CN112201736B - MiniLED matrix backlight board, manufacturing method thereof and notebook computer - Google Patents
MiniLED matrix backlight board, manufacturing method thereof and notebook computer Download PDFInfo
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- CN112201736B CN112201736B CN202010994053.5A CN202010994053A CN112201736B CN 112201736 B CN112201736 B CN 112201736B CN 202010994053 A CN202010994053 A CN 202010994053A CN 112201736 B CN112201736 B CN 112201736B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- 239000000284 extract Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 13
- 235000012431 wafers Nutrition 0.000 claims description 12
- 239000002313 adhesive film Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
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- 238000004891 communication Methods 0.000 description 11
- 238000003466 welding Methods 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007723 die pressing method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
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Abstract
The invention discloses a MiniLED matrix backlight board, a manufacturing method thereof and a notebook computer, wherein the manufacturing method of the MiniLED matrix backlight board comprises the following steps: s1, designing a plurality of groups of pad structures on the flexible circuit board, wherein the distance between a positive pad and a negative pad of each group of pad structures is 0.1-0.15 mm; s2, pressing the die to form a plurality of miniLEDs, and packaging the miniLEDs by using blue films, wherein the height of each miniLED is 0.18-0.2 mm; s3, the dispensing head extracts solder paste from the large-stroke die bonder and dispenses the solder paste to the centers of the positive electrode bonding pad and the negative electrode bonding pad of each group of bonding pad structure; and S4, extracting the miniLEDs one by one from the blue film by a suction nozzle, and respectively flatly pasting the miniLEDs on the solder paste of each group of the pad structure. According to the technical scheme, on the basis of ensuring the light emitting uniformity of the miniLED matrix backlight plate, the thickness of a product is reduced, and the lamp-attaching yield of the product is improved.
Description
Technical Field
The invention relates to the technical field of backlight, in particular to a MiniLED matrix backlight board, a manufacturing method thereof and a notebook computer.
Background
The matrix backlight LED is an LED (light emitting diode) used as a backlight of a liquid crystal display panel. Compared with the traditional CCFL (cold cathode tube) backlight source, the LED has the characteristics of low power consumption, low heat productivity, high brightness, long service life and the like, and is expected to completely replace the traditional backlight system in recent years.
At present, common matrix backlight LEDs on the market mostly use TOP LEDs (TOP surface emitting and plane emitting) or CHIP LEDs (surface mounted LEDs), both of which cannot be applied to a light and thin notebook computer, while conventional CSP (CHIP scale) lamp beads can be suitable for the thickness of the light and thin notebook computer, but the conventional solder paste brushing and welding process is adopted by the SMT process, the yield of the lamp is only about 85%, and the large-scale lamp pasting in the process production is not facilitated.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a MiniLED matrix backlight plate, and aims to solve the technical problem that the yield of the MiniLED matrix backlight plate in the prior art is low.
In order to achieve the above purpose, the manufacturing method of the MiniLED matrix backlight plate provided by the invention comprises the following steps:
s1, designing a plurality of groups of pad structures on the flexible circuit board, wherein the distance between a positive pad and a negative pad of each group of pad structures is 0.1-0.15 mm;
s2, pressing the die to form a plurality of miniLEDs, and packaging the miniLEDs by using blue films, wherein the height of each miniLED is 0.18-0.2 mm;
s3, the dispensing head extracts solder paste from the large-stroke die bonder and dispenses the solder paste to the centers of the positive electrode bonding pad and the negative electrode bonding pad of each group of bonding pad structure;
and S4, extracting the miniLEDs one by one from the blue film by a suction nozzle, and respectively flatly pasting the miniLEDs on the solder paste of each group of the pad structure.
Optionally, the method further comprises the steps of:
and S5, pasting a PC adhesive film on the front surface of the flexible circuit board, wherein the PC adhesive film is provided with holes which are away from the miniLEDs and one surface which is away from the flexible circuit board and is subjected to matte treatment.
Optionally, in the step S5, the outer surface of the PC adhesive film is disposed flush with the top surface of the Mini LED.
Optionally, in the step S1, the flexible circuit board is made of FR4 material.
Optionally, in the step S1, the front surface of the flexible circuit board is covered by a copper material, a grid is added to the back surface, and the overall thickness is between 0.15mm and 0.18 mm.
Optionally, in the step S1, each of the positive electrode pad and the negative electrode pad is square, and a side length is between 0.33mm and 0.38 mm.
Optionally, in step S2, the step of pressing the mold to form a plurality of minileds specifically includes: arranging a plurality of wafers according to a preset rule, covering a fluorescent film at the position of each wafer, pressing and baking the wafers through a die for curing, and finally cutting the wafers into monomers.
The invention also provides a MiniLED matrix backlight plate which is prepared by the following steps:
s1, designing a plurality of groups of pad structures on the flexible circuit board, wherein the distance between a positive pad and a negative pad of each group of pad structures is 0.1-0.15 mm;
s2, pressing the die to form a plurality of miniLEDs, and packaging the miniLEDs by using blue films, wherein the height of each miniLED is 0.18-0.2 mm;
s3, the dispensing head extracts solder paste from the large-stroke die bonder and dispenses the solder paste to the centers of the positive electrode bonding pad and the negative electrode bonding pad of each group of bonding pad structure;
and S4, extracting the miniLEDs one by one from the blue film by a suction nozzle, and respectively flatly pasting the miniLEDs on the solder paste of each group of the pad structure.
The invention also provides a notebook computer, which comprises a MiniLED matrix backlight plate, wherein the MiniLED matrix backlight plate is manufactured by the following steps:
s1, designing a plurality of groups of pad structures on the flexible circuit board, wherein the distance between a positive pad and a negative pad of each group of pad structures is 0.1-0.15 mm;
s2, pressing the die to form a plurality of miniLEDs, and packaging the miniLEDs by using blue films, wherein the height of each miniLED is 0.18-0.2 mm;
s3, the dispensing head extracts solder paste from the large-stroke die bonder and dispenses the solder paste to the centers of the positive electrode bonding pad and the negative electrode bonding pad of each group of bonding pad structure;
and S4, extracting the miniLEDs one by one from the blue film by a suction nozzle, and respectively flatly pasting the miniLEDs on the solder paste of each group of the pad structure.
The technical scheme of the invention is that in the manufacturing process of the miniLED matrix backlight plate: the spacing between each corresponding positive electrode bonding pad and negative electrode bonding pad on the flexible circuit board is reduced, the height of the miniLED is accurately controlled by using a new press-fit die, and then the large-stroke die bonder is introduced to independently perform tin spot bonding on each miniLED, so that the thickness of the product is reduced, the bonding yield of the bonding lamp is improved and the practicability of the product is greatly improved on the premise that the miniLED matrix backlight plate has good light-emitting uniformity. Particularly, the design method is applied to the notebook computer (which is beneficial to exerting the advantage of lightness and thinness of the notebook computer to the maximum extent), and colorful patterns are displayed based on the instruction of the notebook computer, so that the attractiveness and uniqueness of the notebook computer are effectively enhanced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a MiniLED matrix backlight panel of the present invention;
FIG. 2 is a schematic structural diagram of a flexible circuit board of the Mini LED matrix backlight in FIG. 1 along the thickness direction;
FIG. 3 is a schematic structural diagram of a soldering structure of the Mini LED matrix backlight in FIG. 1;
FIG. 4 is a schematic view of the manufacturing process of the MiniLED matrix backlight plate of the present invention.
The reference numbers illustrate:
1. a flexible circuit board; 11. a fluorescent glue layer; 12. a crystalline layer; 13. welding a positive electrode layer and a negative electrode layer; 131. welding a structure; 131a, a positive electrode pad; 131b, a negative electrode pad; 2. communication module
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a Mini LED matrix backlight plate and a manufacturing method thereof.
In this embodiment, referring to fig. 1 to 3, the Mini LED matrix backlight plate includes: the back of the flexible circuit board 1 is detachably assembled with a top cover of a notebook computer, and the front of the flexible circuit board is provided with a light display area and a communication connection area; the communication module 2 is assembled in the communication connection area and is used for being in communication connection with the notebook computer; and the display module is assembled in the lamplight display area and comprises a plurality of Mini LEDs, and the Mini LEDs are used for being distributed by a user according to a preset rule. It can be understood that, in order to avoid the communication module 2 on the communication connection area from affecting the display effect of the Mini LED on the light display area, in this embodiment, the communication connection area is arranged at the edge of the flexible circuit board 1; the communication module 2 may be a bluetooth module fixedly disposed on the flexible circuit board 1, may also be a WIFI module, and may also be a 4G module, a 5G module, which is easy to understand, and the connection between the Mini LED matrix backlight board and the notebook computer is established by using a wireless communication technology, which has the advantages of stability, reliability, convenient connection, etc. it should be noted that the design is not limited thereto, and in other embodiments, the communication module 2 and the notebook computer may also be connected by using a wired connection, which is not limited thereto.
In an embodiment of the present invention, as shown in fig. 4, the method for manufacturing a Mini LED matrix backlight plate includes the following steps:
s1, designing a plurality of groups of pad structures on the flexible circuit board 1, wherein the distance between the positive pad 131a and the negative pad 131b of each group of pad structures is d, and d is 0.1-0.15 mm;
it can be understood that the smaller the distance between the positive electrode bonding pad 131a and the negative electrode bonding pad 131b is, the smaller the miniLED placed between the positive electrode bonding pad and the negative electrode bonding pad is, the more the miniLED quantity which can be arranged under the same area is, the better the light emitting effect of the Mini LED matrix backlight plate can be improved, and the imaging patterns of the Mini LED matrix backlight plate can be enriched. For example, but not limiting of, in the present embodiment, d is 0.13 mm. In this embodiment, the flexible circuit board 1 is sequentially provided with a fluorescent glue layer 11, a crystal layer 12, and a positive and negative electrode welding layer 13 from the back side to the front side, and the positive and negative electrode welding layer 13 is used for welding and fixing the plurality of Mini LEDs. The structure layer is the structure of the common PCB in the prior art, has stable structure and reliable connection, and is beneficial to reducing the cost of the Mini LED matrix backlight plate while ensuring the normal operation of the Mini LED matrix backlight plate. It should be noted that the design is not limited thereto, and in other embodiments, the PCB may be disposed in other structural layers.
S2, pressing the die to form a plurality of miniLEDs, and packaging the miniLEDs by using blue films, wherein the height of each miniLED is h, and h is 0.18-0.2 mm;
in this embodiment, the die pressing process for forming a plurality of miniLEDs specifically includes: arranging a plurality of wafers according to a preset rule, covering a fluorescent film at the position of each wafer, pressing and baking the wafers through a die for curing, and finally cutting the wafers into monomers. It can be understood that in the die pressing process, a newly designed high-precision die pressing jig is adopted to control the height and precision of the pressed film, and preferably, the height of the miniLED is 0.2 mm.
S3, the dispensing head extracts solder paste from the large-stroke die bonder and dispenses the solder paste to the centers of the positive electrode bonding pad 131a and the negative electrode bonding pad 131b of each group of bonding pad structures;
it can be understood that, in the embodiment, the conventional die bonder for packaging is replaced by the large-stroke die bonder to solve the problem of insufficient stroke. Without loss of generality, the large-stroke die bonder comprises a rotating part driven by a central rotating shaft to rotate, a volume control block is arranged beside one side of the rotating part, and solder paste is coated on the peripheral surface of the rotating part so as to be extracted by a dispensing head.
And S4, extracting the miniLEDs one by one from the blue film by a suction nozzle, and respectively flatly pasting the miniLEDs on the solder paste of each group of the pad structure.
The sticking lamp adopts a tin-burning process, each miniLED is independently assembled, the yield of the sticking lamp is effectively improved, and statistics shows that the yield of the sticking lamp of the miniLED matrix backlight board produced by the manufacturing method can reach more than 99%.
The technical scheme of the invention is that in the manufacturing process of the miniLED matrix backlight plate: the spacing between each corresponding positive electrode pad 131a and negative electrode pad 131b on the flexible circuit board 1 is reduced, the height of the miniLED is accurately controlled by using a new press-fit die, and then the large-stroke die bonder is introduced to independently perform tin soldering on each miniLED, so that the thickness of the product is reduced, the yield of the soldering lamp is improved and the practicability of the product is greatly improved on the premise that the miniLED matrix backlight plate has good light-emitting uniformity. Particularly, the design method is applied to the notebook computer (which is beneficial to exerting the advantage of lightness and thinness of the notebook computer to the maximum extent), and colorful patterns are displayed based on the instruction of the notebook computer, so that the attractiveness and uniqueness of the notebook computer are effectively enhanced.
Optionally, the method further includes step S5 of attaching a PC adhesive film to the front surface of the flexible circuit board 1, where the PC adhesive film is provided with a matte surface away from the openings of the minileds and away from the flexible circuit board 1. It can be understood that, so set up, can effectively protect the front of flexible circuit board 11 to avoid external scraping damage, and adopt the PC film, then because it has advantages such as environmental protection, high pressure resistant and fire behavior is good, can effectively prolong the life of finished product Mini LED matrix board in a poor light. Specifically, in order to avoid the Mini LED from being worn during the daily use, in this embodiment, the outer surface of the PC adhesive film is flush with the top surface of the Mini LED.
Optionally, in the step S1, the flexible circuit board 1 is made of FR4 material. It can be understood that by adopting the FR4 grade material, the phenomena of expansion and shrinkage warping, lamp welding position offset and the like of the flexible circuit board 1 after high temperature welding can be effectively avoided, and the good yield of the finished Mini LED matrix backlight plate can be effectively improved; it should be noted that the design is not limited thereto, and in other embodiments, the flexible circuit board 1 may also be made of FR5 grade material, which is not limited thereto; without loss of generality, in order to improve the heat dissipation capability and the electric conduction capability of the PCB, in this embodiment, the front surface of the flexible circuit board 1 is further provided with a copper plating layer, and in addition, the grid is added to the back surface of the flexible circuit board 1, and the overall thickness is between 0.15mm and 0.18 mm.
Optionally, in the step S1, each of the positive electrode pad 131a and the negative electrode pad 131b is square, the side length is a, and a is located between 0.33mm and 0.38 mm. It will be appreciated that this arrangement, on the one hand, accommodates small miniLED sizes and, on the other hand, facilitates a simplified design of the flexible circuit board 1. For example, but not limited to, a is specifically 0.36 mm. It should be noted that the design is not limited thereto, and in other embodiments, each of the positive electrode pad 131a and the negative electrode pad 131b may also be rectangular or have other shapes.
The invention further provides a notebook computer, which comprises a computer body and a Mini LED matrix backlight board, the specific structure of the Mini LED matrix backlight board refers to the above embodiments, and the notebook computer adopts all the technical schemes of all the embodiments, so that the notebook computer at least has all the beneficial effects brought by the technical schemes of the above embodiments, and the detailed description is omitted.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A manufacturing method of a MiniLED matrix backlight board is characterized by comprising the following steps:
s1, designing a plurality of groups of pad structures on a flexible circuit board made of FR4 material, wherein the distance between a positive pad and a negative pad of each group of pad structures is 0.1-0.15 mm;
s2, pressing the die to form a plurality of miniLEDs, and packaging the miniLEDs by using blue films, wherein the height of each miniLED is 0.18-0.2 mm;
s3, the dispensing head extracts solder paste from the large-stroke die bonder and dispenses the solder paste to the centers of the positive electrode bonding pad and the negative electrode bonding pad of each group of bonding pad structure;
s4, extracting the miniLEDs from the blue film one by a suction nozzle, and respectively flatly attaching the miniLEDs to the solder paste of each group of the pad structures;
s5, pasting a PC adhesive film on the front surface of the flexible circuit board, wherein the PC adhesive film is provided with holes which are away from the miniLEDs and one surface of the PC adhesive film, which is far away from the flexible circuit board, and the side of the PC adhesive film is subjected to matte treatment;
in the step S5, the outer surface of the PC adhesive film is disposed flush with the top surface of the Mini LED;
in the step S1, the front surface of the flexible circuit board is covered by a copper material, and a grid is added to the back surface, so that the overall thickness is between 0.15mm and 0.18 mm.
2. The method of claim 1, wherein in step S1, each of the positive and negative pads is square with a side length of 0.33mm to 0.38 mm.
3. The method of claim 1, wherein the step S2 of pressing the mold to form a plurality of minileds includes: arranging a plurality of wafers according to a preset rule, covering a fluorescent film at the position of each wafer, pressing and baking the wafers through a die for curing, and finally cutting the wafers into monomers.
4. A MiniLED matrix backlight unit produced by the method for producing a MiniLED matrix backlight unit according to any one of claims 1 to 3.
5. A notebook computer comprising the MiniLED matrix backlight of claim 4.
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| CN202010994053.5A CN112201736B (en) | 2020-09-21 | 2020-09-21 | MiniLED matrix backlight board, manufacturing method thereof and notebook computer |
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| CN202010994053.5A CN112201736B (en) | 2020-09-21 | 2020-09-21 | MiniLED matrix backlight board, manufacturing method thereof and notebook computer |
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| CN112201736B true CN112201736B (en) | 2022-02-11 |
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| CN113113523B (en) * | 2021-03-25 | 2022-09-09 | 深圳市华星光电半导体显示技术有限公司 | Die bonder |
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| CN108601521A (en) * | 2016-02-08 | 2018-09-28 | 爱德华多·斯威特莉莎 | Lighting system |
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| CN107170879A (en) * | 2017-05-31 | 2017-09-15 | 天下知光科技（深圳）有限公司 | A kind of large area flip LED area source piece and its bonder |
| CN108010994A (en) * | 2017-12-15 | 2018-05-08 | 惠州雷通光电器件有限公司 | Micro- light emitting diode transfer method |
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