CN206036727U - High -efficient integrated MLCOB light source module - Google Patents
High -efficient integrated MLCOB light source module Download PDFInfo
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- CN206036727U CN206036727U CN201620968413.3U CN201620968413U CN206036727U CN 206036727 U CN206036727 U CN 206036727U CN 201620968413 U CN201620968413 U CN 201620968413U CN 206036727 U CN206036727 U CN 206036727U
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Abstract
The utility model discloses a high -efficient integrated MLCOB light source module, include: base plate, functional areas, optics cup, chip, drive control unit, locating hole and electrode be provided with on the base plate the group the optics cup, the drive control unit including the constant current drive function, transfer function, self -adaptation function and peripheral electron device, and accessible function module circuit connects to distribute and is in the base plate the surface with the inside of optics cup, its characterized in that still includes: the optics cup can be for bowl cup, circular, square and toper structure, and the inner wall can scribble wherein one kind of high reflective coating and cladding material. The utility model discloses a be provided with multiunit optics cup on the base plate, the LED chip is arranged in the cup, and drive IC distributes inside substrate surface or cup through corresponding circuit connection, compare in traditional COB light source, the utility model aims at providing a high -efficient integrated MLCOB light source module who has high light efficiency, AC drive, modularization design features.
Description
Technical field
This utility model is related to technical field of LED illumination, more particularly to a kind of efficiently integrated MLCOB light source dies
Group.
Background technology
With the continuous development of LED technology, LED product is widely applied in all trades and professions.Skill is encapsulated along with LED
The performance and species of the day by day ripe and product of constantly bringing forth new ideas of art has been obtained further being lifted and has been enriched, and new encapsulation technology layer goes out
Poor, product develops towards high power small size and multifunctional integrated, modularity, intelligentized direction.In tradition application
In the main medium and small work(based on SMD discrete devices and high-power integrated device, wherein with 2835,3014,5050 etc. as representative
Application of the rate discrete device in fluorescent tube, panel, ball bubble, light bar is in the majority；High-power integrated device is typically with COB products as representative
Based on application in Down lamp, ball bubble, shot-light, track lamp, street lamp and Tunnel Lamp etc..Traditional discrete device is in application process
In lamp bead need to be mounted on lamp bar/plate through SMT techniques, easily cause dead lamp, failure welding, photoelectric parameter and decline simultaneously increase
Processing cost；COB products are luminous uniform with which, and color tolerance is little, and without hot spot, volume tightly promotees, and secondary optical design is simple, it is easy to
The advantages of installation, is more and more used widely and popularization in commercial lighting, outdoor lighting.
COB encapsulation referred to directly by chip bonding on substrate, compared with traditional SMD pasters its pass through high-thermal conductive metal or
Ceramic substrate directly radiates, and can not only reduce manufacturing process and its cost of support, the also advantage with low thermal resistance.COB light source
Two kinds of forms are broadly divided at present：One kind is the integrated COB light source of typical high power, i.e., on metallic substrates by the form of box dam
A big cup is formed, chip is distributed in cup by certain arrangement, is connected by wire bonding mode and related circuit,
Integral-filled fluorescent glue；Another kind is many glasss of integrated COB, i.e. it is traditional COB to MCOB (Multiple chips on Board)
The extension of encapsulation technology, it is on original substrate to manufacture multiple band optics cup body structures by certain rule, by LED chip by putting
In respective optical cup, circuit connection is carried out by the side of wire bonding between each cup, then each chip is being carried out respectively
Fluorescent glue coat, have an advantage in that, such COB be point light source groups into area source, the independent LENS molding of each cup unit its
The more traditional COB of light extraction efficiency is high, and photochromic one to property is good, heat relative distribution, and glue quantity is also relative to be reduced；MLCOB be also
The COB light source of the another kind of many glasss of poly-lenses that developed on the basis of this.
From from the point of view of the application direction of product, single product is cannot meet the variation of different clients and the need of polytropy
Ask the modularity of LED light source, the design of integrated and light fixture, it has also become industry is stepped into
The emphasis of worry and to finally realize LED illumination lamp product seriation, variation then need to match somebody with somebody on the basis of light source module
Close radiating, optics and driver part.LED manufacturer, encapsulation factory, drive manufacturer all in the collection of Development and Production all size in recent years
Into photoelectricity engine product, such as " LED light source+driving power supply ", " HVLEDs+ high-voltage linear constant-current sources " are exactly similar blank.With
High product light efficiency is not generally relatively low therefore a for discrete light source device attachment process such light source die set product integrated level in the majority
The integrated optical of specular removal high power density is electrically integrated product and is particularly important for the modular applications of LED product,
It is to make great efforts to solve and the realization of the integrated MLCOB light sources module exactly technical scheme needed for industry technical staff.
Therefore, how to provide it is a kind of drive with specular removal, exchange, the efficient integrated MLCOB light of modularized design feature
Source module is the problem of those skilled in the art's urgent need to resolve.
Utility model content
In view of this, this utility model provide it is a kind of with specular removal, exchange drive, modularized design feature it is efficient
Integrated MLCOB light sources module.
For achieving the above object, this utility model provides following technical scheme：
A kind of efficiently integrated MLCOB light sources module, including：Substrate, functional areas, optics cup, chip, drive control list
Unit, location hole and electrode, are provided with the substrate to organizing the optics cup, and the drive control unit includes constant current
Driving function, transfer function, adaptation function and peripheral electron device, and can be distributed in by function module circuit connection described
The surface of substrate and the inside of the optics cup；Characterized in that, also including：The optics cup can be bowl, circle, side
Shape and pyramidal structure, and inwall can scribble highly-reflective coating and coating one kind therein.
Preferably, in a kind of above-mentioned efficiently integrated MLCOB light sources module, the substrate is metal material, ceramic material
With composite one kind therein.
Preferably, in a kind of above-mentioned efficiently integrated MLCOB light sources module, in the functional areas and the optics cup
It is internal to adopt device type mounting method, it is packaged with IC chips and LED wafer.
Preferably, in a kind of above-mentioned efficiently integrated MLCOB light sources module, LENS molding or overall gluing process can be adopted
The functional areas are carried out with fluorescent glue coating operation.
Preferably, in a kind of above-mentioned efficiently integrated MLCOB light sources module, the optics cup can by injection mo(u)lding,
Printed wiring board is etched and a kind of punch forming mode therein is made.
Preferably, in a kind of above-mentioned efficiently integrated MLCOB light sources module, the optics cup is in one on the substrate
Determine regular array, light shape can be met and be uniformly distributed the requirement with minimum process spacing.
Understand that compared with prior art, this utility model is more by being provided with substrate via above-mentioned technical scheme
Group optics cup, LED chip drive IC to be distributed in inside substrate surface or cup by related circuit connection in cup,
Compared to traditional COB light source, with the characteristics of specular removal, exchange driving, modularized design.
Description of the drawings
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or accompanying drawing to be used is briefly described needed for description of the prior art, it should be apparent that, drawings in the following description are only
It is embodiment of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work, also
Other accompanying drawings can be obtained according to the accompanying drawing for providing.
Fig. 1 accompanying drawings are board structure schematic diagram of the present utility model.
Fig. 2 accompanying drawings are integrated molding portion view structure schematic diagram of the present utility model.
Fig. 3 accompanying drawings are LENS forming parts view structure schematic diagram of the present utility model.
In FIG：
1 is substrate, 2 is functional areas, 3 is optics cup, 5 is drive control unit, 6 is location hole, 7 is electrode.
In fig. 2：
1 is substrate, 3 is optics cup, 4 is chip, 8 is peripheral electron device, 9 is fluorescent adhesive layer for driving IC, 10.
In figure 3：
1 is substrate, 3 is optics cup, 4 is chip, 8 is peripheral electron device, 9 is fluorescent adhesive layer for driving IC, 10.
Specific embodiment
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only this utility model a part of embodiment, rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of this utility model protection.
This utility model embodiment disclose it is a kind of drive with specular removal, exchange, the efficient collection of modularized design feature
Into MLCOB light source modules.
Accompanying drawing 1, accompanying drawing 2, accompanying drawing 3 is referred to, is a kind of efficiently integrated MLCOB light sources module disclosed in this utility model,
Specifically include：
Substrate 1, functional areas 2, optics cup 3, chip 4, drive control unit 5, location hole 6 and electrode 7, on substrate 1
It is provided with to a group optics cup 3, drive control unit 5 includes constant-current driving function, transfers function, adaptation function and periphery
Electronic device 8, and the surface of substrate 1 and the inside of optics cup 3 can be distributed in by function module circuit connection；Its feature exists
In also including：Optics cup 3 can be bowl, circle, square and pyramidal structure, and inwall can scribble highly-reflective coating and coating
One kind therein.
By being provided with multigroup optics cup on substrate, LED chip drives IC to pass through in cup to this utility model
Related circuit connection is distributed in inside substrate surface or cup, compared to traditional COB light source, with specular removal, exchange driving, mould
The characteristics of massing is designed.
In order to further optimize above-mentioned technical proposal, substrate 1 is metal material, ceramic material and composite therein
Kind.
In order to further optimize above-mentioned technical proposal, IC9 is driven to be wafer die and be arranged on inside functional areas 2 and control
In unit 4, it is encapsulated in together with LED wafer inside colloid, it is such as shown in (figure two), brilliant according to total watt level IC of light source module
Piece can be superimposed for single or many.
In order to further optimize above-mentioned technical proposal, LENS molding or overall gluing process can be adopted to carry out functional areas 2
Fluorescent glue coats operation.
In order to further optimize above-mentioned technical proposal, optics cup 3 can be by injection mo(u)lding, printed wiring board etching and punching
A kind of molded mode therein is made.
In order to further optimize above-mentioned technical proposal, optics cup 3 is in certain regular array on substrate 1, can meet light
Shape is uniformly distributed the requirement with minimum process spacing.
In order to further optimize above-mentioned technical proposal, the manufacture method of the optics cup 3 on substrate 1 has following scheme：1 adopts
The injection molding material (such as PCT, EMC) of the high light-reflecting property yellowing-resistant of high heat conduction is selected to form corresponding cup knot with the mode of injection molded
Structure；2 form corresponding cup and structure using punching printed wiring board molding scheme example with the thickness of BT layer materials.
In order to further optimize above-mentioned technical proposal, chip is arranged in optics cup 3, in each optics cup 3 at least
There is a LEDs chip, such as (figure three) fluorescent adhesive layer 10, can be the lens with bulb of each cup unit independence of point LENS molding,
Conventional dispensing pattern such as (figure two) fluorescent adhesive layer 10 is may also be employed, the coating operation of integral fluorescence glue is carried out, by correlation between cup
Circuit connects, and the LED chip in cup is connected to corresponding function pad area by bonding line.
In order to further optimize above-mentioned technical proposal, drive control unit 5 is arranged on outside the functional areas 2 of substrate 1, passes through
Linear property current constant control IC and peripheral electron device 8 are arranged on substrate 1 by device mounting method by circuit design, such as figure one
In, for the potential safety hazard that the high-pressure area for preventing drive control part is touched and caused by user by mistake, in the drive control unit 5
Electronic device and exposed circuit part available electron packaging plastic wrap up, to play a part of insulation protection.
In order to further optimize above-mentioned technical proposal, the coating of fluorescent glue can be carried out as follows：1st, substrate 1 is glimmering in point
Overall box dam is done before optical cement and does related baking except wet trade；2nd, on substrate 1, each cup is individually put fluorescent glue to flat cup；3、
The slightly larger silica gel of relatively thin one layer refractive index close viscosity or silicone rubber is put on the basis of 2, is carried out by glue property after levelling
Prebake conditions (such as 80 DEG C/20min or 100 DEG C/10min)；4th, secondary dispensing operation is carried out to substrate 1 after prebake conditions, routinely COB
Dispensing pattern and subsequent production technique are carried out.
In this specification, each embodiment is described by the way of progressive, and what each embodiment was stressed is and other
The difference of embodiment, between each embodiment identical similar portion mutually referring to.For device disclosed in embodiment
For, as which corresponds to the method disclosed in Example, so description is fairly simple, related part is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use that this practicality is new
Type.Various modifications to these embodiments will be apparent for those skilled in the art, determined herein
The General Principle of justice can be realized in the case of without departing from spirit or scope of the present utility model in other embodiments.Cause
This, this utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The most wide scope consistent with features of novelty.
Claims (6)
1. a kind of efficiently integrated MLCOB light sources module, including：Substrate (1), functional areas (2), optics cup (3), chip (4), drive
Dynamic control unit (5), location hole (6) and electrode (7), are provided with to organizing optics cup (3) on the substrate (1), institute
State drive control unit (5) to include constant-current driving function, transfer function, adaptation function and peripheral electron device (8), and can
The surface of the substrate (1) and the inside of the optics cup (3) are distributed in by function module circuit connection；Its feature exists
In also including：Optics cup (3) can be bowl, circle, square and pyramidal structure, and inwall can scribble highly-reflective coating
With coating one kind therein.
2. a kind of efficiently integrated MLCOB light sources module according to claim 1, it is characterised in that described substrate (1) is gold
Category material, ceramic material and composite one kind therein.
3. a kind of efficiently integrated MLCOB light sources module according to claim 1, it is characterised in that in the functional areas (2)
Device type mounting method is adopted with the inside of optics cup (3), IC chips and LED wafer is packaged with.
4. a kind of efficiently integrated MLCOB light sources module according to claim 1 or 3, it is characterised in that can using LENS into
Type or overall gluing process carry out fluorescent glue coating operation to the functional areas (2).
5. a kind of efficiently integrated MLCOB light sources module according to claim 1, it is characterised in that optics cup (3)
Can be etched by injection mo(u)lding, printed wiring board and a kind of punch forming mode therein is made.
6. a kind of efficiently integrated MLCOB light sources module according to claim 1, it is characterised in that optics cup (3)
It is in certain regular array on the substrate (1), light shape can be met and be uniformly distributed the requirement with minimum process spacing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620968413.3U CN206036727U (en) | 2016-08-25 | 2016-08-25 | High -efficient integrated MLCOB light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620968413.3U CN206036727U (en) | 2016-08-25 | 2016-08-25 | High -efficient integrated MLCOB light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206036727U true CN206036727U (en) | 2017-03-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620968413.3U Active CN206036727U (en) | 2016-08-25 | 2016-08-25 | High -efficient integrated MLCOB light source module |
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| Country | Link |
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| CN (1) | CN206036727U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110285344A (en) * | 2019-06-19 | 2019-09-27 | 厦门普为光电科技有限公司 | The lamps and lanterns of high heat dissipation efficiency |
-
2016
- 2016-08-25 CN CN201620968413.3U patent/CN206036727U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110285344A (en) * | 2019-06-19 | 2019-09-27 | 厦门普为光电科技有限公司 | The lamps and lanterns of high heat dissipation efficiency |
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| GR01 | Patent grant |