CN107818936A - A kind of bonder with brush coating device - Google Patents
A kind of bonder with brush coating device Download PDFInfo
- Publication number
- CN107818936A CN107818936A CN201711288729.3A CN201711288729A CN107818936A CN 107818936 A CN107818936 A CN 107818936A CN 201711288729 A CN201711288729 A CN 201711288729A CN 107818936 A CN107818936 A CN 107818936A
- Authority
- CN
- China
- Prior art keywords
- brush coating
- coating device
- bonder
- fixed seat
- swing arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 53
- 239000011248 coating agent Substances 0.000 title claims abstract description 50
- 239000013078 crystal Substances 0.000 claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 14
- 238000007664 blowing Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 230000009466 transformation Effects 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000002525 ultrasonication Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a kind of bonder with brush coating device, including bonder body, the bonder body includes board, it is arranged at the tracks for being used for transportation frame device on the board, and it is arranged at the crystal solidifying apparatus in the tracks, brush coating device is also fixedly connected with the bonder body, the brush coating device is arranged at before the crystal solidifying apparatus.Bonder provided by the present invention with brush coating device, by setting brush coating device in front of the crystal solidifying apparatus of bonder body, brush coating process and die bond process are completed in same equipment, product quality and die bond speed can not only be effectively improved, and the transformation flexibility of board is big and the problem of can make full use of the production capacity of equipment.
Description
Technical field
The invention belongs to chip encapsulation technology field, and in particular to a kind of bonder with brush coating device.
Background technology
Bonder is equipment used in load processing procedure during semiconductor die package.At work, bonder is walked
Band clamp drives the framework for carrying chip to be transmitted on orbit plane, each chip is passed sequentially through dispensing position and load
Position, operated with carrying out corresponding dispensing and welding.
Traditional bonder is used to realize the electrical connection between semiconductor devices and substrate.Traditional bonder can be by semiconductor
Device is cemented on substrate with conductive silver paste or non-conductive adhesive.Then baking process is carried out, by conductive silver paste or non-conductive gluing
The semiconductor devices solidification of knot.Finally under hot pressing ultrasonication, by bonding equipment, it will pass through between substrate and semiconductor devices
Gold thread (copper cash or silver alloy wire) is connected, to realize the electrical communication between semiconductor devices and substrate.
But traditional bonder has several defects in dispensing the step：(1) dispensing glue amount it is unstable there is several factors that
Cause, as glue is too many, it is too high to climb to sides of chip height, or even climbs to chip surface.There is bubble in glue, Glue dripping head has blocking,
Point gum machine precision not enough etc..(2) have cavity in the glue after die bond, after the dispensing pin mark glue of array, pin and pin it
Between inevitable hole, the air after upper core in hole can not discharge.(3) thickness of glue-line is unstable, it is too low or too high or
Tilt.(4) low (UPH) the low shortcoming of speed for dispensing glue.
In order to solve the drawbacks described above of traditional bonder, person skilled in art is replaced existing using brush coating mode
Dispensing mode, it is can solve many defects for dispensing glue the advantages of the improved technical scheme, but the technical scheme is one
Gluing machine provides brush coating service for many bonders so that the quantities of the die bond equipment is big, price, take up an area it is big, complicated, and
Need to transform original production line, and the technical scheme is only suitable for producing in enormous quantities for a long time without flexibility.
The content of the invention
It is contemplated that at least solves one of technical problem in correlation technique to a certain extent.Therefore, the present invention
Main purpose is to provide a kind of bonder with brush coating device, it is intended to solves that dispensing quality is unstable, dispensing speed is low, machine
The problem of transformation flexibility of platform is small and can not make full use of the production capacity of equipment.
The purpose of the present invention is achieved through the following technical solutions：
A kind of bonder with brush coating device, including bonder body, the bonder body include board, are arranged at
It is used for the tracks of transportation frame, and the crystal solidifying apparatus being arranged in the tracks, the die bond on the board
Brush coating device is also fixedly connected with machine body, is seen along the conveying direction of the workpiece of the crystal solidifying apparatus, the brush coating device
It is arranged at the workpiece entrance side of the crystal solidifying apparatus.
Preferably, wherein the brush coating device includes doctor blade device and drives the doctor blade device to make the first of side-to-side movement
Drive device, feeding device is provided with immediately below the doctor blade device, and the feeding device includes vacuum platform and driving institute
The second drive device of vacuum platform up and down motion is stated, the frame mounting is provided with above the vacuum platform, in addition to
The manipulator mechanism being set up on the board, the manipulator mechanism include swingable swing arm and drive the swing arm to make directly
Line moves back and forth and the 3rd drive device that can vertically rotate, and device for suction material and drive the device for suction material air-breathing or
The drive cylinder of air blowing, the device for suction material are arranged at the end of the swing arm.
Preferably, wherein the first driving means include ball screw, servomotor and fixed seat, the servomotor
Output axis connection ball screw, the fixed seat includes being fixedly installed on left fixed seat and right fixed seat on the board,
The ball screw is threadedly coupled through left fixed seat and right fixed seat and with the left fixed seat and right fixed seat.
Preferably, wherein the doctor blade device includes vertical cylinder and scraper, the vertical cylinder by fixed support with
The ball screw is connected, and is connected with the scraper, and the vertical cylinder can drive the scraper closer or far from institute
State frame mounting.
Preferably, wherein also including industry control mechanism, the industry control mechanism is arranged in the board, and is filled with the die bond
Put to communicate with brush coating device and connect.
Preferably, wherein the device for suction material includes suction nozzle, flow sensor and signal processing apparatus, the suction nozzle is fixed
In on the free end of the swing arm, the flow sensor is communicated between the suction nozzle and drive cylinder, the suction nozzle, flow
Sensor and drive cylinder are connected by tracheae, and the flow sensor is used to detect the endotracheal throughput and export electricity
Whether signal, the signal processing apparatus are used to the electric signal of flow sensor output is compared to export after processing to leak
Brilliant judgement signal.
Preferably, wherein the manipulator mechanism also includes the air valve being communicated between the suction nozzle and flow sensor.
Preferably, wherein the manipulator mechanism also includes the filter being communicated between air valve and the flow sensor.
Preferably, wherein the manipulator mechanism is also included for driving the swing arm motor of the swing arm rotation and being used for
Drive the control motor of the swing arm stretching motion.
Compared with prior art, the present invention at least has advantages below：
Bonder provided by the present invention with brush coating device, including bonder body, have on the bonder body
For the orbit plane of transportation frame, brush coating device is fixedly connected with bonder body, along the workpiece of the crystal solidifying apparatus
Conveying direction on see, the brush coating device is arranged at the workpiece entrance side of the crystal solidifying apparatus.During specific works, by solid
Brush coating device is set in front of the crystal solidifying apparatus of brilliant machine body so that brush coating process and die bond process can be complete in same equipment
Into product quality and die bond speed can not only be effectively improved, and the transformation flexibility of board is big and can make full use of equipment
The problem of production capacity.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the main structure chart of the bonder provided by the present invention with brush coating device；
Fig. 2 is the main structure chart of brush coating device in the bonder provided by the present invention with brush coating device；
Wherein, 1, board；2nd, tracks；3rd, crystal solidifying apparatus；4th, brush coating device；41st, doctor blade device；42nd, the first driving
Device；43rd, vacuum platform；44th, the second drive device；45th, manipulator mechanism；5th, frame mounting.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only the part of the embodiment of the present invention, rather than whole embodiments.
Based on the embodiment in the present invention, those of ordinary skill in the art are obtained under the premise of creative work is not made
The every other embodiment obtained, belongs to the scope of protection of the invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining the relative position relation under a certain particular pose (as shown in drawings) between each part, motion conditions etc., if should
When particular pose changes, then directionality instruction also correspondingly changes therewith.
In the present invention such as relating to the description of " first ", " second " etc. is only used for describing purpose, and it is not intended that instruction
Or imply its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, " first ", " second " are defined
Feature can express or implicitly include at least one this feature.
In the description of the invention, " multiple " are meant that at least two, such as two, three etc., unless otherwise clear and definite
It is specific to limit.
In the present invention, unless otherwise clearly defined and limited, term " connection ", " fixation " etc. should be interpreted broadly,
For example, " fixation " can be fixedly connected or be detachably connected, or integrally；Can be mechanically connect or
Electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, can be the connection or two of two element internals
The interaction relationship of individual element, limited unless otherwise clear and definite.For the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
Embodiment 1
As shown in figure 1, a kind of bonder with brush coating device, including bonder body, the bonder body include machine
Platform 1, it is arranged at the tracks 2 for being used for transportation frame device 5 on board 1, and the crystal solidifying apparatus being arranged in tracks 2
3, brush coating device 4 is also fixedly connected with bonder body, is seen along the conveying direction of the workpiece of crystal solidifying apparatus 3, brush coating dress
Put the 4 workpiece entrance sides for being arranged at crystal solidifying apparatus 3.When specifically used, first pass through brush coating device 4 and lower tablet is glued and brushed
Glue, then the upper tablet semi-finished product after the completion of brush coating are transferred to crystal solidifying apparatus 3, subsequent processing is then transferred to, by bonder sheet
Brush coating device 4 is fixedly connected with body so that brush coating process and die bond process can be completed in same equipment, can not only be effective
Improve product quality and die bond speed, and the transformation flexibility of board is greatly and the problem of can make full use of the production capacity of equipment.
Embodiment 2
As shown in Fig. 2 the present embodiment, on the basis of embodiment 1, wherein brush coating device 4 includes doctor blade device 41 and driving
Doctor blade device 41 makees the first driving means 42 of side-to-side movement, and the underface of the doctor blade device 41 is provided with feeding device, on this
Expect device include vacuum platform 43 and drive vacuum platform 43 move up and down the second drive device 44, the vacuum platform 43 it is upper
Side is provided with frame mounting 5, and the frame mounting includes hollow screen frame and is covered in the hollow printing screen of screen frame, in addition to
The manipulator mechanism 45 being set up on board 1, the manipulator mechanism 45 include swingable swing arm and drive the swing arm to make directly
Line moves back and forth and the 3rd drive device that can vertically rotate, and device for suction material and drive the device for suction material air-breathing or
The drive cylinder of air blowing, the device for suction material are arranged at the end of swing arm.When specifically used, first glue (or silver paste, tin cream)
It is poured on by hand on the printing screen of frame mounting 5, drive cylinder is started working, and the device for suction material of manipulator mechanism 45 inhales substrate
It is attached on vacuum platform 43, after manipulator mechanism 45 removes avoidance, the second drive device 44 driving vacuum platform 43 rises to
Printing screen bottom is developed, and now first driving means 42 drive doctor blade device 41 to carry out brush coating work, treats that brush coating work is completed
Afterwards, the second drive device 44 drives vacuum platform 43 to drop to specified location again, finally again by manipulator mechanism 45
Device for suction material absorption frame mounting 5 put to carrying out die bond work in tracks 2.
Preferably, in a preferred scheme of the present embodiment, wherein first driving means 42 include ball screw, servo
Motor and fixed seat, the output axis connection ball screw of servomotor, fixed seat include the left fixation being fixedly installed on board
Seat and right fixed seat, ball screw passes through left fixed seat and right fixed seat, and connects with the left fixed seat and right fixed seat screw thread
Connect, during specific works, servomotor driving doctor blade device is reciprocating (left and right) along ball screw, and brush coating device is by adopting
With the first driving means 42 so that the precision of brush coating can control between ± 0.01mm, substantially increase the quality of product.
Preferably, in another preferred scheme of the present embodiment, wherein doctor blade device 41 includes vertical cylinder and scraper,
Vertical cylinder is connected by fixed support with ball screw, and is connected with scraper, and the vertical cylinder can drive scraper to lean on
Close or remote from the frame mounting, and wherein also include industry control mechanism, the industry control mechanism is arranged in the board, and and die bond
Device and the communication connection of brush coating device, when specifically used, by directly inputting technical data in industry control mechanism, open solid
Brilliant machine, it can be automatically performed the work of brush coating die bond, and automaticity is high, significantly reduces the working strength of operating personnel.
Embodiment 3
The present embodiment is on the basis of above-described embodiment 1 and embodiment 2, and wherein device for suction material includes suction nozzle, flow passes
Sensor and signal processing apparatus, suction nozzle are fixed on the free end of the swing arm, and flow sensor is communicated in suction nozzle and driving gas
Between cylinder, the suction nozzle, flow sensor and drive cylinder are connected by tracheae, and flow sensor is used to detect endotracheal air-flow
Measure and export electric signal, the signal processing apparatus, which is used for output after the electric signal that flow sensor exports is compared processing, is
The brilliant judgement signal of no leakage.The manipulator mechanism of the bonder detects endotracheal gas flow by flow sensor, so as to
Learn whether suction nozzle is adsorbed with chip, do not receive ambient light interference in detection process, and then improve the mechanical mobile phone of the bonder
The brilliant accuracy of structure detection leakage is higher.
Preferably, in a preferred scheme of the present embodiment, wherein manipulator mechanism 45 also includes being communicated in the suction
Air valve between mouth and flow sensor, the air valve are used to cut off the air-flow in the tracheae；And also include be communicated in air valve with
Filter between the flow sensor, the impurity that the filter is used in filtered airflow, and manipulator mechanism 45 also include
For driving the swing arm motor of swing arm rotation and the control motor of swing arm stretching motion, the setting to further increase manipulator
The accuracy of the grabber piece of mechanism 45, and then further increase the quality stability of die bond product.
More than, it is only the preferable embodiment of the present invention, but the protection domain invented is not limited thereto, and it is any ripe
Know those skilled in the art the invention discloses technical scope in, the change or replacement that can readily occur in should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by the protection domain of claims.
Claims (9)
1. a kind of bonder with brush coating device, it is characterised in that including bonder body, the bonder body includes machine
Platform, it is arranged at the tracks for being used for transportation frame device on the board, and the die bond being arranged in the tracks
Device, brush coating device is also fixedly connected with the bonder body, is seen along the conveying direction of the workpiece of the crystal solidifying apparatus,
The brush coating device is arranged at the workpiece entrance side of the crystal solidifying apparatus.
2. the bonder according to claim 1 with brush coating device, it is characterised in that the brush coating device includes scraper
Device and the driving doctor blade device make the first driving means of side-to-side movement, and feeding is provided with immediately below the doctor blade device
Device, the second drive device that the feeding device includes vacuum platform and drives the vacuum platform to move up and down are described
The frame mounting is provided with above vacuum platform, in addition to the manipulator mechanism being set up on the board, the machinery
The 3rd drive that mobile phone structure includes swingable swing arm and drives the swing arm to make straight reciprocating motion and can vertically rotate
Dynamic device, and device for suction material and the drive cylinder for driving the device for suction material air-breathing or air blowing, the device for suction material are arranged at institute
State the end of swing arm.
3. the bonder according to claim 1 or 2 with brush coating device, it is characterised in that the first driving means
Including ball screw, servomotor and fixed seat, the output axis connection ball screw of the servomotor, the fixed seat includes
The left fixed seat and right fixed seat being fixedly installed on the board, the ball screw pass through left fixed seat and right fixed seat simultaneously
It is threadedly coupled with the left fixed seat and right fixed seat.
4. the bonder according to claim 3 with brush coating device, it is characterised in that the doctor blade device includes vertical
Cylinder and scraper, the vertical cylinder are connected by fixed support with the ball screw, and are connected with the scraper, institute
The scraper can be driven closer or far from the frame mounting by stating vertical cylinder.
5. the bonder according to claim 4 with brush coating device, it is characterised in that described also including industry control mechanism
Industry control mechanism is arranged in the board, and is connected with the crystal solidifying apparatus and the communication of brush coating device.
6. the bonder according to claim 5 with brush coating device, it is characterised in that the device for suction material includes inhaling
Mouth, flow sensor and signal processing apparatus, the suction nozzle are fixed on the free end of the swing arm, and the flow sensor connects
Pass through between the suction nozzle and drive cylinder, the suction nozzle, flow sensor and drive cylinder are connected by tracheae, the flow
Sensor is used to detect the endotracheal throughput and export electric signal, and the signal processing apparatus is used to pass the flow
The electric signal of sensor output exports the judgement signal for whether leaking crystalline substance after being compared processing.
7. the bonder according to claim 2 with brush coating device, it is characterised in that the manipulator mechanism also includes
The air valve being communicated between the suction nozzle and flow sensor.
8. the bonder with brush coating device according to claim 2 or 7, it is characterised in that the manipulator mechanism is also
Including the filter being communicated between air valve and the flow sensor.
9. the bonder according to claim 8 with brush coating device, it is characterised in that the manipulator mechanism also includes
For driving the swing arm motor that the swing arm rotates and the control motor for driving the swing arm stretching motion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711288729.3A CN107818936A (en) | 2017-12-07 | 2017-12-07 | A kind of bonder with brush coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711288729.3A CN107818936A (en) | 2017-12-07 | 2017-12-07 | A kind of bonder with brush coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107818936A true CN107818936A (en) | 2018-03-20 |
Family
ID=61605458
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711288729.3A Pending CN107818936A (en) | 2017-12-07 | 2017-12-07 | A kind of bonder with brush coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107818936A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108767101A (en) * | 2018-05-25 | 2018-11-06 | 苏州市汇涌进光电有限公司 | A kind of LED die-bonding methods |
| CN111430285A (en) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN117352432A (en) * | 2023-10-23 | 2024-01-05 | 鸿盛芯创半导体设备(昆山)有限公司 | Full-automatic glue brushing machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448780A (en) * | 2015-12-04 | 2016-03-30 | 大族激光科技产业集团股份有限公司 | Die bonder |
| CN205970335U (en) * | 2016-08-30 | 2017-02-22 | 昆山琉明光电有限公司 | Automatic solder paste printing process device |
| CN206401275U (en) * | 2017-01-03 | 2017-08-11 | 江苏新智达新能源设备有限公司 | Glue applying mechanism for diode package |
| CN107170879A (en) * | 2017-05-31 | 2017-09-15 | 天下知光科技（深圳）有限公司 | A kind of large area flip LED area source piece and its bonder |
| CN208570529U (en) * | 2017-12-07 | 2019-03-01 | 上海屹壹电子科技有限公司 | A kind of bonder with brush coating device |
-
2017
- 2017-12-07 CN CN201711288729.3A patent/CN107818936A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105448780A (en) * | 2015-12-04 | 2016-03-30 | 大族激光科技产业集团股份有限公司 | Die bonder |
| CN205970335U (en) * | 2016-08-30 | 2017-02-22 | 昆山琉明光电有限公司 | Automatic solder paste printing process device |
| CN206401275U (en) * | 2017-01-03 | 2017-08-11 | 江苏新智达新能源设备有限公司 | Glue applying mechanism for diode package |
| CN107170879A (en) * | 2017-05-31 | 2017-09-15 | 天下知光科技（深圳）有限公司 | A kind of large area flip LED area source piece and its bonder |
| CN208570529U (en) * | 2017-12-07 | 2019-03-01 | 上海屹壹电子科技有限公司 | A kind of bonder with brush coating device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108767101A (en) * | 2018-05-25 | 2018-11-06 | 苏州市汇涌进光电有限公司 | A kind of LED die-bonding methods |
| CN111430285A (en) * | 2020-04-01 | 2020-07-17 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN111430285B (en) * | 2020-04-01 | 2020-11-13 | 深圳新益昌科技股份有限公司 | Die bonder with glue brushing device |
| CN117352432A (en) * | 2023-10-23 | 2024-01-05 | 鸿盛芯创半导体设备(昆山)有限公司 | Full-automatic glue brushing machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208570529U (en) | A kind of bonder with brush coating device | |
| CN107818936A (en) | A kind of bonder with brush coating device | |
| CN107388086A (en) | The full-automatic assemble method of LED string | |
| CN107363371A (en) | LED string automatically assembles equipment | |
| CN106824678B (en) | High-precision full-automatic injection type dispensing machine and dispensing method | |
| CN102074559A (en) | SiP (Session Initiation Protocol) system integrated-level IC (Integrated Circuit) chip packaging part and manufacturing method thereof | |
| CN107305916A (en) | A kind of CSP encapsulation LED chip mounter and its processing technology | |
| CN103400784B (en) | Multipurpose sealed in unit | |
| CN104124216A (en) | Substrate chip carrier CSP package and production method thereof | |
| CN208835028U (en) | A kind of lead frame film sticking apparatus | |
| CN208016242U (en) | A kind of high intelligent high-precision liquid crystal module FPC automatic collating units | |
| CN207719162U (en) | Stable die bonding structure of die bonder | |
| CN117096066A (en) | Full-automatic coil stock high-speed high-precision eutectic and dispensing switchable equipment | |
| CN207068816U (en) | Continuous crystal solidifying apparatus | |
| CN106952848A (en) | Bonder and its pickup bonding apparatus | |
| CN108807191A (en) | A kind of die-bonding method for IC chip | |
| US5846851A (en) | Method of applying adhesive to lead of lead frame and method of making semiconductor device using the same | |
| CN113328028B (en) | CSP on-line die bonder | |
| CN206758414U (en) | Bonder and its pickup bonding apparatus | |
| CN105789086B (en) | A kind of device of chip double-side scaling powder coating | |
| JP2014109454A (en) | Method of manufacturing semiconductor device | |
| CN104733331B (en) | Vapour-pressure type colloid flattening device and its levelling method | |
| CN208512917U (en) | A kind of die bond and point tin cream coordinated type point tin cream machine | |
| CN107634021A (en) | A kind of multi-functional processing unit (plant) of quartz crystal oscillator | |
| CN108231982A (en) | A kind of LED packaging technologies |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |