CN107464803A - It is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating - Google Patents
It is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating Download PDFInfo
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- CN107464803A CN107464803A CN201710712972.7A CN201710712972A CN107464803A CN 107464803 A CN107464803 A CN 107464803A CN 201710712972 A CN201710712972 A CN 201710712972A CN 107464803 A CN107464803 A CN 107464803A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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Abstract
The invention discloses it is a kind of based on wafer-level package can from the LED filament preparation method of color-temperature regulating, including：Prepare fluorescent coating, the wafer-level package flip-chip for preparing different-colour, etching conductive circuit, chip installation on substrate.It is provided by the invention it is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating, this kind of method can reach different luminous flux, colour temperature, aobvious finger and photochromic requirement, meet real life environments to luminous requirement, user can dexterously be coupled out required illuminating effect by the size of line current where regulating and controlling different-colour chip.The flexibility and the scope of application that also increase LED filament uses simultaneously, also are adapted for large-scale industrial production.
Description
Technical field
The invention belongs to LED lighting engineering, more particularly to it is a kind of based on wafer-level package can be from the LED of color-temperature regulating
Silk preparation method.
Background technology
Light source is as a kind of novel green lighting source for light emitting diode (Light Emitting Diode), with it without dirt
The features such as dye, long-life, low-loss, photochromic pure, vibration resistance, is widely used in the world.Wafer-level package
LED is because having the characteristics such as small encapsulation volume, perfect heat-dissipating, luminous uniform, long lifespan wide concerned and with its using flexible
The characteristics of high, turns into industry new lover in recent years.
The LED major companies on the ground such as Taiwan, Japan and Korea S, America and Europe have issued similar wafer-level package LED product one after another at present.It is comprehensive
Close each enterprise product, it is common the characteristics of be to be based on the basis of flip-chip, make encapsulation volume smaller, optics, thermal property are more
It is good, while because of the step of eliminating lead frame and routing, make its later process more convenient.Current Domestic CSP (Chip
Scale Package) LED production it is more without essence, simply reached small size encapsulation, while cost improves, its performance is but
Expection is unable to reach, its basic reason is, domestic manufacturer does not form the understanding of a science to CSP, and we are breaking through
While CSP production technologies, CSP encapsulation advantage is taken full advantage of, CSP is applied to LED filament first, and prepare
Can be from the LED filament of color-temperature regulating.
LED filament is gradually hot in recent years, the LAVIE EN ROSE carried due to itself and enjoy pursuing for people, had
People is attempted with preparing LED filament：Huizhou Huarui Light Source Technology Co., Ltd., the Marvin's ripple of auspicious photoelectricity (Huizhou) Co., Ltd of China
Etc. have developed a kind of LED filament (" LED filament ", patent publication No.：105161597A), this piece patent simply protects one kind
The structure of LED filament, its performance and method are not all protected.River great waves of Jiaxing Shan Pu Lighting Electric Appliance Co., Ltd etc. are developed
A kind of LED filament (" LED filament ", patent publication No.：106838660A), equally it is improvement and encapsulating material to structure
Optimization, it is impossible to reach the stability of photoluminescence of wafer-level package flip-chip.ZhangZhou Rieter photoelectron Science and Technology Ltd. was once
Cyclopentadienyl, which is entered et al., have developed a kind of LED filament lamp, (LED filament lamp, patent publication No.：105485534A) but still simply excellent
Change structure to be radiated, can only achieve single illumination effect, light underaction, is applicable ineffective.Be not suitable for batch into
Production.Presently disclosed document and patent are all the simple Making programmes on LED filament, and optimization structure and material is not to property
Elaboration can be made, luminous example is also coordinated without multi color temperature chip, we are improved in addition regarding to the issue above, and are prepared
The LED filament that can voluntarily regulate and control colour temperature based on wafer-level package flip-chip.
The content of the invention
The technical problem to be solved in the present invention is to provide it is a kind of based on wafer-level package can be from the LED filament system of color-temperature regulating
Preparation Method, this kind of method can reach different luminous flux, colour temperature, aobvious finger and photochromic requirement, meet real life environments pair
Luminous requirement, user can be dexterously coupled out required by the size of line current where regulating and controlling different-colour chip
Illuminating effect.The flexibility and the scope of application that also increase LED filament uses simultaneously, also are adapted for large-scale industrial production.
To solve the above problems, the technical scheme is that：
It is a kind of to be comprised the following steps based on wafer-level package from the LED filament preparation method of color-temperature regulating：
S1：Prepare fluorescent coating；
It is preferred that with silica gel A, B glue mixes with fluorescent material, and fluorescent glue is made using rotary coating or silk screen print method
Film, thickness is between 0.2~0.6mm；
S2：Prepare the wafer-level package flip-chip of different-colour；
It is preferred that upside-down mounting blue chip is pressed together in the fluorescent coating prepared, the fluorescent coating solidification is treated
Cut afterwards with scribing machine, by padded and the control of scribing machine blade thickness inside pressing machine, obtaining regulation top
The chip of face package thickness and regulation side package thickness, the arrange in pairs or groups different top capsulation thickness and side encapsulation thickness
Degree can obtain the wafer-level package flip-chip of different-colour；
S3：Etching conductive circuit on substrate：Two or a plurality of conducting wire are etched on strip substrate, and described
Preset die bond position is reserved between conducting wire；
S4：Chip is installed：The wafer-level package by packaged wafer-level package flip-chip according to identical colour temperature
Flip-chip series connection, the wafer-level package flip-chip of different-colour mode in parallel, are alternately mounted on the strip
On the preset die bond position on substrate.
In the step S3, the strip substrate is hard substrate or flexible base board.
In an embodiment of the present invention, the hard substrate material is glass.
In an embodiment of the present invention, the hard substrate material is light-transmittance ceramics.
In an embodiment of the present invention, the flexible base board material is the good metal substrate of heat dispersion.
In an embodiment of the present invention, the flexible base board material is the good non-metal base plate of heat dispersion.
In the step S3, the conducting wire connects for parallel way, and its feature is that the conducting wire shares one
Positive source, and individually output is first negative pole and the second negative pole to every conducting wire.
The present invention makes it have the following advantages that and actively imitate compared with prior art due to using above technical scheme
Fruit：
The present invention creatively uses the wafer-level package flip-chip combination of multiple color temperatures to make LED filament, uses
Cheng Zhong, user can dexterously be coupled out required illumination by the size of line current where regulating and controlling different-colour chip
Effect.
The present invention replaces common formal dress or flip-chip with wafer-level package flip-chip, has launching efficiency height, thing
Physicochemical stable performance, the series of advantages such as high homogeneity, thermal conductivity are high, aftertreatment technology is simple, overcome fluorescent material envelope
The problems such as stability of dress is poor, easy to aging；Simple, the good heat dissipation using inverted structure LED chip die bond technique；The present invention uses more
Colour temperature chip parallel combination and the positive and negative die bond that can arrange in pairs or groups, can reach different luminous flux, colour temperature, it is aobvious refer to and it is photochromic will
Ask, meet real life environments to luminous requirement；The packaging technology of the wafer-level package is simple, the letter of LED vermicelli production technique
Easily, it is adapted to large-scale industrial production.
Brief description of the drawings
The schematic diagram of Fig. 1 SMIS chip size package upside-down mounting blue chips of the present invention.
The schematic diagram of LED filament in Fig. 2 present invention.
1- fluorescent coatings
2- wafer-level package flip-chip 2-1 upside-down mounting blue chips
3-LED filament 3-1 conducting wire 3-2 strip substrates
4- positive sources
5-1 the first negative pole the second negative poles of 5-2
Embodiment
Below in conjunction with the drawings and specific embodiments to it is proposed by the present invention it is a kind of based on wafer-level package can be from color-temperature regulating
LED filament preparation method be described in further detail.According to following explanation and claims, advantages and features of the invention
It will become apparent from.It should be noted that accompanying drawing uses using very simplified form and non-accurately ratio, only to facilitate,
Lucidly aid in illustrating the purpose of the embodiment of the present invention.
It is a kind of to be comprised the following steps based on wafer-level package from the LED filament preparation method of color-temperature regulating：
S1：Prepare fluorescent coating 1；
It is preferred that with silica gel A, B glue mixes with fluorescent material, and fluorescent glue is made using rotary coating or silk screen print method
Film, thickness is between 0.2~0.6mm；
S2：Prepare the wafer-level package flip-chip 2 of different-colour；
It is preferred that upside-down mounting blue chip 2-1 is pressed together in the fluorescent coating 1 prepared, used after the solidification of fluorescent coating 1
Scribing machine is cut, by padded and the control of scribing machine blade thickness inside pressing machine, obtaining regulation top surface envelope
Fill thickness and provide the chip of side package thickness, the top capsulation thickness for arranging in pairs or groups different can obtain not with side package thickness
With the wafer-level package flip-chip 2 of colour temperature；
The present invention replaces common formal dress or flip-chip with wafer-level package flip-chip, has launching efficiency height, thing
Physicochemical stable performance, the series of advantages such as high homogeneity, thermal conductivity are high, aftertreatment technology is simple, overcome fluorescent material envelope
The problems such as stability of dress is poor, easy to aging.
S3：Etching conductive circuit 3-1 on substrate：Two or a plurality of conducting wire 3- are etched on strip substrate 3-2
1, and preset die bond position is reserved between conducting wire 3-1；
S4：Chip is installed：Wafer-level package upside-down mounting by packaged wafer-level package flip-chip 2 according to identical colour temperature
The mode that chip 2 is connected, the wafer-level package flip-chip of different-colour 2 is in parallel, is alternately mounted on strip substrate 3-2
On preset die bond position.
The present invention creatively uses the wafer-level package flip-chip combination of multiple color temperatures to make LED filament, uses
Cheng Zhong, user can dexterously be coupled out required illumination by the size of line current where regulating and controlling different-colour chip
Effect.
The present invention uses multi color temperature chip parallel combination and the positive and negative die bond that can arrange in pairs or groups, can reach different luminous flux,
Colour temperature, aobvious finger and photochromic requirement, meet real life environments to luminous requirement；The packaging technology letter of the wafer-level package
Single, LED vermicelli production technique is simple, is adapted to large-scale industrial production.
In step S3, strip substrate 3-2 is hard substrate or flexible base board.
In one embodiment, the hard substrate material is glass.
In one embodiment, the hard substrate material is light-transmittance ceramics.
In one embodiment, the flexible base board material is the good metal substrate of heat dispersion.
In one embodiment, the flexible base board material is the good non-metal base plate of heat dispersion.
In step S3, conducting wire 3-1 connects for parallel way, and its feature is that conducting wire 3-1 is sharing a power supply just
Pole 4, and individually output is a first negative pole 5-1 and the second negative pole 5-2 to every conducting wire 3-1.
Embodiments of the present invention are explained in detail above in conjunction with accompanying drawing, but the present invention is not limited to above-mentioned implementation
Mode.Even if to the present invention, various changes can be made, if these changes belong to the model of the claims in the present invention and its equivalent technologies
Within enclosing, then still fall among protection scope of the present invention.
Claims (6)
1. it is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating, it is characterised in that including following step
Suddenly：
S1：Prepare fluorescent coating (1)；
S2：Prepare the wafer-level package flip-chip (2) of different-colour；
S3：Etching conductive circuit (3-1) on substrate：Two or a plurality of conducting wire (3- are etched on strip substrate (3-2)
1) preset die bond position, and between the conducting wire (3-1) is reserved；
S4：Chip is installed：Packaged wafer-level package flip-chip (2) is fallen according to the wafer-level package of identical colour temperature
Cartridge chip (2) series connection, the wafer-level package flip-chip (2) of different-colour mode in parallel, are alternately mounted on the length
On the preset die bond position on strip substrate (3-2).
2. it is as claimed in claim 1 it is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating, its feature
It is, in the step S1, is mixed with silica gel with fluorescent material, the fluorescent glue is prepared using rotary coating or silk screen print method
Film (1), the thickness of the fluorescent coating (1) is between 0.2~0.6mm.
3. it is as claimed in claim 1 it is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating, its feature
It is, in the step S3, the strip substrate (3-2) is hard substrate or flexible base board.
4. it is as claimed in claim 3 it is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating, its feature
It is, the hard substrate material is glass or light-transmittance ceramics.
5. it is as claimed in claim 3 it is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating, its feature
It is, the flexible base board material is the good metal or non-metal base plate of heat dispersion.
6. it is as claimed in claim 1 it is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating, its feature
It is, in the step S3, the conducting wire (3-1) connects for parallel way, and its feature is common for the conducting wire (3-1)
With a positive source (4), and individually output is first negative pole (5-1) and the second negative pole to every conducting wire (3-1)
(5-2)。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710712972.7A CN107464803B (en) | 2017-08-18 | 2017-08-18 | It is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating |
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|---|---|---|---|
| CN201710712972.7A CN107464803B (en) | 2017-08-18 | 2017-08-18 | It is a kind of based on wafer-level package can be from the LED filament preparation method of color-temperature regulating |
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| CN107464803A true CN107464803A (en) | 2017-12-12 |
| CN107464803B CN107464803B (en) | 2019-10-11 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108258109A (en) * | 2018-02-06 | 2018-07-06 | 海迪科（南通）光电科技有限公司 | A kind of CSP encapsulation LED variable color-temperature filament lamp pin connection structures and preparation method thereof |
| CN108321150A (en) * | 2017-12-21 | 2018-07-24 | 维沃移动通信有限公司 | A kind of preparation method of light source and light source |
| CN108598068A (en) * | 2018-05-15 | 2018-09-28 | 上海应用技术大学 | A kind of LED filament preparation method with laminated packaging structure |
| CN108826031A (en) * | 2018-07-09 | 2018-11-16 | 上海应用技术大学 | It is a kind of based on stack effect can be from the preparation method of the LED bulb of color-temperature regulating |
| CN109638008A (en) * | 2018-12-28 | 2019-04-16 | 苏州工业园区客临和鑫电器有限公司 | A kind of flexible filament and its packaging method of double-colored temperature |
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| CN203812875U (en) * | 2014-02-20 | 2014-09-03 | 惠州市华阳光电技术有限公司 | A color-temperature-adjustable LED light source device and a lamp comprising the color-temperature-adjustable LED light source device |
| CN205069682U (en) * | 2015-09-16 | 2016-03-02 | 福建天电光电有限公司 | LED wrapper spare with flip -chip structure |
| CN106895282A (en) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | Fluorescence membrane is used for the method that LED filament makes bulb lamp |
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2017
- 2017-08-18 CN CN201710712972.7A patent/CN107464803B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN203812875U (en) * | 2014-02-20 | 2014-09-03 | 惠州市华阳光电技术有限公司 | A color-temperature-adjustable LED light source device and a lamp comprising the color-temperature-adjustable LED light source device |
| CN205069682U (en) * | 2015-09-16 | 2016-03-02 | 福建天电光电有限公司 | LED wrapper spare with flip -chip structure |
| CN106895282A (en) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | Fluorescence membrane is used for the method that LED filament makes bulb lamp |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321150A (en) * | 2017-12-21 | 2018-07-24 | 维沃移动通信有限公司 | A kind of preparation method of light source and light source |
| CN108258109A (en) * | 2018-02-06 | 2018-07-06 | 海迪科（南通）光电科技有限公司 | A kind of CSP encapsulation LED variable color-temperature filament lamp pin connection structures and preparation method thereof |
| CN108598068A (en) * | 2018-05-15 | 2018-09-28 | 上海应用技术大学 | A kind of LED filament preparation method with laminated packaging structure |
| CN108826031A (en) * | 2018-07-09 | 2018-11-16 | 上海应用技术大学 | It is a kind of based on stack effect can be from the preparation method of the LED bulb of color-temperature regulating |
| CN109638008A (en) * | 2018-12-28 | 2019-04-16 | 苏州工业园区客临和鑫电器有限公司 | A kind of flexible filament and its packaging method of double-colored temperature |
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| CN107464803B (en) | 2019-10-11 |
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Effective date of registration: 20210323 Address after: 315301 No. 299, Zongan Road, Zonghan street, Cixi City, Ningbo City, Zhejiang Province Patentee after: NINGBO LONGER LIGHTING Co.,Ltd. Address before: 200235 Caobao Road, Xuhui District, Shanghai, No. 120-121 Patentee before: SHANGHAI INSTITUTE OF TECHNOLOGY Patentee before: Zhejiang Emitting Optoelectronic Technology Co.,Ltd. |
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