CN107170879A - A kind of large area flip LED area source piece and its bonder - Google Patents
A kind of large area flip LED area source piece and its bonder Download PDFInfo
- Publication number
- CN107170879A CN107170879A CN201710398368.1A CN201710398368A CN107170879A CN 107170879 A CN107170879 A CN 107170879A CN 201710398368 A CN201710398368 A CN 201710398368A CN 107170879 A CN107170879 A CN 107170879A
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- 230000007246 mechanism Effects 0.000 claims abstract description 62
- 230000005540 biological transmission Effects 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 238000006073 displacement reaction Methods 0.000 claims abstract description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 42
- 239000010959 steel Substances 0.000 claims description 42
- 239000000725 suspension Substances 0.000 claims description 18
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 239000006071 cream Substances 0.000 claims description 13
- 230000005693 optoelectronics Effects 0.000 claims description 12
- 230000008520 organization Effects 0.000 claims description 8
- 230000006870 function Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000003139 buffering effect Effects 0.000 claims description 3
- 230000005622 photoelectricity Effects 0.000 claims description 2
- 230000008450 motivation Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000001514 detection method Methods 0.000 abstract description 2
- 230000001276 controlling effect Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000013500 data storage Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The embodiment of the invention discloses a kind of large area flip LED area source piece and its bonder, the circuit printing machine structure and die bond and transmission mechanism of the bonder are arranged on accurate gallows frame and transmission mechanism, and its all controllable displacement in three mutually orthogonal directions above working face；As a result of accurate gallows frame and transmission mechanism, realize the linkage with circuit print system and die bond and transmission mechanism, and working face detection, positioning, the function such as district operation and connection, breach the limitation to substrate size, die bond speed is adjustable, accuracy is controllable, be particularly suitable for substrate lateral dimension between 200mm 1200mm and the mass automatic production of super large stroke large area flip LED area source piece that longitudinal size is not limited, domestic even international blank is filled up, further increase product quality, improve the yields of product, reduce production cost.
Description
Technical field
The present invention relates to large area LED area light source piece and its sealed in unit field, more particularly to a kind of large area flip LED
Area source piece and its bonder.
Background technology
With the development of LED encapsulation technologies and great power LED application technology, traditional wire bond connected mode
(Wire Bonding) is replaced with planting the technique after ball by LED chip reverse installation process, and extensive low-power LED chip
Large area reverse installation process, by the developing direction as LED area light source technology and great power LED application technology.
The bonder of older generation, by dispensing and bonding wire craft, to realize the electrical connection between LED chip and substrate；And
The bonder of a new generation, by print solder paste circuit realiration die bond, reduces technological process, reduces production cost, improve
Product quality.
But, bonder of new generation, due to the limitation of its controlling of production process, when producing area source piece, working face
Size can be severely restricted, cost height, efficiency bottom, time-consuming；Up to the present, bonder of new generation is only capable of production
Maximum is no more than the area source piece of 200mm~300mm sizes, the development of LED area light source industry is seriously constrained, especially straight
The luminous field such as 600mm*600mm panel lights and large size TV backlight, it has to by the area source piece of splicing come real
It is existing, it also have impact on the Integral luminous uniformity and quality of product.
The content of the invention
For above-mentioned technical problem, the embodiments of the invention provide a kind of large area flip LED area source piece and its die bond
Machine, can break through the limitation to substrate size, and product quality is high, yields is high, production cost is low.
First aspect of the embodiment of the present invention provides a kind of bonder of large area flip LED area source piece, including：Board,
Accurate gallows frame and transmission mechanism, working face loader mechanism, circuit printing machine structure, die bond and transmission mechanism, optoelectronic scanning control
Mechanism processed；The accurate gallows frame and transmission mechanism and working face and loader mechanism are fixedly installed on board；The work
Making face loader mechanism is used to load on the working face of board and fixed substrate；The circuit printing machine structure and die bond and driver
Structure is arranged on accurate gallows frame and transmission mechanism, and all controllable in three mutually orthogonal directions above working face
Make its displacement；The circuit printing machine structure is used to paste solder printing forming line map on substrate；The die bond and transmission
Mechanism be used for by LED chip by go here and there and in the way of be inverted in and be printed with the substrate of tin cream, and by the both positive and negative polarity and line of LED chip
Road figure is electrically connected with；The optoelectronic scanning controlling organization is used to be scanned positioning to substrate and line map.
Alternatively, the accurate gallows frame and transmission mechanism include：Suspension bracket, vertical rail, the first servomotor, traverse rod, cunning
Wheel, cantilever and motor vertical, suspension operation is carried out for the circuit printing machine structure and die bond and transmission mechanism in suspension bracket；Institute
State suspension bracket to be formed by connecting by four vertical square steel and four horizontal square steel, four horizontal square steel are fixed on the top of four vertical square steel
End, the bottom of four vertical square steel is fixed on board；The vertical rail is arranged on horizontal square steel two longer, and described the
One servomotor is arranged on the end of horizontal square steel two longer, for driving the circuit printing machine structure and die bond and transmission
Mechanism is moved horizontally in suspension bracket；The traverse rod is located between horizontal square steel two longer, and can exist along the vertical rail
Vertically moved between horizontal square steel two shorter；The pulley is socketed on traverse rod, and can along the traverse rod two compared with
Laterally moved between long horizontal square steel, the length of horizontal square steel two shorter is mutually fitted with the stroke of pulley transverse shifting
Match somebody with somebody；The upper end of the cantilever is connected with the pulley, and the motor vertical is connected to the lower end of cantilever, for driving the line
Road printing mechanism and die bond and transmission mechanism are moved up and down in suspension bracket, to leave or contact working face.
Alternatively, the accurate gallows frame and transmission mechanism also include：Buffer, decelerator, brake and industry control list
Member；The buffer, decelerator and brake are respectively used to the movement to the circuit printing machine structure and die bond and transmission mechanism
Enter row buffering, slow down and brake；The industry control unit is used to controlling and adjusting the circuit printing machine structure and die bond and driver
The translational speed and accuracy of structure.
Alternatively, the circuit printing machine structure includes steel mesh and its support, the second servomotor and scraper plate；The steel mesh and
Its support is moved up and down under the driving of the second servomotor above working face, in order to vertical silk-screen；The scraper plate position
In the top of steel mesh and its support, the upper horizontal in working face under the driving of the second servomotor is moved.
Alternatively, the die bond and transmission mechanism include wafer delivery unit, wafer placement unit and heating unit；It is described
Wafer delivery unit is used to lift and transmit LED chip；The wafer placement unit is used to draw LED chip, and by LED chip
It is placed on the circuit of substrate；The heating unit is used to heat the substrate placed by LED chip, to melt tin cream, makes
LED chip is fixed on substrate via tin cream, and makes the positive and negative electrode of LED chip via tin cream and the circuit turn-on of substrate.
Alternatively, the wafer delivery unit includes expander wafer disk and thimble, and the expander wafer disk is by blue film
Support, the thimble is located at the middle position of expander wafer disk.
Alternatively, the wafer placement unit includes swing arm and suction nozzle；The suction nozzle is located at the top of swing arm, for drawing
LED chip, and LED chip is placed on the circuit of substrate.
Alternatively, the optoelectronic scanning controlling organization includes substrate vision module and wafer vision module；The substrate is regarded
Feel that module is used to carry out optoelectronic scanning, subregion and positioning to the substrate on working face, and the region of adjacent sectors is docked；
Precise positioning and control function are provided when the wafer vision module is used for district operation.
Second aspect of the embodiment of the present invention provides a kind of large area flip LED area source piece, using the embodiment of the present invention
The bonder for the large area flip LED area source piece that first aspect is provided is produced.
Alternatively, the substrate width of the large area flip LED area source piece in 200mm between 1200mm.
In technical scheme provided in an embodiment of the present invention, as a result of accurate gallows frame and transmission mechanism, by complete
Newly-designed industrial control system, realizes the linkage with circuit print system and die bond and transmission mechanism, and working face is detected, determined
The functions such as position, district operation and connection, therefore relative to the bonder of new generation for using tin cream die bond in the prior art, the present invention
A kind of bonder of large area flip LED area source piece of embodiment, breaches the limitation to substrate size, die bond speed can
Adjust, accuracy is controllable, be particularly suitable for substrate lateral dimension super large that longitudinal size is not limited between 200mm-1200mm
The mass automatic production of stroke large area flip LED area source piece, has filled up domestic even international blank, has entered one
Step improves product quality, improves the yields of product, reduces production cost.
Brief description of the drawings
Fig. 1 is large area flip LED area source piece bonder embodiment operating principle schematic diagram of the present invention；
Fig. 2 is large area flip LED area source piece bonder embodiment primary structure schematic diagram of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made
Example, belongs to the scope of protection of the invention.
Referring to Fig. 1, Fig. 1 is large area flip LED area source piece bonder embodiment operating principle schematic diagram of the present invention,
The bonder of large area flip LED area source piece in the embodiment of the present invention, including：Board 100, accurate gallows frame and transmission
Mechanism 200, working face loader mechanism 300, circuit printing machine structure 400, die bond and transmission mechanism 500, optoelectronic scanning controlling organization；
The accurate gallows frame and transmission mechanism 200 and working face and loader mechanism 300 are fixedly installed on board 100；It is described
Working face loader mechanism 300 is used to load on the working face of board 100 and fixed substrate 310；The circuit printing machine structure 400
It is arranged at die bond and transmission mechanism 500 on accurate gallows frame and transmission mechanism 200, and above the working face of board 100
Three mutually orthogonal directions on all can control its displacement, including transverse shifting direction 211 and vertically move direction
212；The circuit printing machine structure 400 is used to paste solder printing forming line map on substrate 310；The die bond and transmission mechanism
500 be used for by LED chip by go here and there and in the way of be inverted in and be printed with the substrate 310 of tin cream, and by the both positive and negative polarity of LED chip with
Line map is electrically connected with；The optoelectronic scanning controlling organization is used to be scanned substrate 310 and line map positioning, and with inspection
Brake；The circuit printing machine structure 400 and die bond and transmission mechanism 500 constitute the scope of operation 230 of bonder.
The bonder only to the large area flip LED area source piece in the embodiment of the present invention is summarized above, this hair
Bright so-called large area flip LED area source piece, refers specifically to substrate lateral dimension longitudinal direction between 200mm-1200mm
The flip LED area source piece that size is not limited, below by the die bond of the large area flip LED area source piece in the embodiment of the present invention
Machine is described in detail.
Fig. 2 is referred to incorporated by reference to Fig. 1, Fig. 2 is large area flip LED area source piece bonder embodiment primary structure of the present invention
Schematic diagram, specifically, the accurate gallows frame and transmission mechanism 200 include：Suspension bracket 201, vertical rail 202, the first servomotor
210th, traverse rod 205, pulley 203, cantilever 204, motor vertical 220, buffer, decelerator, brake and industry control unit, for institute
State circuit printing machine structure 400 and die bond and transmission mechanism 500 carries out suspension operation in suspension bracket 201；The suspension bracket 201 is by four
Vertical square steel and four horizontal square steel are formed by connecting, and four horizontal square steel are fixed on the top of four vertical square steel, and four vertical
The bottom of square steel is fixed on board；The vertical rail 202 is arranged on horizontal square steel two longer, the first servo electricity
Machine 210 is arranged on the end of horizontal square steel two longer, for driving the circuit printing machine structure 400 and die bond and driver
Structure 500 is moved horizontally in suspension bracket 201；The traverse rod 205 is located between horizontal square steel two longer, and can be along described
Vertical rail 202 is vertically moved between horizontal square steel two shorter, because the working face of board is in production line, because
This stroke vertically moved can be without considering；The pulley 203 is socketed on traverse rod 205, and can be along the traverse rod 205 two
Laterally moved between the longer horizontal square steel of root, the length of two shorter horizontal square steel and the row of the transverse shifting of pulley 203
Journey is adapted, and the upper limit can reach 1200mm；The upper end of the cantilever 204 is connected with the pulley 203, the motor vertical
220 are connected to the lower end of cantilever 204, for driving the circuit printing machine structure 400 and die bond and transmission mechanism 500 in suspension bracket
Moved up and down in 201, to leave or contact working face；The buffer, decelerator and brake are respectively used to described
The necessary buffering of mobile carry out, deceleration and the braking of circuit printing machine structure 400 and die bond and transmission mechanism 500；The industry control list
Member is used to controlling and adjusting the circuit printing machine structure 400 and die bond and the translational speed and accuracy of transmission mechanism 500.
Specifically, the working face loader mechanism 300 is made up of the fixture for loading and fixing substrate 310, can be by width
The substrate 310 of degree up to 1200mm oversize is fixed on the working face of board 100.
Specifically, the circuit printing machine structure 400 includes steel mesh and its support 410, the second servomotor 420, scraper plate
430；After the scope of operation 230 that bonder is made up of the circuit printing machine structure 400 and die bond and transmission mechanism 500 is in place,
The steel mesh and its support 410 are moved up and down under the driving of the second servomotor 420 above working face, in order to vertical
Silk-screen；The scraper plate 430 is located at the top of steel mesh and its support 410, in working face under the driving of the second servomotor 420
Upper horizontal is moved.
Specifically, the die bond and transmission mechanism 500 include wafer delivery unit 510, wafer placement unit 530, heating
Unit；The wafer delivery unit 510 is used to lift and transmit LED chip；The wafer placement unit 530 is used to draw LED
Chip, and LED chip is placed on the circuit of substrate 310；The heating unit is used for placing the substrate 310 by LED chip
Heated, to melt tin cream, so that LED chip is fixed on substrate 310 via tin cream, and make the positive and negative of LED chip
Electrode is via tin cream and the circuit turn-on of substrate 310.
It is preferred that the wafer delivery unit 510 includes expander wafer disk 520 and thimble 521, the expander is brilliant
Piece disk 520 is supported by blue film, and the thimble 521 is located at the middle position of expander wafer disk 520；LED chip is placed on expansion
On device wafer disk 520.
It is preferred that the wafer placement unit 530 uses swing arm laminating type, including swing arm 531, suction nozzle
532nd, transmission mechanism, vacuum source device 540, containing flow sensor, tracheae and signal processing apparatus；The suction nozzle 532 is located at
The top of swing arm 531, is placed on the circuit of substrate 310 for drawing LED chip, and by LED chip；The wafer placement unit
530 also have the brilliant automatic detection function of leakage, take the accuracy of brilliant action and die bond action all very high.
Specifically, the optoelectronic scanning controlling organization includes scanning processor and the base being electrically connected with the scanning processor
Plate vision module 320, wafer vision module 550, photodetector, power optimization device, light source, power-sensing circuit, spectrum are visited
Survey device, light intensity detector, spectrum datum mark setting apparatus, light intensity datum mark setting apparatus, light intensity regulating driver, spectral comparator and
Light intensity comparator, data storage, synchrodata transmitter, alarm, display module, for being carried for optoelectronic scanning control software
For the collection and computing of data；The substrate vision module 320 is used to sweep the progress photoelectricity of super large substrate 310 on working face
Retouch, subregion and positioning, and the region of adjacent sectors is docked；When the wafer vision module 550 is used for district operation
Precise positioning and control function are provided；The die bond and transmission mechanism 500 link with accurate gallows frame and transmission mechanism 200,
The region delimited according to optoelectronic scanning control software carries out taking brilliant and die bond operation one by one, until completing to whole super large substrate
310 whole die bond operations.
Based on the bonder of the large area flip LED area source piece in the embodiments of the present invention, the invention also provides
A kind of large area flip LED area source piece, using the large area flip LED area source provided in the invention described above any embodiment
The bonder of piece is produced.
Specifically, the substrate width of the large area flip LED area source piece in 200mm between 1200mm, substrate is wide
Preferred 300mm is spent between 900mm, particularly 600mm width.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
The present invention is described in detail, it will be understood by those within the art that：It still can be to foregoing each implementation
Technical scheme described in example is modified, or carries out equivalent substitution to which part technical characteristic, such as used herein
" mechanism ", namely " component " or " part " etc.；And these modifications or replacement, do not make the essence disengaging of appropriate technical solution
The spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. a kind of bonder of large area flip LED area source piece, it is characterised in that including：Board, accurate gallows frame and biography
Motivation structure, working face loader mechanism, circuit printing machine structure, die bond and transmission mechanism and optoelectronic scanning controlling organization；
The accurate gallows frame and transmission mechanism and working face and loader mechanism are fixedly installed on board；
The working face loader mechanism is used to load on the working face of board and fixed substrate；
The circuit printing machine structure and die bond and transmission mechanism are arranged on accurate gallows frame and transmission mechanism, and in work
Its displacement is all can control in three mutually orthogonal directions above face；
The circuit printing machine structure is used to paste solder printing forming line map on substrate；
The die bond and transmission mechanism be used for by LED chip by go here and there and in the way of be inverted in and be printed with the substrate of tin cream, and will
The both positive and negative polarity of LED chip is electrically connected with line map；
The optoelectronic scanning controlling organization is used to be scanned positioning to substrate and line map.
2. the bonder of large area flip LED area source piece according to claim 1, it is characterised in that：The accurate dragon
Door hanger and transmission mechanism include：Suspension bracket, vertical rail, the first servomotor, traverse rod, pulley, cantilever and motor vertical, for described
Circuit printing machine structure and die bond and transmission mechanism carry out suspension operation in suspension bracket；
The suspension bracket is formed by connecting by four vertical square steel and four horizontal square steel, and four horizontal square steel are fixed on four Vertical Squares
The top of steel, the bottom of four vertical square steel is fixed on board；
The vertical rail is arranged on horizontal square steel two longer, and first servomotor is arranged on two longer levels
The end of square steel, for driving the circuit printing machine structure and die bond and transmission mechanism to be moved horizontally in suspension bracket；
The traverse rod is located between horizontal square steel two longer, and can be along the vertical rail between horizontal square steel two shorter
Vertically move；
The pulley is socketed on traverse rod, and can be laterally moved along the traverse rod between horizontal square steel two longer, and two
The length of the shorter horizontal square steel of root is adapted with the stroke of pulley transverse shifting；
The upper end of the cantilever is connected with the pulley, and the motor vertical is connected to the lower end of cantilever, described for driving
Circuit printing machine structure and die bond and transmission mechanism are moved up and down in suspension bracket, to leave or contact working face.
3. the bonder of large area flip LED area source piece according to claim 2, it is characterised in that：The accurate dragon
Door hanger and transmission mechanism also include：Buffer, decelerator, brake and industry control unit；The buffer, decelerator and braking
Device is respectively used to the movement to the circuit printing machine structure and die bond and transmission mechanism and enters row buffering, slows down and brake；The work
Control unit is used to controlling and adjusting the circuit printing machine structure and die bond and the translational speed and accuracy of transmission mechanism.
4. the bonder of large area flip LED area source piece according to claim 1, it is characterised in that：The circuit print
Brush mechanism includes steel mesh and its support, the second servomotor and scraper plate；The drive of the steel mesh and its support in the second servomotor
Moved up and down under dynamic above working face, in order to vertical silk-screen；The scraper plate is located at the top of steel mesh and its support, the
Upper horizontal under the driving of two servomotors in working face is moved.
5. the bonder of large area flip LED area source piece according to claim 1, it is characterised in that：The die bond and
Transmission mechanism includes wafer delivery unit, wafer placement unit and heating unit；The wafer delivery unit is used to lift and pass
Send LED chip；The wafer placement unit is used to draw LED chip, and LED chip is placed on the circuit of substrate；It is described to add
Hot cell is used to heat the substrate placed by LED chip, to melt tin cream, LED chip is fixed on base via tin cream
On plate, and make the positive and negative electrode of LED chip via tin cream and the circuit turn-on of substrate.
6. the bonder of large area flip LED area source piece according to claim 5, it is characterised in that：The wafer is passed
Unit is sent to include expander wafer disk and thimble, the expander wafer disk is supported by blue film, it is brilliant that the thimble is located at expander
The middle position of piece disk.
7. the bonder of large area flip LED area source piece according to claim 5, it is characterised in that：The wafer is grabbed
Unit is taken to include swing arm and suction nozzle；The suction nozzle is located at the top of swing arm, and base is placed in for drawing LED chip, and by LED chip
On the circuit of plate.
8. the bonder of large area flip LED area source piece according to claim 1, it is characterised in that：The photoelectricity is swept
Retouching controlling organization includes substrate vision module and wafer vision module；The substrate vision module is used for the substrate on working face
Optoelectronic scanning, subregion and positioning are carried out, and the region of adjacent sectors is docked；The wafer vision module is used for subregion
Precise positioning and control function are provided during operation.
9. a kind of large area flip LED area source piece, it is characterised in that：Using the big face any one of claim 1 to 8
The bonder of product flip LED area source piece is produced.
10. large area flip LED area source piece according to claim 1, it is characterised in that：The large area flip LED
The substrate width of area source piece is in 200mm between 1200mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710398368.1A CN107170879B (en) | 2017-05-31 | 2017-05-31 | A kind of large area flip LED area source piece and its bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710398368.1A CN107170879B (en) | 2017-05-31 | 2017-05-31 | A kind of large area flip LED area source piece and its bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107170879A true CN107170879A (en) | 2017-09-15 |
| CN107170879B CN107170879B (en) | 2019-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710398368.1A Active CN107170879B (en) | 2017-05-31 | 2017-05-31 | A kind of large area flip LED area source piece and its bonder |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107818936A (en) * | 2017-12-07 | 2018-03-20 | 上海屹壹电子科技有限公司 | A kind of bonder with brush coating device |
| CN108215464A (en) * | 2017-12-19 | 2018-06-29 | 广东北玻臻兴玻璃技术工业有限公司 | A kind of full-automatic glass printing equipment |
| CN109985829A (en) * | 2019-05-06 | 2019-07-09 | 山东泓瑞光电科技有限公司 | A kind of LED wafer automatic fraction collector dilator body |
| CN112201736A (en) * | 2020-09-21 | 2021-01-08 | 深圳市弘亮光电股份有限公司 | MiniLED matrix backlight board, manufacturing method thereof and notebook computer |
| CN113954516A (en) * | 2021-12-01 | 2022-01-21 | 深圳市卓兴半导体科技有限公司 | Partitioned precision printing equipment for substrate |
| CN115249758A (en) * | 2022-09-22 | 2022-10-28 | 深圳市卓兴半导体科技有限公司 | Pixel die bonder |
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| CN112201736A (en) * | 2020-09-21 | 2021-01-08 | 深圳市弘亮光电股份有限公司 | MiniLED matrix backlight board, manufacturing method thereof and notebook computer |
| CN112201736B (en) * | 2020-09-21 | 2022-02-11 | 深圳市弘亮光电股份有限公司 | MiniLED matrix backlight board, manufacturing method thereof and notebook computer |
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| CN115249758A (en) * | 2022-09-22 | 2022-10-28 | 深圳市卓兴半导体科技有限公司 | Pixel die bonder |
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