CN101629707A - LED lamp and encapsulating method thereof - Google Patents
LED lamp and encapsulating method thereof Download PDFInfo
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- CN101629707A CN101629707A CN200910109512A CN200910109512A CN101629707A CN 101629707 A CN101629707 A CN 101629707A CN 200910109512 A CN200910109512 A CN 200910109512A CN 200910109512 A CN200910109512 A CN 200910109512A CN 101629707 A CN101629707 A CN 101629707A
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Abstract
The invention discloses an LED lamp and an encapsulating method thereof. The encapsulating method comprises the following steps: firstly, providing a bearing seat and an LED blue-light wafer which comprises a sapphire substrate; the bottom of the sapphire substrate is provided with a layer of metal or alloy; secondarily, fixing the metal or the alloy arranged at the bottom of the sapphire substrate on the bearing seat by fixed crystal cohesive glue; then, respectively connecting a positive electrode and a negative electrode of the LED blue-light wafer with a positive electrode and a negative electrode of the bearing seat by leads; and finally, encapsulating the LED blue-light wafer connected with the positive electrode and the negative electrode. The LED lamp manufactured by the method is provided with the metal or the alloy with favorable conductive performance at the bottom of the sapphire substrate, and the metal or the alloy is fixed to the bearing seat by the fixed crystal cohesive glue with favorable conductive performance so as to greatly improve the radiating effect of the LED lamp, improve the light decay of the LED lamp and prolong the service life of the LED lamp.
Description
Technical field
The present invention relates to a kind of lamp, particularly relate to a kind of LED lamp and method for packing thereof.
Background technology
The LED lamp is as a kind of new type light source, rely on it low power consuming, pollution-free, volume is little and advantage such as flexibly easy to use, be widely used in building, the small size decorative lighting of solar street light, flashlight, auto lamp, desk lamp, backlight, shot-light, garden, wall lamp, household and collection are decorated with advertisement is the commercial lighting etc. of one.
The LED lamp generally all has one and is used for luminous LED wafer, sees also Fig. 1, and it is the structural representation of existing a kind of LED wafer 100, and described LED wafer 100 comprises a Sapphire Substrate 101 and growth semiconductor 102 thereon.The bottom of described Sapphire Substrate 101 is fixed on the stacker (not shown) with adhesive glue, thereby whole LED wafer 100 is fixed on the stacker.
Yet, the LED lamp throw light on for a long time use after, LED wafer 100 can heating, the adhesive glue variable color, rotten of at high temperature can absorbing heat,, blackening sallow such as becoming, thus the heat conduction of adhesive glue and heat dispersion are descended.The heat that LED wafer 100 sends is difficult in time distribute, and makes that the LED light temperature is too high, causes occurring the low phenomenon of serious light decay, light efficiency, and the LED lamp life-span also shorten, influence the application of white LED lamp in high-end market.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of LED lamp and method for packing thereof, can promote the light efficiency of LED lamp, and can improve the light decay of LED lamp and the life-span that increases the LED lamp.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the method for packing that a kind of LED lamp is provided, comprise the steps: at first to provide a stacker and a LED blue light wafer, described LED blue light wafer comprises a Sapphire Substrate, in the bottom of described Sapphire Substrate layer of metal or alloy is set; The metal or alloy that will be arranged on the bottom of described Sapphire Substrate then is fixed on the described stacker by solid brilliant adhesive glue; Be connected with the positive and negative electrode of described stacker respectively with the positive and negative electrode of lead again described LED blue light wafer; At last the described LED blue light wafer that connects behind the positive and negative electrode is encapsulated.
Wherein, described bottom in Sapphire Substrate is provided with in layer of metal or the alloy step, and described metal or alloy is arranged on described sapphire bottom by the method for deposition or evaporation.
Wherein, described solid brilliant adhesive glue is elargol or insulating cement.
Wherein, described bottom in Sapphire Substrate is provided with in layer of metal or the alloy step, and described metal is golden Au, copper Cu, tin Sn, silver-colored Ag or aluminium Al, and described alloy is gold-tin alloy or silver-colored ashbury metal.
Wherein, described LED blue light wafer surface is coated with the fluorescent glue that one deck contains a certain proportion of fluorescent material composition, after smearing fluorescent glue, LED blue light wafer surface toasts its hardened forming, the semi-finished product of the coated LED of having blue light wafer, stacker, fluorescent glue are encapsulated with glue, carry out the baking hardening moulding then.
Wherein, described fluorescent glue is epoxy resin OXY or silica gel SILICONE.
Wherein, described glue is epoxy resin OXY, silica gel SILICONE, silicones or UV glue.
The invention provides a kind of LED lamp, comprise a LED blue light wafer and a stacker, described LED blue light wafer comprises a Sapphire Substrate, and the bottom of described Sapphire Substrate is provided with layer of metal or alloy, and described metal or alloy is fixed on the described stacker by solid brilliant adhesive glue.
Wherein, described metal is golden Au, copper Cu, tin Sn, silver-colored Ag or aluminium Al, and described alloy is gold-tin alloy or silver-colored ashbury metal.
Wherein, described solid brilliant adhesive glue is elargol or insulating cement.
The invention has the beneficial effects as follows: be different from prior art and adopt sapphire to cause LED light to decline seriously as its adhesive glue heat conductivility decline in use of the LED lamp of backing material, light efficiency is low, the situation that life-span is short, LED lamp of the present invention is provided with heat conductivility good metal or alloy in the bottom of described Sapphire Substrate, and metal or alloy is fixed on the stacker with the good solid brilliant adhesive glue of heat conductivility, thereby significantly promote the radiating effect of LED lamp, make LED lamp when work can be not overheated and cause light efficiency to reduce, therefore the light efficiency of LED lamp can be promoted, and the light decay of LED lamp and the life-span that increases the LED lamp can be improved; In addition, the metal or alloy layer can reflect the light that LED sends towards the substrate direction, improves the brightness of LED lamp.
Description of drawings
Fig. 1 is the structural representation of existing Sapphire Substrate LED blue light wafer;
Fig. 2 is the structural representation of the LED blue light wafer of Sapphire Substrate deposition of the present invention or evaporation metal or alloy;
Fig. 3 is the product structure figure that adopts the direct insertion white light LEDs that the inventive method is made into;
Fig. 4 is the product structure figure that adopts the SMD SMD white light LEDs that the inventive method is made into;
Fig. 5 adopts the inventive method to make the process chart of LED lamp.
The specific embodiment
By describing technology contents of the present invention, structural feature in detail, realized purpose and effect, give explanation below in conjunction with embodiment and conjunction with figs. are detailed.
See also Fig. 2, Fig. 3 and Fig. 4, LED lamp of the present invention comprises a LED blue light wafer 1 and the stacker 2 that carries the spill of this LED blue light wafer 1.Described LED blue light wafer 1 comprises a Sapphire Substrate 11 and the semiconductor 12 of growth on described Sapphire Substrate 11.The bottom deposit of described Sapphire Substrate 11 or evaporation have layer of metal or alloy 3, and described metal is golden Au, copper Cu, tin Sn, silver-colored Ag or aluminium Al, and described alloy is gold-tin alloy or silver-colored ashbury metal.
The metal or alloy layer of described Sapphire Substrate 11 bottom deposits or evaporation is fixed in the described stacker 2 by the solid brilliant adhesive glue 7 of high-performance heat conduction, and described solid brilliant adhesive glue 7 can be elargol or insulating cement.Described LED blue light wafer 1 has positive and negative (P, N) two electrodes that can switch on, and the stacker 2 of described matrix has positive and negative (P, N) electrode.With lead 4 positive and negative (P, N) electrode of described LED blue light wafer 1 is welded with positive and negative (P, N) electrode of described stacker 2 respectively.The surface encapsulation of described LED blue light wafer 1 has fluorescent glue 5.The top one deck glue 6 that also is packaged with of described fluorescent glue 5.
The light that the bottom deposit of the Sapphire Substrate 11 of described LED blue light wafer 1 or the layer of metal of evaporation or alloy can send the LED lamp on the one hand more reflects, and can reach the effect that increases heat radiation, reduces light decay on the other hand.The good heat conductivity of described solid brilliant adhesive glue 7 is beneficial to heat conduction, heat radiation, also helps reducing the light decay of LED lamp.
See also Fig. 5, the invention provides a kind of LED lamp method for packing and comprise the steps:
At first, an one LED blue light wafer 1 and a stacker 2 are provided, described LED blue light wafer 1 comprises a Sapphire Substrate 11, bottom deposit or evaporation in described Sapphire Substrate 11 have layer of metal or alloy 3, described metal is golden Au, copper Cu, tin Sn, silver-colored Ag or aluminium Al, and described alloy is gold-tin alloy or silver-colored ashbury metal;
Secondly, will be fixed on the described stacker 2 by the solid brilliant adhesive glue 7 (elargol or insulating cement) of high-performance heat conduction, and toast again and strengthen fixing in the bottom deposit of Sapphire Substrate 11 or the metal or alloy of evaporation;
Then, with lead 4 positive and negative electrode of described LED blue light wafer 1 is welded with the positive and negative electrode of described stacker 2 respectively;
The step that the described LED blue light wafer that connects behind the positive and negative electrode is encapsulated, comprise: smear the fluorescent glue 5 that one deck contains a certain proportion of fluorescent material composition on the surface of LED blue light wafer 1 again, toast then its hardened forming, described fluorescent glue 5 can be epoxy resin OXY or silica gel SILICONE;
Then, the coated semi-finished product that have LED blue light wafer 1, stacker 2, fluorescent glue 5 with glue 6 encapsulation, are carried out the baking hardening moulding then, described glue 6 can be epoxy resin OXY, silica gel SILICONE, silicones or UV glue;
At last, the finished product after the moulding is toasted once more, cut pin then and peel off, beam split color separation, packing warehouse-in.
Being different from prior art adopts sapphire in use its adhesive glue heat conductivility descends that to cause the LED lamp light decay to occur serious as the LED lamp of backing material, light efficiency is low, the situation that life-span is short, LED lamp of the present invention is provided with heat conductivility good metal or alloy 3 in the bottom of described Sapphire Substrate 11, and metal or alloy 3 is fixed on the stacker 2 with the good solid brilliant adhesive glue 7 of heat conductivility, thereby significantly promote the radiating effect of LED lamp, make LED lamp when work can be not overheated and cause light efficiency to reduce, therefore the light efficiency of LED lamp can be promoted, and the light decay of LED lamp and the life-span that increases the LED lamp can be improved; In addition, the light that metal or alloy can send the LED lamp more reflects, and improves the brightness of LED lamp.
LED lamp of the present invention is by bottom deposit or evaporation layer of metal or alloy 3 in Sapphire Substrate 11, metal or alloy 3 is used simultaneously with Sapphire Substrate 11, the light that metal or alloy 3 can send the LED lamp more reflects, and can reach the effect that increases heat radiation, reduces light decay on the other hand; And with the solid brilliant adhesive glue 7 of high-performance heat conduction metal or alloy 3 is fixed on the stacker 2, Gu the good heat conductivity of brilliant adhesive glue 7 is beneficial to heat conduction, heat radiation, can reduce the light decay of LED lamp.
In sum, the LED lamp that uses method for packing of the present invention to make can effectively reduce the light decay of LED lamp, and the light efficiency that promotes the LED lamp also can prolong the service life of LED lamp.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. the method for packing of a LED lamp is characterized in that, comprises the steps:
One stacker and a LED blue light wafer are provided, and described LED blue light wafer comprises a Sapphire Substrate, in the bottom of described Sapphire Substrate layer of metal or alloy is set;
The metal or alloy that is arranged on the bottom of described Sapphire Substrate is fixed on the described stacker by solid brilliant adhesive glue;
Be connected with the positive and negative electrode of described stacker respectively with the positive and negative electrode of lead described LED blue light wafer;
The described LED blue light wafer that connects behind the positive and negative electrode is encapsulated.
2. the method for packing of LED lamp according to claim 1 is characterized in that, described bottom in Sapphire Substrate is provided with in layer of metal or the alloy step, and described metal or alloy is arranged on described sapphire bottom by the method for deposition or evaporation.
3. the method for packing of LED lamp according to claim 2 is characterized in that, described solid brilliant adhesive glue is elargol or insulating cement.
4. the method for packing of LED lamp according to claim 3, it is characterized in that, described bottom in Sapphire Substrate is provided with in layer of metal or the alloy step, and described metal is golden Au, copper Cu, tin Sn, silver-colored Ag or aluminium Al, and described alloy is gold-tin alloy or silver-colored ashbury metal.
5. the method for packing of LED lamp according to claim 1, it is characterized in that, the step that the described LED blue light wafer that will connect behind the positive and negative electrode encapsulates, comprise: LED blue light wafer surface is smeared the fluorescent glue that one deck contains a certain proportion of fluorescent material composition, after smearing fluorescent glue, LED blue light wafer surface toasts its hardened forming, the semi-finished product of the coated LED of having blue light wafer, stacker, fluorescent glue are encapsulated with glue, carry out the baking hardening moulding then.
6. the method for packing of LED lamp according to claim 5 is characterized in that, described fluorescent glue is epoxy resin OXY or silica gel SILICONE.
7. the method for packing of LED lamp according to claim 5 is characterized in that, described glue is epoxy resin OXY, silica gel SILICONE, silicones or UV glue.
8. LED lamp, comprise a LED blue light wafer and a stacker, described LED blue light wafer comprises a Sapphire Substrate, it is characterized in that, the bottom of described Sapphire Substrate is provided with layer of metal or alloy, and described metal or alloy is fixed on the described stacker by solid brilliant adhesive glue.
9. LED lamp according to claim 8 is characterized in that, described metal is golden Au, copper Cu, tin Sn, silver-colored Ag or aluminium Al, and described alloy is gold-tin alloy or silver-colored ashbury metal.
10. LED lamp according to claim 9 is characterized in that, described solid brilliant adhesive glue is elargol or insulating cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910109512A CN101629707A (en) | 2009-08-05 | 2009-08-05 | LED lamp and encapsulating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910109512A CN101629707A (en) | 2009-08-05 | 2009-08-05 | LED lamp and encapsulating method thereof |
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| CN101629707A true CN101629707A (en) | 2010-01-20 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157665A (en) * | 2011-03-22 | 2011-08-17 | 湘能华磊光电股份有限公司 | Light-emitting diode (LED) chip packaging structure and packaging method thereof |
| CN102376655A (en) * | 2011-10-28 | 2012-03-14 | 三星半导体(中国)研究开发有限公司 | Chip packaging structure with metal layer |
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| CN110246952A (en) * | 2019-05-08 | 2019-09-17 | 格瑞电子（厦门）有限公司 | A kind of LED wafer color-changing device |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
-
2009
- 2009-08-05 CN CN200910109512A patent/CN101629707A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157665A (en) * | 2011-03-22 | 2011-08-17 | 湘能华磊光电股份有限公司 | Light-emitting diode (LED) chip packaging structure and packaging method thereof |
| CN102376655A (en) * | 2011-10-28 | 2012-03-14 | 三星半导体(中国)研究开发有限公司 | Chip packaging structure with metal layer |
| US10248372B2 (en) | 2013-12-31 | 2019-04-02 | Ultravision Technologies, Llc | Modular display panels |
| US10373535B2 (en) | 2013-12-31 | 2019-08-06 | Ultravision Technologies, Llc | Modular display panel |
| US10380925B2 (en) | 2013-12-31 | 2019-08-13 | Ultravision Technologies, Llc | Modular display panel |
| US10410552B2 (en) | 2013-12-31 | 2019-09-10 | Ultravision Technologies, Llc | Modular display panel |
| US10540917B2 (en) | 2013-12-31 | 2020-01-21 | Ultravision Technologies, Llc | Modular display panel |
| US10871932B2 (en) | 2013-12-31 | 2020-12-22 | Ultravision Technologies, Llc | Modular display panels |
| US10706770B2 (en) | 2014-07-16 | 2020-07-07 | Ultravision Technologies, Llc | Display system having module display panel with circuitry for bidirectional communication |
| CN110246952A (en) * | 2019-05-08 | 2019-09-17 | 格瑞电子（厦门）有限公司 | A kind of LED wafer color-changing device |
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Open date: 20100120 |