored temperature as described in claim 1, it is characterised in that: the following steps are included:
Step 1: flexible base board is provided;
Step 2: two circuits are made on flexible substrates;
Step 3: it by flip LED chips on substrate, by way of equipment die bond, is fixed on electric bracket, forms two groups and fall
LED chip is filled, and communicates two groups of flip LED chips with circuit respectively;
Step 4: in the substrate front side for fixing two groups of flip LED chips, the silica gel phosphor mixture of two kinds of colour temperatures is carried out
Coating；
Step 5: in the substrate back side for fixing flip LED chips, continue the painting of two kinds of colour temperature silica gel phosphor mixtures
It covers；
Step 6: will coat the bracket of silica gel phosphor mixture, be put into 150 DEG C of -200 DEG C of baking 5-8h of high temperature；
Step 7: baked finished product carries out lighting test；
Step 8: the product for testing OK is punched out, and is punched into single filament packaging；
Step 9: double-colored tenderness filament encapsulation is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811620899.1A CN109638008A (en) | 2018-12-28 | 2018-12-28 | A kind of flexible filament and its packaging method of double-colored temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811620899.1A CN109638008A (en) | 2018-12-28 | 2018-12-28 | A kind of flexible filament and its packaging method of double-colored temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109638008A true CN109638008A (en) | 2019-04-16 |
Family
ID=66078699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811620899.1A Pending CN109638008A (en) | 2018-12-28 | 2018-12-28 | A kind of flexible filament and its packaging method of double-colored temperature |
Country Status (1)
| Country | Link |
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| CN (1) | CN109638008A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817609A (en) * | 2018-12-06 | 2019-05-28 | 浙江开元机电科技有限公司 | A kind of color temperature-tunable LED tunnel lamp of dual chip |
| CN110828647A (en) * | 2019-11-20 | 2020-02-21 | 侯立东 | Manufacturing method of flexible LED lamp string |
| CN111883628A (en) * | 2020-07-09 | 2020-11-03 | 苏州工业园区客临和鑫电器有限公司 | High-density shadow-free flexible lamp strip and packaging method thereof |
| CN111883634A (en) * | 2020-07-09 | 2020-11-03 | 苏州工业园区客临和鑫电器有限公司 | Multicolor flexible filament and packaging method thereof |
| CN112804820A (en) * | 2021-01-27 | 2021-05-14 | 恒太工业科技(深圳)股份有限公司 | MINI multi-color lamp strip and production process method |
| CN113471179A (en) * | 2021-06-11 | 2021-10-01 | 五邑大学 | Color temperature adjustable COB LED light source and manufacturing method thereof |
| CN114566492A (en) * | 2022-01-19 | 2022-05-31 | 苏州工业园区客临和鑫电器有限公司 | Chip-scale packaging-based LED flexible filament preparation method capable of self-adjusting color temperature |
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| CN206361426U (en) * | 2016-12-29 | 2017-07-28 | 浙江瑞丰光电有限公司 | A kind of LED filament of adjustable color and the light fixture including it |
| CN107464803A (en) * | 2017-08-18 | 2017-12-12 | 上海应用技术大学 | It is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating |
| CN108258109A (en) * | 2018-02-06 | 2018-07-06 | 海迪科（南通）光电科技有限公司 | A kind of CSP encapsulation LED variable color-temperature filament lamp pin connection structures and preparation method thereof |
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2018
- 2018-12-28 CN CN201811620899.1A patent/CN109638008A/en active Pending
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| CN105590994A (en) * | 2014-10-22 | 2016-05-18 | 泉州市金太阳照明科技有限公司 | LED light source substrate and manufacturing method thereof |
| CN206361426U (en) * | 2016-12-29 | 2017-07-28 | 浙江瑞丰光电有限公司 | A kind of LED filament of adjustable color and the light fixture including it |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817609A (en) * | 2018-12-06 | 2019-05-28 | 浙江开元机电科技有限公司 | A kind of color temperature-tunable LED tunnel lamp of dual chip |
| CN110828647A (en) * | 2019-11-20 | 2020-02-21 | 侯立东 | Manufacturing method of flexible LED lamp string |
| CN111883628A (en) * | 2020-07-09 | 2020-11-03 | 苏州工业园区客临和鑫电器有限公司 | High-density shadow-free flexible lamp strip and packaging method thereof |
| CN111883634A (en) * | 2020-07-09 | 2020-11-03 | 苏州工业园区客临和鑫电器有限公司 | Multicolor flexible filament and packaging method thereof |
| CN112804820A (en) * | 2021-01-27 | 2021-05-14 | 恒太工业科技(深圳)股份有限公司 | MINI multi-color lamp strip and production process method |
| CN113471179A (en) * | 2021-06-11 | 2021-10-01 | 五邑大学 | Color temperature adjustable COB LED light source and manufacturing method thereof |
| CN114566492A (en) * | 2022-01-19 | 2022-05-31 | 苏州工业园区客临和鑫电器有限公司 | Chip-scale packaging-based LED flexible filament preparation method capable of self-adjusting color temperature |
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Application publication date: 20190416 |