CN208835028U - A kind of lead frame film sticking apparatus - Google Patents

A kind of lead frame film sticking apparatus Download PDF

Info

Publication number
CN208835028U
CN208835028U CN201821836881.0U CN201821836881U CN208835028U CN 208835028 U CN208835028 U CN 208835028U CN 201821836881 U CN201821836881 U CN 201821836881U CN 208835028 U CN208835028 U CN 208835028U
Authority
CN
China
Prior art keywords
film
lead frame
ontology
pasting
sticking apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821836881.0U
Other languages
Chinese (zh)
Inventor
李海飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Hai Zhan Automation Equipment Co Ltd
Original Assignee
Shanghai Hai Zhan Automation Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Hai Zhan Automation Equipment Co Ltd filed Critical Shanghai Hai Zhan Automation Equipment Co Ltd
Priority to CN201821836881.0U priority Critical patent/CN208835028U/en
Application granted granted Critical
Publication of CN208835028U publication Critical patent/CN208835028U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Labeling Devices (AREA)

Abstract

The utility model discloses a kind of lead frame film sticking apparatus, including ontology, the front end of the ontology is equipped with PLC controller, operation button and display instrument, the rear end of ontology is equipped with film feeding mechanism, yellow membrane cylinder and useless film cylinder, it is equipped in the middle part of ontology on table-driving mechanism and table-driving mechanism and is slidably fitted with lead frame workbench, swing film pasting mechanism is installed, film feeding mechanism, table-driving mechanism and swing film pasting mechanism are electrically connected with PLC controller on lead frame workbench.Rationally, by the cooperation of all parts, effective solution orientation problem, buckling deformation problem have simultaneously carried out effective fixation to lead frame for this product design;This product realizes the crawl of the upper surface of yellow membrane while step on cut-in without ball without touching the measured length of surface with glue, yellow membrane and cut, cut off preceding a piece of yellow membrane, the effect of the end head of a piece of yellow membrane under having picked up;This product controls precision height, and using effect is good, has positive social benefit.

Description

A kind of lead frame film sticking apparatus
Technical field
It is specifically a kind of to draw the utility model relates to the back side pad pasting field of the lead frame in LED and semicon industry Wire frame film sticking apparatus.
Background technique
Integrated circuit is a kind of microelectronic device or component, is using certain technique, needed for a circuit The elements such as transistor, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or Jie On matter substrate, it is then encapsulated in a shell, becomes the microstructure with required circuit function;Wherein all elements are being tied It has formed a whole on structure, integrated circuit makes electronic component in terms of microminaturization, low-power consumption, intelligence and high reliability Major step is strided forward.
Chip carrier of the lead frame as integrated circuit is that one kind is drawn by means of bonding material realization chip internal circuits The electrical connection of outlet and outer lead, forms the key structure part of electric loop, it plays the bridge connected with outer lead Effect, is basic material important in electronics and information industry.
Lead frame will carry out back-protective before high temperature bakes or is molded, so this layer of yellow membrane of back-protective wants energy High temperature resistant and opposing runners frame position is accurate, best yellow membrane is completely in the specified region of lead frame range, before pad pasting It accurately to position and effectively aid is fixed, operator and equipment itself must not touch lead frame in this action process Chip on front, people are in the research for carrying out this respect at present.
Summary of the invention
The purpose of this utility model is to provide a kind of lead frame film sticking apparatus, to solve to propose in above-mentioned background technique The problem of.
To achieve the above object, the utility model provides the following technical solutions:
A kind of lead frame film sticking apparatus, including ontology, the front end of the ontology are equipped with PLC controller, operation button And display instrument, the rear end of ontology are equipped with film feeding mechanism, yellow membrane cylinder and useless film cylinder, and workbench driving is equipped in the middle part of ontology It is slidably fitted with lead frame workbench in mechanism and table-driving mechanism, swing patch is installed on lead frame workbench It film mechanism and swings film pasting mechanism and is used cooperatively with film feeding mechanism, film feeding mechanism, table-driving mechanism and swing laminator Structure is electrically connected with PLC controller.
As a further solution of the present invention: the rear end of ontology, which is equipped with useless film, collects guiding mechanism, the film that gives up is collected Guiding mechanism is used cooperatively with useless film cylinder.
It puts film guiding mechanism as a further solution of the present invention: the rear end of ontology is equipped with and puts film Guiding machine Structure is used cooperatively with film pasting mechanism is swung.
As a further solution of the present invention: lead frame workbench include lead frame clamping device, positioning pin, Sucker, chip mounting groove and mobile mechanism, mobile mechanism are located at the lower part of lead frame workbench, and chip mounting groove is located at lead The center of frame work platform, lead frame clamping device, positioning pin and sucker are respectively positioned on the side of chip mounting groove.
As a further solution of the present invention: sucker is using soft material production.
As a further solution of the present invention: swinging film pasting mechanism includes preceding pad pasting idler wheel mechanism, rear pad pasting idler wheel Mechanism, cutting cutter mechanism, Hou Xi membrane arms mechanism, Qian Xi membrane arms mechanism and wobble drive arm, preceding pad pasting idler wheel mechanism and rear pad pasting Idler wheel mechanism is located at the two sides for swinging film pasting mechanism, and cutting cutter mechanism is located at the centre for swinging film pasting mechanism, preceding suction membrane arms Mechanism is located between cutting cutter mechanism and preceding pad pasting idler wheel mechanism, and Hou Xi membrane arms mechanism is located at cutting cutter mechanism and rear pad pasting idler wheel Between mechanism, wobble drive arm is located at the outside for swinging film pasting mechanism.
Compared with prior art, the utility model has the beneficial effects that
First, this product design rationally, by the cooperation of all parts, effective solution orientation problem, buckling deformation Problem has simultaneously carried out effective fixation to lead frame;
Second, this product, which realizes the crawl of the upper surface of yellow membrane, steps on cut-in without ball without touching the measured length of surface with glue, yellow membrane and cuts, cuts Before disconnected while a piece of yellow membrane, the effect of the end head of a piece of yellow membrane under having picked up;
Third, this product control precision height, and using effect is good, has positive social benefit.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the lead frame of back side part pad pasting.
Fig. 2 is the structural schematic diagram of face-up lead frame.
Fig. 3 is the cross-sectional view of the lead frame after pad pasting.
Fig. 4 is the location drawing of yellow membrane opposing runners frame.
Fig. 5 is the perspective view of lead frame film sticking apparatus.
Fig. 6 is the structure chart of lead frame workbench in lead frame film sticking apparatus.
Fig. 7 is the operation schematic diagram of lead frame in lead frame film sticking apparatus.
Fig. 8 is operation schematic diagram when lead frame film sticking apparatus carries out pad pasting.
Fig. 9 is the structure chart that film pasting mechanism is swung in lead frame film sticking apparatus.
Figure 10 is the effect picture that lead frame film sticking apparatus pad pasting finishes.
Wherein: 1- yellow membrane cylinder, 2- give up film cylinder, 3-PLC controller, 4- operation button, 5- display instrument, 6- film feeding mechanism, 7- table-driving mechanism, 8- put film guiding mechanism, and 9- is useless, and film collects guiding mechanism, 25- lead frame workbench, 26- lead Frame clamping device, 27- positioning pin, 28- sucker, 29- chip mounting groove, 30- mobile mechanism, 55- swing film pasting mechanism, 56- Preceding pad pasting idler wheel mechanism, pad pasting idler wheel mechanism after 57-, 58- cut cutter mechanism, 59- Hou Xi membrane arms mechanism, inhale membrane arms machine before 60- Structure, 61- wobble drive arm, T- yellow membrane, F- lead frame, G- chip.
Specific embodiment
The technical solution of the patent is explained in further detail With reference to embodiment.
Embodiment 1
A kind of lead frame film sticking apparatus, including ontology, the front end of the ontology are equipped with PLC controller 3, operation button 4 and display instrument 5, the rear end of ontology film feeding mechanism 6, yellow membrane cylinder 1 and useless film cylinder 2 are installed, work is installed in the middle part of ontology Lead frame workbench 25 is slidably fitted in platform driving mechanism 7 and table-driving mechanism 7, on lead frame workbench 25 It is equipped with to swing film pasting mechanism 55 and swing film pasting mechanism 55 and be used cooperatively with film feeding mechanism 6, film feeding mechanism 6, workbench drive Motivation structure 7 and swing film pasting mechanism 55 are electrically connected with PLC controller 3.The rear end of ontology is equipped with useless film and collects guiding mechanism 9, useless film is collected guiding mechanism 9 and is used cooperatively with useless film cylinder 2.The rear end of ontology is equipped with to put film guiding mechanism 8 and put film and lead It is used cooperatively to mechanism 8 with film pasting mechanism 55 is swung.
Embodiment 2
A kind of lead frame film sticking apparatus, including ontology, the front end of the ontology are equipped with PLC controller 3, operation button 4 and display instrument 5, the rear end of ontology film feeding mechanism 6, yellow membrane cylinder 1 and useless film cylinder 2 are installed, work is installed in the middle part of ontology Lead frame workbench 25 is slidably fitted in platform driving mechanism 7 and table-driving mechanism 7, on lead frame workbench 25 It is equipped with to swing film pasting mechanism 55 and swing film pasting mechanism 55 and be used cooperatively with film feeding mechanism 6, film feeding mechanism 6, workbench drive Motivation structure 7 and swing film pasting mechanism 55 are electrically connected with PLC controller 3.Lead frame workbench 25 is clamped including lead frame Mechanism 26, positioning pin 27, sucker 28, chip mounting groove 29 and mobile mechanism 30, mobile mechanism 30 are located at lead frame workbench 25 lower part, chip mounting groove 29 are located at the center of lead frame workbench 25, lead frame clamping device 26, positioning pin 27 and sucker 28 be respectively positioned on the side of chip mounting groove 29.Sucker 28 is using soft material production.Swinging film pasting mechanism 55 includes Preceding pad pasting idler wheel mechanism 56, rear pad pasting idler wheel mechanism 57, cutting cutter mechanism 58, Hou Xi membrane arms mechanism 59, Qian Xi membrane arms mechanism 60 With wobble drive arm 61, preceding pad pasting idler wheel mechanism 56 and rear pad pasting idler wheel mechanism 57 are located at and swing the two of film pasting mechanism 55 Side, cutting cutter mechanism 58 are located at the centre for swinging film pasting mechanism 55, and Qian Xi membrane arms mechanism 60 is located at cutting cutter mechanism 58 and preceding patch Between film idler wheel mechanism 56, Hou Xi membrane arms mechanism 59 is located between cutting cutter mechanism 58 and rear pad pasting idler wheel mechanism 57, swings and drives Swing arm 61 is located at the outside for swinging film pasting mechanism 55.
The working principle of the utility model is: lead frame workbench 25 use hollow design, lead frame F overleaf to The region chip G is hanging when upper placement, but has support between chip G and chip G;The setting of 25 two sides of lead frame workbench is floated Positioning pin 27 and flexible sucker 28;25 both sides of lead frame workbench setting driving lead frame clamping device 26 carries out Y-Z axis Mobile mobile mechanism 30 can efficiently solve the problems, such as orientation problem, buckling deformation and carry out effectively to lead frame F It is fixed.
It is provided in this product and swings film pasting mechanism 55, realize the timely conversion of the position of left, center, right three;It is inhaled after design Membrane arms mechanism 59 and Qian Xi membrane arms mechanism 60 simultaneously add cutter structure 58 between, realize and the upper surface of yellow membrane T is grabbed and stepped on Cut-in without ball is cut.
This product controls the speed of service and position using PLC controller 3, realizes and specifies region to be pasted on lead frame F Film, control accuracy are high.
This product merges out the space of chip G using the subregional chip mounting groove 29 in 25 top of lead frame workbench.
This product realizes the precise positioning of lead frame F using positioning pin 27, can't generate not to subsequent pad pasting process Good influence.
This product initially fixes lead frame F using soft sucker 28, is carried out using mobile mechanism 30 to lead frame Frame F is finally fixed, to achieve the purpose that the lead frame F to serious buckling deformation carries out pad pasting.
This product by Hou Xi membrane arms mechanism 59 and Qian Xi membrane arms mechanism 60 adsorb yellow membrane T in the way of realize upper suction film, with Reach the precondition for cutting film in the air, while realizing the random control of yellow membrane T length.
This product realizes that the angle position of left, center, right three is converted in time using film pasting mechanism 55 is swung, before reaching attaching The purpose on the latter head yellow membrane T is picked up while one yellow membrane T again.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting Related claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art The other embodiments being understood that.

Claims (6)

1. a kind of lead frame film sticking apparatus, including ontology, the front end of the ontology is equipped with PLC controller (3), operation button (4) and display instrument (5), which is characterized in that the rear end of ontology is equipped with film feeding mechanism (6), yellow membrane cylinder (1) and useless film cylinder (2), It is equipped in the middle part of ontology on table-driving mechanism (7) and table-driving mechanism (7) and is slidably fitted with lead frame work Make platform (25), is equipped on lead frame workbench (25) and swings film pasting mechanism (55) and swing film pasting mechanism (55) and film feeding Mechanism (6) is used cooperatively, and film feeding mechanism (6), table-driving mechanism (7) and swings film pasting mechanism (55) and PLC controller (3) it is electrically connected.
2. lead frame film sticking apparatus according to claim 1, which is characterized in that the rear end of the ontology is equipped with useless film It collects guiding mechanism (9), useless film is collected guiding mechanism (9) and is used cooperatively with useless film cylinder (2).
3. lead frame film sticking apparatus according to claim 1, which is characterized in that the rear end of the ontology, which is equipped with, puts film Guiding mechanism (8) and put film guiding mechanism (8) with swing film pasting mechanism (55) be used cooperatively.
4. lead frame film sticking apparatus according to claim 1, which is characterized in that lead frame workbench (25) packet Lead frame clamping device (26), positioning pin (27), sucker (28), chip mounting groove (29) and mobile mechanism (30) are included, it is mobile Mechanism (30) is located at the lower part of lead frame workbench (25), and chip mounting groove (29) is located in lead frame workbench (25) Heart position, lead frame clamping device (26), positioning pin (27) and sucker (28) are respectively positioned on the side of chip mounting groove (29).
5. lead frame film sticking apparatus according to claim 4, which is characterized in that the sucker (28) is using soft material Production.
6. lead frame film sticking apparatus according to claim 1 or 3, which is characterized in that the swing film pasting mechanism (55) Including preceding pad pasting idler wheel mechanism (56), rear pad pasting idler wheel mechanism (57), cutting cutter mechanism (58), Hou Xi membrane arms mechanism (59), preceding It inhales membrane arms mechanism (60) and wobble drive arm (61), preceding pad pasting idler wheel mechanism (56) and rear pad pasting idler wheel mechanism (57) is located at The two sides of film pasting mechanism (55) are swung, cutting cutter mechanism (58) is located at the centre for swinging film pasting mechanism (55), Qian Xi membrane arms mechanism (60) it is located between cutting cutter mechanism (58) and preceding pad pasting idler wheel mechanism (56), Hou Xi membrane arms mechanism (59) is located at cutting cutter mechanism (58) between rear pad pasting idler wheel mechanism (57), wobble drive arm (61) is located at the outside for swinging film pasting mechanism (55).
CN201821836881.0U 2018-11-08 2018-11-08 A kind of lead frame film sticking apparatus Active CN208835028U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821836881.0U CN208835028U (en) 2018-11-08 2018-11-08 A kind of lead frame film sticking apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821836881.0U CN208835028U (en) 2018-11-08 2018-11-08 A kind of lead frame film sticking apparatus

Publications (1)

Publication Number Publication Date
CN208835028U true CN208835028U (en) 2019-05-07

Family

ID=66319934

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821836881.0U Active CN208835028U (en) 2018-11-08 2018-11-08 A kind of lead frame film sticking apparatus

Country Status (1)

Country Link
CN (1) CN208835028U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109300821A (en) * 2018-11-08 2019-02-01 上海海展自动化设备有限公司 A kind of lead frame film sticking apparatus and its workflow
CN114171393A (en) * 2021-12-08 2022-03-11 天水华洋电子科技股份有限公司 Film pasting device for producing integrated circuit lead frame and film pasting method thereof
CN117059527A (en) * 2023-10-09 2023-11-14 广州市番禺申宁五金电子有限公司 Film covering device of anti-deformation lead frame

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109300821A (en) * 2018-11-08 2019-02-01 上海海展自动化设备有限公司 A kind of lead frame film sticking apparatus and its workflow
CN109300821B (en) * 2018-11-08 2024-06-18 上海海展自动化设备有限公司 Lead frame film sticking device and working process thereof
CN114171393A (en) * 2021-12-08 2022-03-11 天水华洋电子科技股份有限公司 Film pasting device for producing integrated circuit lead frame and film pasting method thereof
CN117059527A (en) * 2023-10-09 2023-11-14 广州市番禺申宁五金电子有限公司 Film covering device of anti-deformation lead frame
CN117059527B (en) * 2023-10-09 2023-12-22 广州市番禺申宁五金电子有限公司 Film covering device of anti-deformation lead frame

Similar Documents

Publication Publication Date Title
CN208835028U (en) A kind of lead frame film sticking apparatus
TWI312569B (en) Semiconductor package on which a semiconductor device is stacked and production method thereof
WO2014156035A1 (en) Manufacturing method for semiconductor package, semiconductor chip support carrier and chip mounting device
CN106373914A (en) Chip bonding device
CN205920952U (en) Chip paster equipment
US20230138119A1 (en) Method for fabricating strain sensing film, strain sensing film, and pressure sensor
TWM582232U (en) Integrated semiconductor loading machine
CN208570529U (en) A kind of bonder with brush coating device
CN208157371U (en) A kind of flip-chip sealed in unit
CN106057709A (en) Chip mounting equipment and application thereof
CN109300821A (en) A kind of lead frame film sticking apparatus and its workflow
CN109461667A (en) Semiconductor chip packaging bonding apparatus and implementation method
CN107818936A (en) A kind of bonder with brush coating device
TW538657B (en) Recognition device, bonding device, and method for making a circuit
CN207269042U (en) One kind insulation film sticking device
CN207731905U (en) A kind of die bond ancillary equipment and bonder
CN202384299U (en) Wafer bonding device
JP2016201427A (en) Component mounting device and component mounting method
CN209418468U (en) Semiconductor chip packaging is bonded mould group
CN104520981A (en) Suction nozzle, method and test mechanism for testing flip LED chip
JP2009004609A5 (en)
CN207719162U (en) A kind of stabilization die bond structure of bonder
CN206820014U (en) A kind of bonder
CN209021386U (en) The apparatus for welding and positioning of more main grid crystal silicon solar batteries
CN218180903U (en) Integrated circuit welding test tool

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant